Page 1
LOW-NOISE VERTICAL DEFLECTION SYSTEM
FEATURES SUMMARY
■ COMPLETE VERTICAL DEFLECTION
SYSTEM
■ LOW NOISE
■ SUITABLE FOR HIGH DEFINITION
MONITORS
■ ESD PROTECTED
DESCRIPTION
The TDA1175P is a monolithic integrated circuit in
POWERDIP16 plastic package. It is intended for
use in black and white and colour TV receivers.
Low-noise makes this device particularly suitable
for use in monitors.
The functions incorporated are: synchronization
circuit, oscillator and ramp generator, high power
gain amplifier, flyback generator, voltage regulator.
TDA1175P
Figure 1. Package
POWERDIP16
(Plastic Package)
Figure 2. Pin Connections
SUPPLY VOLTAGE
POWER AMPLIFIER OUTPUT
POWER AMPLIFIER
SUPPLY VOLTAGE
REGULATED VOLTAGE
RAMP OUTPUT
FLYBACK
GROUND
GROUND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
RAMP GENERATOR
COMPENSATION
AMP. INPUT
GROUND
GROUND
OSCILLATOR
SYNC. INPUT
9
HEIGHT ADJUSTMENT
REV. 2
1/13April 2004
Page 2
TDA1175P
Figure 3. Block Diagram
C4 D
+V
S
A
SYNC
FREQ
C1
P1
11
10
TDA1175P
OSCILLATOR
SYNC
CIRCUIT
125413
TABS
HEIGHT
8
VOLTAGE
REGULATOR
RAMP
GENERATOR
916114
C2
A
2
LINEARITY
37
FLYBACK
GENERATOR
BUFFER
STAGE
P3P2 R
C3
PREAMPLIFIER
R
B
POWER
AMPLIFIER
6
R
G
15
R
D
R
C
Table 1. Absolute Maximum Ratings
Symbol Parameter Value Unit
V
S
V
6, V7
V
14
I
O
I
O
I
O
Pin 3 DC Current at V6 < V
I
3
I
Pin 3 Peak to Peak Flyback Current for f = 50Hz, t
3
I
10
P
TOT
T
STG , Tj
Supply Voltage at Pin 2 35 V
Flyback Peak Voltage 60 V
Power Amplifier Input Voltage
+ 10
– 0.5
Output Peak Current (non repetitive) at t = 2ms 2 A
Output Peak Current at f = 50Hz, t ≤ 10µs2.5 A
Output Peak Current at f = 50Hz, t > 10µs1.5A
2
≤ 1.5ms
fly
100 mA
1.8 A
Pin 10 Current ± 20 mA
Power Dissipation at at T
Power Dissipation at T
= 90°C
tab
= 70°C (free air) (1)
amb
4.3 W
1W
Storage and Junction Temperature – 40 to 150 °C
C6
C9
R
H
YOKE
C8
C7C5
R
E
R
F
V
Table 2. Thermal Data
Symbol Parameter Value Unit
R
th (j-tab)
R
th (j-amb)
Note: 1. Obtained with tabs soldered to printed circuit with minimized copper area.
2/13
Thermal Resistance Junction-pin Max. 12 °C/W
Thermal Resistance Junction-ambient Max. 80
°C/W
(1)
Page 3
TDA1175P
ELECTRICAL CHARACTERISTICS
= 25°C, unless otherwise specified)
(T
amb
Table 3. DC CHARACTERISTICS
(Refer to the test circuits, VS = 35V)
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
I
I
2
Pin 2 Quiescent Current
I7 Pin 7 Quiescent Current
–I
11
–I
14
–I
16
–I
16
Oscillator Bias Current
Amplifier Input Bias Current
Ramp Generator Bias Current
Ramp Generator Current
= 0
3
I
= 0
6
V
= 1V
11
V
= 1V
14
V
= 0
16
I
= 20µA, V16 = 0
9
714mA5
817mA5
0.1 1 µA4
110µA5
0.02 0.3 µA4
18.5 20 21.5 µA5
∆
V
-------------
V
∆
I16∆
----------
I
16
V
V
V
V
V
V
V
V
8
S
S
1
3
6
6L
6H
8
9
------------
∆
∆V
Ramp Generator Non-linearity
= 0 to 12V, I9 = 20µA
16
0.2 1 % 5
Supply Voltage Range 10 35 V
Pin 1 Saturation Voltage to
Ground
Pin 3 Saturation Voltage to
Ground
Qiuescent output Voltage
Output Saturation Voltage to
Ground
Output Saturation Voltage to
Supply
I
= 1mA
1
I
= 10mA
3
V
= 10V, R1 = 1kΩ, R2 = 1k
s
V
= 35V, R1 = 3kΩ, R2 = 1kΩ
s
– I
= 0.1A
6
= 0.8A
– I
6
I
= 0.1A
6
= 0.8A
I
6
114 V
1.5 2.5 V 4
Ω
4.1 4.4 4.7 V 4
8.2 8.8 9.4 V 4
0.9 1.2 V 6
1.8 2.2 V 6
1.4 2.1 V 7
2.8 3.1 V 7
Regulated Voltage at Pin 8 6.5 6.7 6.9 V 5
I
Regulated Voltage at Pin 9
V9∆
Regulated Voltage Drift with
Supply Voltage
V
S
= 20µA
9
6.6 6.8 7 V 5
∆Vs = 10 to 35V 1 2 mV/V 5
V
14
Amplifier Input Reference
Voltage
V
≤ 0.4V
10
2.20 2.27 2.35 V
3/13
Page 4
TDA1175P
Table 4. AC CHARACTERISTICS
(Refer to the AC test circuit, V
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
I
S
I10
V
6
t
fly
V
ON
f
O
f
OPER
∆f Synchronization Range
Supply Current
Sync. Input Current (positive or
negative)
Flyback Voltage
Flyback Time
Peak to Peak Output Noise Pin 11 Connected to GND 18 30
Free Running Frequency
Operating Frequency Range 10 120 Hz 8
= 22V, f = 50Hz)
S
I
I
I
(P1 + R1) = 300kΩ
C9 = 0.1 µF
I
(P1+R1) = 300kΩ
= 1
Y
APP
= 1
Y
APP
= 1
Y
APP
= 0.5mA, C9 = 0.1µF
10
140 mA 8
0.5 2 mA 8
45 V 8
0.7 ms 8
mV
36 43.5 Hz 8
14 Hz 8
8
pp
f∆
----------
V
∆
------------
∆
T
f∆
S
ab
Frequency Drift with Supply
Voltage
Frequency Drift with tab
Temperature
VS = 10 to 35V
T
= 40 to 120°C
tab
0.00
Hz/V
5
0.01 Hz/°C 8
8
4/13
Page 5
DC TEST CIRCUITS
TDA1175P
Figure 4.
V
3
10
11
I
8
1κΩ
1V 1V 8V
-I
9
Figure 5.
+V
I
3
3
S
7
2
TDA1175P
916 14
TABS
-I
12
R2
+V
I
2
S
Figure 6.
+ V
S
I
27
6
R1
V
4
11
TDA1175P
14
6
TABS
4
V
4L
4V
Figure 7.
+ V
S
27
11
TDA1175P
16
V
6
-I
98
12
V
7
100kΩ
I
5
14
TABS
-I
1V
27
11
TDA1175P
14
10
6
TABS
V
4H
I
4
1V
5/13
Page 6
TDA1175P
Figure 8. AC Test and Application Circuit for Large Screen B/W TV Set 10Ω/20mH/1A
VS = 22V
16
470µF
100pF
1.8kΩ
0.1µF
5.6kΩ
5.6kΩ
10µF
Yoke
Ry = 10
Ω
Ly = 20mH
1000µF
2
15
14
1
3.3Ω
220kΩ
470pF
22kΩ
100kΩ
47kΩ
0.1µF
100µF
SYNC.
INPUT
P1
100kΩ
1N4001
TABS
7
3 6
10
11
220kΩ
R1
8 9
TDA1175P
100kΩ
PP
560Ω*
C9
0.1µF
120kΩ
910kΩ
0.1µF
1Ω
0.1µF
*on application only
6/13
Page 7
TDA1175P
Figure 9. Typical Application Circuit for VGA Monitor (RY = 10Ω, LY = 20mH, IY = 0.8APP)
C9 C10 560pF
V
(26V)
S
C1
0.1µF
R1
3.3kΩ
1.8µF
C2
1000µF
35V
0.15µF
C5
D1
1N4007
C3
100µF
35V
C4
P1
100kΩ
V.FREQ
200kΩ
R3
240kΩ
R5
3.3nF
7
3
10
11
82kΩ
15
R2
P2
220kΩ
220kΩ
98
V. SIZE
R12
2
6
TDA1175P
R4
1MΩ
R14
220µF
1/2W
R9
5.1kΩ
C12
470µF
50V
Y1
YOKE
R13
3.3Ω
C11
0.1µF
22µF
35V
14
1
P3
50kΩ
4 5
16
C6
0.1µF
C7
0.1µF
12 13
V.LIN
R6
56kΩ
C8
2.7kΩ
27kΩ
R8
47kΩ
0.82Ω
R11
R7
R10
7/13
Page 8
TDA1175P
Figure 10. P.C. Board and Components Layout of the Circuit of Figure 9 (1:1 scale)
C9
C12
C18
R18
R11
C11
R10
Y1
R8
R14
R7
C7
Table 5. Bill of Material
Item Qty Reference Part
1 4 C1, C6, C7, C11 0.1µF
2 1 C2 1000µF 35V
3 1 C3 100µF 35V
4 1 C4 0.15µF
5 1 C5 1.8nF
61 C8 22µF 35V
7 1 C9 3.3nF
8 1 C10 560pF
9 1 C12 470µF 50V
10 1 D1 1N4007
11 1 IC1 TDA1175P
12 1 P1 100kΩ POT
13 1 P2 220kΩ POT
14 1 P3 50kΩPOT
V-FREQ
R12
P1
C4
C8
R4
IC1
R8
C6
P2
R2
R1
D1
R6
V-SIZE
C6
R6C2R9
GND
VS
C1
C3
P3
V.LIN
R
Item Qty Reference Part
15 1 R1 3.3kΩ
16 1 R2 82kΩ
17 1 R3 240kΩ
18 1 R4 1MΩ
19 1 R5 200kΩ
20 1 R6 56kΩ
21 1 R7 27kΩ
22 1 R8 47kΩ
23 1 R9 5.1kΩ
24 1 R10 0.82Ω
25 1 R11 2.7kΩ
26 1 R12 220kΩ
27 1 R13 3.3Ω
28 1 R14 220Ω 1/2W
29 1 Y1 YOKE
8/13
Page 9
MOUNTING INSTRUCTION
The R
(j-a) can be reduced by soldering the GND
th
pins to a suitable copper area of the printed circuit
board (Figure 11) or to an external heatsink (Figure 12).
The diagram of Figure 13 shows the maximum dissipable power P
and the Rth (
tot
) as a function of
j-a
the side "I" of two equal square copper areas having a thicknessof 35µ (1.4 mils).
During soldering the pins temperature must not
exceed 260°C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper
area must be connected to electrical ground.
TDA1175P
Figure 13. Maximum Power Dissipation and
Junction-ambient Thermal Resistance versus
"I"
G-3558
P
(W)
tot
4
R
3
th j - amb
R
th
(˚C/W)
80
60
Figure 11. Example of P.C. Board Copper Area
COPPER AREA 35µ THICKNESS
P.C. BOARD
S-3181
Figure 12. External Heatsink Mounting
Example
17.0 mm
2
P
(T
= 70˚C)
tot
1
0
0 10 20 30 40 l (mm)
amb
Figure 14. Maximum Allowable Power
Dissipation versus Ambient Temperature
P
tot
4
3
2
WITH HEAT SINK HAVING R
th
= 25˚ C / W
FREE AIR
G-3559/2
WITH INFINITE HEAT SINK
40
20
0
11.9 mm
S-3474
38.0 mm
1
0
-50 0 50 100
(˚C)
T
amb
9/13
Page 10
TDA1175P
PART NUMBERING
Table 6. Order Codes
Part Number Package Temperature Range
TDA1175P POWERDIP16 -25 to 85 °C
10/13
Page 11
PACKAGE MECHANICAL
Table 7. POWERDIP16 - Mechanical Data
millimeters inches
Symbol
Typ Min Max Typ Min Max
a1 0.51 0.020
B 0.85 1.4 0.033 0.055
b 0.5 0.020
b1 0.38 0.5 0.015 0.020
D 20 0.787
E 8.8 0.346
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
i 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
TDA1175P
Figure 15. POWERDIP16 - Package Dimensions
Z
b
B
e3
D
16
18
a1
e
9
I
L
b1
E
F
Note: Drawing is not to scale
11/13
Page 12
TDA1175P
REVISION HISTORY
Table 8. Revision History
Date Revision Description of Changes
August-1995 1 First Issue
14-Apr-2004 2 Stylesheet update. No content change.
12/13
Page 13
TDA1175P
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2004 STMicroelectronics - All rights reserved
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