
This is information on a product in full production.
N-channel 600 V, 0.135 Ω typ., 20 A MDmesh™ II
Power MOSFETs in D²PAK and TO-220 packages
Datasheet - production data
1
2
3
TAB
TO-220
TAB
D PAK
2
AM01475v1_noTab_noZen
D(2)
G(1)
S(3)
Features
100% avalanche tested
Low input capacitance and gate charge
Low gate input resistance
Applications
Switching applications
Figure 1: Internal schematic diagram
Description
These devices are N-channel Power MOSFETs
developed using the second generation of
MDmesh™ technology. This revolutionary Power
MOSFET associates a vertical structure to the
company’s strip layout to yield one of the world’s
lowest on-resistance and gate charge. It is
therefore suitable for the most demanding high
efficiency converters.
Table 1: Device summary

Contents
1 Electrical ratings ............................................................................. 3
2 Electrical characteristics ................................................................ 4
2.1 Electrical characteristics (curves) ...................................................... 6
3 Test circuits ..................................................................................... 8
4 Package information ....................................................................... 9
4.1 D2PAK (TO-263) type A package information................................... 9
4.2 D2PAK packaging information ........................................................ 12
4.3 TO-220 type A package information ................................................ 14
5 Revision history ............................................................................ 16

Drain current (continuous) at TC = 25 °C
Drain current (continuous) at TC = 100 °C
Total dissipation at TC = 25 °C
Peak diode recovery voltage slope
Storage temperature range
Operating junction temperature range
Notes:
(1)
Pulse width limited by safe operating area.
(2)
ISD ≤ 20 A, di/dt ≤ 400 A/µs, V
DS(peak)
≤ V
(BR)DSS, VDD
= 80% V
(BR)DSS
Thermal resistance junction-case
Thermal resistance junction-ambient
Thermal resistance junction-pcb
Notes:
(1)
When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 s.
Single pulse avalanche current (pulse width limited by T
jmax
)
Single pulse avalanche energy (starting TJ=25 °C, ID=IAS,
VDD=50 V)
1 Electrical ratings
Table 2: Absolute maximum ratings
Table 3: Thermal data
Table 4: Avalanche characteristics

Electrical characteristics
Drain-source
breakdown voltage
Zero gate voltage drain
current
VGS = 0 V, VDS = 600 V,
TC= 125 °C
(1)
Gate-body leakage current
Static drain-source onresistance
Notes:
(1)
Defined by design, not subject to production test.
VDS = 50 V, f = 1 MHz,
VGS = 0 V
Reverse transfer
capacitance
Equivalent output
capacitance
VGS = 0 V, VDS = 0 to 480 V
VDD = 480 V, ID = 20 A,
VGS = 10 V
(see Figure 14: "Test circuit for
gate charge behavior"
Notes:
(1)
C
oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C
oss
when VDS
increases from 0 to 80% V
DS
2 Electrical characteristics
(T
= 25 °C unless otherwise specified)
CASE
Table 5: On/off states
Table 6: Dynamic

Electrical characteristics
VDD = 300 V, ID = 10 A, RG = 4.7 Ω,
VGS = 10 V
(see Figure 13: "Test circuit for
resistive load switching times" and
Figure 18: "Switching time
waveform")
Source-drain current
(pulsed)
ISD = 20 A, di/dt = 100 A/µs
VDD = 60 V
(see Figure 15: "Test circuit for
inductive load switching and diode
recovery times")
ISD = 20 A, di/dt = 100 A/µs
VDD = 60 V, Tj = 150 °C
(see Figure 15: "Test circuit for
inductive load switching and diode
recovery times")
Notes:
(1)
Pulse width limited by safe operating area.
(2)
Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Table 7: Switching times
Table 8: Source-drain diode

Electrical characteristics
Figure 2: Safe operating area
Figure 3: Thermal impedance
Figure 4: Output characteristics
Figure 5: Transfer characteristics
Figure 6: Gate charge vs gate-source voltage
Figure 7: Static drain-source on-resistance
2.1 Electrical characteristics (curves)

Electrical characteristics
Figure 8: Capacitance variations
Figure 9: Source-drain diode forward characteristics
Figure 10: Normalized gate threshold voltage vs
temperature
Figure 11: Normalized on-resistance vs temperature
Figure 12: Normalized V
(BR)DSS
vs temperature

Figure 13: Test circuit for resistive load
switching times
Figure 14: Test circuit for gate charge
behavior
Figure 15: Test circuit for inductive load
switching and diode recovery times
Figure 16: Unclamped inductive load test
circuit
Figure 17: Unclamped inductive waveform
Figure 18: Switching time waveform
3 Test circuits

4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
4.1 D2PAK (TO-263) type A package information
Figure 19: D²PAK (TO-263) type A package outline

Table 9: D²PAK (TO-263) type A package mechanical data

Figure 20: D²PAK (TO-263) recommended footprint (dimensions are in mm)

4.2 D2PAK packaging information
Figure 21: Tape outline

Figure 22: Reel outline
Table 10: D²PAK tape and reel mechanical data

4.3 TO-220 type A package information
Figure 23: TO-220 type A package outline

Table 11: TO-220 type A mechanical data

Added new package, mechanical data: D²PAK
Inserted device in I²PAK.
Updated P
TOT
and derating factor in Table 2.
Update R
thj-case
for TO-220FP in Table 3.
Update Figure 10 and Figure 15.
Update Section 5: Packaging mechanical data.
Updated title on the cover page.
Minor text changes.
– The part numbers STI26NM60N and STW26NM60N have been
moved to the separate datasheets
– Modified: VGS value in Table 2.
The part number STF26NM60N has been moved to a separate
datasheet.
Modified Table 2: "Absolute maximum ratings", Table 3: "Thermal
data", Table 5: "On/off states", Table 6: "Dynamic" and Table 7:
"Switching times".
Modified Section 2.1: "Electrical characteristics (curves)".
Minor text changes.
5 Revision history
Table 12: Document revision history

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