STB34N65M5, STI34N65M5,
D2PAK
I2PAK
TO-220
TO-247
STP34N65M5, STW34N65M5
N-channel 650 V, 0.09 Ω typ., 28 A MDmesh™ V Power MOSFETs
in D
2
PAK, I2PAK, TO-220 and TO-247 packages
Datasheet - production data
TAB
3
2
1
Figure 1. Internal schematic diagram
Features
Order codes V
STB34N65M5
STI34N65M5
STP34N65M5
STW34N65M5
• Worldwide best R
• Higher V
DSS
• Excellent switching performance
• 100% avalanche tested
DS
@ T
Jmax
R
DS(on)
max I
710 V 0.11 Ω 28 A
* area
DS(on)
rating and high dv/dt capability
D
Applications
• Switching applications
Description
These devices are N-channel MDmesh™ V
Power MOSFETs based on an innovative
proprietary vertical process technology, which is
combined with STMicroelectronics’ well-known
PowerMESH™ horizontal layout structure. The
resulting product has extremely low onresistance, which is unmatched among siliconbased Power MOSFETs, making it especially
suitable for applications which require superior
power density and outstanding efficiency.
Table 1. Device summary
Order codes Marking Packages Packaging
2
STB34N65M5
STI34N65M5 I
34N65M5
STW34N65M5 TO-247
October 2013 DocID022853 Rev 3 1/22
This is information on a product in full production.
PAK Tape and reel
D
2
PAK
Tube STP34N65M5 TO-220
www.st.com
Contents STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2/22 DocID022853 Rev 3
STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5 Electrical ratings
1 Electrical ratings
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
V
I
DM
P
dv/dt
dv/dt
T
1. ISD ≤ 28 A, di/dt ≤ 400 A/µs; VDS
2. VDS ≤ 480 V
Gate-source voltage ± 25 V
GS
I
Drain current (continuous) at TC = 25 °C 28 A
D
I
Drain current (continuous) at TC = 100 °C 17.7 A
D
(1)
Drain current (pulsed) 112 A
Total dissipation at TC = 25 °C 190 W
TOT
(1)
Peak diode recovery voltage slope 15 V/ns
(2)
MOSFET dv/dt ruggedness 50 V/ns
Storage temperature - 55 to 150 °C
stg
T
Max. operating junction temperature 150 °C
j
peak
< V
(BR)DSS
, VDD=400 V.
Table 3. Thermal data
Value
Symbol Parameter
2
D
PA K
TO-220,
2
PA K
I
TO-247
Unit
R
thj-case
R
thj-pcb
R
thj-amb
1. When mounted on 1 inch² FR-4, 2 Oz copper board.
Thermal resistance junction-case max 0.66 °C/W
Thermal resistance junction-pcb max
(1)
30 °C/W
Thermal resistance junction-ambient max 62.5 50 °C/W
Table 4. Avalanche characteristics
Symbol Parameter Value Unit
Avalanche current, repetitive or not repetitive
I
AR
(pulse width limited by T
E
Single pulse avalanche energy (starting tj=25°C,
AS
= IAR; Vdd=50)
I
d
jmax
)
7A
510 mJ
DocID022853 Rev 3 3/22
22
Electrical characteristics STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5
2 Electrical characteristics
(TC = 25 °C unless otherwise specified)
Table 5. On /off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Drain-source
breakdown voltage
Zero gate voltage
drain current (VGS = 0)
Gate-body leakage
current (VDS = 0)
ID = 1 mA, VGS = 0 650 V
V
= 650 V
DS
V
= 650 V, TC=125 °C
DS
1
100µAµA
VGS = ± 25 V ± 100 nA
Gate threshold voltage VDS = VGS, ID = 250 µA 3 4 5 V
Static drain-source
on-resistance
V
= 10 V, ID = 14 A 0.09 0.11 Ω
GS
Table 6. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
C
C
C
C
o(tr)
Input capacitance
iss
V
Output capacitance - 75 - pF
oss
Reverse transfer
rss
capacitance
Equivalent
(1)
capacitance time
= 100 V, f = 1 MHz,
DS
V
= 0
GS
related
= 0 to 520 V, VGS = 0
V
Equivalent
(2)
C
o(er)
capacitance energy
DS
related
G
Intrinsic gate
resistance
f = 1 MHz open drain - 1.95 - Ω
R
- 2700 - pF
-6 . 3-p F
-2 2 0-p F
-6 3-p F
Q
Q
Q
1. Time related is defined as a constant equivalent capacitance giving the same charging time as C
V
DS
2. Energy related is defined as a constant equivalent capacitance giving the same stored energy as C
when V
Total gate charge
g
Gate-source charge - 17 - nC
gs
Gate-drain charge - 28 - nC
gd
increases from 0 to 80% V
increases from 0 to 80% V
DS
VDD = 520 V, ID = 14 A,
V
= 10 V
GS
(see Figure 18 )
DSS
DSS
4/22 DocID022853 Rev 3
- 62.5 - nC
when
oss
oss
STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5 Electrical characteristics
Table 7. Switching times
Symbol Parameter Test conditions Min. Typ. Max. Unit
(v) Voltage delay time
t
d
(v) Voltage rise time - 8.7 - ns
t
r
t
(i) Current fall time - 7.5 - ns
f
tc(off) Crossing time - 12 - ns
= 400 V, ID = 18 A,
V
DD
RG = 4.7 Ω, V
GS
= 10 V
(see Figure 19 and
Figure 22)
-5 9-n s
Table 8. Source drain diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
I
SDM
V
SD
Q
I
RRM
Q
I
RRM
1. Pulse width limited by safe operating area.
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Source-drain current - 28 A
SD
(1)
Source-drain current (pulsed) - 112 A
(2)
Forward on voltage ISD = 28 A, VGS = 0 - 1.5 V
t
Reverse recovery time
rr
Reverse recovery charge - 5.6 µC
rr
I
SD
VDD = 100 V (see Figure 22 )
Reverse recovery current - 32 A
t
Reverse recovery time
rr
Reverse recovery charge - 7.4 µC
rr
Reverse recovery current - 35 A
I
SD
VDD = 100 V, Tj = 150 °C
(see Figure 22 )
= 28 A, di/dt = 100 A/µs
= 28 A, di/dt = 100 A/µs
- 350 ns
- 422 ns
DocID022853 Rev 3 5/22
22
Electrical characteristics STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5
I
D
100
10
1
0.1
0.1
1
100
V
DS
(V)
10
(A)
Opera tion in this a rea is
Limited b y ma x R
DS (on)
10µs
100µs
1ms
10ms
Tj=150°C
Tc=25°C
S ingle
pu ls e
AM153 11v1
I
D
100
10
1
0.1
0.1
1
100
V
DS
(V)
10
(A)
Opera tion in this a rea is
Limited b y ma x R
DS (on)
10µs
100µs
1ms
10ms
Tj=150°C
Tc=25°C
S ingle
pu ls e
AM153 18 v1
I
D
60
40
20
0
0
10
V
DS
(V)
20
(A)
5
15
8 0
VGS = 6 V
VGS = 7 V
VGS = 8 V
25
VGS = 9 V
10
3 0
50
70
AM153 19v1
2.1 Electrical characteristics (curves)
Figure 2. Safe operating area for D2PAK, I2PAK
Figure 4. Safe operating area for TO-247 Figure 5. Thermal impedance for TO-247
Figure 3. Thermal impedance for D2PAK, I2PAK
and TO-220
and TO-220
6/22 DocID022853 Rev 3
Figure 6. Output characteristics Figure 7. Transfer characteristics
I
(A)
8 0
70
60
50
3 0
20
10
D
AM153 20v1
VDS = 25 V
0
3
5
4
7
6
8409
V
GS
(V)
STB34N65M5, STI34N65M5, STP34N65M5, STW34N65M5 Electrical characteristics
V
GS
6
4
2
0
0
20
Q
g
(nC)
(V)
50
8
30
40
10
VDD=520 V
I
D
=14 A
60
3 00
200
100
0
400
500
V
DS
(V)
V
DS
12
70
8 0
AM153 21v1
C
1000
100
10
1
0.1
10
V
DS
(V)
(pF)
1
100
Ciss
Coss
Crss
1000
AM153 23 v1
V
GS (th)
1.00
0.90
0.8 0
0.70
-50
0
T
J
(°C)
(norm)
-25
1.10
75
25
50
100
ID = 250 µ A
V
DS
= V
GS
AM05459v1
Figure 8. Gate charge vs gate-source voltage Figure 9. Static drain-source on-resistance
R
DS (on)
0.096
0.096
0.094
0.092
0.09
0.088
0.08 6
0.08 4
0.08 2
(Ω )
0.08
0
VGS =10V
5
10
15
20
25
AM153 22v1
I
D
(A)
Figure 10. Capacitance variations Figure 11. Output capacitance stored energy
Figure 12. Normalized gate threshold voltage vs
temperature
E
oss
AM153 24v1
(µ J)
12
10
8
6
4
2
0
0
100
200
3 00
400
500
600
V
DS
Figure 13. Normalized on-resistance vs
temperature
R
DS (on)
(norm)
2.1
1.9
1.7
1.5
1.3
1.1
V
GS
= 10 V
ID = 14 A
AM05460v1
(V)
0.9
0.7
DocID022853 Rev 3 7/22
0.5
-50
-25
25
0
50
75
100
T
J
(°C)
22