ST MICROELECTRONICS STPSC606G Datasheet

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Features

STPSC606

600 V power Schottky silicon carbide diode

■ No or negligible reverse recovery

■ Switching behavior independent of

temperature

■ Dedicated to PFC boost diode

Description

The SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide bandgap material allows the design of a Schottky diode structure with a 600 V rating. Due to the Schottky construction no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature.

ST SiC diodes will boost the performance of PFC operations in hard switching conditions.

TO-220AC

STPSC606D

PAK

STPSC606G

Table 1. Device summary

F(AV)

RRM

j (max)

C (typ)

6 A

600 V

175 °C

6 nC

September 2009 Doc ID 16284 Rev 1 1/8

www.st.com

Characteristics STPSC606

1 Characteristics

Table 2. Absolute ratings (limiting values at 25 °C unless otherwise specified)

Symbol Parameter Value Unit

F(RMS)

F(AV)

Table 3. Thermal resistance

Repetitive peak reverse voltage 600

RRM

Forward rms current 18

Average forward current Tc = 125 °C, δ = 0.5 6

= 10 ms sinusoidal, Tc = 25 °C

Surge non repetitive forward

FSM

current

Repetitive peak forward current δ = 0.1, Tc = 110 °C, Tj = 150 °C 27

FRM

Storage temperature range -55 to +175 °C

stg

Operating junction temperature range -40 to +175 °C

= 10 ms sinusoidal, Tc = 125 °C

= 10 µs square, Tc = 25 °C

27 22

110

Symbol Parameter Value Unit

th(j-c)

Table 4. Static electrical characteristics (per diode)

Junction to case 2.8 °C/W

Symbol Parameter Tests conditions Min. Typ. Max. Unit

1. tp = 10 ms, δ < 2%

2. tp = 500 µs, δ < 2%

current

(2)

Forward voltage drop

Reverse leakage

(1)

= 25 °C

= 150 °C - 100 750

= V

RRM

Tj = 25 °C

IF = 6 A

= 150 °C - 1.6 2.1

-1575

-1.41.7

To evaluate the conduction losses use the following equation: P = 1.20x I

Table 5. Other parameters

Symbol Parameter Test conditions Typ. Unit

C Total capacitance

+ 0.15 x I

F(AV)

F2(RMS)

Total capacitive charge

= 400 V, IF = 6 A dIF/dt = -200 A/µs

= 150 °C

= 0 V, Tc = 25 °C, F = 1 Mhz 375

= 400 V, Tc = 25 °C, F = 1 Mhz 30

6nC

µA

2/8 Doc ID 16284 Rev 1

STPSC606 Characteristics

Figure 1. Forward voltage drop versus

forward current (typical values)

IFM(A)

0.0 0.5 1.0 1.5 2.0 2.5 3.0

Tj=25 °CTj=25 °C

Tj=150 °CTj=150 °C

Tj=175 °CTj=175 °C

VFM(V)

Figure 3. Peak forward current versus case

temperature

IM(A)

δ=0.1

δ=0.3

δ=0.5

d=1δ=1

d=0.7δ=0.7

0 25 50 75 100 125 150 175

TC(°C)

=tp/T

Figure 2. Reverse leakage current versus

reverse voltage applied (maximum values)

IR(µA)

1.E+04

1.E+03

1.E+02

1.E+01

1.E+00

1.E-01

Tj=150 °CTj=150 °C

0 50 100 150 200 250 300 350 400 450 500 550 600

Tj=175 °CTj=175 °C

Tj=25 °CTj=25 °C

VR(V)

Figure 4. Junction capacitance versus

reverse voltage applied (typical values)

C(pF)

300

250

200

150

100

1 10 100 1000

VR(V)

OSC

F=1 MHz

=30 mV

Tj=25 °C

RMS

Doc ID 16284 Rev 1 3/8

Characteristics STPSC606

Figure 5. Relative variation of thermal

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

impedance junction to case versus pulse duration

th(j-c)/Rth(j-c)

Single pulse

tp(s)

Figure 6. Non-repetitive peak surge forward

current versus pulse duration (sinusoidal waveform)

(A)

FSM

1.E+03

1.E+02

1.E+01

1.E+00

1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00

Figure 7. Total capacitive charges versus dIF/dt (typical values)

QC(nC)

IF=6 A

=400 V

Tj=150 °C

Tc=25 °C

Tc=125 °C

tp(s)

0 50 100 150 200 250 300 350 400 450 500

dIF/dt(A/µs)

4/8 Doc ID 16284 Rev 1

STPSC606 Package information

2 Package information

● Epoxy meets UL94, V0

● Cooling method: convection (C)

● Recommended torque: 0.4 to 0.6 N·m

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 6. TO-220AC dimensions

packages, depending on their level of environmental compliance. ECOPACK®

is an ST trademark.

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

Ø I

C 1.23 1.32 0.048 0.051

D 2.40 2.72 0.094 0.107

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

F1 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

H2 10.00 10.40 0.393 0.409

L2 16.40 typ. 0.645 typ.

L4 13.00 14.00 0.511 0.551

L5 2.65 2.95 0.104 0.116

L6 15.25 15.75 0.600 0.620

L7 6.20 6.60 0.244 0.259

L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. I 3.75 3.85 0.147 0.151

Doc ID 16284 Rev 1 5/8

Package information STPSC606

Table 7. D2PAK dimensions

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

* FLAT ZONE NO LESSTHAN 2mm

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126

R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

Figure 8. Footprint (dimensions in mm)

16.90

10.30

8.90

5.08

1.30

3.70

6/8 Doc ID 16284 Rev 1

STPSC606 Ordering information

3 Ordering information

Table 8. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPSC606D STPSC606D TO-220AC 1.86 g 50 Tube

STPSC606G-TR STPSC606G D2PAK 1.48 g 1000 Tape and reel

4 Revision history

Table 9. Document revision history

Date Revision Changes

24-Sep-2009 1 First issue.

Doc ID 16284 Rev 1 7/8

STPSC606

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8/8 Doc ID 16284 Rev 1

ST MICROELECTRONICS STPSC606G Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

Table 1. Device summary

1 Characteristics

Table 3. Thermal resistance

Table 4. Static electrical characteristics (per diode)

Table 5. Other parameters

Figure 7. Total capacitive charges versus dIF/dt (typical values)

2 Package information

Table 6. TO-220AC dimensions

Table 7. D2PAK dimensions

Figure 8. Footprint (dimensions in mm)

3 Ordering information

Table 8. Ordering information

4 Revision history

Table 9. Document revision history