N-channel 650 V, 0.070 Ω, 33 A MDmesh™ V Power MOSFET
3
Features
Type
STB42N65M5
STF42N65M5
STI42N65M5
STP42N65M5
STW42N65M5
V
DSS
T
Jmax
710 V
710 V
710 V
710 V
710 V
@
STx42N65M5
2
in I
PAK, TO-220, TO-220FP, D2PAK and TO-247
R
DS(on)
max
< 0.079 Ω
< 0.079 Ω
< 0.079 Ω
< 0.079 Ω
< 0.079 Ω
I
33 A
33 A
33 A
33 A
33 A
D
3
1
D²PAK
(1)
TO-220FP
2
1
TO-220
3
2
1
1. Limited only by maximum temperature allowed
■ TO-220 worldwide best R
■
Higher V
■ High dv/dt capability
■ Excellent switching performance
■ Easy to drive
■ 100% avalanche tested
DSS
rating
DS(on)
Application
■ Switching applications
Description
MDmesh™ V is a revolutionary Power MOSFET
technology based on an innovative proprietary
vertical process, which is combined with
STMicroelectronics’ well-known PowerMESH™
horizontal layout structure. The resulting product
has extremely low on-resistance, which is
unmatched among silicon-based Power
MOSFETs, making it especially suitable for
applications which require superior power density
and outstanding efficiencies.
Figure 10.Gate charge vs gate-source voltage Figure 11.Static drain-source on resistance
VGS
(V)
10
VDS
5
10
15
V
8
VDD=520V
6
V
GS=10V
D=16.5A
I
4
2
0
0
20
40
60
80
100
120
50
40
30
20
10
0
RDS(on)
(Ω)
0.076
0.074
0.072
0.070
0.068
0.066
0.064
3
4
5
7
6
8
9
GS(V)
V
AM01568v1
VGS=10V
0
10
20
30
D(A)
I
Figure 12.Capacitance variationsFigure 13.Output capacitance stored energy
C
(pF)
10000
1000
AM01570v1
Ciss
Eoss
(µJ)
16
14
12
10
100
Coss
8
6
10
Crss
1
1
10
100
V
DS(V)
4
2
0
0
100
200
300
400
500
Doc ID 15317 Rev 37/18
600
AM03231v1
DS(V)
V
Electrical characteristicsSTx42N65M5
Figure 14.Normalized gate threshold voltage
VGS(th)
(norm)
vs temperature
1.1
1.0
0.9
0.8
0.7
0.6
-50
AM01571v1
D = 250 µA
I
T
0
50
100
J(°C)
Figure 16.Source-drain diode forward
characteristics
V
SD
(V)
1.0
0.9
0.8
T
J
=-25°C
AM01574v1
Figure 15.Normalized on resistance vs
temperature
R
DS(on)
(norm)
2.0
1.5
1.0
0.5
0
-50
Figure 17.Normalized B
BV
DSS
(norm)
1.05
0
ID = 16.5 A
GS
= 10 V
V
50
VDSS
100
vs temperature
AM01573v1
T
J
(°C)
AM01572v1
0.7
0.6
0.5
TJ=150°C
J
T
=25°C
0.4
0.3
0.2
0
5
Figure 18.Switching losses vs gate resistance
(1)
10
15
20
25
30
E
(µJ)
600
500
ID=20A
DD=400V
V
L=50µH
Eon
400
300
200
100
Eoff
I
SD
(A)
AM01575v1
1.00
0.95
0.90
-50
ID = 1 mA
T
J
0
50
100
(°C)
0
10
5
0
15
20
25
30
35
40 45
R
G(Ω)
1. Eon including reverse recovery of a SiC diode
8/18 Doc ID 15317 Rev 3
STx42N65M5Test circuits
3 Test circuits
Figure 19. Switching times test circuit for
PW
resistive load
VGS
VD
RG
RL
D.U.T.
2200
µF
3.3µF
AM01468v1
V
DD
Figure 21. Test circuit for inductive load
G
25
Ω
switching and diode recovery times
A
D
D.U. T.
S
B
R
FAST
DIODE
G
A
A
L=100µH
B
B
D
G
S
3.3
µF
1000
µF
V
DD
Figure 20. Gate charge test circuit
V
i=20V=VGMAX
PW
2200
µF
1kΩ
12V
IG=CONST
2.7kΩ
47kΩ
47kΩ
100Ω
100nF
D.U.T.
AM01469v1
Figure 22. Unclamped inductive load test
circuit
L
VD
ID
Vi
D.U. T.
2200
µF
3.3µF
1kΩ
VDD
V
VDD
G
Pw
AM01470v1
Figure 23. Unclamped inductive waveformFigure 24. Switching time waveform
V(BR)DSS
VD
IDM
ID
VDD
VDD
AM01472v1
0
0
10%
tdon
ton
90%
tr
10%
V
GS
Doc ID 15317 Rev 39/18
VDS
tdoff
90%
AM01471v1
toff
tf
90%
10%
AM01473v1
Package mechanical dataSTx42N65M5
4 Package mechanical data
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