ST MICROELECTRONICS STW15N80K5 Datasheet

STB15N80K5, STF15N80K5,
D(2, TAB)
G(1)
S(3)
AM01476v1
TO-220
1
2
3
TAB
1
2
3
TO-220FP
TO-247
D2PAK
1
2
3
STP15N80K5, STW15N80K5
N-channel 800 V, 0.3 Ω typ., 14 A MDmesh™ K5 Power MOSFETs
in D2PAK, TO-220FP, TO-220 and TO-247 packages
Datasheet − production data
TAB
3
1

Figure 1. Internal schematic diagram

Table 1. Device summary

Features
Order code V
STB15N80K5 STF15N80K5 35 W STP15N80K5
800 V 0.375 14 A
STW15N80K5
Industry’s lowest R
Industry’s best figure of merit (FoM)
Ultra low gate charge
100% avalanche tested
Zener-protected
DS
R
DS(on)
DS(on)
max I
x area
P
D
TOT
190 W
190 W
Applications
Switching applications
Description
These very high voltage N-channel Power MOSFETs are designed using MDmesh™ K5 technology based on an innovative proprietary vertical structure. The result is a dramatic reduction in on-resistance and ultra-low gate charge for applications requiring superior power density and high efficiency.
Order code Marking Package Packaging
2
STB15N80K5
PAK Tape and reel
D
STF15N80K5 TO-220FP
15N80K5
TubeSTP15N80K5 TO-220
STW15N80K5 TO-247
October 2014 DocID023468 Rev 3 1/23
This is information on a product in full production.
www.st.com
23
Contents STB15N80K5, STF15N80K5, STP 15N8 0K5, STW 15N8 0K5
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1 STB15N80K5, D²PAK (TO-263) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
4.2 STP15N80K5, TO-220 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.3 STF15N80K5, TO-220FP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4 STW15N80K5, TO-247 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5 Packaging information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2/23 DocID023468 Rev 3
STB15N80K5, STF15N80K5, STP15N80K5, STW15N80K5 Electrical ratings

1 Electrical ratings

Table 2. Absolute maximum rat ings

Value
Symbol Parameter
2
PAK,
D
TO-220, TO-247
TO-220FP
Unit
Gate- source volta ge ± 30 V Drain current (continuous) at TC = 25 °C 14 14 Drain current (continuous) at TC = 100 °C 8.8 8.8
(2)
Drain current (pulse d) 56 56 Total dissipation at TC = 25 °C 190 35 W
I
DM
P
V
GS
I
D
I
D
TOT
Max current during repetitive or single
I
AR
E
AS
pulse avalanche (pulse width limited by T
jmax
Single pulse avalanche energy (starting TJ = 25 °C, ID=IAS, VDD= 50 V)
Insulation withstand voltage (RMS) from
V
iso
dv/dt
T
T
stg
1. Limited by package.
2. Pulse width limited by safe operating area.
3. ISD 14 A, di/dt 100 A/µs, V
all three leads to external heat sink (t=1 s;T
(3)
Peak diode recovery voltage slope 4.5 V/ns Operating junction temperature
j
=25 °C)
C
Storage temperature
V
Peak
)
(BR)DSS
(1)
(1)
(1)
A A A
4A
150 mJ
2500 V
-55 to 150 °C

Table 3. Thermal data

Symbol Parameter
R
thj-case
R
thj-amb
R
thj-pcb
1. When mounted on 1inch² FR-4 board, 2 oz Cu.
Thermal resistance junction-case max
Thermal resist a nc e jun cti on-amb max 62.5 50 62.5
(1)
Thermal resistance junction-pcb max 30
DocID023468 Rev 3 3/23
Value
TO-220 TO-247 D
0.66 3.6
2
PAK TO-220FP
Unit
°C/W
Electrical characteristics STB15N80K5, STF15N80K5, STP15N80K5, STW15N80K5

2 Electrical characteristics

(T
= 25 °C unless otherwise specified).
CASE

T a ble 4. On/off states

Symbol Parameter T est cond ition s Min. T yp . Max. Uni t
V
(BR)DSS
V
R
I
DSS
I
GSS
GS(th)
DS(on)
Drain-source breakdown voltage (V
GS
= 0)
Zero gate voltage drain current (V
GS
= 0)
Gate body leakage current (V
= 0)
DS
Gate threshold volta ge V Static drain-source on
resistance
= 1 mA 800 V
I
D
V
= 800 V 1 µA
DS
V
= 800 V, Tc=125 °C 50 µA
DS
= ± 20 V ±10 µA
V
GS
= VGS, ID = 100 µA 3 4 5 V
DS
= 10 V , ID= 7 A 0.3 0.375
V
GS

Table 5. Dynamic

Symbol Parameter Test conditions Min. Typ. Max. Unit
C
C
C
C
o(tr)
C
o(er)
Input capacitance
iss
Output capacitance - 85 - pF
oss
Reverse transfer
rss
capacitance Equivalent c apac itance tim e
(1)
V
=100 V, f=1 MHz, VGS=0
DS
related
= 0, VDS = 0 to 640 V
V
Equivalent capacitance
(2)
GS
energy rel ated
- 1100 - pF
-1.5- pF
-113- pF
-49-pF
R
Q Q Q
1. Time related is defined as a constant equivalent capacitance giving the same charging time as C VDS increases from 0 to 80% V
2. Energy related is defined as a constant equivalent capacitance giving the same stored energy as C when V
Intrinsic gate resistance f = 1MHz, ID=0 - 4.5 -
G
Total gate charg e
g
Gate-source charge - 6 - nC
gs
Gate-drain charge - 22 - nC
gd
DSS
increases from 0 to 80% V
DS
DSS
= 640 V, ID = 14 A
V
DD
V
=10 V
GS
(see Figure 20)
4/23 DocID023468 Rev 3
-32-nC
when
oss
oss
STB15N80K5, STF15N80K5, STP15N80K5, STW15N80K5 Electrical characteristics

Table 6. Switching times

Symbol Parameter Test conditions Min. Typ. Max. Unit
t
d(on)
t
d(off)
Turn-on delay time
= 400 V, ID = 7 A,
V
t
Rise time - 17.6 - ns
r
Turn-of f del ay time - 44 - ns
t
Fall time - 10 - ns
f
DD
R
=4.7 , VGS=10 V
G
(see Figure 19 and 24)
-19-ns

T a ble 7. Source drain diode

Symbol Parameter Test conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
t
Q
I
RRM
1. Pulsed: pulse duration = 300µs, duty cycle 1.5%
Source-drain current - 14 A Source-drain current (pulsed) - 56 A
(1)
Forward on voltage ISD= 14 A, VGS=0 - 1.5 V Reverse recovery time
rr
Reverse recovery charge - 8.2 μC
rr
Reverse recovery current - 37 A Reverse recovery time ISD= 14 A,VDD= 60 V
rr
Reverse recovery charge - 10 μC
rr
Reverse recovery current - 35 A
I
= 14 A, VDD= 60 V
SD
di/dt = 100 A/µs,
(see Figure 21)
di/dt=100 A/µs, Tj=150 °C
(see Figure 21)
- 445 ns
- 580 ns

Table 8. Gate-source Zener diode

Symbol Parameter Test conditions Min. Typ. Max Unit
V
(BR)GSO
Gate-source breakdown voltage IGS= ± 1mA, ID= 0 30 - - V
The built-in back-to-back Zener diodes have been specifically designed to enhance the ESD capability of the device. The Zener voltage is appropriate for efficient and cost-effective intervention to protect the device integrity. These integrated Zener diodes thus eliminate the need for external components.
DocID023468 Rev 3 5/23
Electrical characteristics STB15N80K5, STF15N80K5, STP15N80K5, STW15N80K5
I
D
10
1
1
100
V
DS
(V)
10
(A)
Operation in this area is
Limited by max R
DS(on)
1µs
10µs
100µs
10ms
Tj=150°C Tc=25°C
Single pulse
1ms
0.1
0.1
AM15432v1
I
D
10
1
0.1
1
100
V
DS
(V)
10
(A)
Operation in this area is
Limited by max R
DS(on)
1µs
10µs
100µs
10ms
Tj=150°C Tc=25°C
Single pulse
1ms
0.1
0.01
AM15433v1
I
D
10
1
1
100
V
DS
(V)
10
(A)
Operation in this area is
Limited by max R
DS(on)
1µs
10µs
100µs
10ms
Tj=150°C Tc=25°C
Single pulse
1ms
0.1
0.1
AM15434v1

2.1 Electrical characteristics (curves)

Figure 2. Safe operating area for D2PAK and

Figure 4. Safe operating area for TO-220FP Figure 5. Thermal impedance for TO-220FP

TO-220
Figure 3. Thermal impedance for D2PAK and
TO-220

Figure 6. Safe operating area for TO-247 Figure 7. Thermal impedance for TO-247

6/23 DocID023468 Rev 3
STB15N80K5, STF15N80K5, STP15N80K5, STW15N80K5 Electrical characteristics
I
D
24
12
0
0
8
V
DS
(V)
16
(A)
4
12
VGS= 6 V
VGS= 7 V
VGS= 8 V
VGS= 9 V
6
18
30
VGS= 10 V
AM15435v1
V
GS
6
4
2
0
0
5
Q
g
(nC)
(V)
20
8
10
15
10
VDD=640 V
I
D
=14 A
25
300
200
100
0
400
500
V
DS
(V)
V
DS
12
30
600
AM15443v1
R
DS(on)
0.3
0.2
0.1
0
0
10
I
D
(A)
(Ω)
5
15
VGS=10V
0.5
0.4
20
25
AM15441v1
C
1000
100
10
1
0.1
10
V
DS
(V)
(pF)
1
100
Ciss
Coss
Crss
AM15442v1

Figure 8. Output characteristics Figure 9. Transfer characteristics

I
D
(A)
30
24
18
12
6
VDS= 20 V
AM15436v1
0
4

Figure 10. Gate charge vs gate-source voltage Figure 11. Static drain-source on-resistance

6
8
10
V
GS
(V)

Figure 12. Capacitance variations Figure 13. Source-drain diode forward

V (V)
SD
characteristics
AM15439v1
TJ=-50°C
0.9
TJ=25°C
0.8
0.7
TJ=150°C
0.6 6
4
10
8
12
SD
(A)
I
DocID023468 Rev 3 7/23
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