Supermicro X10 UP User Manual

Page 1
Memory Conguration for
X10 UP Motherboards
(Socket R3)
USER’S GUIDE
Revision 1.0
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Acknowledgements
Intel is the rightful owner of the memory tables on page 4 and the copyright thereof. Super Micro Computer, Inc. incorporates the memory tables into this document under a general licensing provision between the two companies. The information provided in this document is for general reference only.
Disclaimer
The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual at any time and without notice. This product, including software and documentation, is the property of Supermicro and/ or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
Manual Revision 1.0
Release Date: March 22, 2018
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this document. Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2018 by Super Micro Computer, Inc. All rights reserved.
Printed in the United States of America
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Memory Support Guidelines
Memory Support for X10 UP Motherboards
This document provides the user with an easy-to-use guide for proper memory conguration and installation of X10 UP (Socket R3) motherboards utilizing RDIMM and LRDIMM DDR4 memory modules. To ensure proper memory installation, please follow the information and instructions listed below.
1 ESD Precautions
Electrostatic Discharge (ESD) can damage electronic com ponents, including memory modules. To avoid damaging DIMMs, it is important to handle them very carefully. The following measures are generally sufcient to protect your equipment from ESD.
Precautions
Use a grounded wrist strap designed to prevent static discharge.
Handle the memory module by its edges only.
Put the memory modules into antistatic bags when not in use.
Check the Supermicro website for recommended memory modules.
Note: All graphics shown in this manual are for reference only. Your system compo­nents may not look the same as the graphics shown in this guide.
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Supermicro Memory Conguration User Guide for the X10 UP Series Motherboards
2 Memory Support
The X10 UP (Socket R3) motherboards support Load Reduced DIMM (LRDIMM) and Registered DIMM (RDIMM) DDR4 (288-pin) ECC memory with speeds of up to 2400MHz in eight memory slots. Refer to the following tables for detailed information on memory support.
RDIMM / LRDIMM DDR4 Memory Support (E5-2600 v3 Motherboards)
Speed (MT/s), Voltage (V),
DIMM Capacity
DIMM Type
RDIMM SRx4 8GB 16GB 2133 2133 1866
RDIMM SRx8 4GB 8GB 2133 2133 1866
RDIMM DRx8 8GB 16GB 2133 2133 1866
RDIMM DRx4 16GB 32GB 2133 2133 1866
LRDIMM QRx4 32GB 64GB 2133 2133 2133
LRDIMM 3DS 8Rx4 64GB 128GB 2133 2133 2133
Ranks Per DIMM
and Data Width
(GB)
DRAM Density 1DPC 1DPC 2DPC
4GB 8GB 1.2V 1.2V 1.2V
1 Slot Per
Channel
Slot Per Channel (SPC),
and DIMM Per Channel (DPC)
2 Slots Per Channel
RDIMM / LRDIMM DDR4 Memory Support (E5-2600 v4 Motherboards)
Speed (MT/s), Voltage (V),
DIMM Capacity
DIMM Type
RDIMM SRx4 8GB 16GB 2400 2400 2133
RDIMM SRx8 4GB 8GB 2400 2400 2133
RDIMM DRx8 8GB 16GB 2400 2400 2133
RDIMM DRx4 16GB 32GB 2400 2400 2133
LRDIMM QRx4 32GB 64GB 2400 2400 2400
LRDIMM 3DS 8Rx4 64GB 128GB 2400 2400 2400
Ranks Per DIMM
and Data Width
(GB)
DRAM Density 1DPC 1DPC 2DPC
4GB 8GB 1.2V 1.2V 1.2V
1 Slot Per
Channel
Slot Per Channel (SPC),
and DIMM Per Channel (DPC)
2 Slots Per Channel
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Memory Support Guidelines
3 Memory Population Order
Memory slots for the X10 UP motherboards are populated using the "Fill First" method. The blue memory slot of each channel is considered the "rst DIMM" of the channel, while the black slot is the second. When installing memory modules, be sure to populate the blue memory slots rst before populating the black slots. To maximize memory capacity and performance, please populate all DIMM slots on the motherboard. Refer to the table below for the recommended DIMM population order.
Note 1. The following memory population table applies to X10SRW-F, X10SRi-F, X10SRL-F, X10SRG-F, and X10SRH-CF/-CLN4F.
Note 2. X10SRM-F/-TF has 4-DIMM slots with 1DPC and will follow the same popula­tion order.
Recommended DIMM Population Order (1 CPU, 8-DIMM Slots)
Number of DIMMs Memory Population Sequence
1 DIMMA1
2 DIMMA1 / DIMMB1
(Unbalanced: Not Recommended)
3
4 DIMMA1 / DIMMB1 / DIMMD1 / DIMMC1
5
(Unbalanced: Not Recommended)
6
(Unbalanced: Not Recommended)
7
(Unbalanced: Not Recommended)
8 DIMMA1 / DIMMA2 / DIMMB1 / DIMMB2 / DIMMD2 / DIMMD1 / DIMMC2 / DIMMC1
DIMMA1 / DIMMA2 / DIMMB1 / DIMMD1 / DIMMC1
DIMMA1 / DIMMA2 / DIMMB1 / DIMMD1 / DIMMC2 / DIMMC1
DIMMA1 / DIMMA2 / DIMMB1 / DIMMB2 / DIMMD1 / DIMMC2 / DIMMC1
DIMMA1 / DIMMB1 / DIMMC1
DIMMA2
DIMMA1
DIMMB2
DIMMB1
1
LGA2011-3
1
DIMMC2
DIMMD2
DIMMD1
DIMMC1
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Supermicro Memory Conguration User Guide for the X10 UP Series Motherboards
4 General Guidelines for Optimizing Memory Performance
1. All DIMMs must be DDR4 and Registered DIMMs must be ECC only.
2. Unbuffered DIMMs (UDIMM) are not supported.
3. A maximum of eight logical ranks per channel is allowed.
4. When single, dual, or quad rank DIMMs are populated for 2DPC, always populate the higher number rank DIMM rst (starting from the farthest slot).
5. Be sure to use memory modules of the same type and speed. Mixing memory modules of different types and speeds is not allowed.
6. Populating memory slots with a pair of DIMMs of the same type and size will result in interleaved memory, which will improve memory performance.
7. Motherboards will support odd-numbered modules. However, to achieve the best memory performance, a balanced memory population is recommended.
8. When one DIMM is used, it must be populated in the blue DIMM slot (furthest away from the CPU) of a given channel.
9. Mixing of Physical Rank DIMMs within a channel is allowed.
10. Mixing of different DDR4 operating frequencies is not recommended. If DIMMs are mixed, all DIMMs will run at the lowest common frequency.
General Population Requirements
DIMM Mixing Rules
Please populate all memory modules with DDR4 DIMMs only.
Mixing of LRDIMMs and RDIMMs is not allowed.
Mixing of non-3DS and 3DS LRDIMM is not allowed.
Mixing of DIMM Types within a Channel
DIMM Types RDIMM LRDIMM 3DS LRDIMM
RDIMM Allowed Not Allowed Not Allowed
LRDIMM Not Allowed Allowed Not Allowed
3DS LRDIMM Not Allowed Not Allowed Allowed
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Memory Support Guidelines
5 DIMM Installation
1. Follow the instructions given in the memory population order guidelines listed in the previous sections to install memory modules on your motherboard.
2. Push the release tabs outwards on both ends of the DIMM slot to unlock it.
3. Align the key of the DIMM module with the receptive point on the memory slot.
4. Align the notches on both ends of the module against the receptive points on the ends of the slot.
5. Press the notches on both ends of the module straight down into the slot until the module snaps into place.
JVRM2
JI2C1
JPG1
1-2:ENABLE
JPG1:VGA 2-3:DISABLE
2-3:DISABLE
J23
JTPM1
:TPM/PRO80
1-2:ENABLE
USB4/5
USB6/7
USB8/9
JI2C2
1
JPB1
OFF:DISABLE
ON: ENABLE
JPB1:BMC
JIPMB1
JPME2
S-SATA0
FANA
COM2
JVRM1
0N: POWER FORCE ON
I2C bus for PCI-E slot JI2C1/JI2C2
BIOS
JPME2
2-3:ME MANUFACTURUNG MODE
1-2:Normal
S-SATA3
S-SATA2 S-SATA1
PCH SLOT2 PCI-E 2.0 X4(IN X8)
PCH SLOT1 PCI-E 2.0 X2(IN X8)
SP1
JBT1
JP3
I-SATA5
1-2:Normal
2-3:BIOS recovery
JBR1
JBR1
JSD2
JSD1
I-SATA1
I-SATA4
I-SATA3
I-SATA2
LE1
UID
VGA
JUIDB1
LEDM1
CPU SLOT3 PCI-E 3.0 X8
CPU SLOT4 PCI-E 3.0 X8
CPU SLOT6 PCI-E 3.0 X16
CPU SLOT5 PCI-E 3.0 X4(IN X8)
BT1
X10SRi-F
1.01REV:
DESIGNED IN USA
JSTBY1
JL1
JOH1
T-SGPIO3 T-SGPIO2
USB10(3.0)
I-SATA0
T-SGPIO1
USB11(3.0)
JF1
LE2
DIMMA2
DIMMA1
DIMMB1
PWR ON RST PWR FAIL OH
BIOS
FF NIC 2
LICENSE
NIC 1
JD1: HDD PWR LED
SPEAKER4-7:
PWR LED1-3:
X
NMI
JD1
FAN4
FAN3
DIMMB2
USB2/3
LAN1
LAN2
(3.0)
JPL1:LAN1/2 1-2:ENABLE 2-3:DISABLE
JPL1
CPU
1
LGA2011-3
BAR CODE
IPMI CODE
MAC CODE
COM1
FAN5
USB0/1
IPMI_LAN
DIMMC2
DIMMD2
DIMMC1
DIMMD1
1
PWR I2C
JPI2C1
JPWR1
J24
1-2:RST
JWD1:Watch Dog
JWD1
2-3:NMI
FAN2
FAN1
6. Press the release tabs to the lock positions to secure the DIMM module into the slot.
6 DIMM Removal
Reverse the steps above to remove memory modules from the motherboard.
Notches
Release Tabs
Press both notches
straight down into
the memory slot.
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