Intel is the rightful owner of the memory tables on page 4 and the copyright thereof. Super Micro Computer, Inc.
incorporates the memory tables into this document under a general licensing provision between the two companies.
The information provided in this document is for general reference only.
Disclaimer
The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
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IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
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OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
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Manual Revision 1.0
Release Date: March 22, 2018
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
This document provides the user with an easy-to-use guide for proper memory conguration
and installation of X10 UP (Socket R3) motherboards utilizing RDIMM and LRDIMM DDR4
memory modules. To ensure proper memory installation, please follow the information and
instructions listed below.
1 ESD Precautions
Electrostatic Discharge (ESD) can damage electronic com ponents, including memory
modules. To avoid damaging DIMMs, it is important to handle them very carefully. The
following measures are generally sufcient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Handle the memory module by its edges only.
• Put the memory modules into antistatic bags when not in use.
• Check the Supermicro website for recommended memory modules.
Note: All graphics shown in this manual are for reference only. Your system components may not look the same as the graphics shown in this guide.
3
Page 4
Supermicro Memory Conguration User Guide for the X10 UP Series Motherboards
2 Memory Support
The X10 UP (Socket R3) motherboards support Load Reduced DIMM (LRDIMM) and
Registered DIMM (RDIMM) DDR4 (288-pin) ECC memory with speeds of up to 2400MHz in
eight memory slots. Refer to the following tables for detailed information on memory support.
RDIMM / LRDIMM DDR4 Memory Support (E5-2600 v3 Motherboards)
Speed (MT/s), Voltage (V),
DIMM Capacity
DIMM Type
RDIMMSRx48GB16GB213321331866
RDIMMSRx84GB8GB213321331866
RDIMMDRx88GB16GB213321331866
RDIMMDRx416GB32GB213321331866
LRDIMMQRx432GB64GB213321332133
LRDIMM 3DS8Rx464GB128GB213321332133
Ranks Per DIMM
and Data Width
(GB)
DRAM Density1DPC1DPC2DPC
4GB 8GB1.2V1.2V1.2V
1 Slot Per
Channel
Slot Per Channel (SPC),
and DIMM Per Channel (DPC)
2 Slots Per Channel
RDIMM / LRDIMM DDR4 Memory Support (E5-2600 v4 Motherboards)
Speed (MT/s), Voltage (V),
DIMM Capacity
DIMM Type
RDIMMSRx48GB16GB240024002133
RDIMMSRx84GB8GB240024002133
RDIMMDRx88GB16GB240024002133
RDIMMDRx416GB32GB240024002133
LRDIMMQRx432GB64GB240024002400
LRDIMM 3DS8Rx464GB128GB240024002400
Ranks Per DIMM
and Data Width
(GB)
DRAM Density1DPC1DPC2DPC
4GB 8GB1.2V1.2V1.2V
1 Slot Per
Channel
Slot Per Channel (SPC),
and DIMM Per Channel (DPC)
2 Slots Per Channel
4
Page 5
Memory Support Guidelines
3 Memory Population Order
Memory slots for the X10 UP motherboards are populated using the "Fill First" method. The
blue memory slot of each channel is considered the "rst DIMM" of the channel, while the
black slot is the second. When installing memory modules, be sure to populate the blue
memory slots rst before populating the black slots. To maximize memory capacity and
performance, please populate all DIMM slots on the motherboard. Refer to the table below
for the recommended DIMM population order.
Note 1. The following memory population table applies to X10SRW-F, X10SRi-F,
X10SRL-F, X10SRG-F, and X10SRH-CF/-CLN4F.
Note 2. X10SRM-F/-TF has 4-DIMM slots with 1DPC and will follow the same population order.
Recommended DIMM Population Order (1 CPU, 8-DIMM Slots)
Supermicro Memory Conguration User Guide for the X10 UP Series Motherboards
4 General Guidelines for Optimizing Memory Performance
1. All DIMMs must be DDR4 and Registered DIMMs must be ECC only.
2. Unbuffered DIMMs (UDIMM) are not supported.
3. A maximum of eight logical ranks per channel is allowed.
4. When single, dual, or quad rank DIMMs are populated for 2DPC, always populate the
higher number rank DIMM rst (starting from the farthest slot).
5. Be sure to use memory modules of the same type and speed. Mixing memory modules
of different types and speeds is not allowed.
6. Populating memory slots with a pair of DIMMs of the same type and size will result in
interleaved memory, which will improve memory performance.
7. Motherboards will support odd-numbered modules. However, to achieve the best
memory performance, a balanced memory population is recommended.
8. When one DIMM is used, it must be populated in the blue DIMM slot (furthest away
from the CPU) of a given channel.
9. Mixing of Physical Rank DIMMs within a channel is allowed.
10. Mixing of different DDR4 operating frequencies is not recommended. If DIMMs are
mixed, all DIMMs will run at the lowest common frequency.
General Population Requirements
DIMM Mixing Rules
• Please populate all memory modules with DDR4 DIMMs only.
• Mixing of LRDIMMs and RDIMMs is not allowed.
• Mixing of non-3DS and 3DS LRDIMM is not allowed.
Mixing of DIMM Types within a Channel
DIMM TypesRDIMMLRDIMM3DS LRDIMM
RDIMMAllowedNot AllowedNot Allowed
LRDIMMNot AllowedAllowedNot Allowed
3DS LRDIMMNot AllowedNot AllowedAllowed
6
Page 7
Memory Support Guidelines
5 DIMM Installation
1. Follow the instructions given in the
memory population order guidelines listed
in the previous sections to install memory
modules on your motherboard.
2. Push the release tabs outwards on both
ends of the DIMM slot to unlock it.
3. Align the key of the DIMM module with the
receptive point on the memory slot.
4. Align the notches on both ends of the
module against the receptive points on the
ends of the slot.
5. Press the notches on both ends of the
module straight down into the slot until the
module snaps into place.
JVRM2
JI2C1
JPG1
1-2:ENABLE
JPG1:VGA
2-3:DISABLE
2-3:DISABLE
J23
JTPM1
:TPM/PRO80
1-2:ENABLE
USB4/5
USB6/7
USB8/9
JI2C2
1
JPB1
OFF:DISABLE
ON: ENABLE
JPB1:BMC
JIPMB1
JPME2
S-SATA0
FANA
COM2
JVRM1
0N: POWER FORCE ON
I2C bus for PCI-E slot
JI2C1/JI2C2
BIOS
JPME2
2-3:ME MANUFACTURUNG MODE
1-2:Normal
S-SATA3
S-SATA2
S-SATA1
PCH SLOT2 PCI-E 2.0 X4(IN X8)
PCH SLOT1 PCI-E 2.0 X2(IN X8)
SP1
JBT1
JP3
I-SATA5
1-2:Normal
2-3:BIOS recovery
JBR1
JBR1
JSD2
JSD1
I-SATA1
I-SATA4
I-SATA3
I-SATA2
LE1
UID
VGA
JUIDB1
LEDM1
CPU SLOT3 PCI-E 3.0 X8
CPU SLOT4 PCI-E 3.0 X8
CPU SLOT6 PCI-E 3.0 X16
CPU SLOT5 PCI-E 3.0 X4(IN X8)
BT1
X10SRi-F
1.01REV:
DESIGNED IN USA
JSTBY1
JL1
JOH1
T-SGPIO3
T-SGPIO2
USB10(3.0)
I-SATA0
T-SGPIO1
USB11(3.0)
JF1
LE2
DIMMA2
DIMMA1
DIMMB1
PWR
ON
RST
PWR
FAILOH
BIOS
FF
NIC
2
LICENSE
NIC
1
JD1:
HDD
PWR
LED
SPEAKER4-7:
PWR LED1-3:
X
NMI
JD1
FAN4
FAN3
DIMMB2
USB2/3
LAN1
LAN2
(3.0)
JPL1:LAN1/2
1-2:ENABLE
2-3:DISABLE
JPL1
CPU
1
LGA2011-3
BAR CODE
IPMI CODE
MAC CODE
COM1
FAN5
USB0/1
IPMI_LAN
DIMMC2
DIMMD2
DIMMC1
DIMMD1
1
PWR I2C
JPI2C1
JPWR1
J24
1-2:RST
JWD1:Watch Dog
JWD1
2-3:NMI
FAN2
FAN1
6. Press the release tabs to the lock positions
to secure the DIMM module into the slot.
6 DIMM Removal
Reverse the steps above to remove memory
modules from the motherboard.
Notches
Release Tabs
Press both notches
straight down into
the memory slot.
7
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