ST MICROELECTRONICS STP24N60DM2 Datasheet

Page 1
STB24N60DM2, STP24N60DM2,
D(2, TAB)
G(1)
S(3)
AM01476v1
D2PAK
TO-220
TO-247
1
3
2
TAB
1
2
3
TAB
1
2
3
STW24N60DM2
N-channel 600 V, 0.175 Ω typ., 18 A FDmesh II Plus™ low Q
Power MOSFETs in D2PAK, TO-220 and TO-247 packages
Datasheet − production data
Features

Figure 1. Internal schematic diagram

@
V
Order codes
STB24N60DM2
STW24N60DM2
DS
T
650 V 0.20 Ω 18 ASTP24N60DM2
Jmax
Extremely low gate charge and input capacitance
Lower R
x area vs previous generation
DS(on)
Low gate input resistance
100% avalanche tested
Zener-protected
Extremely high dv/dt and avalanche
capabilities
R
DS(on)
max
g
I
D
Applications
Switching applications
Description
These FDmesh II Plus™ low Qg Power MOSFETs with intrinsic fast-recovery body diode are produced using a new generation of MDmesh™ technology: MDmesh II Plus™ low Q revolutionary Power MOSFETs associate a vertical structure to the company's strip layout to yield one of the world's lowest on-resistance and gate charge. They are therefore suitable for the most demanding high efficiency converters and ideal for bridge topologies and ZVS phase-shift converters.

Table 1. Device summary

Order codes Marking Package Packaging
STB24N60DM2
STP24N60DM2 TO-220
STW24N60DM2 TO-247
24N60DM2
2
PAK Tape and reel
D
g
Tube
. These
March 2014 DocID025499 Rev 3 1/21
This is information on a product in full production.
www.st.com
Page 2
Contents STB24N60DM2, STP24N60DM2, STW24N60DM2
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2/21 DocID025499 Rev 3
Page 3
STB24N60DM2, STP24N60DM2, STW24N60DM2 Electrical ratings

1 Electrical ratings

Table 2. Absolute maximum ratings

Symbol Parameter Value Unit
V
I
DM
P
dv/dt
dv/dt
T
1. Pulse width limited by safe operating area.
2. ISD 18 A, di/dt 400 A/μs; VDS
3. VDS 480 V
Gate-source voltage ± 25 V
GS
I
Drain current (continuous) at TC = 25 °C 18 A
D
I
Drain current (continuous) at TC = 100 °C 11 A
D
(1)
Drain current (pulsed) 72 A
Total dissipation at TC = 25 °C 150 W
TOT
(2)
Peak diode recovery voltage slope 40 V/ns
(3)
MOSFET dv/dt ruggedness 50 V/ns
Storage temperature
stg
T
Max. operating junction temperature
j
peak
< V
(BR)DSS
, VDD=400 V.
- 55 to 150 °C

Table 3. Thermal data

Value
Symbol Parameter
2
D
PAK TO-220 TO-247
Unit
R
thj-case
R
thj-pcb
R
thj-amb
1. When mounted on 1 inch² FR-4, 2 Oz copper board
Thermal resistance junction-case max 0.83 °C/W
Thermal resistance junction-pcb max
(1)
30 °C/W
Thermal resistance junction-ambient max 62.5 50 °C/W

T able 4. Avalanche characteristics

Symbol Parameter Value Unit
Avalanche current, repetitive or not
I
AR
repetitive (pulse width limited by T
E
Single pulse avalanche energy (starting
AS
T
=25°C, ID= IAR; VDD=50)
j
jmax
)
3.5 A
180 mJ
DocID025499 Rev 3 3/21
21
Page 4
Electrical characteristics STB24N60DM2, STP24N60DM2, STW24N60DM2

2 Electrical characteristics

(TC = 25 °C unless otherwise specified)

Table 5. On /off states

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Drain-source breakdown voltage
Zero gate voltage drain current (VGS = 0)
Gate-body leakage current (V
DS
= 0)
ID = 1 mA, VGS = 0 600 V
V
= 600 V 1.5 μA
DS
V
= 600 V, TC=125 °C 100 μA
DS
= ± 25 V ±10 μA
V
GS
Gate threshold voltage VDS = VGS, ID = 250 μA 345V
Static drain-source on-resistance
= 10 V, ID = 9 A 0.175 0.200 Ω
V
GS

Table 6. Dynamic

Symbol Parameter Test conditions Min. Typ. Max. Unit
- 1055 - pF
pF
-2.4-
pF
C
oss eq.
C
C
C
Input capacitance
iss
= 100 V, f = 1 MHz,
Output capacitance - 56 -
oss
Reverse transfer
rss
V
DS
VGS = 0
capacitance
Equivalent output
(1)
capacitance
G
Intrinsic gate resistance
R
= 0 to 480 V, VGS = 0 - 259 - pF
V
DS
f = 1 MHz, I
= 0 - 7 - Ω
D
Q
Q
Q
1. C
oss eq.
increases from 0 to 80% V
Total gate charge
g
Gate-source charge - 6 - nC
gs
Gate-drain charge - 12 - nC
gd
is defined as a constant equivalent capacitance giving the same charging time as C
DSS
VDD = 480 V, ID = 18 A, VGS = 10 V
(see Figure 17)

Table 7. Switching times

Symbol Parameter Test conditions Min. Typ. Max. Unit
t
d(on)
t
d(off)
4/21 DocID025499 Rev 3
Turn-on delay time
= 300 V, ID = 9 A,
V
t
Rise time - 8.7 - ns
r
Turn-off delay time - 60 - ns
t
Fall time - 15 - ns
f
DD
RG = 4.7 Ω, V
(see Figure 16 and 21)
GS
= 10 V
-29-nC
when VDS
oss
-15-ns
Page 5
STB24N60DM2, STP24N60DM2, STW24N60DM2 Electrical characteristics

Table 8. Source drain diode

Symbol Parameter Test conditions Min. Typ. Max. Unit
(1)
I
SD
I
SDM
V
SD
Q
I
RRM
Q
I
RRM
1. Limited by maximum junction temperature
2. Pulse width limited by safe operating area.
3. Pulsed: pulse duration = 300 μs, duty cycle 1.5%
Source-drain current - 18 A
(2)
Source-drain current (pulsed) - 72 A
(3)
Forward on voltage ISD = 18 A, VGS = 0 - 1.6 V
t
Reverse recovery time
rr
Reverse recovery charge - 956 nC
rr
I
= 18 A, di/dt = 100 A/μs
SD
V
= 60 V (see Figure 18)
DD
- 155 ns
Reverse recovery current - 12.5 A
t
Reverse recovery time
rr
Reverse recovery charge - 1450 nC
rr
Reverse recovery current - 13 A
I
= 18 A, di/dt = 100 A/μs
SD
VDD = 60 V, Tj = 150 °C
(see Figure 18)
- 200 ns
DocID025499 Rev 3 5/21
21
Page 6
Electrical characteristics STB24N60DM2, STP24N60DM2, STW24N60DM2
I
D
10
1
0.1
0.1
1
100
V
DS
(V)
10
(A)
Operation in this area is
Limited by max R
DS(on)
10µs 100µs
1ms
10ms
Tj=150°C Tc=25°C
Single pulse
AM16164v1
I
D
10
1
0.1
0.1
1
100
V
DS
(V)
10
(A)
Operation in this area is
Limited by max R
DS(on)
10µs
100µs
1ms
10ms
Tj=150°C Tc=25°C
Single pulse
AM16165v1
I
D
30
20
10
0
0
10
V
DS
(V)
(A)
5
15
40
VGS= 4 V
VGS= 5 V
VGS= 7 V
VGS= 8, 9, 10 V
5
15
25
35
VGS= 6 V
20
AM16166v1

2.1 Electrical characteristics (curves)

Figure 2. Safe operating ar ea fo r D2PAK, TO-220 Figure 3. Thermal impedance D2PAK, TO-220

Figure 4. Safe operating area for TO-247 Figure 5. Thermal impedance for TO-247

Figure 6. Output characteristics Figure 7. Transfer characteristics

6/21 DocID025499 Rev 3
I
(A)
40
35
30
25
20
15
10
D
AM16167v1
VDS= 17 V
5
0
0
4
2
8
6
10
V
GS
(V)
Page 7
STB24N60DM2, STP24N60DM2, STW24N60DM2 Electrical characteristics
VDS
V
GS
6
4
2
0
0
5
Q
g
(nC)
(V)
20
8
10
15
10
VDD=480 V
I
D
=18 A
25
300
200
100
0
400
500
V
DS
(V)
V
DS
12
30
35
AM16168v1
C
1000
100
10
1
0.1
10
V
DS
(V)
(pF)
1
100
Ciss
Coss
Crss
AM15467v1
V
GS(th)
0.9
0.8
0.7
0.6
-50
0
T
J
(°C)
(norm)
-25
1.0
75
25
50
100
ID = 250 µA
1.1
AM15473v1

Figure 8. Gate charge vs gate-source voltage Figure 9. Static drain-source on-resistance

R
DS(on)
0.186
0.184
0.182
0.180
0.178
0.176
0.174
0.172
0.170
0.168
(Ω)
VGS=10V
12
14
0
4
2
10
6
8
16
AM16169v1
D
(A)
I

Figure 10. Capacitance variations Figure 11. Output capacitance stored energy

Figure 12. Normalized gate threshold voltage vs
temperature
E
oss
AM15472v1
(µJ)
8
7
6
5
4
3
2
1
0
0
100
200
300
400
500
600
V
DS
(V)
Figure 13. Normalized on-resistance vs
temperature
T
J
(°C)
AM15464v1
R
DS(on)
(norm)
2.3
2.1
ID = 9 A
GS
= 10 V
V
1.9
1.7
1.5
1.3
1.1
0.9
0.7
0.5
-50
-25
25
0
50
75
100
DocID025499 Rev 3 7/21
21
Page 8
Electrical characteristics STB24N60DM2, STP24N60DM2, STW24N60DM2
V
SD
0
4
I
SD
(A)
(V)
2
10
6
8
0
0.2
0.4
0.6
0.8
1
1.2 TJ=-50°C
TJ=150°C
TJ=25°C
12
14
16
1.4
AM15468v1
Figure 14. Source-drain diode forward
characteristics
Figure 15. Normalized V
V
(BR)DSS
(norm)
1.11
D
= 1mA
1.09
1.07
1.05
1.03
1.01
0.99
0.97
0.95
0.93
-50
-25
I
25
0
(BR)DSS
75
50
vs temperature
AM15466v1
T
J
100
(°C)
8/21 DocID025499 Rev 3
Page 9
STB24N60DM2, STP24N60DM2, STW24N60DM2 Test circuits
AM01468v1
VGS
PW
VD
RG
RL
D.U.T.
2200
μF
3.3 μF
V
DD
AM01469v1
VDD
47kΩ
1kΩ
47kΩ
2.7kΩ
1kΩ
12V
V
i=20V=VGMAX
2200 μF
PW
IG=CONST
100Ω
100nF
D.U.T.
V
G
AM01470v1
A
D
D.U.T.
S
B
G
25
Ω
A
A
B
B
R
G
G
FAST DIODE
D
S
L=100μH
μF
3.3
1000
μF
V
DD
$0Y
9%5'66
9''
9''
9'
,'0
,'

3 Test circuits

Figure 16. Switching times test circuit for
resistive load
Figure 18. Test circuit for inductive load
switching and diode recovery times

Figure 17. Gate charge test circuit

Figure 19. Unclamped inductive load test circuit

L
VD
2200
μF
3.3
μF
VDD

Figure 20. Unclamped inductive waveform Figure 21. Switching time waveform

ID
Vi
D.U.T.
Pw
AM01471v1
tdon
ton
tr
90%
tdoff
toff
tf
90%
10%
0
10%
VDS
90%
V
GS
10%
0
AM01473v1
DocID025499 Rev 3 9/21
21
Page 10
Package mechanical data STB24N60DM2, STP24N60DM2, STW24N60DM2

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
10/21 DocID025499 Rev 3
Page 11
STB24N60DM2, STP24N60DM2, STW24N60DM2 Package mechanical data
0079457_T

Figure 22. D²PAK (TO-263) drawing

DocID025499 Rev 3 11/21
21
Page 12
Package mechanical data STB24N60DM2, STP24N60DM2, STW24N60DM2

Table 9. D²PAK (TO-263) mechanical data

mm
Dim.
Min. Typ. Max.
A4.40 4.60
A1 0.03 0.23
b0.70 0.93
b2 1.14 1.70
c0.45 0.60
c2 1.23 1.36
D8.95 9.35
D1 7.50
E 10 10.40
E1 8.50
e2.54
e1 4.88 5.28
H 15 15.85
J1 2.49 2.69
L2.29 2.79
L1 1.27 1.40
L2 1.30 1.75
R0.4
V2
12/21 DocID025499 Rev 3
Page 13
STB24N60DM2, STP24N60DM2, STW24N60DM2 Package mechanical data
16.90
12.20
9.75
3.50
5.08
1.60
Footprint

Figure 23. D²PAK footprint

(a)
a. All dimension are in millimeters
DocID025499 Rev 3 13/21
21
Page 14
Package mechanical data STB24N60DM2, STP24N60DM2, STW24N60DM2
BW\SH$B5HYB7

Figure 24. TO-220 type A drawing

14/21 DocID025499 Rev 3
Page 15
STB24N60DM2, STP24N60DM2, STW24N60DM2 Package mechanical data

Table 10. TO-220 type A mechanical data

mm
Dim.
Min. Typ. Max.
A4.40 4.60
b0.61 0.88
b1 1.14 1.70
c0.48 0.70
D 15.25 15.75
D1 1.27
E 10 10.40
e2.40 2.70
e1 4.95 5.15
F1.23 1.32
H1 6.20 6.60
J1 2.40 2.72
L13 14
L1 3.50 3.93
L20 16.40
L30 28.90
P3.75 3.85
Q2.65 2.95
DocID025499 Rev 3 15/21
21
Page 16
Package mechanical data STB24N60DM2, STP24N60DM2, STW24N60DM2
0075325_G

Figure 25. TO-247 drawing

16/21 DocID025499 Rev 3
Page 17
STB24N60DM2, STP24N60DM2, STW24N60DM2 Package mechanical data

Table 11. TO-247 mechanical data

mm.
Dim.
Min. Typ. Max.
A 4.85 5.15
A1 2.20 2.60
b1.0 1.40
b1 2.0 2.40
b2 3.0 3.40
c 0.40 0.80
D 19.85 20.15
E 15.45 15.75
e 5.30 5.45 5.60
L 14.20 14.80
L1 3.70 4.30
L2 18.50
P 3.55 3.65
R 4.50 5.50
S 5.30 5.50 5.70
DocID025499 Rev 3 17/21
21
Page 18
Packaging mechanical data STB24N60DM2, STP24N60DM2, STW24N60DM2
P1
A0
D1
P0
F
W
E
D
B0
K0
T
User direction of feed
P2
10 pitches cumulative tolerance on tape +/- 0.2 mm
User direction of feed
R
Bending radius
B1
For machine ref. only including draft and radii concentric around B0
AM08852v1
Top cover tape

5 Packaging mechanical data

Figure 26. Tape

18/21 DocID025499 Rev 3
Page 19
STB24N60DM2, STP24N60DM2, STW24N60DM2 Packaging mechanical data
A
D
B
Full radius
G measured at hub
C
N
REEL DIMENSIONS
40mm min.
Access hole
At sl ot location
T
Tape slot in core for tape start 25 mm min. width
AM08851v2

Figure 27. Reel

Table 12. D²PAK (TO-263) tape and reel mechanical data

Tape Reel
mm
Dim.
Dim.
Min. Max. Min. Max.
A0 10.5 10.7 A 330
B0 15.7 15.9 B 1.5
D 1.5 1.6 C 12.8 13.2
D1 1.59 1.61 D 20.2
E 1.65 1.85 G 24.4 26.4
F 11.4 11.6 N 100
K0 4.8 5.0 T 30.4
P0 3.9 4.1
P1 11.9 12.1 Base qty 1000
P2 1.9 2.1 Bulk qty 1000
R50
T 0.25 0.35
W 23.7 24.3
mm
DocID025499 Rev 3 19/21
21
Page 20
Revision history STB24N60DM2, STP24N60DM2, STW24N60DM2

6 Revision history

Table 13. Document revision history

Date Revision Changes
12-Nov-2013 1 First release.
– Document status promoted from preliminary data to production
data
– Modified: dv/dt (peak diode recovery voltage slope) value in
17-Jan-2014 2
Table 2
– Modified: I – Modified: I
value in Table 4
AR
and V
DSS
GS(th)
– Minor text changes
03-Mar-2014 3
– Modified: I
– Added: note 1.: Limited by maximum junction temperature
value in Table 4
AR
– Minor text changes
values in Table 5
20/21 DocID025499 Rev 3
Page 21
STB24N60DM2, STP24N60DM2, STW24N60DM2
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2014 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
DocID025499 Rev 3 21/21
21
Loading...