ST MICROELECTRONICS STPS 340U STM Datasheet

®

MAIN PRODUCT CHARACTERISTICS

STPS340U/S/B

POWER SCHOTTKY RECTIFIER

I

F(AV)

V

RRM

3 A

40 V

Tj (max) 150 °C

(max) 0.57 V

V

F

VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSE S
LOW FORWARD V O LTAGE DROP
LOW THERMAL RE SISTA NCE
EXTREMELY FAST SWITCHING
SURFACE MOUNTED DEVICE

DESCRIPTION

Single chip Schottky rectifier suited for Switch
Mode Power Supplies and high frequency DC to
DC converters.

Packaged in SMB, SMC and DPAK this device is
intended for use in low and medium voltage
operation, high frequency inverters, free wheeling
and polarity protection applications where low
switching losses are required.

K

SMB

(JEDEC DO -214AA)

STPS340U

A

NC

DPAK

STPS340B

SMC

(JEDEC DO-214AB)

STPS340S

ABSOLUTE RATINGS (limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

Repetitive peak reverse voltage
RMS forward current DPAK

SMB / SMC

= 135°C δ = 0.5

T

Average forward current

Surge non repetitive forward

c

= 105°C δ = 0.5

T

L

tp = 10 ms Sinusoidal

DPAK
SMB / SMC

40 V

6A

10

3

75 A

current

I

RRM

Repetitive peak reverse

tp = 2 µs F = 1kHz square

1A

current

Tstg

Tj

dV/dt

June 1999 - Ed: 6B

Storage temperature range
Maximum operating junction temperature
Critical rate of rise of r ever se voltage

- 65 to + 150 °C
+ 150 °C

10000 V/µs

A

1/7

STPS340U/S/B

THERMAL R E SI ST A NCES

Symbol Parameter Value Unit

R

th (j-l)

Junction to leads SMC

SMB

R

th (j-c)

Junction to case DPAK

STATIC ELECTRICAL CHARACTERISTI CS

Symbol Tests Conditions Tests Conditions Min. Typ. Max. Unit

*

I

R

V

Reverse leakage current

*

F

Forward voltage drop

Pulse test : * tp = 380 µs, δ < 2 %

Tj = 25°CV
Tj = 125°CV
Tj = 25°CI
Tj = 25°CI
Tj = 125°CI
Tj = 125°CI

= V

R

= V

R

= 3 A

F

= 6 A

F

= 3 A

F

= 6 A

F

RRM
RRM

20 °C/W
25

5.5 °C/ W

20 µA

210mA

0.63 V

0.84

0.52 0.57

0.63 0.72

To evaluate the maximum conduction losses use the follo wing equation :
P = 0.42 x I

Fig. 1: Average forward power dissipation versus
average forward current.

PF(av)(W)

2.5

2.0

1.5

1.0

0.5

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

F(AV)

δ = 0.05

+ 0.050 I

δ = 0.1

F2(RMS)

δ = 0.2

IF(av) (A)

δ = 0.5

δ

=tp/T

δ = 1

Fig. 2: Average current versus ambient
temperature (δ =0.5).

IF(av)(A)

3.5

3.0

2.5

Rth(j-a)=65°C/W

2.0

1.5

T

tp

1.0

0.5

0.0
0 25 50 75 100 125 150

δ

=tp/T

Rth(j-a)=Rth(j-c)

(DPAK)

Rth(j-a)=Rth(j-l)

(SMB/SMC)

T

tp

Tamb(°C)

2/7

STPS340U/S/B

Fig. 3-1: Non repetit iv e s urge peak forward current

versus overload duration (SMB)(Maximum values).

IM(A)

10

9
8
7
6
5
4
3

I

M

2
1
0

1E-3 1E-2 1E-1 1E+0

t

δ

=0.5

t(s)

Ta=25°C

Ta=50°C

Ta=100°C

Fig. 3-3: Non repetitive surge peak forward current
versus overload duration (DPAK) (Maximum
values).

IM(A)

50

40

30

20

I

M

10

0

1E-3 1E-2 1E-1 1E+0

t

δ

=0.5

t(s)

Tc=25°C

Tc=50°C

Tc=100°C

Fig. 3- 2 : Non repetitive surge peak forward current
versus overload duration (SMC) (Maximum values).

IM(A)

12
10

8

Ta=25°C

6
4

I

M

2
0

1E-3 1E-2 1E-1 1E+0

t

δ

=0.5

t(s)

Ta=50°C

Ta=100°C

Fig. 4-1: Relative variation of thermal transient
impedance junction to lead versus pulse duration
(SMB).

Zth(j-a)/Rth(j-a)

1.0

Printed circuit board (e=35µm)

0.9

0.8

0.7

0.6

0.5

δ = 0.5

0.4

0.3

0.2

δ = 0.2
δ = 0.1

0.1

0.0

1.0E-2 1.0E-1 1.0E+0 1.0E+1 1.0E+2 1.0E+3

Single pulse

tp(s)

δ

=tp/T

T

tp

Fig. 4-2: Relative variation of thermal transient
impedance junction to lead versus pulse duration
(SMC).

Zth(j-a)/Rth(j-a)

1.0

Printed circuit board (e=35µm)

0.9

0.8

0.7

0.6

0.5

δ = 0.5

0.4

0.3

δ = 0.2

0.2

δ = 0.1

0.1

0.0

1.0E-2 1.0E-1 1.0E+0 1.0E+1 1.0E+2 1.0E+3

Single pulse

tp(s)

δ

=tp/T

T

tp

Fig. 4-3: Relative variation of thermal transient
impedance junction to lead versus pulse
duration(DPAK).

Zth(j-a)/Rth(j-a)

1.0

Printed circuit board (e=35µm)

0.9

0.8

0.7

0.6

δ = 0.5

0.5

0.4

δ = 0.2

0.3

δ = 0.1

0.2

Single pulse

0.1

0.0

1E-3 1E-2 1E-1 1E+0

tp(s)

δ

=tp/T

T

tp

3/7

STPS340U/S/B

Fig. 5: Reverse leakage current versus reverse

voltage applied (Typical values).

IR(A)

1E-2

Tj=150°C

Tj=125°C

1E-3

Tj=100°C

1E-4

Tj=75°C

VR(V)

1E-5

0 5 10 15 20 25 30 35 40

Fig. 7: Forward voltage drop versus forward
current (Maximum values).

IFM(A)

10.00

Typical values

Tj=150°C

1.00

0.10

Tj=125°C

Fig. 6: Junction capacitance versus reverse
voltage applied (Typical values).

C(pF)

500

F=1MHz

200
100

50

20
10

12 51020 50

VR(V)

Tj=25°C

Fig. 8-1: Thermal resistance junction to ambient
versus co pper surface under e ach lead (Epoxy printed
circuit boa rd FR4, copper thickness: 35 µm) (SMB).

Rth(j-a) (°C/W)

120
100

80
60
40

0.01

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

VFM(V)

Fig. 8-2: Thermal resistance junction to ambient
versus copp er surface under ea ch lead (Epoxy printed
circuit boar d FR4, copper thickness: 35µ m ) (S MC) .

Rth(j-a) (°C/W)

100

80

60

40

20

0

012345

S(Cu) (cm²)

20

0

012345

S(Cu) (cm²)

Fig. 8-3: Thermal resistance junction to ambient
versus c opper surf ace under eac h lead ( Epo xy p rinted
circ uit board FR 4, coppe r thicknes s: 35µm) (DPAK).

Rth(j-a) (°C/W)

100

80

60

40

20

0

02468101214161820

S(Cu) (cm²)

4/7

PACKAGE ME CHANICAL D AT A

DPAK

STPS340U/S/B

DIMENSIONS

REF.

A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°

Millimeters Inches

Min. Max Min. Max.

FOOTPRINT DIMENSIONS (in millimeters)

6.7

6.7

3

3

1.61.6

2.32.3

5/7

STPS340U/S/B

PACKAGE ME CHANICAL D AT A

SMB

E1

D

E

A1

C

L

A2

FOOTPRINT DIMENSIONS (in millimeters)

2.3

DIMENSIONS

REF.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087
c 0.15 0.41 0.006 0.016

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

D 3.30 3.95 0.130 0.156

b

L 0.75 1.60 0.030 0.063

1.52 2.75

6/7

1.52

PACKAGE ME CHANICAL D AT A

SMC

STPS340U/S/B

E1

D

E

A1

C

E2

L

A2

FOOTPRINT DIMENSIONS (in millimeters)

3.3

DIMENSIONS

REF.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0. 075 0.096

A2 0.05 0.20 0. 002 0.008

b 2.90 3.2 0.114 0.126

c 0.15 0.41 0.006 0.016

E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185

D 5.55 6.25 0.218 0.246

L 0.75 1.60 0.030 0.063

b

2.0 4.2 2.0

Ordering type Marking P ackage Weight Base qty Delivery mode

STPS340U U34 SMB 0.107g 2500 Tape and reel
STPS340S S34 SMC 0.243g 2500 Tape and reel
STPS340B S 340 DPAK 0.30g 75 Tube

STPS340B-TR S340 DPAK 0.30g 2500 Tape and reel

Band indicates cathode on SMB, SMC
Epoxy meets UL94,V0

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change without notice. This publication supersedes and replaces all information previously supplied.
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© 1999 STMicroelectronics - Printed in Italy - All rights reserved.

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7/7

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