Sun Oracle Sun Blade X3-2B Service Manual

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual

Part No: E20885–08 May, 2014

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Contents

Using This Documentation ...................................................................................................................5

Sun Blade X3–2B Model Name Change .......................................................................................5

Getting the Latest Firmware and Software ...................................................................................6

Documentation and Feedback ......................................................................................................6

About This Documentation ...........................................................................................................6

Support and Training .....................................................................................................................7

Contributors ....................................................................................................................................7

Change History ...............................................................................................................................7

Service Manual Overview ......................................................................................................................9

About the Sun Blade X3-2B ................................................................................................................ 11

Product Description .................................................................................................................... 11

Front Panel Features .................................................................................................................... 12

Front Panel LEDs and Buttons ................................................................................................... 14

Rear Panel Features ...................................................................................................................... 20

About the System Chassis ...........................................................................................................21

About Oracle ILOM ..................................................................................................................... 22

About the Chassis Monitoring Module (CMM) ...................................................................... 23

Replaceable Server Module Components ................................................................................. 24

Preparing the Sun Blade X3-2B for Service ...................................................................................... 27

Obtaining the Server Module Serial Number ........................................................................... 27

Powering O the Server Module ................................................................................................ 28

Performing ESD and Antistatic Prevention Measures ............................................................ 33

Set Up for ESD Prevention .......................................................................................................... 34

Managing the Locate LED ........................................................................................................... 35

Remove the Server Module from the Sun Blade Chassis ......................................................... 36

Remove the Server Module Top Cover ..................................................................................... 39

Removing or Inserting Filler Panels ........................................................................................... 40

About the Multi-port Cable ........................................................................................................ 42

Contents

Attach a Dongle Cable ................................................................................................................. 43

Servicing Sun Blade X3-2B Components ......................................................................................... 45

Servicing a Storage Drive (CRU) ................................................................................................ 45

Servicing DIMMs (CRU) ............................................................................................................ 55

Replace the System Battery (CRU) ............................................................................................ 66

Servicing USB Flash Drives (CRU) ............................................................................................ 67

Servicing a Fabric Expansion Module (CRU) ........................................................................... 70

Servicing a RAID Expansion Module (CRU) ........................................................................... 72

Servicing Cables (CRU) ............................................................................................................... 77

Servicing a Processor and Heat Sink Assembly (FRU) ............................................................ 79

Servicing the Motherboard Assembly (FRU) ........................................................................... 93

Returning Sun Blade X3-2B to Operation ...................................................................................... 101

Install the Server Module Top Cover ....................................................................................... 101

Install the Sun Blade X3-2B in the Chassis .............................................................................. 102

Powering On the Server Module .............................................................................................. 103

Troubleshooting the Sun Blade X3-2B ........................................................................................... 107

Diagnosing Server Module Hardware Faults .......................................................................... 107

Troubleshooting Using LED Status Indicators ...................................................................... 108

Using the DIMM and Processor Test Circuit ......................................................................... 108

Troubleshooting Server Module Power States ....................................................................... 109

Firmware and Software Troubleshooting ............................................................................... 110

BIOS Power-On Self-Test (POST) Checkpoints ........................................................................... 113

About POST Code Checkpoint Memory Testing .................................................................. 113

Viewing POST Code Checkpoints ........................................................................................... 113

POST Code Checkpoint Reference .......................................................................................... 115

Getting Server Firmware and Software ........................................................................................... 125

Firmware and Software Updates .............................................................................................. 125

Firmware and Software Access Options .................................................................................. 126

AvailableSoftware Release Packages ....................................................................................... 126

Accessing Firmware and Software ........................................................................................... 127

Installing Updates ...................................................................................................................... 131

Index ................................................................................................................................................... 133

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,20144

UsingThis Documentation

This section describes how to get the latest rmware and software for the system, documentation and feedback, and a document change history.

■

“Sun Blade X3–2B Model Name Change” on page 5

■

“Getting the Latest Firmware and Software” on page 6

■

“Documentation and Feedback” on page 6

■

“About This Documentation” on page 6

■

“Support and Training” on page 7

■

“Contributors” on page 7

■

“Change History” on page 7

Sun Blade X3–2B Model Name Change

The Sun Blade X3-2B was previously named the Sun Blade X6270 M3 Server Module. This name might still appear in the software. The name change does not indicate any change in system features or functionality.

The new name identies the following:

■

X identies an x86 product.

■

The rst number, 3, identies the generation of the server.

■

The second number, 2, identies the number of processors.

■

The alpha character, B, identies the product as a blade server.

Getting the Latest Firmware and Software

Firmware, drivers, and other hardware-related software for each Oracle x86 server, server module (blade), and blade chassis are updated periodically.

You can obtain the latest version in one of three ways:

■

Oracle System Assistant – This is a new factory-installed option for Sun Oracle x86 servers. It has all the tools and drivers you need and resides on a USB drive installed in most servers.

■

My Oracle Support – http://support.oracle.com

■

Physical media request

For more information, see

“Getting Server Firmware and Software” on page 125.

Documentation and Feedback

Documentation Link

All Oracle products http://www.oracle.com/documentation

Sun Blade X3-2B http://www.oracle.com/

Oracle ILOM 3.1 http://www.oracle.com/

Oracle Hardware Management Pack http://www.oracle.com/

Provide feedback on this documentation at: http://www.oracle.com/goto/docfeedback.

About This Documentation

This documentation set is available in both PDF and HTML. The information is presented in topic-based format (similar to online help) and therefore does not include chapters, appendixes, or section numbering.

pls/topic/lookup?ctx=SunBladeX3-2B

pls/topic/lookup?ctx=ilom31

pls/topic/lookup?ctx=ohmp

You can generate a PDF that includes all information about a particular topic subject (such as hardware installation or product notes) by clicking the PDF button in the upper left corner of the HTML page.

Some of the documents are translated into French, Spanish, Simplied Chinese, and Japanese.

The most up-to-date versions of the documents are available in English.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,20146

Support andTraining

These web sites provide additional resources:

■

Support: http://support.oracle.com

■

Training: http://education.oracle.com

Contributors

Primary Authors: Ray Angelo, Lisa Kuder, Cynthia Chin-Lee, Mark McGothigan.

Contributors: Yi Cai, Kenny Tung, Salomon Chavez Velazquez, Daniel Silverman, Johnny Hui, Angela Vlahos, Anand Srinivasan, Darren Tran, Mark Stanton, Denise Silverman, Ralph Woodley, Mick Tabor

Change History

The following lists the release history of this documentation set:

■

May 2014. Revised Product Notes for SW v1.3. Revised Service Manual.

■

May/August 2013. Updated the supported OS list in Product Notes and revised Administration Guide, Installation Guide, Security Guide.

■

March 2013. Revised Installation Guide and Product Notes.

■

January 2013. Revised Product Notes, Administration Guide, Installation Guide

■

November 2012. Updated for SW 1.2 and document refresh. Revised Product Notes, Service Manual, Installation Guide, and Administration Guide.

■

August 2012. Revised Product Notes only.

■

July 2012. Revised Product Notes only.

■

July 2012. Server model name changed. All documents revised.

■

June 2012. Updated for SW 1.1. Revised Product Notes and Service Manual.

■

May 2012. Updated for SW 1.0.1. Documentation library re-released with editorial revisions.

■

April 2012. Initial publication.

Change History

Service Manual Overview

Note – Important: The Sun Blade X3-2B was formerly named the Sun Blade X6270 M3 server

module. This name might still appear in the software. The name change does not indicate any change in system features or functionality.

The Sun Blade X3-2B Service Manual contains service, component removal and replacement, and maintenance procedures for the Sun Blade X3-2B. The following table describes the major sections.

Description Link

An overview of the server module and its components. “About the Sun Blade X3-2B” on page 11

Procedures for preparing to service the server module. Power information and procedures for powering o the server module.

Procedures for removal and installation of server module components.

Procedures for preparing to return the server to operation. This section also describes power information and procedures related to powering on the server module.

Corrective maintenance-related information and procedures. This section also describes how to restore your Oracle ILOM SP rmware.

Explains POST code checkpoint testing, provides methods to view POST checkpoint codes, lists the POST code checkpoints, and describes how to congure POST code checkpoint options.

Explains the options for accessing server rmware and software.

“Preparing the Sun Blade X3-2B for Service ” on page 27

“Servicing Sun Blade X3-2B Components ” on page 45

“Returning Sun Blade X3-2B to Operation ” on page 101

“Troubleshooting the Sun Blade X3-2B” on page 107

“BIOS Power-On Self-Test (POST) Checkpoints ” on page 113

“Getting Server Firmware and Software” on page 125

About the Sun Blade X3-2B

This section contains an overview of the Sun Blade X3-2B and its components. The following topics are covered:

■

“Product Description” on page 11

■

“Front Panel Features” on page 12

■

“Front Panel LEDs and Buttons” on page 14

■

“Rear Panel Features” on page 20

■

“About the System Chassis” on page 21

■

“About Oracle ILOM ” on page 22

■

“About the Chassis Monitoring Module (CMM) ” on page 23

■

“Replaceable Server Module Components” on page 24

Product Description

The Sun Blade X3-2B is an enterprise class blade server that supports two processors (2P) congurations. The server module has a standard Sun Blade 6000 chassis blade form factor and compatibility with RAID expansion modules (REMs) and fabric expansion modules (FEMs). The Sun Blade X3-2B is based on two Intel(R) Xeon(R) processors in the E5-2600 family, and the Intel C600 series chipset. The Sun Blade X3-2B includes an on-board Oracle ILOM service processor (SP).

Front Panel Features

Related Information

■

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Installation Guide

Front Panel Features

The following illustration shows front panel features on the Sun Blade X3-2B.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201412

Front Panel Features

Figure Legend

1 Locate button and LED – white 8 USB ports (2)

2 Ready to remove LED – blue 9 Universal connector port (UCP)

3 Service action required LED – amber 10 Storage drive (HDD 0)

4 Power OK LED – green 11 Storage drive (HDD 1)

5 Power button 12 Storage drive (HDD 2)

6 NMI Reset button (Service only) 13 Storage drive (HDD 3)

Front PanelLEDs and Buttons

Figure Legend

7 RFID tag (with serial number) 14 Ejectorlevers

Related Information

■

“Front Panel LEDs and Buttons” on page 14

■

“Identifying Storage Drive LEDs and Mechanical Components” on page 47

■

“Rear Panel Features” on page 20

Front Panel LEDs and Buttons

The topics included in this section show the location of the front panel LEDs and buttons and describe their functions.

Location of Front Panel LED and Buttons

This illustration shows the location of the front panel LEDs and buttons.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201414

Front PanelLEDs and Buttons

The descriptions and functions are described below.

Locate LED Button

Front PanelLEDs and Buttons

Functionality:

■

Combination white LED and button.

■

The Locate LED button is used to activate the Locate LED to identify a server module within a chassis.

■

The Locate LED button is also used for some Oracle ILOM procedures.

■

Press the Locate LED button to activate the Locate LED. You can also remotely activate the Locate LED from Oracle ILOM.

■

See “Managing the Locate LED”on page 35.

Ready ToRemove LED

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201416

Front PanelLEDs and Buttons

Functionality:

■

Blue LED.

■

Indicates when it is safe to remove the server module from the chassis.

■

O: Normal operation. Do not remove the server module.

■

On solid: The server module is ready to remove. See “Remove the Server Module from the

Sun Blade Chassis” on page 36

Service Action Required LED

Front PanelLEDs and Buttons

Functionality:

■

Amber LED.

■

Service Action Required LED indicates a server module fault.

■

O: Normal operation.

■

On solid: The server module has a fault. See “Troubleshooting the Sun Blade X3-2B” on

page 107

PowerOK LED and Button

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201418

Front PanelLEDs and Buttons

Functionality:

■

Green LED.

■

Power button is used to toggle the server between standby power and full power mode.

■

Operation of the Power button requires the use of a stylus.

■

The Power/OK LED indicates the status of the server power.

■

LED states:

■

Service processor is starting: Fast blink

■

Host is booting: Slow blink at 1 Hz.

■

Standby power mode: Blink 0.2 seconds on, 2.8 seconds o

■

Full power mode: On solid (does not blink)

■

Press to power the server module on or o. See “Powering O the Server Module” on

page 28

or “PoweringOn the Server Module” on page 103.

NMI Button

Rear Panel Features

Functionality:

The NMI (non-maskable interrupt) button is for service use only. Do not press.

Related Information

■

“Front Panel Features” on page 12

■

“Rear Panel Features” on page 20

Rear Panel Features

The following illustration shows rear panel features on the Sun Blade X3-2B.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201420

About the System Chassis

Figure Legend

1 Power connector 3 Protective shipping cover for rear connector

(remove before inserting into chassis)

2 I/O connector 4 USB ash drives 2, 3 (P0 and P1)

Related Information

■

“Front Panel Features” on page 12

■

“Front Panel LEDs and Buttons” on page 14

■

“About the System Chassis” on page 21

About the System Chassis

The Sun Blade X3-2B is used in a Sun Blade 6000 chassis. When fully loaded, the Sun Blade 6000 chassis can hold a combination of up to ten server modules and blades. Power limitations apply to the number of server modules that can be installed in a Sun Blade 6000 modular system. For more information about the Sun Blade X3–2B conguration and compatibility, see

Server Module Components” in Sun Blade X3-2B (formerly Sun Blade X6270 M3) Product

Notes

Related Information

■

Sun Blade 6000 Modular System Chassis documentation (http://www.oracle.com/pls/ topic/lookup?ctx=sb6000)

“Supported

About Oracle ILOM

Oracle Integrated Lights Out Manager (Oracle ILOM) is system management rmware that is preinstalled on an embedded service processor (SP) on Oracle's x86- and SPARC-based servers. Oracle ILOM enables you to actively manage and monitor components in the server in both standby power and full power modes. Using Oracle ILOM, you can remotely manage and monitor the server as if you were using a locally attached keyboard, monitor, and mouse. The Oracle ILOM rmware automatically initializes when standby power is applied to the server.

Oracle ILOM allows you to choose either a command-line interface (CLI) or a browser-based interface.

Note – The chassis also has Oracle ILOM installed on the chassis monitoring module (CMM),

which is used to manage chassis functions.

With Oracle ILOM, you can:

■

Monitor the status of server module sensors and indicators.

■

Monitor hardware errors and faults and send events using SNMP traps or e-mail alerts when faults occur.

■

Remotely control the power state of your server module.

■

Congure the server module BIOS settings.

The SP has a dedicated Ethernet port, and it runs its own Oracle ILOM embedded OS, providing out-of-band management capability. In addition, you can access Oracle ILOM from the server's host OS.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201422

About the Chassis Monitoring Module (CMM)

Related Information

■

“About the Chassis Monitoring Module (CMM) ” on page 23

■

Oracle Integrated Lights Out Manager (ILOM) 3.1 Documentation Collection (http://www.oracle.com/pls/topic/lookup?ctx=ilom31).

■

“Oracle Integrated Lights Out Manager (ILOM)” in Sun Blade X3-2B (formerly Sun Blade X6270 M3) Administration Guide

About the Chassis Monitoring Module (CMM)

The chassis monitoring module (CMM) provides a common management interface for each server module. The CMM is the primary point of management interaction for all shared chassis components and functions.

The CMM indicator panel is located on the rear of the chassis.

Each blade is assigned an IP address that is used for CMM management. IP addresses for server module blades are assigned by static or DHCP methods.

Related Information

■

Sun Blade 6000 Modular System documentation (http://www.oracle.com/ us/products/servers-storage/servers/blades/sun-blade-6000-chassis/overview/ index.html)

■

Oracle Integrated Lights Out Manager (ILOM) 3.1 Documentation Collection (http://www.oracle.com/pls/topic/lookup?ctx=ilom31)

Replaceable Server Module Components

This section includes an illustrated parts breakdown, replaceable component (CRU and FRU) list, and information about component serviceability.

The following topics are covered:

■

“Illustrated Parts Breakdown” on page 24

■

“Replaceable Components (FRUs and CRUs)” on page 25

■

“Component Serviceability” on page 26

Illustrated Parts Breakdown

The following illustration and table identies Sun Blade X3-2B internal components.

Figure Legend

1 Storage drives (4

maximum, HDD or SSD)

2 RAID expansion module

(REM)

3 Processors (0 and 1) 8 System battery (type: CR2032 )

4 Heat sink assemblies (0

and 1)

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201424

6 USB 2.0 drives (0 and 1)

7 DIMMs DDR3 LV (24 maximum)

9 Server module enclosure (Includes motherboard, disk

backplane, and enclosure assembly.)

Figure Legend

Replaceable Components (FRUs and CRUs)

5 Fabric expansion modules

(FEM)

Note – FEMs are available

in two possible form factors (single-width and double-width).

10 REM storage drive cable

Related Information

■

“Replaceable Components (FRUs and CRUs)” on page 25

■

“Component Serviceability” on page 26

Replaceable Components (FRUs and CRUs)

The replaceable components in your Sun Blade X3-2B are designated as either eld-replaceable units (FRU) or customer-replaceable units (CRU). A part designated as a FRU must be replaced by an Oracle-qualied service technician. A part designated as a CRU can be replaced by a person who is not an Oracle-qualied service technician. The following table lists the FRU and CRU components.

Component Description Designation

HDDs or SSDs (and llers) CRU

DIMMs (and llers) CRU

Battery, system CRU

USB 2.0 drives (rear) CRU

FEM CRU

REM CRU

REM storage drive cable CRU

Processor and heat sink assembly (CPU) FRU

Motherboard and blade enclosure assembly FRU

Related Information

■

“Illustrated Parts Breakdown” on page 24

■

“Component Serviceability” on page 26

Component Serviceability

Components are either hot serviceable or cold serviceable.

■

Hot service capability allows you to safely remove this component while the server module

is running.

■

Cold service capability requires you to remove the server module from service.

The following table lists the serviceability of components.

Component Description Serviceability

HDDs or SSDs (and llers)

DIMMs (and optional llers) Cold

Battery, system Cold

USB 2.0 drives (rear) Cold

FEM Cold

REM Cold

REM storage drive cable Cold

Hot

Processor and heat sink assembly (CPU) Cold

Motherboard and blade enclosure assembly Cold

Before removing consult your operating system for instructions on safe removal.

Related Information

■

“Illustrated Parts Breakdown” on page 24

■

“Replaceable Components (FRUs and CRUs)” on page 25

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201426

Preparing the Sun Blade X3-2B for Service

This section describes how to safely prepare the Sun Blade X3-2B for service and component removal and replacement. Power information and procedures are also included:

■

“Obtaining the Server Module Serial Number ” on page 27

■

“Powering O the Server Module” on page 28

■

“Performing ESD and Antistatic Prevention Measures” on page 33

■

“Set Up for ESD Prevention” on page 34

■

“Managing the Locate LED” on page 35

■

“Remove the Server Module from the Sun Blade Chassis” on page 36

■

“Remove the Server Module Top Cover” on page 39

■

“Removing or Inserting Filler Panels” on page 40

■

“About the Multi-port Cable” on page 42

■

“Attach a Dongle Cable” on page 43

Obtaining the Server Module Serial Number

To obtain support for your server module, you need the serial number.

The serial number (SysSN) is located on the front panel of the server module on an RFID label, as shown in the following gure.

PoweringO the Server Module

Note – The serial number is also visible on the top of the server module. Access requires server

module removal.

Related Information

■

“Front Panel Features” on page 12

■

“Powering O the Server Module” on page 28

Powering O the Server Module

This section contains information and procedures related to power and powering o the server module:

■

“Power Modes” on page 28

■

“Graceful Power O Using the Power Button” on page 29

■

“Immediate Power O Using the Power Button” on page 29

■

“Complete Power Removal” on page 30

■

“Remote PowerO Using Oracle ILOM SP CLI” on page 31

■

“Remote PowerO Using Oracle ILOM SP Web Interface” on page 32

Power Modes

The Sun Blade X3-2B has two power modes, full power mode and standby power mode.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201428

BeforeYou Begin

Full power mode is the normal operational mode for the server. When the server enters full power mode, power is supplied to all the server components, the server boots, and the operating system (OS) functions. You achieve full power mode by pressing the Power button on the server front panel when the server is in standby power mode. You can also achieve full power mode by powering on the server from Oracle ILOM. Once the server is operating in full power mode, the Power OK LED is on continuously (does not blink).

Standby power is a non-operating mode, where minimum power is supplied to the components that are required to run the service processor (SP), but the OS is not booted. To enter standby power mode, install the server into a fully-powered chassis, but do not press the front panel Power button. You can also enter standby power mode by powering o the server (from an operational full power mode) using one of the power-o methods (see below). In standby power mode, the front panel Power LED blinks quickly while the SP is booting, and slowly when the SP has booted.

▼

Graceful PowerO Using the Power Button

Note – This procedure is performed locally requiring access to the server module front panel.

Pressing the Power button causes operating systems with Advanced Conguration and Power Interface (ACPI) to perform an orderly shutdown of the OS. Server modules not running ACPI-enabled operating systems might ignore this event, and the host does not shut down.

■

“Front Panel LEDs and Buttons” on page 14

■

“Power Modes” on page 28

PowerModes

See Also

Use a stylus, to gently press and releasethe Power button on the front panel.

See the illustration in

Verify that the full power is o.

“Powering O the Server Module” on page 28.

The OK LED on the front panel blinks, indicating that the server module is in standby power mode.

■

“Manage the Locate LED Remotely From Oracle ILOM SP Web Interface” on page 35

■

“Manage the Locate LED Remotely From Oracle ILOM CLI” on page 36

■

“Complete Power Removal” on page 30

▼

Immediate Power O Using the Power Button

This procedure is performed locally requiring access to the server module front panel.

PowerModes

BeforeYou Begin

See Also

Caution – Data loss. All applications and les will be closed abruptly without changes being

saved.

■

“Front Panel LEDs and Buttons” on page 14

■

“Power Modes” on page 28

Use a stylus to press and hold the Power button for at least ve seconds until the full power is o

and the server module enters standby power mode.

Verify that the full power is o, and that the OK LED on the front panel blinks, indicating that the

server module is in standby power mode.

“Front Panel LEDs and Buttons” on page 14.

See

■

“Manage the Locate LED Remotely From Oracle ILOM SP Web Interface” on page 35

■

“Manage the Locate LED Remotely From Oracle ILOM CLI” on page 36

■

“Complete Power Removal” on page 30

▼

Complete Power Removal

Powering the server module from full power mode to standby power mode does not power o the server completely. In some situations, it might be necessary to remove power from the server module and place it in an non-powered state. To do this, you must disengage the server module from the chassis backplane by partially removing it.

BeforeYou Begin

Use this procedure to remove power from the server module by partially removing it from the chassis.

“Remove the Server Module from the Sun Blade Chassis” on page 36.

See

Place the server module in standby power mode.

“Powering O the Server Module” on page 28.

See

To partially remove the servermodule, pull it out approximately 3 inches (8 cm) from the rack

using the ejector levers.

Caution – Component damage or data loss. Server modules should be removed only if the blue

Ready to Remove LED is lit, or if you are certain that a rmware update is not in progress. Pulling the server module out of the chassis during a rmware update might damage the server module, which might not be repairable in the eld.

Alternatively, you can remove the server module from the chassis.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201430

See Also

If you completelyremove the servermodule from the chassis, insert a ller panel in its place

within 60 seconds.

Caution – Component damage or data loss. Do not insert a server module into the chassis until at

least 20 seconds has elapsed since the server module was disengaged from the midplane connector.

■

“Graceful Power O Using the Power Button” on page 29

■

“Immediate Power O Using the Power Button” on page 29

■

“Remote PowerO Using Oracle ILOM SP CLI” on page 31

■

“Remote PowerO Using Oracle ILOM SP Web Interface” on page 32

■

Oracle Integrated Lights Out Manager (ILOM) 3.1 Documentation Collection (http://www.oracle.com/pls/topic/lookup?ctx=ilom31)

▼

Remote Power O Using Oracle ILOM SP CLI

You can use the service processor command-line interface (CLI) to remotely perform power o the server module.

Log into the server module host OS as a superuser or equivalent.

Depending on the type of problem, you might want to view server module status or log les, or run diagnostics before you shut down the server module.

PowerModes

Notify users of impending power-o.

Save any open les and quit all running programs.

Refer to your application documentation for specic information.

Open an SSH session to the SP.

“Access Oracle ILOM Using CLI” in Sun Blade X3-2B (formerly Sun Blade X6270 M3)

See

Administration Guide

The default user name is root, and the password is changeme.

The CLI prompt appears:

At the prompt,type one of the followingcommands:

■

For graceful power o:

PowerModes

See Also

stop /System

■

For immediate power o:

stop -force /System

■

“Graceful Power O Using the Power Button” on page 29

■

“Immediate Power O Using the Power Button” on page 29

■

“Complete Power Removal” on page 30

■

Oracle Integrated Lights Out Manager (ILOM) 3.1 Documentation Collection (http://www.oracle.com/pls/topic/lookup?ctx=ilom31)

▼

Remote Power O Using Oracle ILOM SP Web Interface

You can use the service processor web interface to perform a graceful shutdown of the server module.

Depending on the type of problem, you might want to view server module status, view log les, or run diagnostics before you shut down the server module.

Notify users of impending power-o.

Save any open les and quit all running programs.

Refer to your application documentation for specic information.

See

“Access Oracle ILOM Using a Web Browser” in Sun Blade X3-2B (formerly Sun Blade X6270

M3) Administration Guide

The default user name is root, and the password is changeme.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201432

Performing ESD and Antistatic Prevention Measures

The Summary screen appears.

In the Actions section of the Summary screen, verify that the powerstate is ON.

To performa graceful powero of the server, click the Turn Obutton.

Alternatively, other power o options are available in the Host Management > Power Control screen.

Click OK.

See Also

Oracle Integrated Lights Out Manager (ILOM) 3.1 Documentation Collection (http://www.oracle.com/pls/topic/lookup?ctx=ilom31)

Performing ESD and Antistatic Prevention Measures

The section contains important electrostatic discharge and antistatic information.

Caution – Component damage. Circuit boards and drives contain electronic components that

are extremely sensitive to static electricity. Ordinary amounts of static electricity from clothing or the work environment can destroy the components located on these boards. As a minimum precaution, do not touch the component's connector edges.

Using an Antistatic Wrist Strap and an Antistatic Mat

Wear an antistatic wrist strap and use an antistatic mat when handling components such as storage drive assemblies, circuit boards (including DIMMs), or PCIe cards. When servicing or removing server components, place an antistatic strap to your wrist and attach the clip end to a bare metal area on the chassis. Following this practice equalizes the electrical potentials between you and the server. Addtionally, always place ESD-sensitive components an antistatic mat or antistatic packaging.

Performing ESD and Antistatic Prevention Measures

Note – An antistatic wrist strap is not included in the accessory kit for the Sun Blade X3-2B.

However, antistatic wrist straps are included with optional components.

Related Information

“Set Up for ESD Prevention” on page 34

▼

Set Up for ESD Prevention

Prepare an antistatic surface to set parts on during the removal, installation, or replacement

process.

Place ESD-sensitive components such as the printed circuit boards on an antistatic mat. The following items can be used as an antistatic mat:

■

Antistatic bag used to wrap an Oracle replacement part

■

An ESD mat

■

A disposable ESD mat (shipped with some replacement parts or optional system components)

Attach an antistatic wrist strap.

When servicing or removing server module components, attach an antistatic strap to your wrist and then to a metal area on the chassis.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201434

Managing the Locate LED

See Also

“Performing ESD and Antistatic Prevention Measures” on page 33.

Managing the Locate LED

The Locate LED/button is located on the server module front panel (see “Front Panel LEDs and

BeforeYou Begin

Buttons” on page 14

server (locally) or use Oracle ILOM to remotely manage it. For example, you can use Oracle ILOM to turn on the Locate LED to nd a specic server within a chassis. Then, you can turn the Locate LED o, locally (or remotely) once you've found the server.

Note – Some Oracle ILOM procedures contain steps that require you to activate the Locate LED

locally.

This section contains the following procedures for managing the Locate LED Button:

■

“Manage the Locate LED Locally” on page 35

■

“Manage the Locate LED Remotely From Oracle ILOM SP Web Interface” on page 35

■

“Manage the Locate LED Remotely From Oracle ILOM CLI” on page 36

▼

Manage the LocateLED Locally

“Front Panel LEDs and Buttons” on page 14

To activateor deactivate the Locate LED, press the LocateLED button.

●

). You can manually activate and deactivate the LED button while at the

See Also

▼

Manage the LocateLED Remotely From Oracle ILOM SP Web Interface

“Access Oracle ILOM Using a Web Browser” in Sun Blade X3-2B (formerly Sun Blade X6270

See

M3) Administration Guide

The Oracle ILOM screen appears.

Select the server module.

The Oracle ILOM Summary screen appears.

In the Actions section, verify that the Locatorindicator is o, and then click the Turn On button.

Click OK.

The Locator indicator on the Summary screen changes to indicate the status of the Locate LED.

■

“Manage the Locate LED Remotely From Oracle ILOM CLI” on page 36

Managing the Locate LED

▼

■

Oracle Integrated Lights Out Manager (ILOM) 3.1 Documentation Collection (http://www.oracle.com/pls/topic/lookup?ctx=ilom31)

Manage the LocateLED Remotely From Oracle ILOM CLI

See

“Access Oracle ILOM Using CLI” in Sun Blade X3-2B (formerly Sun Blade X6270 M3)

Administration Guide

The CLI prompt appears:

–>

Typeone of the following commands:

■

To turn on the Locate LED, type:

–> set /System/ locator_indicator=on

■

To turn o the Locate LED, type:

–> set /System/ locator_indicator=off

To verify the status of the Locate LED, type:

–> show /System/ locator_indicator

See Also

The output of the command appears:

/System

Properties:

locator_indicator = Off

The value locator_indicator shows the status as either On or Off.

■

“Manage the Locate LED Remotely From Oracle ILOM SP Web Interface” on page 35

■

Oracle Integrated Lights Out Manager (ILOM) 3.1 Documentation Collection (http://www.oracle.com/pls/topic/lookup?ctx=ilom31)

▼

Remove the Server Module from the Sun Blade Chassis

The server module must be removed from the Sun Blade 6000 chassis to:

■

Service CRU and FRU internal system components such as: system battery, cables, rear USB drives, DIMMs, processors (CPU), REMs and FEMs.

■

Access Fault Remind buttons for processors and DIMMs.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201436

Managing the Locate LED

Note – You do not need to remove the server module from the Sun Blade chassis to service

storage drive components on the Sun Blade X3-2B front panel.

See

“Access Oracle ILOM Using CLI” in Sun Blade X3-2B (formerly Sun Blade X6270 M3)

Administration Guide

The CLI prompt appears: –>

Type:

-> set /System/ action=prepare_to_remove

Verify the removal status.Type:

-> show /System/ health

/System

Properties:

health = Offline

Oine status ensures that no rmware updates are taking place before you remove the blade.

Caution – Component damage or data loss. Server modules should be removed only if the blue

LED is lit, or if you are certain that a rmware update is not in progress. Pulling the server module out of the chassis during a rmware update might damage the server module, which might not be repairable in the eld.

Powero the server module or place it in standby powermode.

See

“Powering O the Server Module” on page 28.

When the server module is in standby power mode, the OK LED on the front panel blinks (0.1 second on, 2.9 seconds o).

To unlock the server module ejector arms, press the green tabs on the ends of ejector arms.

Caution – Component damage or data loss. Do not install a server module into the chassis until

at least 20 seconds has elapsed since the server module was disengaged from the chassis mid-plane connector.

Managing the Locate LED

To disengage the server module from the internal connector, rotate both ejector arms away from the server module atthe same time until fully extended.

The result of this action disengages the server module, places it in a no-power state, and leaves it protruding approximately three inches from the front of the chassis.

Caution – Component damage or personal injury. Do not attempt to remove the server module

using only the ejector levers.

Do one of the followingto remove the server module from the chassis:

Caution – Component damage or data loss. Server modules should be removed only if the blue

■

Complete removal: Pull the server module awayfrom the Sun Blade chassis (approximately 5–6 inches) using the ejector arms until you are able to grab the server module with both hands.To remove, pull the server module out of the chassis using both hands.

Caution – Component damage or personal injury. Blades can weigh up to 22 lbs (10kg). Use

two hands to install or remove the blade from the chassis.

■

Partial removal: Ensure that the servermodule is disengaged from the internal connector and protruding from the front of the chassis approximately 3 inches (8 cm). If necessary,use the ejector levers to pull the server module away from the chassis.

Note – This method is used to remove power from the server module. See “Complete Power

Removal” on page 30

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201438

Managing the Locate LED

Set the server module on a at antistatic surface.

“Performing ESD and Antistatic Prevention Measures” on page 33.

See

Caution – Component damage. Observe the proper ESD precautions when handling the server

module. Wear a securely grounded ESD wrist strap. Handle components by the edges only. Do not touch metal contacts. Damage to system components can occur through improper handling.

Insert a server module ller panel in the unused server slot to ensure properairow throughout

the system.

“Insert Server Module Filler Panels” on page 41.

See

Caution – Over-temperature condition. Always insert a server module ller panel into an empty

slot within 60 seconds to reduce the possibility of server module shutdown. Do not operate the chassis with empty slots. If you operate the chassis with an empty server module slot, you might notice a reduction in system performance. Possible system and component over-temperature warnings, shutdown, and heat-related damage might be caused by empty chassis slots.

See Also

Next Steps

Oracle Integrated Lights Out Manager (ILOM) 3.1 Documentation Collection (http://www.oracle.com/pls/topic/lookup?ctx=ilom31)

“Remove the Server Module Top Cover” on page 39

▼

Remove the Server Module Top Cover

You need to remove the server module cover to service components inside the Sun Blade X3-2B.

Note – You do not need to remove the top cover to access storage drives and internal USB 2.0

drives.

Powero the server module.

“Powering O the Server Module” on page 28.

See

Remove the servermodule from the chassis.

“Remove the Server Module from the Sun Blade Chassis” on page 36.

See

Attach an antistatic wrist strap.

“Performing ESD and Antistatic Prevention Measures” on page 33.

See

Removing or Inserting Filler Panels

Press down on the server module cover release button and, using the indent for leverage, slide

the top covertowardthe rear of the servermodule chassis approximately0.5 inch (12 mm).

Grasp the server module coverby its rear edge. Lift the cover straight up from the server

module.

Next Steps

“Insert Server Module Filler Panels” on page 41

“Servicing Sun Blade X3-2B Components ” on page 45

Removing or Inserting Filler Panels

A ller panel is a metal or plastic enclosure that does not contain any functioning system hardware or cables. The primary purpose of a ller is to occupy vacant slots to maintain cooling and proper air ow throughout the system. Do not operate your system with unoccupied slots. Improper cooling and airow can compromise the operating performance of your system and quickly damage components.

For server module ller panel removal and installation procedures see the following topics:

Note – For instructions for adding or replacing chassis component ller panels (for example,

network modules or chassis monitoring modules), refer to the documentation supplied with your chassis.

■

“Component Filler Panels ” on page 41

■

“Remove Server Module Filler Panels” on page 41

■

“Insert Server Module Filler Panels” on page 41

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201440

Component Filler Panels

In addition to ller panels in the chassis server module slots, each server module arrives with ller panels for storage drives and optional ller panels for memory modules. These component ller panels are installed at the factory and must remain in the server module until you are ready to replace them with a component.

To remove or insert component ller panels, choose one of the following procedures:

■

“Remove Storage Drive Filler Panels” on page 54

■

“Insert Storage Drive Filler Panels” on page 55

■

“Remove Optional DIMM Filler Panels” on page 65

■

“Install Optional DIMM Filler Panels” on page 65

▼

Remove Server Module Filler Panels

Locate the servermodule ller panel to be removed from the chassis.

To unlatch the server module ller panel from the chassis, press the button on the release lever

handle, and then lower the lever into the fully open position.

See Also

To remove the ller panel from the chassis,hold the release lever,and then gently slide the ller

panel toward you.

■

“Component Filler Panels ” on page 41

■

“Remove Server Module Filler Panels” on page 41

■

“Insert Server Module Filler Panels” on page 41

▼

Insert Server Module Filler Panels

Locate the vacant server module slot in the chassis.

About the Multi-port Cable

See Also

Ensure that the release lever is fully opened, and then align the ller panel with the vacant server module slot.

Slide the ller panel into the vacant server module slot.

As the release lever makes contact with the chassis, the lever will start to close.

Close the release lever until it locks the ller panel in place.

■

“Component Filler Panels ” on page 41

■

“Remove Server Module Filler Panels” on page 41

■

“Insert Server Module Filler Panels” on page 41

About the Multi-port Cable

The multi-port cable (dongle) provides a single multiple-interface access point to the server module. You can use the multi-port cable to connect devices directly into the universal connector port (UCP) on the front of the server module for service, maintenance, and OS installation procedures. Using the multi-port cable, you can work locally at the server and attach USB, serial, and video devices directly to the server module.

The following illustration shows the interfaces available through the UCP using the three-connector multi-port cable.

Note – Multi-port cables are available in two varieties, a newer three cable version and a four

cable version

The four-port cable has a DB-9 serial connector, while the three-port cable does not. Your chassis might ship with a DB-9-to-RJ-45 serial cable adapter. The adapter allows you to attach a serial cable with a DB-9 connector to the server module using the RJ-45 port on the multi-port cable.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201442

Figure Legend

About the Multi-port Cable

1 DB-15 (video port)

2 RJ-45 (serial management port)

3 USB 2.0 (2 ports)

Related Information

■

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Installation Guide

■

“Attach a Dongle Cable” on page 43

▼

Attach a Dongle Cable

The multi-port cable attaches to the front of the server module using the universal connector port (UCP). The multi-port cable is designed for temporary attachment. Disconnect the cable when nished.

Position the multi-port cable connector so the at side of the connector aligns with the at side

of the universal connector port (UCP).

About the Multi-port Cable

Gently squeeze the sides of the multi-port cable connector and insert the multi-portcable into the UCP on the server module front panel.

Connect the devices using the appropriate interfaces.

For an overview of the available interfaces on the multi-port cable, see

“About the Multi-port

Cable” on page 42.

Caution – Component damage. When not in use, do not leave the cable attached to the server

module. The multi-port cable is designed for temporary use.

To disconnect the multi-portcable, gently squeeze the sides of the cable connector and pull away from the server module.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201444

Servicing Sun Blade X3-2B Components

Note – Some of the procedures in this section are for customer-replaceable units (CRUs) and

some are for eld-replaceable units (FRUs), as noted in the procedures. FRU components must be replaced only by an Oracle Service technician. Contact your Oracle Service representative for assistance with FRU replacements. See

page 25

This section contains procedures and information about how to safely and eciently remove and install Sun Blade X3-2B components.

The following sections are covered:

■

“Servicing a Storage Drive (CRU)” on page 45

■

“Servicing DIMMs (CRU)” on page 55

■

“Replace the System Battery (CRU)” on page 66

■

“Servicing USB Flash Drives (CRU)” on page 67

■

“Servicing a Fabric Expansion Module (CRU)” on page 70

■

“Servicing a RAID Expansion Module (CRU)” on page 72

■

“Servicing Cables (CRU)” on page 77

■

“Servicing a Processor and Heat Sink Assembly (FRU)” on page 79

■

“Servicing the Motherboard Assembly (FRU)” on page 93

“Replaceable Components (FRUs and CRUs)” on

Servicing a Storage Drive (CRU)

Note – This component is a hot-swappable customer-replaceable unit (CRU).

Hot-swap capability allows you to safely remove this component while the server module is running. However, you might have to prepare the server module operating system before you remove drives.

To remove and install a hard drive (HD) or a solid state drive (SSD), use the following procedures:

Identifying Storage Drives

■

“Identifying Storage Drives” on page 46

■

“Identifying Storage Drive LEDs and Mechanical Components” on page 47

■

“About Storage Drive Failure and RAID ” on page 50

■

“About Disk Backplane Cabling” on page 51

■

“Remove a Storage Drive” on page 51

■

“Install a New Storage Drive” on page 52

■

“Replace a Storage Drive” on page 53

■

“Remove Storage Drive Filler Panels” on page 54

■

“Insert Storage Drive Filler Panels” on page 55

Identifying Storage Drives

The system software designation for storage drive devices (hard disk drives [HDD] or solid state drives [SSD]) is shown in the following gure.

Figure Legend

0 Hard disk drive (HDD 0) 2 Hard disk drive (HDD 2)

1 Hard disk drive (HDD 1) 3 Hard disk drive (HDD 3)

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201446

Identifying Storage Drive LEDs and Mechanical Components

Related Information

■

“Identifying Storage Drive LEDs and Mechanical Components” on page 47

Identifying Storage DriveLEDs and Mechanical Components

The topics included in this section show the location of the storage drive LEDs and mechanical components and describe their functions.

Legend Name

1 Ready to Remove LED

2 Service Action Required LED

3 Power/OK LED

4 Lever Release button

5 Lever

The functions of the storage drive LEDs and mechanical components are described below.

Ready to Remove LED

This topic describes the Ready to Remove LED.

Identifying Storage Drive LEDs and Mechanical Components

Functionality:

■

Blue LED.

■

Conditions:

■

On solid: The storage drive is in standby power mode. The storage drive can be removed safely during a hot-plug operation. A lit Ready to Remove LED indicates that service action is allowed on the storage drive. The “prepare_to_remove_status” status is “Ready (OK to remove).”

■

O: Normal operation. Do not remove the drive.

Service Action Required LED

This topic describes the Service Action Required LED.

Functionality:

■

Amber LED.

■

Conditions:

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201448

Identifying Storage Drive LEDs and Mechanical Components

■

On solid: The system has detected a fault with the storage drive.

■

O: Normal operation.

Power/OKLED

This topic describes the Power/OK LED.

Functionality:

■

Green LED

■

Identies the power state of the storage drive.

■

Conditions:

■

O: Poweris o or installed drive is not recognized by the system.

■

Blink, variable: Disk activity.

■

On solid (does not blink): The drive is engaged and is receiving full power.

Lever and Lever Release Button

This topic describes the operation and purpose of the storage drive lever and the lever release button.

About Storage Drive Failure and RAID

Functionality:

■

Press the lever release button to unlock the lever.

■

When the button is pressed, the spring-loaded lever unlocks and pops open.

■

Lever functions:

■

Drive removal: Use the lever to pull the drive out of the server. For more information, see

“Remove a Storage Drive” on page 51.

Drive installation: Use the lever to engage the drive with the internal connector. For more information, see

“Install a New Storage Drive” on page 52.

Related Information

■

“Identifying Storage Drives” on page 46

About Storage DriveFailure and RAID

A single storage device failure does not cause a data failure if the storage devices are congured as a mirrored RAID 1 volume (optional). Storage devices, such as HDDs, can be removed, and when a new storage device is inserted, the contents are automatically rebuilt from the rest of the array with no need to recongure the RAID parameters. If the replaced storage drive was congured as a hot-spare, the new HDD is automatically congured as a new hot-spare.

Before you permanently remove a storage device from the server that is part of an active RAID volume, you should delete the active RAID volume from the storage device. For information about how to delete a RAID volume, use the appropriate RAID management utility for the RAID controller installed.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201450

About Disk Backplane Cabling

Caution – Data loss. If you insert a storage device that has been congured with a RAID volume

into a server that did not previously have its storage devices congured with RAID volumes, the existing storage devices in the server will be converted to RAID volumes during automatic synchronization, and any existing data on the existing storage devices in the server is erased.

Related Information

■

“Conguring RAID” in Sun Blade X3-2B (formerly Sun Blade X6270 M3) Administration Guide

About Disk Backplane Cabling

The server has two internal disk backplanes. The right-side backplane supports drives HD 0 and HD 1. The left–side backplane supports drives HD 2 and HD 3. Each backplane has three connectors, one 10-pin power connector and two color-coded data connectors (one for each drive). Backplane power and data cables connect from connectors on the backplane to connectors on the motherboard. Cabling for the two disk backplanes is described below.

■

Disk backplane for HD 0 and 1:

■

Backplane power: the cable connects to the nearby DBP Power connector on the MB.

■

Blue connector on the backplane (HD 0): cable connects to the REM 0 connector on the

MB.

■

Black connector on the backplane (HD 1): cable connects to the REM 1 connector on the MB.

■

Disk backplane for HD 2 and 3:

■

Backplane power: the cable connects to the nearby DBP Power connector on the MB.

■

Blue connector on the backplane (HD 2) : cable connects to the REM 2 connector on the

MB.

■

Black connector on the backplane (HD 3): cable connects to REM 3 on the MB.

▼

Remove a Storage Drive

If necessary, prepare the server module operating system before you remove drives.

Refer to the OS documentation.

Locate the storage drive in the server module bays.

For drive locations on the server module, see

“Identifying Storage Drives” on page 46.

About Disk Backplane Cabling

View the storage drive front panel LEDs to identify the faultydrive in the server module.

Ensure that the blue Ready to Remove LED is lit. See

Mechanical Components” on page 47

Press the release lever button on the drive front panel, and then tilt the lever into a fully opened

position.

Hold the opened release lever and gently slide the drive towardyou.

If you arenot immediately replacing the drive, insert a ller panel into the empty driveslot on

the server.

Caution – Over-temperature condition. Do not operate the server with empty storage device

slots. Always insert a ller panel into an empty storage device slot. See

Filler Panels” on page 55

“Identifying Storage Drive LEDs and

“Insert Storage Drive

Next Steps

“Replace a Storage Drive” on page 53

▼

Install a New Storage Drive

Locate the storage drive ller panels in the server module bays.

For drive locations on the server, see

Remove the storage drive ller panels from the server module bays.

For instructions to remove drive ller panels, see

“Identifying Storage Drives” on page 46.

“Remove Storage Drive Filler Panels” on

page 54.

Ensure that the storage drive releaselever on the drive is in a fully opened position.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201452

About Disk Backplane Cabling

Slide the storage drive into the vacant slot by pressing the middle of the storage drive faceplate

with your thumb or nger until the release lever engages with the chassis.

The release lever starts to close as it makes contact with the chassis. Do not slide the storage drive in all the way. Leave the storage drive out approximately 0.25 to 0.50 inch (6 to 12 mm) from the opening.

Close the release lever until the storage drive clicks into place and is ush with the front of the

server.

A pawl near the hinge on the lever engages the sidewall drawing the drive inward and seating the drive connector with the internal hard drive backplane connector.

▼

Replace a Storage Drive

Remove a ller panel or storage drive from the storage device slot in the server module.

Ensure that the storage drive releaselever is in a fully opened position.

Slide the storage drive into the vacant slot by pressing the middle of the storage drive faceplate

with your thumb or nger until the release lever engages with the chassis.

The release lever will start to close as it makes contact with the chassis. Do not slide the storage drive in all the way. Leave the storage drive out approximately 0.25 to 0.50 inch (6 to 12 mm) from the opening.

About Disk Backplane Cabling

Close the release lever until the storage drive clicks into place and is ush with the front of the

server.

Note – If the storage devices were previously congured as a mirrored RAID 1 array, an

automatic resynchronization is invoked and the contents are automatically rebuilt from the rest of the array with no need to recongure the RAID parameters. If the replaced storage device was congured as a hot-spare, the new HDD is automatically congured as a new hot-spare.

▼

Remove Storage Drive Filler Panels

Locate the storage drive ller panel to be removedfrom the server.

Filler panels have no button on the drive front panel.

To unlatch the storage drive ller panel, press the release leverbutton, and then tilt the lever up

into the fully opened position.

To remove the ller panel from the slot,hold the opened release lever and gently slide the ller

panel toward you.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201454

Servicing DIMMs (CRU)

▼

Insert Storage Drive Filler Panels

Locate the vacant storage drive module slot in the server module.

Ensure that the release lever on the ller panel is fully opened.

Slide a standard storage drive ller panel into the vacant storage drive slot.

Press the middle of the ller panel faceplate with your thumb or nger until the release lever engages with the chassis.

The release lever starts to close as it makes contact with the chassis. Do not slide the ller panel in all the way. Leave the ller panel out approximately 0.25 to 0.50 inch (6 to 12 mm) from the opening.

Caution – Component damage. Do not insert an XL size ller panel.

Close the release lever until it clicks into place and is ush with the front of the server.

Servicing DIMMs (CRU)

Note – This component is a customer-replaceable unit (CRU).

This section describes how to diagnose, remove, and install DDR3 LV DIMMs in the Sun Blade X3-2B.

To watch a video that shows how to remove and install a DIMM, see

Overview Video

Use these procedures to service DIMMs:

■

“DIMM Fault Remind Circuit” on page 56

■

“Identify Faulty DIMMs” on page 57

■

“DIMM Population Rules and Guidelines” on page 58

■

“Remove DIMMs” on page 62

■

“Install DIMMs” on page 63

■

“Remove Optional DIMM Filler Panels” on page 65

■

“Install Optional DIMM Filler Panels” on page 65

DIMM Replacement

DIMM Fault Remind Circuit

The following topics describe the components of the Fault Remind circuitry.

FaultRemind Button and Charge Status LED

Note – Do not press the white Clear CMOS Button (SW1801).

The blue Fault Remind button (SW3001) is located on the motherboard next to the Charge Status LED (CR3002). The Charge Status LED indicates the usability of the processor test circuit. When the Fault Remind button is pressed, the Charge Status LED, lights green to indicate that there is sucient voltage present in the fault remind circuit to activate the fault LEDs. DIMM Fault LEDs identify DIMMs in a fault state.

Note – Press the fault remind circuitry within 15 minutes of removing the server from the

chassis. If the green Charge Status LED fails to light when you press the Fault Remind button, it is likely that the fault remind circuit has lost its charge.

DIMM Fault LEDs

The DIMM Fault LEDs are located on the on the motherboard next to each DIMM slot. The amber LEDs light up when the Fault Remind button is pressed and a DIMM fault condition exists.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201456

Related Information

DIMM Fault Remind Circuit

■

“Using the DIMM and Processor Test Circuit ” on page 108

■

“Identify Faulty DIMMs” on page 57

▼

Identify Faulty DIMMs

Prepare the servermodule for service.

See

“Preparing the Sun Blade X3-2B for Service ” on page 27.

Caution – Component damage. This procedure requires that you handle components that are

sensitive to static discharge. This sensitivity can cause the component to fail. To avoid damage, ensure that you follow electrostatic discharge safety measures and antistatic practices. See

“Performing ESD and Antistatic Prevention Measures” on page 33.

Verify that the charge status LED is lit green.

A lit green Charge Status LED, located next to the Fault Remind button, indicates that the Fault Remind LED circuit is operational.

DIMM Population Rules and Guidelines

Note – The Charge Status LED indicates the test circuit power level. If the Charge Status LED is

out, the Fault Remind LEDs can not function. After the server module is inserted into the Sun Blade chassis, the test circuit will recharge. However, any DIMM errors must reoccur to be stored and visible on a DIMM Fault LED during the next fault remind test.

To identify a faulty DIMM, press and hold the blue Fault Remind button on the motherboard

(SW3001).

Release the button after an amber DIMM Fault LED lights. Do not hold the Fault Remind button down longer than necessary.

Next Steps

See Also

For information about using the DIMM test circuit, see

Circuit ” on page 108

Note the location of the faulty DIMMs on the motherboard.

“Using the DIMM and Processor Test

A lit amber LED next to a DIMM slot indicates a faulty DIMM.

LED State DIMM Status

O Operating properly, if the DIMM test circuit is ready

to use

On (amber) Faulty and should be replaced.

Ensure that all DIMMs are seated correctly in their connector slots.

If re-seating the DIMM does not x the problem, remove and replace the faulty DIMM.

Note – The DIMM Fault LED remains on when the Fault Remind button is pressed after the

DIMM is re-seated. The server module must be powered up again to verify if re-seating xes the DIMM problem.

“Remove DIMMs” on page 62

■

“DIMM Population Rules and Guidelines” on page 58

■

“Using the DIMM and Processor Test Circuit ” on page 108

DIMM Population Rules and Guidelines

Use these DIMM guidelines and illustrations to help you plan the memory conguration of the Sun Blade X3-2B.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201458

DIMM Population Rules and Guidelines

Basic Memory Guidelines

When populating DIMM slots, follow these population rules and guidelines.

■

Each processor has four DDR3 memory channels (or buses).

■

Each DDR3 memory channel supports up to three DIMMs for a total of 12 DIMMs per processor.

■

The server module supports one DIMM per channel, two DIMMs per channel, and three DIMMs per channel across all sockets. Minimum per processor: 1, Maximum per processor:

12.

■

The minimum supported memory conguration is one DIMM per processor D0.

■

The maximum supported memory conguration is 384 GB.

■

Use 8 GB DDR3–1600 LV DIMMs and 16 GB DDR3–1600 LV DIMMs only:

■

Install up to four memory channels, with three DIMMs per channel.

■

Install up to 24 DIMMs per server module or up to 12 DIMMs per processor.

■

For optimal performance, install DIMMs in groups of three sockets per channel.

■

Always install DIMMs in ascending order, within a color or group following the “farthest from processor rst” convention. See the following table:

DIMM Sockets DIMM Slot Location Socket Color

First D0, D3, D6, D9 Blue

Second D1, D4, D7, D10 White

Third D2, D5, D8, D11 Black

■

The following illustration shows the motherboard, DIMM slot numbering and DIMM slot locations within the Sun Blade X3-2B enclosure.

DIMM Population Rules and Guidelines

■

Ensure all slots are lled with either a DIMM or a DIMM ller for proper airow.

Detailed Memory PopulationRules

■

Rule 1: Always populate the channels as follows. See the gure below.

1. Fill up all the blue sockets.

Always populate the DIMMs furthest from the processor (blue sockets) rst.

2. Fill up all the white sockets.

3. Fill up the black sockets.

Example Conguration

A processor with four DIMMs. Install four DIMMs in blue sockets D0, D3, D6 and D9.

A processor with eight DIMMs. Install four DIMMs in blue sockets D0, D3, D6 and D9, and four

more DIMMs in the white sockets D1, D4, D7 and D10.

A processor with 12 DIMMs. Install processors in all the sockets as shown in the gure below.

The following gure shows the DIMM slot designations and population order for the Sun Blade X3-2B.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201460

DIMM Population Rules and Guidelines

Tip – This is known as the "ll farthest" approach to DIMM installation.

■

Rule 2: Memory symmetry across processors is required.

Processor 1 memory must match processor 0 memory, in placement, type, size, capacity, frequency and voltage.

■

Rule 3: Each processor can support a single DIMM, two DIMMs, three DIMMs or four DIMMs per color socket set.

■

Rule 4: Within every set of four DIMMs (for example: blue socket set, white socket set, black socket set), mixing/matching of dierent size, memory speed and voltage is not allowed.

■

Memories in D0, D3, D6 and D9 must be all the same.

■

Next, memories in D1, D4, D7 and D10 must be all the same, and so on. While doing this, Rule 2 must be maintained.

■

Rule 5: Mixing and matching of dierent size, voltage and speed across dierent 4 DIMM sets is allowed. For example, memories in D0, D3, D6, D9 (blue sockets) must have the same size. But, they do not have to match memory size/voltage/speed in D1, D4, D7, D10 (white sockets).

Note – When mixing speed across dierent four DIMM sets, all memory will be tuned to the

slower speed.

DIMM Population Rules and Guidelines

Note – When mixing sizes across dierent 4 DIMM sets, populate the highest density

(largest) DIMMs on the blue socket set, the next size in the white socket set and the smallest DIMMs in the black socket set.

■

Rule 6: The blade must have all RDIMMs installed. Mixing of dierent DIMM technology

is not supported.

■

Rule 7: Each processor can support a maximum of 12 dual-rank (DR) DIMMs.

■

Rule 8: For maximum performance, apply the following rules:

■

DIMMs can run in one of the following three speeds: 1600 MHz, 1333 MHz, and 1067 MHz.

■

DIMM speed rules are: (SR = single rank; DR = dual rank; QR = quad rank)

1. One DIMM per channel or 2 DIMMs per channel (DR) = 1600 or 1333 MHz , at full

2. One DIMM per channel = 1067 MHz.

3. Three DIMMs per channel (DR) = 1067 MHz.

4. Three DIMMs per channel (QR) is not supported, currently.

■

Rule 9: The maximum DIMM speed is limited by the processor part number, with the DIMM population, whichever is lower. Currently, processor memory speed limitation is a function of core count:

■

8-core processors from Intel Xeon processor E5-2600 product family run at a maximum speed of 1600 MHz.

■

6-core processors from Intel Xeon processor E5-2600 product family run at a maximum speed of 1333 MHz

■

4-core processors from Intel Xeon processor E5-2600 product family run at a maximum speed of 1067 MHz.

speed as rated by the DIMM.

▼

Remove DIMMs

Tip – To watch a video that shows how to remove and install a DIMM, see DIMM Replacement

Overview Video

Prepare the servermodule for service.

“Preparing the Sun Blade X3-2B for Service ” on page 27.

See

Identify faulty DIMMs, as required.

“Identify Faulty DIMMs” on page 57.

See

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201462

DIMM Population Rules and Guidelines

Remove DIMM ller panels, as required.

See

“Remove Optional DIMM Filler Panels” on page 65.

Rotate both DIMM slot ejectortabs outward as far as they go.

This action partially ejects the DIMM from the slot.

Caution – Component damage. Exercise caution when removing DIMMs close to the drive

enclosure and P1. Space near the DIMM slot ejector tabs is limited.

Carefully lift the DIMM straight up to removeit from the slot.

Place the DIMM on an antistatic mat.

Next Steps

BeforeYou Begin

■

“Install DIMMs” on page 63

■

“Returning Sun Blade X3-2B to Operation ” on page 101

▼

Install DIMMs

Always replace a DIMM with the same Oracle part number as the failed DIMM.

Tip – To watch a video that shows how to remove and install a DIMM, see DIMM Replacement

Overview Video

■

“DIMM Population Rules and Guidelines” on page 58

DIMM Population Rules and Guidelines

■

“Remove DIMMs” on page 62.

To install DIMMs on the Sun Blade X3-2B motherboard:

Prepare the servermodule for service.

“Preparing the Sun Blade X3-2B for Service ” on page 27.

See

Unpack the replacement DIMMs and place them on an antistatic mat.

Ensure that the connector slot ejector tabs are in the open position.

Line up the replacement DIMM with the connector.

Align the DIMM notch with the key in the connector. This ensures that the DIMM is oriented correctly.

Push the DIMM into the slot until the ejector tabs lift and lock the DIMM in place.

Caution – Component damage. If the DIMM does not easily seat into the connector, verify

correct orientation. If the orientation is reversed, damage to the DIMM or DIMM slot might occur.

Repeat Step 3 through Step 5 until all replacement DIMMs are installed.

Prepare the servermodule for operation.

“Returning Sun Blade X3-2B to Operation ” on page 101.

See

Verify DIMM component information.

Use the Oracle ILOM web interface or CLI to view DIMM component information.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201464

DIMM Population Rules and Guidelines

Refer to the Oracle Integrated Lights Out Manager (ILOM) 3.1 Documentation Collection

(http://www.oracle.com/pls/topic/lookup?ctx=ilom31)

▼

Remove Optional DIMM Filler Panels

Note – DIMM slot ller panels are optional and are not required for cooling.

Locate the memory module ller panel to be removed from the motherboard.

Simultaneously press down on both ejector lever tabs at the ends of the connector slot.

Lift the ller panel straight up to remove it from the connector socket.

▼

Install Optional DIMM Filler Panels

Note – DIMM slot ller panels are optional and are not required for cooling.

Locate the vacant DIMM slot on the motherboard.

Ensure that ejector lever tabs at both ends of the DIMM slot are in the fully opened position.

DIMM Population Rules and Guidelines

Align the DIMM ller panel with the empty slot, and then gently press the ller panel into the

empty slot until both ejector lever tabs close, locking the ller panel in place.

▼

Replace the System Battery (CRU)

Note – This component is a customer-replaceable unit (CRU).

A real-time clock (RTC) system battery (type CR2032) is located on the motherboard. The system battery maintains the real-time clock.

Prepare the servermodule for service.

See

“Preparing the Sun Blade X3-2B for Service ” on page 27.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201466

Servicing USB Flash Drives (CRU)

To remove the battery from its holder, gently push the top edge of the battery away from the

battery holder [1].

See the following illustration.

Caution – Component damage. Exercise caution when removing the battery. The battery is

located near the server module side wall.

Orient the new battery so that the + symbol faces towards the server module side wall.

Insert the battery into the holder, and then press the battery into position.

Access the BIOS Setup Utility to congure the BIOS time and date settings, as required.

Refer to the

Prepare the servermodule for operation.

“Returning Sun Blade X3-2B to Operation ” on page 101.

See

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Administration Guide.

Servicing USB Flash Drives (CRU)

Note – This component is a customer-replaceable unit (CRU).

Two USB ash drive ports (P0 and P1) are located on the motherboard at the rear of the server module. The USB ash drive port 0, P0, might contain the factory-installed Oracle System Assistant USB ash drive. This drive contains server-specic data and provides important

Servicing USB Flash Drives (CRU)

server functionality (for more information about Oracle System Assistant, see Sun Blade X3-2B

(formerly Sun Blade X6270 M3) Administration Guide

Caution – Data and functionality loss. USB ash drive P0 (port 0) might contain the Oracle

System Assistant USB ash drive. Do not misplace, damage, or overwrite this drive.

Use these procedures to remove and install USB ash drives:

■

“Remove USB Flash Drives” on page 68

■

“Install USB Flash Drives” on page 69

▼

Remove USB Flash Drives

Caution – Data loss. Oracle System Assistant (OSA) software might reside on a USB ash drive.

For information about Oracle System Assistant, see

M3) Administration Guide

Sun Blade X3-2B (formerly Sun Blade X6270

If necessary, back up any data that is contained on the USB ash drives.

Prepare the servermodule for service.

See

“Preparing the Sun Blade X3-2B for Service ” on page 27.

Note – You do not have to remove the server module top cover to access the rear USB ports.

Locate the USB ports P0 (Oracle System Assistant) and P1 on the back of the motherboard.

To remove, pull the USB ash drive out of the port.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201468

Prepare the servermodule for operation.

See

“Returning Sun Blade X3-2B to Operation ” on page 101.

Servicing USB Flash Drives (CRU)

Next Steps

“Install USB Flash Drives” on page 69

▼

Install USB Flash Drives

Prepare the servermodule for service.

See

“Preparing the Sun Blade X3-2B for Service ” on page 27.

Note – You do not have to remove the server module top cover to access the rear USB ports.

Locate the correct rear USB port P0 (OracleSystem Assistant) or P1.

Push the USB ash drive into port 0 or 1.

Caution – Component damage or data loss. USB ash drives must t inside the rear of the

motherboard. Installing a longer USB drive on the rear port might damage the blade when inserted into the chassis. Drives can be no larger than 7.5 mm wide and 43 .0 mm deep.

Caution – Component damage. Ensure the USB ash drive contacts are in the upward-facing

position.

Prepare the servermodule for operation.

See

“Returning Sun Blade X3-2B to Operation ” on page 101.

Servicing a Fabric Expansion Module (CRU)

Caution – Component damage or data loss. Flash drives extend past the rear of the blade. Handle

the blade with care.

Verify component information.

Use the Oracle ILOM web interface or CLI.

Refer to the

Oracle Integrated Lights Out Manager (ILOM) 3.1 Documentation Collection

(http://www.oracle.com/pls/topic/lookup?ctx=ilom31)

Servicing a Fabric Expansion Module (CRU)

Note – This component is a customer-replaceable unit (CRU).

The fabric expansion module (FEM) is available in either single-width or double-width form factor.

Figure Legend

1 FEM double-width form factor. 2 FEMsingle-width form factor. Install in FEM 0.

Use these procedures to remove and install a fabric expansion module (FEM) card option:

■

“Remove a FEM” on page 71

■

“Install a FEM” on page 71

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201470

Servicing a Fabric Expansion Module (CRU)

▼

Remove a FEM

Prepare the servermodule for service.

See

“Preparing the Sun Blade X3-2B for Service ” on page 27.

Insert a ller panel into the empty server slot to reduce the possibility of a system shut down.

Pull the existing FEM card up and out of the motherboard.

Next Steps

“Install a FEM” on page 71

▼

Install a FEM

Prepare the servermodule for service.

See

“Preparing the Sun Blade X3-2B for Service ” on page 27.

Remove the existing FEM card, as required.

See

“Remove a FEM” on page 71.

Slide the FEM card at an angle into the support bracket.

Note – Always install a single-width form factor FEM in FEM 0.

Servicing a RAID Expansion Module (CRU)

Press the FEM card carefully into the connector.

Prepare the servermodule for operation.

See

“Returning Sun Blade X3-2B to Operation ” on page 101.

Servicing a RAID Expansion Module (CRU)

Note – This component is a customer-replaceable unit (CRU).

The RAID expansion module (REM), if ordered, might not arrive installed on the Sun Blade X3-2B. In some cases, this option is shipped separately for customer installation. The REM enables the RAID functionality for SAS drives.

Refer to

Administration Guide

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201472

“Conguring RAID” in Sun Blade X3-2B (formerly Sun Blade X6270 M3)

for additional information.

BeforeYou Begin

Servicing a RAID Expansion Module (CRU)

A REM Storage Drive cable kit is required when you want a Sun Blade X3-2B to communicate with the Sun Blade Storage Module M2 across the Sun Blade 6000 midplane. See

“Servicing

Cables (CRU)” on page 77

Note – When adding a REM to a server, you must install one or more storage drives (hard disk or

solid state drive) in the server disk slots 0 through 3.

Use these procedures to service a REM card option:

■

“Remove a REM Card” on page 73

■

“Install a REM Card” on page 74

■

“Replace a REM Battery on the REM Card” on page 76

▼

Remove a REM Card

Caution – Data loss. Back up your data to an external site before proceeding. The following steps

will remove all data from the system.

Next Steps

Prepare the servermodule for service.

See

“Preparing the Sun Blade X3-2B for Service ” on page 27.

Open the REM latch.

Locate the REM support bracket on the motherboard,and pull the REM card out at an angle

away from the support bracket [1].

Pull the REM card carefully out of the connector [2].

“Install a REM Card” on page 74

Servicing a RAID Expansion Module (CRU)

▼

Install a REM Card

Use this procedure with the REM removal procedure to replace an existing REM, or use this procedure for rst-time installation of a REM card in the server.

BeforeYou Begin

Caution – Data loss. Back up your data to an external site before proceeding. The following steps

will remove all data from the system.

Prepare the servermodule for service.

“Preparing the Sun Blade X3-2B for Service ” on page 27.

See

Insert a ller panel into the empty server slot to reduce the possibility of a system shut down.

“Insert Server Module Filler Panels” on page 41.

See

If you arereplacing a REM card, remove the existing card.

“Remove a REM Card” on page 73.

See

If you areperforming a rst-time REM card installation, connect the REM storage drive cable to

the motherboard.

“Install the REM Storage Drive Cable” on page 78.

See

Note – The REM storage drive cable must be installed when the system is using a REM.

Locate the REM support bracket on the motherboard.

For more information, see

Close the REM handle [1].

Slide the REM card under the anges on the support bracket.

“Replaceable Server Module Components” on page 24.

The anges are on the support bracket opposite the REM handle.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201474

Servicing a RAID Expansion Module (CRU)

Carefully align the connector on the underside of the REM card with the connector on the

motherboard.

To install the REM card,gently push down on the connector end of the card until the card is fully

seated under the REM card retaining spring.

Caution – Component damage. Excessive downward force is not required. When properly

aligned the connectors mate with minimum downward pressure. If not, realign the connectors slightly and try again. Do not apply excessive force.

An audible click occurs when the spring secures the card.

If this is a rst-time installation of a REM cardin the server module, perform the following

sub-steps.

Perform the following sub–steps only if the new disk does not have an operating system, or any data. Skip this step if preloaded software resides on the storage drives.

a. Restore the data from backups.

b. Install an operating system.

Operating System Link

Linux Sun Blade X3-2B (formerly Sun Blade X6270 M3) Installation Guide for Linux

Operating Systems

Solaris Sun Blade X3-2B (formerly Sun Blade X6270 M3) Installation Guide for the Oracle

Solaris Operating System

Windows Sun Blade X3-2B (formerly Sun Blade X6270 M3) Installation Guide for Windows

Operating Systems

VM Sun Blade X3-2B (formerly Sun Blade X6270 M3) Installation Guide for ESX

Software

Oracle VM Sun Blade X3-2B (formerly Sun Blade X6270 M3) Installation Guide for Oracle VM

Server

Prepare the servermodule for operation.

See

“Returning Sun Blade X3-2B to Operation ” on page 101.

Servicing a RAID Expansion Module (CRU)

▼

Replace a REM Battery on the REM Card

BeforeYou Begin

This task requires a #00 Phillips screwdriver.

Remove the REM card.

“Remove a REM Card” on page 73.

See

Remove and retain the three screwssecuring the REM battery to the card.

Remove the REM battery from the REM card.

Attach the new battery to the REM card using the three screws.

Attach any required battery cables and install the REM card in the servermodule.

“Install a REM Card” on page 74.

See

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201476

Servicing Cables (CRU)

This section contains procedures for removing and installing the REM storage drive cable:

■

“Remove the REM Storage Drive Cable” on page 77

■

“Install the REM Storage Drive Cable” on page 78

▼

Remove the REM Storage Drive Cable

Use this procedure when replacing a REM storage drive cable.

Prepare the servermodule for service.

“Preparing the Sun Blade X3-2B for Service ” on page 27.

See

Remove the REM card.

“Remove a REM Card” on page 73.

See

Make note of the cable's route through the server.

The replacement cable must be routed through the server following the same path.

Disconnect the ribbon cable from the connector at the frontmotherboard.

Servicing Cables (CRU)

Next Steps

Disconnect the ribbon cable from the connector at the rearof the motherboard.

Remove the cable from the server.

“Install the REM Storage Drive Cable” on page 78

Servicing Cables (CRU)

▼

Install the REM Storage Drive Cable

Use this procedure with the REM storage drive cable removal procedure to replace an existing cable, or use this procedure for rst-time installation of a REM card in the server.

Prepare the servermodule for service.

See

“Preparing the Sun Blade X3-2B for Service ” on page 27.

If you arereplacing an existing REM Storage Drive cable, do the following:

“Remove a REM Card”on page 73

b. “Remove the REM Storage DriveCable”on page 77

Connect the new REM StorageDrive cable to the connector at the front of the motherboard.

Caution – Do not insert the REM Storage Drive cable into the connector near CPU 1.

Carefully route and dress the cable through the server toward the rear connector as shown in

the illustration below:

The cable must be routed exactly as shown in the illustration.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201478

Servicing a Processor and Heat Sink Assembly (FRU)

Caution – Component damage. Do not deviate from the cable route. Ensure that the cable does

not protrude above the server enclosure side walls and contact or interfere with the server top cover.

Connect the cable to the connector at the rear of the motherboard.

Install the REM card.

See

“Install a REM Card” on page 74.

Prepare the servermodule for operation.

See

“Returning Sun Blade X3-2B to Operation ” on page 101.

Servicing a Processor and Heat Sink Assembly (FRU)

Note – This component is a eld-replaceable unit (FRU). A part designated as a FRU must be

replaced by an Oracle-qualied service technician.

Processor FaultRemind Circuit

When replacing a processor, ensure that the replacement processor matches the speed of the other processor on the motherboard, and ensure that you use the replacement tool that is packaged with the new processor.

Tip – To watch a video that shows how to remove and install a processor using the replacement

tool, see

Use these procedures to remove and install processor and heat sink assemblies:

■

Processor Fault Remind Circuit

The following illustrations shows the components and locations of the server module fault remind circuit. Use the fault remind circuit to identify a failed processor.

CPU Replacement Overview Video.

“Processor Fault Remind Circuit” on page 80 “Identify a Faulty Processor” on page 82 “Remove a Processor Heat Sink” on page 83 “Remove a Processor” on page 84 “Install a Processor” on page 87 “Install a Processor Heat Sink” on page 90 “Clear Server Module Processor Faults” on page 92

The following topics describe the components of the Fault Remind circuitry.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201480

FaultRemind Button and Charge Status LED

Processor FaultRemind Circuit

Note – Do not press the white Clear CMOS Button (SW1801).

Note – Press the fault remind circuitry within 15 minutes of removing the server from the

chassis. If the green Charge Status LED fails to light when you press the Fault Remind button, it is likely that the fault remind circuit has lost its charge.

Processor Fault LED

Processor FaultRemind Circuit

The Processor Fault LEDs are located on the server module motherboard next to each processor. The amber LEDs light up when the Fault Remind button is pressed and a processor fault condition exists.

Related Information

“Using the DIMM and Processor Test Circuit ” on page 108

▼

Identify a Faulty Processor

Prepare the servermodule for service.

“Preparing the Sun Blade X3-2B for Service ” on page 27.

See

Caution – Component damage. This procedure requires that you handle components that are

sensitive to static discharge. This sensitivity can cause the component to fail. To avoid damage, ensure that you follow electrostatic discharge safety measures and antistatic practices. See

“Performing ESD and Antistatic Prevention Measures” on page 33.

Press and hold the Fault Remind button on the motherboard to illuminate a processor FaultLED

(for more information, see “Processor Fault Remind Circuit”on page 80).

A failed processor is identied by the amber processor Fault LED, as indicated in the following table.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201482

LED State Processor Status

O Operating properly.

On (amber) Faulty and should be replaced.

Processor FaultRemind Circuit

Next Steps

BeforeYou Begin

“Remove a Processor Heat Sink” on page 83

▼

Remove a Processor Heat Sink

To replace a processor, you must rst remove the processor heat sink. The heat sink sits on top of the processor and is secured to the motherboard by four screws. Once removed, retain the heat sink for reuse.

Tip – To watch a video that shows how to remove and install a processor using the replacement

tool, see

Caution – Component damage. Handle processor socket pins with extreme care. Processor and

CPU Replacement Overview Video.

socket pins are very fragile. A light touch can bend the processor socket pins and damage the board beyond repair.

■

“Preparing the Sun Blade X3-2B for Service ” on page 27

■

“Identify a Faulty Processor” on page 82

■

A number 2 Phillips screwdriver is required for this procedure.

Gently press down on the top of the heat sink to counteract the pressure of the captive

spring-loaded screws that secure the heat sink to the motherboard.

Using a No.2 Phillips screwdriver, alternately loosen the four screws in the heat sink.

Turn each screw one and one half turns until they are fully disengaged.

Processor FaultRemind Circuit

To separate the heat sink from the top of the processor, gently wiggle the heat sink left and

right, while pulling upward.

A thin layer of thermal compound separates the heat sink and the processor. This compound also acts as an adhesive.

Note – Do not allow the thermal compound to contaminate the work space or other

components.

Place the heat sink upside down on a at surface.

Next Steps

BeforeYou Begin

“Remove a Processor” on page 84

▼

Remove a Processor

Tip – To watch a video that shows how to remove and install a processor using the replacement

tool, see

Caution – Component damage. Handle processor socket pins with extreme care. Processor and

CPU Replacement Overview Video.

socket pins are very fragile. A light touch can bend the processor socket pins and damage the board beyond repair.

■

See “Remove a Processor Heat Sink” on page 83.

■

CPU Replacement Overview Video

■

Processor replacement tool model LGA2011 (color code: green) is required for this procedure.

Caution – Component damage. Use the correct processor replacement tool. Attempting to

replace the processor using the incorrect tool could result in irreparable damage the processor or the motherboard.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201484

Processor FaultRemind Circuit

Unpack the processor and processor removal/insertion tool from the replacement processor

packaging, as required.

Leave the processor in the anti-static tray until it is ready to be installed.

Release the two processor pressure frame retaining levers on the servermodule motherboard

[1].

a. Disengage the processor release lever on the right side of the processor socket (viewing the

server from the front) by pushing down and moving it to the side away from the processor, and then rotating the lever upward.

b. Disengage the processor release lever on the left side of the processor socket (viewing the

server from the front) by pushing down and moving it to the side away from the processor, and then rotating the lever upward.

Processor FaultRemind Circuit

Lift the processor pressure frame up to the fully open position [2].

Push the removal/insertion tool button [1].

Place the removal/insertion tool on top of the processor [2].

Properly position the tool over the processor socket and lower it into place over the processor socket. Ensure that the tool and processor key corners are aligned. To properly position the tool over the processor socket, rotate the tool until the green triangle on the side of the tool is facing the front of the server and it is over the left side of the processor socket when viewing the server from the front.

Click the tab on the removal/insertion tool to secure the tool to the processor [3].

Press the release lever on the tool to release the center button and engage the processor. An audible click indicates that the processor is engaged.

Lift the processor out of the socket while it is still attached to the removal/insertion tool [4].

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201486

Processor FaultRemind Circuit

Turnthe tool upside down and verify that it contains the processor[5].

Hold the processor by its edges and press the center button on the tool to releasethe processor [5].

Carefully lift it out of the tool and place it with its circuit side down (the installed orientation) on an antistatic mat [6].

Carefully clean the thermal compound o the top of the processor.

Place the removedprocessor into an antistatic container.

Next Steps

BeforeYou Begin

“Install a Processor” on page 87

▼

Install a Processor

Tip – To watch a video that shows how to remove and install a processor using the replacement

tool, see

■

CPU Replacement Overview Video.

CPU Replacement Overview Video

“Preparing the Sun Blade X3-2B for Service ” on page 27 “Remove a Processor Heat Sink” on page 83

Processor FaultRemind Circuit

■

Unpack the replacement processor and place it on an anti-static mat.

Ensure that the two processor socket release levers arein the fully open position [1].

“Remove a Processor” on page 84

Ensure that the processor pressure frame is in the fully open position [2].

Press the button in the center of the tool to the down position [1].

Turnthe tool upside down, grasp the processor by its edges and place the processor (circuit side

up) in the tool [2].

Ensure that the triangle on the corner of the processor aligns with the triangle on the side of the processor removal/replacement tool [2].

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201488

Processor FaultRemind Circuit

Press the tool release lever to release the center button and secure the processor in the tool.

An audible click indicates that the processor is locked in place.

Ensure that the processor is secure in the tool before rotating the tool.

Rotate the tool,so the processor faces downward.

Properly position the tool over the processor socket and lower it into place [4].

Ensure that the notches on the sides of the processor align with the keys on the socket, and the green triangle on the side of the tool is aligned with the front left corner of the processor socket (when viewing from the front of the server).

Press the center button to releasethe processor [5].

Caution – Component damage. Do not press down on the processor. Irreparable damage to the

processor or motherboard might occur from excessive downward pressure. Do not forcibly seat the processor into the socket. Excessive downward pressure might damage the socket pins.

Remove the processor removal/replacementtool [6].

Processor FaultRemind Circuit

Visually check the alignment of the processor in the socket [7].

When properly aligned, the processor sits at in the processor socket and has minimal side-to-side movement.

Close the processor pressure frame cover[1].

Lower the rst retaining lever and secure it under the retaining clip [2].

Lower the second retaining lever and secure it under the retaining clip [2].

This action secures the processor in the socket.

Next Steps

BeforeYou Begin

“Install a Processor Heat Sink” on page 90

▼

Install a Processor Heat Sink

The replacement processor is not shipped with a heat sink. Reuse the original processor heat sink.

■

“Remove a Processor” on page 84

■

“Install a Processor” on page 87

Clean the heat sink:

■

Remove any dust or debris that might be lodged in the heat sink ns.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201490

Processor FaultRemind Circuit

■

Use an alcohol pad to completely clean all thermal compound from the underside of the heat sink.

Use the syringe (supplied with the new or replacement processor) to apply approximately 0.1 ml of thermal compound as a single dollop to the center of the top of the processor.

Note – Do not distribute or spread the compound; the pressure applied when attaching the heat

sink performs this action.

Position the heat sink over the processor, aligning it with the threaded mounting posts.

Orient the heat sink so that the screws line up with the mounting posts. The processor heat sink is not symmetrical.

Caution – Component damage. When handling the heat sink, do not to transfer the compound

to other server components.

Carefully lower the heat sink onto the processor takingcare to reducethe amount of movement

it makes after initial contactwith the layer of thermal compound on topof the processor.

Processor FaultRemind Circuit

Caution – Over-temperature condition. Avoid moving the heat sink after it has contacted the top

of the processor. Too much movement could spread the layer of thermal compound, causing voids in the distribution and leading to ineective heat dissipation and component damage.

Use a No.2 Phillips screwdriverto alternately tighten each Phillips screw one-half turn until fully

seated.

Prepare the servermodule for operation.

See

“Returning Sun Blade X3-2B to Operation ” on page 101.

Next Steps

Update the BIOS and ILOM rmware.

Refer to the

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Administration Guide and

“Setting Up Software and Firmware” in Sun Blade X3-2B (formerly Sun Blade X6270 M3) Installation Guide

■

“Clear Server Module Processor Faults” on page 92

▼

Clear Server Module Processor Faults

Use Oracle ILOM command-line interface (CLI) commands to view and clear server module faults.

“Access Oracle ILOM Using CLI” in Sun Blade X3-2B (formerly Sun Blade X6270 M3)

See

Administration Guide

To list all known faults on the system, type:

-> show /SP/faultmgmt

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201492

The server lists all known faults, for example:

-> show /SP/faultmgmt

Targets: 0 (/SYS/MB/P0)

Properties:

Commands:

show

To clear the fault, type:

-> set /SYS/MB/P0 clear_fault_action=true

For example:

-> set /SYS/MB/P0 clear_fault_action=true

Are you sure you want to clear /SYS/MB/P0 (y/n)? y

Set ’clear_fault_action’ to ’true’

Close the Oracle ILOM session.

Servicing the Motherboard Assembly (FRU)

■

See Also

Oracle Integrated Lights Out Manager (ILOM) 3.1 Documentation Collection (http://www.oracle.com/pls/topic/lookup?ctx=ilom31)

Servicing the Motherboard Assembly (FRU)

Note – This component is a eld-replaceable unit (FRU). A part designated as a FRU must be

replaced by an Oracle-qualied service technician.

The motherboard assembly includes the motherboard, the disk backplane and the server module enclosure. The motherboard and the disk backplane are shipped installed in the enclosure. Do not remove the motherboard or the disk backplane from the enclosure. If either of these components fails, replace the entire motherboard assembly.

To replace the motherboard assembly, transfer all reusable components from the failed assembly to the replacement assembly and update the FRUID using the following procedures:

■

“Remove and Install a Processor Cover Plate” on page 94

■

“Motherboard Assembly Replacement” on page 97

■

“Update FRUID (Service Only)” on page 98

Servicing the Motherboard Assembly (FRU)

▼

Remove and Install a Processor Cover Plate

Cover plates are plastic inserts that attach to the processor load plate and protect the pins of an unoccupied psocket. Cover plates are installed on replacement motherboards and need to be removed before installing processors and heatsinks. When removing or installing processor cover plates, ensure that the pins in the processor socket are not damaged.

Ensure proper ESD protection.

Release the two processor pressure frame retaining levers on the processor socket [1].

Caution – Component damage. The pins in the processor socket are fragile. Opening the

pressure frame and the load plate exposes the pins. Do not touch or damage the processor socket pins.

a. Disengage the processor release lever on the right side of the processor socket (viewing the

server from the front) by pushing down and moving it to the side away from the processor, and then rotating the lever upward.

b. Disengage the processor release lever on the left side of the processor socket (viewing the

server from the front) by pushing down and moving it to the side away from the processor, and then rotating the lever upward.

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201494

Lift the processor pressure frame up to the fully open position [2].

With the pressure frame in the open position, do one of the following:

■

To remove a cover plate, gently push on the underside of the plate.

The plate is tted into the pressure frame. Pushing on the underside of the plate causes the it to pop out of the frame.

Servicing the Motherboard Assembly (FRU)

■

To install a cover plate, align the plate with the topside of the pressure frame and gently push it into the frame until it locks in place.

The cover plate is notched to t the pressure frame and must align correctly.

Next Steps

Close and lock the load plate.

■

“Motherboard Assembly Replacement” on page 97

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201496

Servicing the Motherboard Assembly (FRU)

▼

Motherboard Assembly Replacement

Use this procedure to replace the motherboard assembly if the motherboard or the disk backplane fails.

Note – If you replace a motherboard or a service processor and an incompatibility arises between

the hardware revision of the component and the rmware version of either the SP or the BIOS, the best practice is to maintain compatibility with the SP rmware. Therefore, update or downgrade the system rmware package to the version compatible with the SP.

BeforeYou Begin

For the location of components, see “Replaceable Server Module Components” on page 24.

Before removing the server module, back up the SP conguration.

Refer to the

Prepare the servermodule for service.

See

“Preparing the Sun Blade X3-2B for Service ” on page 27.

Insert a blade ller panel into the empty slot.

See

“Insert Server Module Filler Panels” on page 41.

Remove reusable components from the old server module motherboard.

Caution – Data loss and over-temperature condition. Label components before removal to

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Administration Guide.

ensure components are returned to original slots.

a. Perform the following component removalprocedures,as required:

■

“Remove a Storage Drive” on page 51

Note the storage drive positions (0, 1, 2, 3).

■

“Remove DIMMs” on page 62

Note the DIMM positions.

■

“Remove a Processor Heat Sink” on page 83

Note the processor positions (0 and 1).

■

“Remove a Processor” on page 84

■

“Remove USB Flash Drives” on page 68

Note the ash drive positions (0 and 1).

■

“Remove a REM Card” on page 73

■

“Remove a FEM” on page 71

Servicing the Motherboard Assembly (FRU)

b. Perform the following ller removal procedures, as required:

■

“Remove Storage Drive Filler Panels” on page 54

■

“Remove Optional DIMM Filler Panels” on page 65

Install the components on the replacement motherboard assembly.

a. Perform the following component installation procedures, as required:

■

“Replace a Storage Drive” on page 53

■

“Remove and Install a Processor Cover Plate” on page 94

■

“Install a Processor” on page 87

■

“Install DIMMs” on page 63

■

“Install a REM Card” on page 74

■

“Install a FEM” on page 71

■

“Install USB Flash Drives” on page 69

b. Perform the following ller installation procedures, as required:

■

“Insert Storage Drive Filler Panels” on page 55

■

“Install Optional DIMM Filler Panels” on page 65

Prepare the servermodule for operation.

“Returning Sun Blade X3-2B to Operation ” on page 101.

See

Note – Do not power on the server.

Update the FRUID/serial number on the new motherboard.

“Update FRUID (Service Only)” on page 98.

See

Restore SP conguration.

▼

Update FRUID (Service Only)

Note – This procedure requires access to Escalation mode.

Use the setpsnc command to program the previous serial number to the new FRUID.

Place the server module in standby power mode.

“Graceful Power O Using the Power Button” on page 29.

See

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual • May,201498

To restore FRUID information, log in to Escalation mode.

The Escalation mode command-line prompt appears: #

Note the previous server module serial number.

Poweron the server module.

“Apply Full Power ” on page 104.

See

Servicing the Motherboard Assembly (FRU)

100

Sun Oracle Sun Blade X3-2B Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Sun Blade X3-2B (formerly Sun Blade X6270 M3) Service Manual

UsingThis Documentation

Sun Blade X3–2B Model Name Change

Getting the Latest Firmware and Software

Documentation and Feedback

About This Documentation

Support andTraining

Contributors

Change History

Service Manual Overview

About the Sun Blade X3-2B

Product Description

Front Panel Features

Front PanelLEDs and Buttons

Rear Panel Features

About the System Chassis

About Oracle ILOM

About the Chassis Monitoring Module (CMM)

Replaceable Server Module Components

Illustrated Parts Breakdown

Replaceable Components (FRUs and CRUs)

Component Serviceability

Preparing the Sun Blade X3-2B for Service

Obtaining the Server Module Serial Number

Power Modes

Complete Power Removal

Performing ESD and Antistatic Prevention Measures

Set Up for ESD Prevention

Managing the Locate LED

Manage the LocateLED Locally

Manage the LocateLED Remotely From Oracle ILOM SP Web Interface

Manage the LocateLED Remotely From Oracle ILOM CLI

Remove the Server Module from the Sun Blade Chassis

Remove the Server Module Top Cover

Removing or Inserting Filler Panels

Component Filler Panels

Remove Server Module Filler Panels

Insert Server Module Filler Panels

About the Multi-port Cable

Attach a Dongle Cable

Servicing Sun Blade X3-2B Components

Servicing a Storage Drive (CRU)

Identifying Storage Drives

Identifying Storage Drive LEDs and Mechanical Components

About Storage Drive Failure and RAID

About Disk Backplane Cabling

Remove a Storage Drive

Install a New Storage Drive

Replace a Storage Drive

Remove Storage Drive Filler Panels

Servicing DIMMs (CRU)

Insert Storage Drive Filler Panels

DIMM Fault Remind Circuit

Identify Faulty DIMMs

DIMM Population Rules and Guidelines

Remove DIMMs

Install DIMMs

Remove Optional DIMM Filler Panels

Install Optional DIMM Filler Panels

Replace the System Battery (CRU)

Servicing USB Flash Drives (CRU)

Remove USB Flash Drives

Install USB Flash Drives

Servicing a Fabric Expansion Module (CRU)

Remove a FEM

Install a FEM

Servicing a RAID Expansion Module (CRU)

Remove a REM Card

Install a REM Card

Replace a REM Battery on the REM Card

Servicing Cables (CRU)

Remove the REM Storage Drive Cable

Install the REM Storage Drive Cable

Servicing a Processor and Heat Sink Assembly (FRU)

Processor FaultRemind Circuit

Identify a Faulty Processor