Sun Microsystems Sun Enterprise 10000 6x00, Sun Enterprise 10000 5x00, Sun Enterprise 10000 4x00, Sun Enterprise 10000 3x00 Installation Guide

Sun Enterprise™ 10000,
6x00, 5x00, 4x00, 3x00 System and
CPU/Memory Boards Thermal Pad
Sun Microsystems, Inc. 901 San Antonio Road Palo Alto, CA 94303 U.S.A. 650-960-1300
Part No. 806-5605-10 May 2000, Revision A
Send comments about this document to: docfeedback@sun.com
Copyright 2000Sun Microsystems,Inc., 901San AntonioRoad •Palo Alto, CA94303-4900 USA.All rightsreserved. This product ordocument isprotected bycopyright anddistributed underlicenses restricting its use, copying,distribution, anddecompilation.
No partof thisproduct ordocument maybe reproducedin anyform byany means withoutprior writtenauthorization ofSun and itslicensors, if any.Third-partysoftware, includingfont technology,is copyrighted andlicensed fromSun suppliers.
Parts ofthe productmay bederived fromBerkeley BSDsystems, licensedfrom theUniversity of California.UNIX isa registeredtrademark in the U.S.and othercountries, exclusivelylicensed throughX/Open Company,Ltd. ForNetscape Communicator™, thefollowing noticeapplies: Copyright 1995Netscape CommunicationsCorporation. Allrights reserved.
Sun, SunMicrosystems, theSun logo,AnswerBook2, docs.sun.com,and Solarisare trademarks,registered trademarks,or service marks of Sun Microsystems,Inc. in theU.S. andother countries.All SPARCtrademarks are used under licenseand aretrademarks orregistered trademarks of SPARCInternational, Inc.in theU.S. andother countries. Productsbearing SPARCtrademarks arebased uponan architecturedeveloped by Sun Microsystems, Inc.
The OPENLOOK andSun™ GraphicalUser Interfacewas developed bySun Microsystems,Inc. forits usersand licensees. Sun acknowledges the pioneeringefforts ofXerox inresearchingand developing theconcept ofvisual orgraphical user interfaces for thecomputer industry.Sun holds anon-exclusive licensefrom Xeroxto theXerox GraphicalUser Interface,which licensealso covers Sun’slicensees whoimplement OPEN LOOK GUIsand otherwisecomply withSun’s writtenlicense agreements.
RESTRICTEDRIGHTS:Use, duplication,or disclosureby theU.S. Government issubject torestrictions ofFAR 52.227-14(g)(2)(6/87)and FAR52.227-19(6/87), orDFAR252.227-7015(b)(6/95) andDFAR 227.7202-3(a).
DOCUMENTATIONIS PROVIDED “AS IS”AND ALL EXPRESS ORIMPLIED CONDITIONS, REPRESENTATIONS ANDWARRANTIES, INCLUDING ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON­INFRINGEMENT, ARE DISCLAIMED, EXCEPT TO THE EXTENT THAT SUCH DISCLAIMERS ARE HELD TO BE LEGALLY INVALID.
Copyright 2000Sun Microsystems,Inc., 901San AntonioRoad •Palo Alto, CA94303-4900 Etats-Unis.Tousdroits réservés. Ce produitou documentest protégépar uncopyright etdistribué avecdes licences quien restreignentl’utilisation, lacopie, ladistribution, etla
décompilation. Aucunepartie dece produitou documentne peutêtre reproduitesous aucuneforme, parquelque moyen quece soit,sans l’autorisation préalableet écritede Sunet deses bailleurs delicence, s’ily ena. Lelogiciel détenu pardes tiers,et quicomprend latechnologie relativeaux polices decaractères, estprotégé parun copyrightet licenciépar desfournisseurs de Sun.
Des partiesde ceproduit pourrontêtre dérivéesdes systèmesBerkeley BSDlicenciés parl’Université de Californie.UNIX estune marque déposée auxEtats-Unis etdans d’autrespays etlicenciée exclusivementpar X/Open Company,Ltd. Lanotice suivanteest applicableà Netscape Communicator™:Copyright 1995Netscape CommunicationsCorporation. Tousdroits réservés.
Sun, SunMicrosystems, theSun logo,AnswerBook2, docs.sun.com,et Solarissont des marquesde fabriqueou desmarques déposées,ou marquesde service, deSun Microsystems,Inc. auxEtats-Unis etdans d’autrespays. Toutes les marques SPARCsont utiliséessous licenceet sont desmarques defabrique oudes marquesdéposées deSPARCInternational, Inc.aux Etats-Unis etdans d’autrespays. Lesproduits portant les marques SPARCsont baséssur unearchitecture développéepar SunMicrosystems, Inc.
L’interfaced’utilisation graphiqueOPEN LOOKet Sun™a été développéepar SunMicrosystems, Inc.pour sesutilisateurs et licenciés. Sun reconnaîtles effortsde pionniers deXerox pourla rechercheet ledéveloppement duconcept desinterfaces d’utilisation visuelle ou graphique pour l’industriede l’informatique.Sun détientune licencenon exclusive deXerox surl’interface d’utilisationgraphique Xerox,cette licence couvrant égalementles licenciésde Sunqui mettenten place l’interfaced’utilisation graphiqueOPEN LOOKet qui en outre seconforment aux licences écritesde Sun.
CETTE PUBLICATION ESTFOURNIE "EN L’ETAT"ET AUCUNE GARANTIE, EXPRESSEOU IMPLICITE, N’EST ACCORDEE, Y COMPRIS DES GARANTIESCONCERNANT LA VALEURMARCHANDE, L’APTITUDEDE LA PUBLICATION AREPONDRE A UNEUTILISATION PARTICULIERE, OU LE FAIT QU’ELLE NE SOIT PAS CONTREFAISANTE DE PRODUIT DE TIERS. CE DENI DE GARANTIE NE S’APPLIQUERAIT PAS, DANS LA MESURE OU IL SERAIT TENU JURIDIQUEMENT NUL ET NON AVENU.
Please
Recycle
Thermal Pad Replacement Procedures
Perform these procedures to replace the old exposed thermal pads or the newer wrapped thermal pads on Sun Enterprise™ 10000, 6x00/5x00/4x00/3x00 system and CPU/memory boards. These procedures must be performed by a Sun certified technician.
Related Documentation
Application Title Part Number
Service Sun Enterprise™ 10000, 6x00, 5x00,
4x00, 3x00 System and CPU/Memory Boards Cleaning Guide
806-4561-10
Sun Welcomes Your Comments
Sun is interested in improving its documentation and welcomes your comments and suggestions. You can email your comments to Sun at:
docfeedback@sun.com
Please include the part number (806-5605-10) of your document in the subject line of your email.
1

Thermal Pad Kit Contents

The thermal pad kit contains the following items:
Thermal Pad Placement Template
Four Thermal Pads
Note – Four thermal pads will install on one Sun Enterprise 10000 system board or
two Sun Enterprise 6x00/5x00/4x00/3x00 CPU/memory boards.

Tools Required

The following tools are necessary to remove, install, and handle the components:
Phillips #1 screwdriver
3/32 Hex driver
Grounding wrist strap
Padded ESD mat

Remove Selected Components

1. Attach a grounding wrist strap.
2. Remove the system or CPU/memory board and place it on the padded ESD mat.
Caution – The heatsinks on the processor modules can be hot. Remove the
processor modules carefully or permit them to cool to avoid burns.
3. Remove five 3/32-inch hex-head screws from the processor module compression connectors.
2 Sun Enterprise System and CPU/Memory Boards Thermal Pad Installation Guide • May 2000
4. Lift the processor module straight from the system or CPU/memory board mating surface and the single standoff (for Sun Enterprise 6x00/5x00/4x00/3x00 CPU/ memory boards only) that locks the module to the board.
Use pressure applied with fingers to assist in removing the module from the standoff.
Note – The standoff is present only on Sun Enterprise 6x00/5x00/4x00/3x00 CPU/
memory boards.
5. Place the processor module on the padded ESD mat.
6. Repeat Step 3 through Step 5 to remove all modules present.
Note – If the old style exposed thermal pad is being replaced on the Sun Enterprise
10000 system board by newer individual wrapped thermal pads, then all four processor modules must be removed.
Thermal Pad Replacement Procedures 3
Processor contact pad array (4 places)
Processor (4 places)
System board
Old style one-piece thermal pad
FIGURE 1 Sun Enterprise 10000 System Board
4 Sun Enterprise System and CPU/Memory Boards Thermal Pad Installation Guide • May 2000
Exposed metal layer for thermal pad
FIGURE 2 Sun Enterprise 6x00, 5x00, 4x00, 3x00, CPU/Memory Board

Remove the Old Thermal Pad(s)

1. Peel away the old thermal pad or pads from the exposed metal layer on the system or CPU/memory board.
Discard the removed thermal pads.
2. Clean the silicone buildup from the back of the processors and the system or CPU/memory board surface. Clean the connector pads and contact pins.
Use the SunShine Cleaning kit and refer to the Sun Enterprise 10000, 6x00,5x00,4x00,3x00 System and CPU/Memory Boards Cleaning Guide.
Thermal Pad Replacement Procedures 5

Install the New Thermal Pads

Note – The Sun Enterprise 10000 system board requires the use of the template to
install the thermal pads in the proper location on the exposed metal layer.
1. Install the thermal pad placement template on the Sun Enterprise 10000 system board in place of the processor (
The side to face up is marked on the template and the holes align with the fastener standoffs on the system board.
2. Peel away the paper strip from the adhesive on the back of the new thermal pads.
3. Center the thermal pad in the opening of the template for a Sun Enterprise 10000 system board ( exposed metal layer strip of the Sun Enterprise 6x00/5x00/4x00/3x00 CPU/memory board.
Apply pressure across the pad to ensure the adhesive on the pad makes complete contact with the metal layer.
THERMAL PAD PLACEMENT TEMPLATE
FIGURE 3). Center and place each thermal pad directly on the
FIGURE 3).
THIS SIDE UP
FIGURE 3 Sun Enterprise E10000 Thermal Pad Placement Template
6 Sun Enterprise System and CPU/Memory Boards Thermal Pad Installation Guide • May 2000
4. Repeat Step 1 through Step 3 as needed until all processor sites have the wrapped thermal pad installed.
For subsequent thermal pads, allow the template to rest over the adjacent installed thermal pads.

Install the Processor Modules

1. Hold the processor module by the edges and align it over the fastener holes.
Make sure the thermal pad placement template is removed from Sun Enterprise 10000 system boards.
2. Rest the module on the board standoff (for Sun Enterprise 6x00/5x00/4x00/3x00 CPU/memory boards only) and align the compression connectors with the screws.
Firmly but gently press the module straight down until the standoff post snaps into place and the module connectors are fully seated.
Note – The standoff is present only on Sun Enterprise 6x00/5x00/4x00/3x00 CPU/
memory boards.
3. Engage all captive connector screws clockwise with the 3/32 in. hex head torque driver.
a. Tighten the captive connector screws in the sequence shown in
they touch the metal plate.
b. Tighten each captive connector screw in the sequence shown in
additional 1/2 turn.
c. Tighten the captive connector screws to a final torque of 0.68 Nm (6.0 inch
pounds) in the pattern shown in
FIGURE 4.
Thermal Pad Replacement Procedures 7
FIGURE 4 until
FIGURE 4 an
3
5
4
2
3 1 4
FIGURE 4 Tightening Pattern for the Processor Module
5
12
4. Install the system or CPU/memory board.
8 Sun Enterprise System and CPU/Memory Boards Thermal Pad Installation Guide • May 2000
Loading...