ST MICROELECTRONICS STW34N65M5 Datasheet

STB34N65M5, STI34N65M5,
1
3
2
TAB
1
2
3
TAB
1
2
3
D2PAK
I2PAK
TO-220
TO-247
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STP34N65M5, STW34N65M5
N-channel 650 V, 0.09 Ω typ., 28 A MDmesh™ V Power MOSFETs
in D
2
PAK, I2PAK, TO-220 and TO-247 packages
Datasheet - production data
TAB
3
2
1

Figure 1. Internal schematic diagram

Features
Order codes V
STB34N65M5
STI34N65M5
STP34N65M5
STW34N65M5
Worldwide best R
Higher V
DSS
Excellent switching performance
100% avalanche tested
DS
@ T
Jmax
R
DS(on)
max I
710 V 0.11 Ω 28 A
* area
DS(on)
rating and high dv/dt capability
D
Applications
Switching applications
Description
These devices are N-channel MDmesh™ V Power MOSFETs based on an innovative proprietary vertical process technology, which is combined with STMicroelectronics’ well-known PowerMESH™ horizontal layout structure. The resulting product has extremely low on­resistance, which is unmatched among silicon­based Power MOSFETs, making it especially suitable for applications which require superior power density and outstanding efficiency.

Table 1. Device summary

Order codes Marking Packages Packaging
2
STB34N65M5
STI34N65M5 I
34N65M5
STW34N65M5 TO-247
October 2013 DocID022853 Rev 3 1/22
This is information on a product in full production.
PAK Tape and reel
D
2
PAK
TubeSTP34N65M5 TO-220
www.st.com
Contents STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2/22 DocID022853 Rev 3
STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5 Electrical ratings

1 Electrical ratings

Table 2. Absolute maximum ratings

Symbol Parameter Value Unit
V
I
DM
P
dv/dt
dv/dt
T
1. ISD 28 A, di/dt 400 A/µs; VDS
2. VDS 480 V
Gate-source voltage ± 25 V
GS
I
Drain current (continuous) at TC = 25 °C 28 A
D
I
Drain current (continuous) at TC = 100 °C 17.7 A
D
(1)
Drain current (pulsed) 112 A
Total dissipation at TC = 25 °C 190 W
TOT
(1)
Peak diode recovery voltage slope 15 V/ns
(2)
MOSFET dv/dt ruggedness 50 V/ns
Storage temperature - 55 to 150 °C
stg
T
Max. operating junction temperature 150 °C
j
peak
< V
(BR)DSS
, VDD=400 V.

Table 3. Thermal data

Value
Symbol Parameter
2
D
PA K
TO-220,
2
PA K
I
TO-247
Unit
R
thj-case
R
thj-pcb
R
thj-amb
1. When mounted on 1 inch² FR-4, 2 Oz copper board.
Thermal resistance junction-case max 0.66 °C/W
Thermal resistance junction-pcb max
(1)
30 °C/W
Thermal resistance junction-ambient max 62.5 50 °C/W

Table 4. Avalanche characteristics

Symbol Parameter Value Unit
Avalanche current, repetitive or not repetitive
I
AR
(pulse width limited by T
E
Single pulse avalanche energy (starting tj=25°C,
AS
= IAR; Vdd=50)
I
d
jmax
)
7A
510 mJ
DocID022853 Rev 3 3/22
22
Electrical characteristics STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5

2 Electrical characteristics

(TC = 25 °C unless otherwise specified)

Table 5. On /off states

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Drain-source breakdown voltage
Zero gate voltage drain current (VGS = 0)
Gate-body leakage current (VDS = 0)
ID = 1 mA, VGS = 0 650 V
V
= 650 V
DS
V
= 650 V, TC=125 °C
DS
1
100µAµA
VGS = ± 25 V ± 100 nA
Gate threshold voltage VDS = VGS, ID = 250 µA 3 4 5 V
Static drain-source on-resistance
V
= 10 V, ID = 14 A 0.09 0.11 Ω
GS

Table 6. Dynamic

Symbol Parameter Test conditions Min. Typ. Max. Unit
C
C
C
C
o(tr)
Input capacitance
iss
V
Output capacitance - 75 - pF
oss
Reverse transfer
rss
capacitance
Equivalent
(1)
capacitance time
= 100 V, f = 1 MHz,
DS
V
= 0
GS
related
= 0 to 520 V, VGS = 0
V
Equivalent
(2)
C
o(er)
capacitance energy
DS
related
G
Intrinsic gate resistance
f = 1 MHz open drain - 1.95 - Ω
R
- 2700 - pF
-6.3-pF
-220-pF
-63-pF
Q
Q
Q
1. Time related is defined as a constant equivalent capacitance giving the same charging time as C V
DS
2. Energy related is defined as a constant equivalent capacitance giving the same stored energy as C when V
Total gate charge
g
Gate-source charge - 17 - nC
gs
Gate-drain charge - 28 - nC
gd
increases from 0 to 80% V
increases from 0 to 80% V
DS
VDD = 520 V, ID = 14 A, V
= 10 V
GS
(see Figure 18)
DSS
DSS
4/22 DocID022853 Rev 3
- 62.5 - nC
when
oss
oss
STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5 Electrical characteristics

Table 7. Switching times

Symbol Parameter Test conditions Min. Typ. Max. Unit
(v) Voltage delay time
t
d
(v) Voltage rise time - 8.7 - ns
t
r
t
(i) Current fall time - 7.5 - ns
f
tc(off) Crossing time - 12 - ns
= 400 V, ID = 18 A,
V
DD
RG = 4.7 Ω, V
GS
= 10 V
(see Figure 19 and
Figure 22)
-59-ns

Table 8. Source drain diode

Symbol Parameter Test conditions Min. Typ. Max. Unit
I
I
SDM
V
SD
Q
I
RRM
Q
I
RRM
1. Pulse width limited by safe operating area.
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Source-drain current - 28 A
SD
(1)
Source-drain current (pulsed) - 112 A
(2)
Forward on voltage ISD = 28 A, VGS = 0 - 1.5 V
t
Reverse recovery time
rr
Reverse recovery charge - 5.6 µC
rr
I
SD
VDD = 100 V (see Figure 22)
Reverse recovery current - 32 A
t
Reverse recovery time
rr
Reverse recovery charge - 7.4 µC
rr
Reverse recovery current - 35 A
I
SD
VDD = 100 V, Tj = 150 °C (see Figure 22)
= 28 A, di/dt = 100 A/µs
= 28 A, di/dt = 100 A/µs
- 350 ns
- 422 ns
DocID022853 Rev 3 5/22
22
Electrical characteristics STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5
I
D
100
10
1
0.1
0.1
1
100
V
DS
(V)
10
(A)
Operation in this area is
Limited by max R
DS(on)
10µs 100µs
1ms
10ms
Tj=150°C Tc=25°C
Single pulse
AM15311v1
I
D
100
10
1
0.1
0.1
1
100
V
DS
(V)
10
(A)
Operation in this area is
Limited by max R
DS(on)
10µs
100µs
1ms
10ms
Tj=150°C Tc=25°C
Single pulse
AM15318v1
I
D
60
40
20
0
0
10
V
DS
(V)
20
(A)
5
15
80
VGS= 6 V
VGS= 7 V
VGS= 8 V
25
VGS= 9 V
10
30
50
70
AM15319v1

2.1 Electrical characteristics (curves)

Figure 2. Safe operating area for D2PAK, I2PAK

Figure 4. Safe operating area for TO-247 Figure 5. Thermal impedance for TO-247

Figure 3. Thermal impedance for D2PAK, I2PAK
and TO-220
and TO-220
6/22 DocID022853 Rev 3

Figure 6. Output characteristics Figure 7. Transfer characteristics

I
(A)
80
70
60
50
30
20
10
D
AM15320v1
VDS= 25 V
0
3
5
4
7
6
8409
V
GS
(V)
STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5 Electrical characteristics
V
GS
6
4
2
0
0
20
Q
g
(nC)
(V)
50
8
30
40
10
VDD=520 V
I
D
=14 A
60
300
200
100
0
400
500
V
DS
(V)
V
DS
12
70
80
AM15321v1
C
1000
100
10
1
0.1
10
V
DS
(V)
(pF)
1
100
Ciss
Coss
Crss
1000
AM15323v1
V
GS(th)
1.00
0.90
0.80
0.70
-50
0
T
J
(°C)
(norm)
-25
1.10
75
25
50
100
ID = 250 µA
V
DS
= V
GS
AM05459v1

Figure 8. Gate charge vs gate-source voltage Figure 9. Static drain-source on-resistance

R
DS(on)
0.096
0.096
0.094
0.092
0.09
0.088
0.086
0.084
0.082
(Ω)
0.08 0
VGS=10V
5
10
15
20
25
AM15322v1
I
D
(A)

Figure 10. Capacitance variations Figure 11. Output capacitance stored energy

Figure 12. Normalized gate threshold voltage vs
temperature
E
oss
AM15324v1
(µJ)
12
10
8
6
4
2
0
0
100
200
300
400
500
600
V
DS
Figure 13. Normalized on-resistance vs
temperature
R
DS(on)
(norm)
2.1
1.9
1.7
1.5
1.3
1.1
V
GS
= 10 V
ID = 14 A
AM05460v1
(V)
0.9
0.7
DocID022853 Rev 3 7/22
0.5
-50
-25
25
0
50
75
100
T
J
(°C)
22
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