Supero SUPER 370DDE, SUPER 370SDA User Manual

®
SUPER 370DDE SUPER 370SDA
USER’S MANUAL
Revision 1.2
SUPER
Please Note: For the most up-to-date version of this manual, please see our web site at < http://www.supermicro.com >.
SUPERMICRO COMPUTER reserves the right to make changes to the product described in this manual at any time and without notice. This product, including software, if any, and documentation may not, in whole or in part, be copied, photocopied, reproduced, translated or reduced to any medium or machine without prior written consent.
IN NO EVENT WILL SUPERMICRO COMPUTER BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, THE VENDOR SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
Unless you request and receive written permission from SUPER MICRO COMPUTER, you may not copy any part of this document.
Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2001 by SUPER MICRO COMPUTER INC. All rights reserved.
Printed in the United States of America.
Preface
About This Manual
This manual is written for system integrators, PC technicians and knowledgeable PC users. It provides information for the installation and use of the SUPER 370DDE motherboard. The SUPER 370DDE supports dual Intel 370-pin Pentium® III FCPGA 500 MHz-1 GHz processors at front side bus speeds of 133, 100 and 66 MHz. The SUPER 370SDA supports a single Intel 370-pin Pentium® III FCPGA 500 MHz-1 GHz processor or a single Intel Celeron® PPGA/FCPGA 333-800 MHz processor -- all such CPUs at front side bus speeds of 133, 100 and 66 MHz. Please refer to the support section of our web site < http://www.supermicro.com/TechSupport.htm > for a complete listing of supported processors. PPGA and FCPGA Pentium
®
III processors are housed in 370-pin packages.
Manual Organization
Chapter 1 includes a checklist of what should be included in your
mainboard box, describes the features, specifications and performance of the SUPER 370DDE/370SDA mainboard and provides detailed information about the chipset.
Chapter 2 begins with instructions on handling static-sensitive devices. Read this chapter when you want to install the processors, SDRAM memory modules for the 370DDE or DDR RAM memory modules for the 370SDA, and mounting the mainboard in the chassis. Also refer to this chapter when you want to connect floppy/hard disk drives, the IDE interfaces, the parallel and serial ports and the twisted wires for the power supply, the reset button, the keylock/power LED, the speaker and the keyboard.
If you encounter any problems, see Chapter 3, which describes trouble­shooting procedures for the video, the memory and the setup configuration stored in CMOS. For quick reference, a general FAQ (Frequently Asked
iii
Preface
SUPER 370DDE/379SDA User’s Manual
iv
Chapter 1: Introduction
1-1 Overview ......................................................................................................... 1-1
Checklist .................................................................................................... 1-1
Contacting Supermicro ............................................................................ 1-2
SUPER 370DDE Section.................................................................................. 1-3
SUPER 370DDE Image ............................................................................. 1-4
SUPER 370DDE Layout ........................................................................... 1-5
SUPER 370DDE Quick Reference .......................................................... 1-6
SUPER 370DDE Features........................................................................ 1-7
SUPER 370SDA Section ................................................................................. 1-9
SUPER 370SDA Image ........................................................................... 1-10
SUPER 370SDA Layout.......................................................................... 1-11
SUPER 370DDE Quick Reference ........................................................1-12
SUPER 370SDA Features ..................................................................... 1-13
General Section ............................................................................................. 1-15
VIA Apollo Pro 266 Chipset: System Block Diagram ........................ 1-16
1-2 Chipset Overview......................................................................................... 1-17
1-3 Special Features........................................................................................... 1-18
Advanced Communications Riser Card (ACR) ................................. 1- 18
1-4 PC Health Monitoring.................................................................................... 1-18
1-5 ACPI/PC 98 Features ................................................................................... 1- 19
1-6 Power Supply ............................................................................................... 1-21
1- 7 Super I/O......................................................................................................... 1-22
Chapter 2: Installation
2-1 Static-Sensitive Devices ............................................................................... 2-1
2-2 Processor Installation.................................................................................... 2-2
2-3 Mounting the Motherboard in the Chassis ................................................. 2-3
2-4 Installing DIMMs............................................................................................... 2-4
2- 5 Port/Front Control Panel Connector Locations .......................................... 2-5
2-6 Connecting Cables ......................................................................................... 2-7
Power Supply Connector ....................................................................... 2-7
Infrared Connector ................................................................................... 2-7
PWR_ON .................................................................................................... 2-8
Table of Contents
About This Manual ...................................................................................................... ii i
Manual Organization ................................................................................................... iii
v
Table of Contents
Reset........................................................................................................... 2-8
IDE LED ...................................................................................................... 2-8
Power LED ................................................................................................ 2-8
Speaker Connector (370DDE) .............................................................. 2-9
ATX PS/2 Keyboard/Mouse Ports ......................................................... 2-9
Universal Serial Bus................................................................................ 2-9
Serial Ports ............................................................................................. 2-10
Wake-On-LAN/Modem ............................................................................ 2-10
Fan Headers ........................................................................................... 2-11
Chassis Intrusion Header ..................................................................... 2-11
Overheat LED .......................................................................................... 2-11
2- 7 Jumper Settings ............................................................................................ 2-12
Explanation of Jumpers ........................................................................ 2-12
Front Side Bus Speed .......................................................................... 2-12
CMOS Clear............................................................................................. 2-13
Wake-On-Ring ......................................................................................... 2-13
Keyboard Wake-Up................................................................................. 2-14
Onboard Speaker Enabled/Disabled (370DDE) .................................. 2-14
Onboard IDE RAID (370DDE) ................................................................ 2-14
2- 8 Parallel Port, ACR, Floppy/Hard Disk Drive and AGP Connections ..... 2-15
Parallel Port Connector ......................................................................... 2-16
Floppy Connector ................................................................................... 2-16
IDE Connectors ...................................................................................... 2-16
AGP Pro Slot ........................................................................................... 2-17
2-9 Installing Software Drivers......................................................................... 2-18
Chapter 3: Troubleshooting
3-1 Troubleshooting Procedures ........................................................................ 3-1
Before Power On .................................................................................... 3-1
No Power .................................................................................................. 3-1
No Video ................................................................................................... 3-1
Memory Errors .......................................................................................... 3-2
3-2 Technical Support Procedures .................................................................... 3-2
3-3 Frequently Asked Questions........................................................................ 3-3
3-4 Returning Merchandise for Service ............................................................ 3-5
SUPER 370DDE User’s Manual
vi
Chapter 4: BIOS
4- 1 Introduction ....................................................................................................... 4-1
4- 2 Running Setup.................................................................................................. 4-2
4- 3 Main BIOS Setup.............................................................................................. 4-2
4-4 Advanced BIOS Setup .................................................................................... 4-6
4-5 PCI/PnPSetup ..................................................................................................4-17
4-6 Power Management ...................................................................................... 4-19
4-7 Boot-up Devices ............................................................................................4-22
4-8 Security Setup ............................................................................................... 4-24
4- 9 Exit Setup ....................................................................................................... 4-26
Chapter 5: Fast Trak100 RAID Card (370DDE option)
5- 1 Introduction ....................................................................................................... 5-1
5-2 Key Features and Benefits ........................................................................... 5-2
5- 3 Checking CMOS Settings ............................................................................... 5-3
5- 4 Installing Drivers .............................................................................................. 5-4
5- 5 IDE RAID (option) User's Manual ................................................................ 5-13
Appendices:
Appendix A: AwardBIOS Post Messages ........................................................... A-1
Appendix B: AwardBIOS Post Codes ................................................................... B-1
Appendix C: AwardBIOSError BeepCodes ..........................................................C-1
Chapter 1: Introduction
1-1
Chapter 1
Introduction
1-1 Overview
Checklist
Congratulations on purchasing your computer motherboard from an ac­knowledged leader in the industry. Supermicro boards are designed with the utmost attention to detail to provide you with the highest standards in quality and performance.
Please check that the following items have all been included with your motherboard. If anything listed here is damaged or missing, contact your retailer.
One (1) Supermicro Mainboard
Two (2) ATA66/100 ribbon cables for IDE devices
One (1) floppy ribbon cable
One (1) Supermicro CD or diskettes containing drivers and utilities
One (1) User's/BIOS Manual
SUPER 370DDE/370SDA User's Manual
1-2
CONTACTING SUPERMICRO
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A. Tel: +1 (408) 503-8000 Fax: +1 (408) 503-8008 E-mail: marketing@supermicro.com (General Information)
support@supermicro.com (Technical Support) Web site: www.supermicro.com
European Office
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML,
's-Hertogenbosch, The Netherlands Tel: +31 (0) 73-6400390 Fax: +31 (0) 73-6416525 E-mail: sales@supermicro.nl (General Information)
support@supermicro.nl (Technical Support)
rma@supermicro.nl (Customer Support)
Asia-Pacific
Address: 6th Floor, No. 755 Chung-cheng Road
Chung-Ho City, Taipei Hsien, Taiwan, R.O.C. Tel: 886 (2) 8221-1690
Fax: 886 (2) 8221-2790
www : www.supermicro.com.tw
Email: support@supermicro.com.tw
Chapter 1: Introduction
1-3
370DDE SECTION
SUPER 370DDE/370SDA User's Manual
1-4
SUPER 370DDE
Figure 1-1. SUPER 370DDE Image
Chapter 1: Introduction
1-5
Figure 1-2. SUPER 370DDE Layout
(not drawn to scale)
SUPER 370DDE
COM1
KB/
MOUSE
USB1
PCI 1
PCI 2
PCI 3
JF2
JF1
IDELED
PW LED
IDE RAID LED/X/JOH/X/PW-ON/X/Reset
FLO
PP
Y
IDE1
WOL1
VIA
Parallel
Port
11.2"
BATTERY
OH Fan(Fan4)
JPW
AKE
11.6"
1
BIOS FWH
370 FCPGA/PPGA
Processor
COM2
®
PCI 4
PCI 5/IDE RAID
AGP PRO
S
U
P
E
R
I/O
J
1
2
J13
J
1
4
J16
VT8633
1
1
ACR
1
JUSB1
WOM1
1
J9
1
1
IDE2
CLK BUF1
CHFan(Fan5)
x
CPU Fan
(Fan2)
A
C
97
(O
P
T
IO
N
)
C
D
_
IN
JC
D
_
IN
1
JP
3
1
SPK1
J2
J
1
0
C
P
U
F
A
N
(F
A
N
3
)
370 FCPGA/PPGA
Processor
1
C
PU
1
C
P
U
2
1
VIA
VT8233
1
IDE RAID
#1
#2
JL1
1
1
SDRM Slots
Clock
1
1
1
1
JP5
JP4
SPEAKER
x
DIMM SLOT1
DIMM SLOT2
DIMM SLOT4
DIMM SLOT3
CLK BUF2
IDE RAID
J17
FAN6 FAN7
SUPER 370DDE/370SDA User's Manual
1-6
370DDE Quick Reference
Jumpers Description Default Setting
JBAT1 CMOS Clear Pins 1-2 (Normal) JPWAKE Keyboard Wake-Up Pins1-2 (Disabled) JP4, JP5 CPU Speeds (See Page 2- for details) J17
(J17 Default 2-3) Onboard IDE RAID
Onboard
IDE RAID
PCI 5
Devices 1-2 Enabled Disabled 2-3 Disabled Enabled
Connectors Description
COM1/COM2 COM1/COM2 Serial Port Connectors FAN2/FAN3(CPU Fans) CPU Fan Headers (Fan2--CPU1 Fan,
Fan3--CPU2 Fan) FAN4 (OH Fan) Overheat Fan Header FAN5 (CH Fan) Chassis Fan Header GAME Game Port Memory Slots 4 SDRAM slots IDE1, IDE2 IDE Hard Disk Drive Connectors IDE3, IDE4 IDE RAID Drive Connectors JP1 Floppy Disk Drive Connector J9 Audio (1-2: Enabled, 2-3 Disabled)
(*Audio is optional for the DDE
board.) J1 0 ATX Power Connector J12 PS/2 Keyboard/Mouse J16 Parallel Printer Port J18 IR Connector JF1, JF2 Front Control Panel JL1 Chassis Intrusion Header JOH Overheat LED WOM1 Wake-On-Ring Header WOL Wake-on-LAN Header USB1, JUSB1 Universal Serial Bus Ports
*Also see the figures on page 2-5 for the I/O ports and page 2-6 for the Front Control Panel (JF1/2) connectors. Please refer to Chapter 2 for detailed information on jumper settings. Jumpers not indicated are for test purposes only.
Chapter 1: Introduction
1-7
Features of the 370DDE Motherboard
CPU
Dual Intel® 370-pin Pentium® III FCPGA 500 MHz-1 GHz processors at 133/100/66 MHz CPU Front Side Bus speeds
Memory
Four PC133 SDRAM DIMM sockets support up to 4 GB SDRAM
Chipset
VIA Apollo Pro 266
Expansion Slots
One 4xAGP Pro
Five 32-bit PCI (33MHz)
One ACR
BIOS
2 Mb Award® Flash ROM
ACPI/APM Power Management
PAC'99 color-code I/O connectors
One WOL (Wake-On-LAN) connector
Internal control of Power-On Mode for Recovery from AC power loss
PC Health Monitoring
Seven onboard voltage monitors for CPU core, chipset voltage, +3.3V,
±5V and ±12V
Four-fan status monitor with firmware/software on/off control
Environmental temperature monitor and control
CPU fan auto-off in sleep mode
Power-up mode control for recovery from AC power loss
System overheat LED and control
System resource alert
Hardware BIOS virus protection
Auto-switching voltage regulator for the CPU core
Slow blinking LED for suspend state indicator
BIOS support for USB keyboard
SUPER 370DDE/370SDA User's Manual
1-8
ACPI/PC 98 Features
Microsoft OnNow
Real-time clock wake-up alarm
Main switch override mechanism
External modem ring-on
Onboard I/O
2 IDE bus master interfaces support UDMA/100
1 floppy port interface (up to 2.88 MB)
2 Fast UART 16550A compatible serial ports
1 EPP (Enhanced Parallel Port) and ECP (Extended Capabilities Port)
supported parallel port
PS/2 mouse and PS/2 keyboard ports
1 infrared port
4 USB ports
2 IDE RAID connectors
Other
Selectable CPU and chassis fan speed control (set in BIOS)
Internal/external modem ring-on
Recovery from AC power loss control
Wake-on-LAN (WOL)
Multiple FSB clock frequency selections (set in BIOS)
CD Utilities
BIOS flash upgrade utility (awdflash.exe)
Drivers for the VIA Apollo Pro 266 chipset
Dimensions
*SUPER 370DDE - ATX: 11.6" x 11.2" (294.64 mm x 284.48 mm)
Chapter 1: Introduction
1-9
370SDA SECTION
SUPER 370DDE/370SDA User's Manual
1-10
SUPER 370SDA
Figure 1-1. SUPER 370SDA Image
Chapter 1: Introduction
1-11
Figure 1-2. SUPER 370SDA Layout
(not drawn to scale)
PCI 1
PCI 2
PCI 3
JF2
JF1
1IDE/LED
IR CON/LED/XXX/PW-ON/X/RESET
FLO
P
P
Y
IDE1
VIA
11.2"
BATTERY
OH Fan
11.6"
BIOS FWH
PCI 4
PCI 5
AGP PRO
S
U
P
E
R
I/O
VT8633
1
1
ACR
1
1
1
IDE2
CHFan
SPK1
1
VIA
VT8233
1
1
1
1
DDR SLOT1
DDR SLOT2
DDR SLOT3
JP5
JP4
KEYLOCK
SUPER 370SDA
®
COM1
KB/
MOUSE
USB1
Parallel
Port
COM2
J13
J
1
4
J16
1
ACR
Intel P III
Celeron
PPGA/FCPGA
or
JP2
JBT1
JUSB1
JL1
JOH
DDR Slots
PWR
WOM1 WOL1
Clock
CLOCK BUFFER
SUPER 370DDE/370SDA User's Manual
1-12
370SDA Quick Reference
Jumpers Description Default Setting
JBT1 CMOS Clear Pins 1-2 (Normal) JPWAKE Keyboard Wake-Up Pins1-2 (Disabled) JP4-JP5 Memory Bus Speed (see table below)
Connectors Description
COM1/COM2 COM1/COM2 Serial Port Connectors FAN2(CPU Fan) CPU Fan Header FAN3 (OH Fan) Overheat Fan Header FAN4 (CH Fan) Chassis Fan Header Memory Slots 3 DDR RAM slots IDE1, IDE2 IDE Hard Disk Drive Connectors JP1 Floppy Disk Drive Connector J1 0 ATX Power Connector J12 PS/2 Keyboard/Mouse J16 Parallel Printer Port JF1, JF2 Front Control Panel JL1 Chassis Intrusion Header JOH Overheat LED WOL1 Wake on LAN WOM1 Wake on Modem USB1, JUSB1 Universal Serial Bus Ports
*Also see the figures on page 2-5 for the I/O ports and page 2-6 for the Front Control Panel (JF1/2) connectors. Please refer to Chapter 2 for detailed information on jumper settings. Jumpers not indicated are for test purposes only.
JP4
AUTO 133M100M66M
1-2
OPEN
OPEN OPEN1-2
2-3 2-3
2-3
JP5
Chapter 1: Introduction
1-13
Features of the 370SDA Motherboard
CPU
Single Intel® 370-pin Pentium® III/Celeron® PPGA/FCPGA 500 MHz-1 GHz processors at 133/100/66 MHz CPU Front Side Bus
speeds
Memory
Three PC1600 (200 MHz)/PC2100 (266 MHz) DDR RAM DIMM sockets support up to 3 GB DDR RAM
Chipset
VIA Apollo Pro 266
Expansion Slots
One 4xAGP Pro
Five 32-bit PCI (33MHz)
One ACR
BIOS
2 Mb Award® Flash ROM
ACPI/APM Power Management
PAC'99 color-code I/O connectors
One WOL (Wake-On-LAN) connector
One WOM (Wake-On-Modem) connector
Internal control of Power-On Mode for Recovery from AC power loss
PC Health Monitoring
Seven onboard voltage monitors for CPU core, chipset voltage, +3.3V,
±5V and ±12V
Four-fan status monitor with firmware/software on/off control
Environmental temperature monitor and control
CPU fan auto-off in sleep mode
Power-up mode control for recovery from AC power loss
System overheat LED and control
System resource alert
Hardware BIOS virus protection
Auto-switching voltage regulator for the CPU core
Slow blinking LED for suspend state indicator
BIOS support for USB keyboard
SUPER 370DDE/370SDA User's Manual
1-14
ACPI/PC 98 Features
Microsoft OnNow
Real-time clock wake-up alarm
Main switch override mechanism
External modem ring-on
Onboard I/O
2 IDE bus master interfaces support UDMA/100
1 floppy port interface (up to 2.88 MB)
2 Fast UART 16550A compatible serial ports
1 EPP (Enhanced Parallel Port) and ECP (Extended Capabilities Port)
supported parallel port
PS/2 mouse and PS/2 keyboard ports
1 infrared port
4 USB ports
2 IDE RAID connectors
Other
Selectable CPU and chassis fan speed control (set in BIOS)
Internal/external modem ring-on
Recovery from AC power loss control
Wake-on-LAN (WOL)
Wake-on-Modem (WOM)
Multiple FSB clock frequency selections (set in BIOS)
CD Utilities
BIOS flash upgrade utility (awdflash.exe)
Drivers for the VIA Apollo Pro 266 chipset
Dimensions
*SUPER 370SDA - ATX: 11.6" x 11.2" (294.64 mm x 284.48 mm)
Chapter 1: Introduction
1-15
GENERAL SECTION
SUPER 370DDE/370SDA User's Manual
1-16
Figure 1-7. VIA 266 Chipset:
System Block Diagram
NOTE: This is a general block diagram and may not
exactly represent the features on your motherboard. See
the following pages for the actual specifications of each
motherboard.
VT8633
DDR Vlink
Host North
552BGA
VT8233
Vlink
133/100/66 MHz Host Bus
3D Graphics
Controller
Pentium III
FCPGA/PPGA
CPU
PCI Slots
266 MHz Mem ory
Memory Bus
AGP Bus
Clock Buffer
Clock
Generator
GCLK
MCLK
HCLK/PCLK
PCI Bus
ATA33/66/100
MII/LAN
6XUSB
LPC
SMBus
Power Plane & Peripheral Control
ACPI events
LPC
Chapter 1: Introduction
1-17
1-2 Chipset Overview
The VIA Apollo Pro266 chipset is a high performance, cost-effective and energy efficient chipset for the implementation of AGP/V-Link/PCI/LPC com­puter systems based on 64-bit, 370 Pentium III (66 MHz/100MHz/133MHz), processors.
VIA's Apollo Pro266 chipset consists of two major components: the VT8633 V-Link Memory Host System Controller(-North-bridge) and the VT8233 V­Link Client PCI/LPC Controller (-South-bridge). The VT8633 Host System Controller provides superior performance between the CPU, DIMM, AGP bus, and V-Link inferface with pipelined, burst, and concurrent operation. The VT8233 V-Link Client Controller is a highly integrated PCI/LPC controller. Its internal bus structure is based on 66MHz PCI bus that provides 2x band­width. The VT8233 integrated Clint V-Link Controller, which supports 266 MB bandwidth between Host/Client V-Link interface, provides a V-Link PCI and V-Link LPC controller. It supports five PCI slots arbitration and decod­ing for all integrated functions and LPC bus.
Memory support and AGP capability for the VT8633 chip
The VT8633 supports SDRAM memory up to 4 GB. The DRAM controller supports SDRAM and VCSDRAM (Virtual Channel SDRAM) in a flexible mix/ match manner. The SDRAM interface allows zero wait state bursting be­tween the DRAM and the data buffers at 66/100/133 MHz.
The VT8633 Controller also supports full AGP v.2.0 capability for maximum bus utilization including 2x and 4x mode transfer, SBA (Side Band Address­ing), Flush/Fence commands and pipelined grants. The VT8633 also pro-
vides flexible CPU/AGP/PCI remapping control which supports major AGP­based 3D and DVD multimedia accelerators.
Recovery from AC Power Loss
BIOS provides a setting for you to determine how the system will respond when AC power is lost and then restored to the system. You can choose for the system to remain powered off (in which case you must hit the power switch to turn it back on) or for it to automatically return to a power on state. See the Power Lost Control setting in the BIOS chapter of this manual to change this setting. The default setting is Always OFF.
SUPER 370DDE/370SDA User's Manual
1-18
1-3 Special Features
Advanced Communications Riser Card (ACR)
The ACR (Advanced Communications Riser Card), combining several existing communications buses with new and advanced communications buses, provides low-cost, high-performance communications solutions to the industry. The ACR Specification supports modem, audio, Local Area Network (LAN), and Digital Subscriber Line (DSL). Pins are also reserved for future wireless bus support. The ACR Specification enables riser-based broadband communications, networking peripheral and audio subsystem designs.
ACR accomplishes this in an open-standards context.
1-4 PC Health Monitoring
This section describes the PC health monitoring features of the SUPER 370DDE motherboard.
Seven Onboard Voltage Monitors for the CPU Core, Chipset Voltage, +3.3V,
±±
±±
±5V and
±±
±±
±12V
The onboard voltage monitor will scan these seven voltages continuously. Once a voltage becomes unstable, it will give a warning or send an error message to the screen. Users can adjust the voltage thresholds to define the sensitivity of the voltage monitor.
Four-Fan Status Monitor with Firmware/Software On/Off Control
The PC health monitor can check the RPM status of the cooling fans. The onboard 3-pin CPU and chassis fans are controlled by the power manage­ment functions. The thermal fan is controlled by the overheat detection logic.
Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will activate the thermal control fan whenever the CPU temperature ex­ceeds a user-defined threshold. The overheat circuitry runs independently from the CPU. It can continue to monitor for overheat conditions even when the CPU is in sleep mode. Once it detects that the CPU temperature is too high, it will automatically turn on the thermal control fan to prevent any overheat damage to the CPU. The onboard chassis thermal circuitry can monitor the overall system temperature and alert users when the chassis temperature is too high.
Chapter 1: Introduction
1-19
CPU Fan Auto-Off in Sleep Mode
The CPU fan activates when the power is turned on. It can be turned off when the CPU is in sleep mode. When in sleep mode, the CPU will not run at full power, thereby generating less heat.
CPU Overheat LED and Control
This feature is available when the user enables the CPU overheat warning function in the BIOS. This allows the user to define an overheat tempera­ture. When this temperature is exceeded, both the overheat fan and the warning LED are triggered.
System Resource Alert
This feature is available when used with Intel's LANDesk Client Manager (optional). It is used to notify the user of certain system events. For example, if the system is running low on virtual memory and there is insuf­ficient hard drive space for saving the data, you can be alerted of the potential problem.
Hardware BIOS Virus Protection
The system BIOS is protected by hardware so that no virus can infect the BIOS area. The user can only change the BIOS content through the flash utility provided by SUPERMICRO. This feature can prevent viruses from infecting the BIOS area and destroying valuable data.
Auto-Switching Voltage Regulator for the CPU Core
The auto-switching voltage regulator for the CPU core can support up to 20A current and auto-sense voltage IDs ranging from 1.3V to 3.5V. This will allow the regulator to run cooler and thus make the system more stable.
1-5 ACPI/PC 99 Features
ACPI stands for Advanced Configuration and Power Interface. The ACPI specification defines a flexible and abstract hardware interface that pro­vides a standard way to integrate power management features throughout a PC system, including its hardware, operating system and application soft­ware. This enables the system to automatically turn on and off peripherals such as CD-ROMs, network cards, hard disk drives and printers. This also includes consumer devices connected to the PC such as VCRs, TVs, tele­phones and stereos.
SUPER 370DDE/370SDA User's Manual
1-20
In addition to enabling operating system-directed power management, ACPI provides a generic system event mechanism for Plug and Play and an oper­ating system-independent interface for configuration control. ACPI lever­ages the Plug and Play BIOS data structures while providing a processor architecture-independent implementation that is compatible with both Win­dows 98, Windows NT, and Windows 2000. You can check to see if ACPI has been properly installed by looking for it in the Device Manager, which is located in the Control Panel in Windows.
Microsoft OnNow
The OnNow design initiative is a comprehensive, system-wide approach to system and device power control. OnNow is a term for a PC that is always on but appears to be off and responds immediately to user or other re­quests.
Slow Blinking LED for Suspend-State Indicator
When the CPU goes into a suspend state, the chassis power LED will start blinking to indicate that the CPU is in suspend mode. When the user presses any key, the CPU will wake-up and the LED will automatically stop blinking and remain on.
BIOS Support for USB Keyboard
If the USB keyboard is the only keyboard in the system, it keyboard will function like a normal keyboard during system boot-up.
Real Time Clock Wake-Up Alarm
Although the PC may be perceived to be off when not in use, it is still capable of responding to preset wake-up events. In the BIOS, the user can set a timer to wake-up the system at a predetermined time.
Main Switch Override Mechanism
When an ATX power supply is used, the power button can function as a system suspend button. When the user depresses the power button, the system will enter a SoftOff state. The monitor will be suspended and the hard drive will spin down. Depressing the power button again will cause the whole system to wake-up. During the SoftOff state, the ATX power supply provides power to keep the required circuitry in the system alive. In
Chapter 1: Introduction
1-21
case the system malfunctions and you want to turn off the power, just depress and hold the power button for 4 seconds. The power will turn off and no main power will be provided to the motherboard.
External Modem Ring-On
Wake-up events can be triggered by a device such as the external modem ringing when the system is in the SoftOff state. Note that external modem ring-on can only be used with an ATX 2.01 (or above) compliant power supply.
Wake-On-LAN (WOL)
Wake-On-LAN is defined as the ability of a management application to re­motely power up a computer that is powered off. Remote PC setup, up­dates and asset tracking can occur after hours and on weekends so that daily LAN traffic is kept to a minimum and users are not interrupted. The motherboards have a 3-pin header (WOL) to connect to the 3-pin header on a Network Interface Card (NIC) that has WOL capability. Wake-On-LAN must be enabled in BIOS. Note that Wake-On-Lan can only be used with an ATX 2.01 (or above) compliant power supply.
1-6 Power Supply
As with all computer products, a stable power source is necessary for proper and reliable operation. It is even more important for processors that have high CPU clock rates of 300 MHz and above.
The SUPER 370DDE accommodates ATX power supplies. Although most power supplies generally meet the specifications required by the CPU, some are inadequate.
It is strongly recommended that you use a high quality power supply that meets ATX power supply Specification 2.02 or above. Additionally, in ar­eas where noisy power transmission is present, you may choose to install a line filter to shield the computer from noise. It is recommended that you also install a power surge protector to help avoid problems caused by power surges.
SUPER 370DDE/370SDA User's Manual
1-22
includes a 16-byte send/receive FIFO, a programmable baud rate generator, complete modem control capability and a processor interrupt system. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which support higher speed modems.
The Super I/O supports one PC-compatible printer port (SPP), Bi-directional Printer Port (BPP) , Enhanced Parallel Port (EPP) or Extended Capabilities Port (ECP).
The Super I/O provides functions that comply with ACPI (Advanced Con­figuration and Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management to reduce power consumption.
The IRQs, DMAs and I/O space resources of the Super I/O can flexibly adjust to meet ISA PnP requirements, which suppport ACPI and APM (Ad­vanced Power Management).
1-7 Super I/O
The functions of the disk drive adapter for the Super I/O chip include a floppy disk drive controller that is compatible with industry standard 82077/ 765, a data separator, write pre-compensation circuitry, decode logic, data rate selection, a clock generator, drive interface control logic and interrupt and DMA logic. The wide range of functions integrated onto the Super I/O greatly reduces the number of components required for interfacing with floppy disk drives. The Super I/O supports four 360 K, 720 K, 1.2 M, 1.44 M disk drives and data transfer rates of 250 Kb/s, 500 Kb/s or 1 Mb/s. It also provides two high-speed, 16550 compatible serial communication ports (UARTs), one of which supports serial infrared communication. Each UART
Chapter 2: Installation
2-1
Chapter 2
Installation
2-1Static-Sensitive Devices
ElectroStatic Discharge (ESD) can damage electronic components. To pre­vent damage to your system board, it is important to handle it very carefully. The following measures are generally sufficient to protect your equipment from ESD.
Precautions
Use a wrist strap designed to prevent electrostatic discharge that is grounded to the computer chassis.
Touch a grounded metal computer object before removing the board from the antistatic bag.
Handle the board by its edges only; do not touch its components, periph­eral chips, memory modules or gold contacts.
When handling chips or modules, avoid touching their pins.
Put the motherboard and peripherals back into their antistatic bags when
not in use.
For grounding purposes, make sure your computer chassis provides ex­cellent conductivity amongst the power supply, the case, the mounting fasteners and the motherboard.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking the board, make sure the person handling it is static pro­tected.
2-2
SUPER 370DDE/370SDA User's Manual
Installation
Heat Sink
Follow the instructions that came with your processors or heat sinks to attach heat sinks to the processors. Each of your heat sinks should have a 3-pin fan cable connecting to the CPU FAN header. Make sure that good contact is made between the processors and the heat sinks. Insufficient contact, incorrect types of heat sinks, fans, or thermal compound used or improper amount of thermal compound applied on the CPU die can cause the processors to overheat, which may crash the system.
Processor
You are now ready to install the processors. Your 370DDE motherboard has two 370-pin, FCPGA type sockets, which support 370-pin Pentium III FCPGA (not SEPP) 500 MHz-1GHz processors. The 370SDA motherboard supports only one Pentium III FCPGA 500 MHz-1GHz CPU -- or supports a single Celeron PPGA/FCPGA 333-700 MHz processor. Lift the lever on the FCPGA socket and install with the notched corner of the processor oriented with pin 1. Fully seat the processor into the socket and then close the lever. See Figure 2-1 for views of the FCPGA 370-pin socket before and after processor installation -- the PPGA is similar.
2-2 Processor Installation
When handling the processor package, avoid placing direct pressure on the label area of the fan.
The following pages cover the installation procedures. You should install the processor in the motherboard first, then install the motherboard in the chassis, then the memory and add-on cards, and finally the cables and drivers. Following the installation procedures in the order they appear in this chapter should eliminate the most common problems encountered when building a system.
IMPORTANT: Always connect the power cord last, and always re­move it before adding, removing or changing any hardware compo­nents.
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