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TD62064,074AP/AF
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
TD62064AP,TD62064AF,TD62074AP,TD62074AF
4ch High-Current Darlington Sink Driver
The TD62064AP/AF and TD62074AP/AF are high-voltage,
high-current darlington drivers comprised of four NPN
darlington pairs.
All units feature integral clamp diodes for switching inductive
loads and all units of TD62074AP/AF feature uncommitted
collectors and emitters for isolated darlington applications.
For proper operation, the substrate (SUB) must be connected to
the most negative voltage.
Applications include relay, hammer, lamp and stepping motor
drivers.
Features
• Output current (single output) 1.5 A (max)
• High sustaining voltage output
50 V (min) (TD62064AP/AF, 074AP/AF)
• Output clamp diodes: TD62064AP/AF
• Isolated darlington array: TD62074AP/AF
• Input compatible with TTL and 5 V CMOS
• GND and SUB terminal = Heat sink
• Package type-AP: DIP-16 pin
• Package type-AF: HSOP-16 pin
TD62064AP
TD62074AP
TD62064AF
TD62074AF
Weight
DIP16- P -300- 2.54A: 1.11 g (typ.)
HSOP16-P-300-1.00: 0.50 g (typ.)
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Pin Assignment (top view)
TD62064AP
Heat sink
O4
NC I4
16 15 14 13 12 11 10 9
1 2 3 4 5 6 7 8
COM O1 I1
TD62074AP
O4
GND I4
16 15 14 13 12 11 10 9
& GND
Heat sink
& GND
Heat sink
& SUB
I3 NC O3
I2 O2 COM
I3 GND O3
TD62064,074AP/AF
1 2 3 4 5 6 7 8
O1 GND I1
Heat sink
& SUB
I2 GND O2
TD62064AF
Heat sink
O4
NC I4 I3 NC O3
16 15 14 13 12 11 10 9
1 2 3 4 5
COM O1 I1 I2 O2 COM
NC NC
& GND
Heat sink
& GND
6
NCNC
TD62074AF
Heat sink
O4
GND GND O3
16 15 14 13 12 11 10 9
& GND
I4 I3
7 8
1 2 3 4 5
O1 GND GND O2
Heat sink
& GND
I2I1
7 8
6
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TD62064,074AP/AF
Schematics
(each driver)
TD62064AP/AF TD62074AP/AF
Input
230 Ω
8.2 kΩ
COMMON
Output
1.1 kΩ
GND
Input
8.2 kΩ
230 Ω
1.1 kΩ
Output
GND
SUB
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Precautions for Usin g
(1) This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
(2) If a TD62064AP/AF is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba
recommends that the diodes (pins 1 and 8) be connected to the secondary power supply pin so as to absorb the
counter electromotive force generated by the load. Please adhere to the device’s absolute maximum ratings.
Toshiba recommends that zener diodes be connected between the diodes (pins 1 and 8) and the secondary
power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again,
please adhere to the device’s absolute maximum ratings.
If a TD62074AP/AF is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba
recommends that a diode be connected between the output pin (as the anode) and the secondary power supply
pin. Please adhere to the device’s absolute maximum ratings.
Absolute Maximum Ratings
(Ta = 25°C)
Characteristics Symbol Rating Unit
Output sustaining voltage V
Output current I
Input current I
Input voltage V
Clamp diode reverse voltage VR (Note 1) 50 V
Clamp diode forward current IF (Note 1) 1.5 A
Isolated voltage
AP
Power dissipation
AF
Operating temperature T
Storage temperature T
CE (SUS)
OUT
IN
IN
V
SUB
(Note 2)
P
D
opr
stg
−0.5 to 50 V
0.5 to 17 V
−
1.47/2.7
(Note 3)
0.9/1.4
(Note 4)
40 to 85 °C
−
−55 to 150 °C
1.5 A/ch
50 mA
50 V
W
Note 1: TD62064AP/AF
Note 2: TD62074AP/AF
Note 3: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 4: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
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TD62064,074AP/AF
Recommended Operati ng Co ndi tions
Characteristics Symbol Test Condition
Output sustaining voltage V
DC1 cir cuit, Ta = 25° C 0 ⎯ 1250
Output current
AP (Note 1)
AF (Note 2)
V
Input voltage
Output ON V
Output OFF V
Input current I
Clamp diode reverse voltage V
Clamp diode forward current I
Isolation voltage V
Power dissipation
AP Ta
AF
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
Electrical Characteristics
(Ta = 25°C)
CE (SUS)
I
OUT
IN
IN (ON)
IN (OFF)
IN
R
F
SUB
P
D
(Ta = −40
to
85°C)
Min Typ. Max Unit
Tpw = 25 ms
4 circuits
T
= 120°C
j
Ta = 85°C
I
= 1.25 A 2.5 ⎯ 8
OUT
TD62064AP/AF 0 ⎯ 50 V
TD62074AP/AF
85°C (Note 1)
=
Ta = 85°C (Note 2) ⎯ ⎯ 0.7
⎯ 0 ⎯ 50 V
Duty = 10% 0 ⎯ 1250
Duty = 50% 0
Duty = 10% 0
Duty = 50% 0
⎯
⎯
⎯
⎯ 0 ⎯ 8
⎯ 0 ⎯ 0.4
⎯ 0 ⎯ 20 mA
⎯
⎯
⎯
⎯
1.25 A
⎯
50 V
⎯
1.4
⎯
390
907
172
mA/ch
V
W
Characteristics Symbol
Output leakage current I
Output saturation voltage V
DC current transfer ratio h
Input voltage (output on) V
Clamp diode leakage current I
Clamp diode forward voltage V
Input capacitance C
Turn-ON delay t
Turn-OFF delay t
CEX
CE (sat)
FE
IN (ON)
R
F
IN
ON
OFF
Test
Circuit
VCE = 50 V, Ta = 25°C
1
2
= 50 V, Ta = 85°C
V
CE
I
= 1.25 A, IIN = 2 mA ⎯ ⎯ 1.6
OUT
I
= 0.75 A, IIN = 935 µA ⎯ ⎯ 1.25
OUT
2 VCE = 2 V
3 I
4
= 1.25 A, IIN = 2 mA ⎯ ⎯ 2.4 V
OUT
VR = 50 V, Ta = 25°C
V
= 50 V, Ta = 85°C
R
5 IF = 1.25 A
Test Condition
I
= 1.0 A ⎯ 800 ⎯
OUT
I
= 0.25 A ⎯ 1500 ⎯
OUT
Min Typ. Max Unit
50
⎯
500
⎯
µA
⎯
⎯
V
⎯
⎯
⎯
⎯
50
⎯
100
⎯
2.0 V
⎯
µ
A
6 VIN = 0 V, f = 1 MHz ⎯ 15 ⎯ pF
C
= 15 pF, V
L
7
R
= 42
Ω
L
C
= 15 pF, V
L
7
R
= 42 Ω
L
= 50 V,
OUT
= 50 V,
OUT
0.1 ⎯
⎯
µ
⎯ 1.0 ⎯ µs
s
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Te st Circuit
X
µ
TD62064,074AP/AF
1. I
CEX
Open
4. I
R
Open
7. t
ON
Pulse
generator
(Note 1)
Open
I
CE
VCE
I
R
Open
, t
OFF
Input
VIN
Open V
VR
OUT
R
C
(Note 2)
2. V
5. VF
L
= 15 pF
L
Open
Output
CE (sat)
I
IN
Input 50%
Output
, hFE
VCE, V
Open
Open
I
CE (sat)
V
F
t
r
90% 90%
10%
t
N
3. V
IN (ON)
T
V
6. CIN
IF
Capacitance
bridge
L
O
(Note 1)
50%
s
50
50% 50%
IN (ON)
f
i
t
tFF
VCE
VIN
10%
Open
I
OUT
Open
VIH = 2.4 V
0
V
OH
V
OL
Open
Note 1: Pulse Width 50 µs, Duty Cycle 10%
Output Impedance 50 Ω, t
Note 2: CL includes probe and jig capacitance
≤ 5 ns, tf ≤ 10 ns
r
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TD62064,074AP/AF
1.5
TD62064AP
TD62074AP
I
OUT
– V
CE
(sat)
12
TD62064AP
TD62074AP
(A)
1.0
OUT
typ.
25°C max
(mA)
IN
8
0.5
Output current I
4
Input current I
0
0.5 1.0 1.5 2.0
0
Collector-emitter saturation voltage
V
CE (sat)
(V)
0
1.0
2.0 3.0 4.0 5.0
Input voltage VIN (V)
400
VCE = 2 V
(mA)
300
OUT
200
100
Output current I
I
– IIN
OUT
Ta = 75 °C 25 −30
3.0
(1)
2.4
(W)
D
1.8
Power dissipation P
(2)
(3)
1.2
(4)
0.6
0
50
100
Input current IIN (µA)
150 200
0
40 160
0
Ambient temperature Ta (°C)
1500
1200
(mA)
900
OUT
600
n = 3
n = 4
I
– Duty cycle
OUT
1500
n = 1
1200
n = 2
(mA)
900
OUT
600
300
0
0
TD62064AP
Ta = 25°C
n-ch ON
40
20 80
Duty Cycle (%)
60 100
Output current I
Output current I
300
0
0
TD62064AP
Ta = 85°C
n-ch ON
20 80
I
– VIN
IN
max
P
– Ta
D
(1) DIP-16 pin
on glass epoxy PCB
(50 × 50 × 1.6 mm Cu 50%)
(2) DIP-16 pin free air
(3) PFP-16 pin
on glass epoxy PCB
(60 × 30 × 1.6 mm Cu 30%)
(4) PFP-16 pin free air
80
I
– Duty cycle
OUT
40
Duty Cycle (%)
min
typ.
120 200
n = 1
n = 2 n = 3n = 4
60 100
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TD62064,074AP/AF
1500
1200
(mA)
900
OUT
600
I
– Duty cycle
OUT
1500
n = 1
1200
(mA)
n = 2 n = 3 n = 4
n = 3
900
OUT
n = 4
600
300
0
0
TD62064AF
Ta = 25°C
n-ch ON
40
20 80
Duty Cycle (%)
60 100
Output current I
Output current I
300
0
0
TD62064AF
Ta = 85°C
n-ch ON
20 80
I
– Duty cycle
OUT
n = 2
40
Duty Cycle (%)
n = 1
60 100
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Package Dimensions
TD62064,074AP/AF
Weight: 1.11 g (ty p.)
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Package Dimensions
TD62064,074AP/AF
Weight: 0.50 g (ty p.)
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Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
TD62064,074AP/AF
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Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in
system design.
TD62064,074AP/AF
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TD62064,074AP/AF
RESTRICTIONS ON PRODUCT USE
• The information contained herein is subject to change without notic e. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in maki ng a saf e desig n for th e enti re sys tem, an d to avoi d situ ations in whic h a mal funct ion or fa ilure of
such TOSHIBA products could cause loss of human lif e, bodily injury or damage to property.
In developing your desi gns, pleas e ensure t hat TOSHIBA products are used within s pecified op erating r anges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mi nd the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measur ing equipment, i ndustrial robotics , domestic appli ances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document s hall not be used or embedded t o any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is gr anted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
021023_A
021023_B
060106_Q
021023_C
060116EBA
• The products described in this document are subject to the foreign exchang e and for eig n tr ade l aws. 021023_E
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