ST MICROELECTRONICS STPSC8H065G Datasheet

K
NC
A
A
K
K
NC
A
TO-220AC
TO-220AC insulated
D²PAK
DPAK
STPSC8H065
Datasheet
650 V, 8 A high surge silicon carbide power Schottky diode
Features
No reverse recovery charge in application current range
Switching behavior independent of temperature
High forward surge capability
Insulated package TO-220AC Ins:
Insulated voltage: 2500 V
Typical package capacitance: 7 pF
Power efficient product
Applications
Switch mode power supply
PFC
DCDC converters
LLC topologies
Boost diode
RMS
Description
This 8 A, 650 V SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide band gap material allows the design of a Schottky diode structure with a 650 V rating. Due to the Schottky
Product status
STPSC8H065
Product summary
Symbol Value
I
F(AV)
V
RRM
T
j(max.)
Product label
8 A
650 V
175 °C
construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature.
This STPSC8H065 is especially suited for use in PFC applications. This ST SiC diode will boost the performance in hard switching conditions. Its high forward surge capability ensures a good robustness during transient phases.
DS9225 - Rev 7 - February 2019 For further information contact your local STMicroelectronics sales office.
www.st.com

1 Characteristics

Table 1. Absolute ratings (limiting values at 25 °C unless otherwise specified)
Symbol Parameter Value Unit
V
I
F(RMS)
I
1. Value based on R
2. (dP
Repetitive peak reverse voltage 650 V
RRM
Forward rms current 22 A
Average forward current
F(AV)
Surge non repetitive forward
I
FSM
current
I
Repetitive peak forward current
FRM
T
Storage temperature range -55 to +175 °C
stg
T
Operating junction temperature range
j
th(j-c)
/dTj) < (1/R
tot
) condition to avoid thermal runaway for a diode on its own heatsink.
th(j-a)
max.
TO-220AC, DPAK, D2PAK, Tc = 140 °C
TO-220AC Ins,Tc = 95 °C
(1)
tp = 10 ms sinusoidal, Tc = 25 °C
tp = 10 ms sinusoidal, Tc = 125 °C
tp = 10 µs square, Tc = 25 °C
TO-220AC, DPAK, D2PAK, Tc = 140 °C
TO-220AC Ins,Tc = 95 °C
(2)
(1)
, Tj = 175 °C, δ = 0.1
(1)
, DC
(1)
, Tj = 175 °C, δ = 0.1
STPSC8H065
Characteristics
8 A
75
69
420
33 A
-40 to +175 °C
A
Table 2. Thermal resistance parameters
Symbol
R
th(j-c)
Junction to case
Parameter Typ. value Max. value Unit
TO-220AC, DPAK, D2PAK
1.3 1.6
TO-220AC Ins 2.45 3.8
Table 3. Static electrical characteristics
Symbol
(1)
I
R
V
F
Reverse leakage current
(2)
Forward voltage drop
1. tp = 10 ms, δ < 2%
2. tp = 500 μs, δ < 2%
Parameter Test conditions Min. Typ. Max. Unit
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VR = V
IF = 8 A
RRM
- 7 80
- 65 335
- 1.56 1.75
- 1.98 2.50
To evaluate the conduction losses, use the following equation:
P = 1.35 x I
F(AV)
+ 0.144 x I
F2(RMS)
For more information, please refer to the following application notes related to the power losses :
AN604: Calculation of conduction losses in a power rectifier
AN4021: Calculation of reverse losses on a power diode
°C/W
µA
V
DS9225 - Rev 7
page 2/17
STPSC8H065
Characteristics
Table 4. Dynamic electrical characteristics
Symbol Parameter Test conditions Typ. Unit
Q
C
Total capacitive charge
cj
Total capacitance
j
1.
Most accurate value for the capacitive charge: QcjVR= 
VR = 400 V
VR = 0 V, Tc = 25 °C, F = 1 MHz
VR = 400 V, Tc = 25 °C, F = 1 MHz
V
R
CjV dV
0
23.5 nC
414
38
pF
DS9225 - Rev 7
page 3/17

1.1 Characteristics (curves)

0
2
4
6
8
10
12
14
16
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Ta=150 °C
Ta=175 °C
Ta=25 °C
Pulse test : tp=500µs
Ta=100 °C
A)IF(
V
F
(V)
0
10
20
30
40
50
60
70
80
0 1 2 3 4 5 6 7 8
Ta=150 °C
Ta=175 °C
Ta=25 °C
Pulse test : tp=500µs
Ta=100 °C
A)IF(
V
F
(V)
IR(µA)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0 50 100 150 200 250 300 350 400 450 500 550 600 650
Tj=25 °C
Tj=150 °C
Tj=175 °C
VR(V)
IM(A)
0
10
20
30
40
50
60
70
80
0 2 5 50 75 100 125 150 175
δ =0.1
δ =0.3
δ =0.5
δ =0.7
δ =1
TC(°C)
T
δ
=tp/T
tp
STPSC8H065
Characteristics (curves)
Figure 1. Forward voltage drop versus forward current
(typical values, low level)
Figure 3. Reverse leakage current versus reverse voltage
applied (typical values)
Figure 2. Forward voltage drop versus forward current
(typical values, high level)
Figure 4. Peak forward current versus case temperature
(TO-220AC, DPAK, D2PAK)
DS9225 - Rev 7
page 4/17
IM(A)
0
10
20
30
40
50
60
0 2 5 50 75 100 125 150 175
δ =0.1
δ =0.3
δ
=0.5
δ =0.7
δ =1
TC(°C)
T
δ
=tp/T
tp
0
50
100
150
200
250
300
350
400
450
500
0.1 1 .0 10.0 100.0 1000.0
F=1 MHz
V
OSC
=30 mV
RMS
Tj=25 °C
VR(V)
Cj(pF)
Z
th(j-c )/Rth(j-c )
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Single pulse
tp(s)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
Z
th(j-c )/Rth(j-c )
tp(s)
STPSC8H065
Characteristics (curves)
Figure 5. Peak forward current versus case temperature
(TO-220AC Ins)
Figure 7. Relative variation of thermal impedance junction
to case versus pulse duration (TO-220AC, DPAK and
D²PAK)
Figure 6. Junction capacitance versus reverse voltage
applied (typical values)
Figure 8. Relative variation of thermal impedance junction
to case versus pulse duration (TO-220AC Ins)
DS9225 - Rev 7
page 5/17
I
FSM
(A)
1.E+01
1.E+02
1.E+03
1.E-05 1.E-04 1.E-03 1.E-02
Ta=25 °C
Ta=125 °C
tp(s)
0
4
8
12
16
20
24
28
0 50 100 150 200 250 300 350 400
VR(V)
QCj(nC)
STPSC8H065
Characteristics (curves)
Figure 9. Non-repetitive peak surge forward current
versus pulse duration (sinusoidal waveform)
Figure 10. Total capacitive charges versus reverse
voltage applied (typical values)
DS9225 - Rev 7
page 6/17

2 Package information

E
b4
L2
H
L4
A
c2
D
A1
R
c
b (2x)
e
e1
A2
L
(L1)
V2
E1
D1
Gauge plane
Seating plane
0.25
STPSC8H065
Package information
2.1
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

DPAK package information

Epoxy meets UL94, V0
Figure 11. DPAK package outline
DS9225 - Rev 7
page 7/17
The device must be positioned within
6.3
6.1
10.7
1.5
4.572
A
B
2.8
1.8 min.
DPAK package information
Table 5. DPAK mechanical data
Dimensions
Dim.
Millimeters
Min. Typ. Max. Min. Typ. Max.
A 2.20 2.40 0.087 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
b 0.64 0.90 0.025 0.035
b4 5.20 5.40 0.205 0.213
c 0.45 0.60 0.018 0.024
c2 0.48 0.60 0.019 0.024
D 6.00 6.20 0.236 0.244
D1 4.95 5.10 5.25 0.195 0.201 0.207
E 6.40 6.60 0.252 0.260
E1 4.60 4.70 4.80 0.181 0.185 0.189
e 2.159 2.286 2.413 0.085 0.090 0.095
e1 4.445 4.572 4.699 0.175 0.180 0.185
H 9.35 10.10 0.368 0.398
L 1.00 1.50 0.039 0.059
(L1) 2.60 2.80 3.00 0.102 0.110 0.118
L2 0.65 0.80 0.95 0.026 0.031 0.037
L4 0.60 1.00 0.024 0.039
R 0.20 0.008
V2
1. Inches dimensions given for reference only
Inches
(1)
STPSC8H065
DS9225 - Rev 7
Figure 12. DPAK recommended footprint (dimensions are in mm)
page 8/17

2.2 D²PAK package information

Epoxy meets UL94, V0.
Cooling method: by conduction (C)
STPSC8H065
D²PAK package information
Figure 13. D²PAK package outline
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
DS9225 - Rev 7
page 9/17
Footprint
STPSC8H065
D²PAK package information
Table 6. D²PAK package mechanical data
Dimensions
Ref.
Min. Typ. Max. Min. Typ. Max.
A 4.40 4.60 0.173 0.181
A1 0.03 0.23 0.001 0.009
b 0.70 0.93 0.028 0.037
b2 1.14 1.70 0.045 0.067
c 0.45 0.60 0.018 0.024
c2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 7.50 7.75 8.00 0.295 0.305 0.315
D2 1.10 1.30 1.50 0.043 0.051 0.060
E 10.00 10.40 0.394 0.409
E1 8.30 8.50 8.70 0.335 0.343 0.346
E2 6.85 7.05 7.25 0.266 0.278 0.282
e 2.54 0.100
e1 4.88 5.28 0.190 0.205
H 15.00 15.85 0.591 0.624
J1 2.49 2.69 0.097 0.106
L 2.29 2.79 0.090 0.110
L1 1.27 1.40 0.049 0.055
L2 1.30 1.75 0.050 0.069
R 0.40 0.015
V2
Millimeters Inches (for reference only)
DS9225 - Rev 7
Figure 14. D²PAK recommended footprint (dimensions are in mm)
page 10/17

2.3 TO-220AC package information

A
C
D
L7
Ø I
L5
L6
L9
L4
F
H2
G
L2
F1
E
M
Gate note (1)(2)
(1) : Max resin gate protusion 0.5 mm
(2) : Resin gate position is accepted in each of the two positions shown on the drawings or their symmetrical
Gate note (1)(2)
0.10
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 N·m
Maximum torque value: 0.70 N·m
Figure 15. TO-220AC package outline
STPSC8H065
TO-220AC package information
DS9225 - Rev 7
page 11/17
STPSC8H065
TO-220AC package information
Table 7. TO-220AC package mechanical data
Dimensions
Ref.
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ.
L4 13.00 14.00 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.60 typ. 0.102 typ.
Diam 3.75 3.85 0.147 0.151
Millimeters Inches (for reference only)
DS9225 - Rev 7
page 12/17

2.4 TO-220AC Ins package information

C
b2
c2
F
Ø I
L
A
a1
a2
B
e
b1
I4
l2
c1
M
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 N·m
Maximum torque value: 0.70 N·m
Figure 16. TO-220AC Ins package outline
STPSC8H065
TO-220AC Ins package information
DS9225 - Rev 7
page 13/17
STPSC8H065
TO-220AC Ins package information
Table 8. TO-220AC Ins package mechanical data
Dimensions
Ref.
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 4.80 5.40 0.189 0.212
F 6.20 6.60 0.244 0.259
L 2.65 2.95 0.104 0.116
I2 1.14 1.70 0.044 0.066
I4 15.80 16.40 16.80 0.622 0.645 0.661
M 2.60 0.102
ØI 3.75 3.85 0.147 0.151
Millimeters Inches (for reference only)
DS9225 - Rev 7
page 14/17

3 Ordering Information

Order code Marking Package Weight Base qty. Delivery mode
STPSC8H065D STPSC8H065D TO-220AC 1.86 g 50 Tube
STPSC8H065DI STPSC 8H065DI TO-220AC Ins 2.12 g 50 Tube
STPSC8H065G-TR STPSC8H065G
STPSC8H065B-TR STPSC 8H065 DPAK 0.32 g 2500 Tape and reel
Table 9. Ordering information
D2PAK
STPSC8H065
Ordering Information
1.48 g 1000 Tape and reel
DS9225 - Rev 7
page 15/17

Revision history

STPSC8H065
able 10. Document revision history
T
Date Version Changes
31-Aug-2012 1 First issue.
10-Oct-2012 2 Added Max. value to Table 3.
07-Nov-2013 3 Updated Figure 1, Figure 2, Figure 13, Figure 14, and Table 9.
07-Jan-2014 4 Added TO-220AC Ins package.
21-Jul-2015 5 Updated Table 10 and reformatted to current standard.
22-Feb-2016 6 Updated cover image.
05-Feb-2019 7
Updated D²PAK package information. Added Section Applications and Section
Sustainable technology program.
DS9225 - Rev 7
page 16/17
STPSC8H065
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DS9225 - Rev 7
page 17/17
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