ST MICROELECTRONICS STP 15NK50 STM Datasheet

STP15NK50Z/FP - STB15NK50Z
3
STB15NK50Z-1 - STW15NK50Z
N-channel 500V - 0.30Ω - 14A TO-220/FP/D2PAK/I2PA K/ TO -2 4 7
General features
Type V
STP15NK50Z 500V <0.34 14A 160 W
STP15NK50ZFP 500V <0.34 14A 40 W
STB15NK50Z 500V <0.34 14A 160W
STB15NK50Z-1 500V <0.34 14A 160W
STW15NK50Z 500V <0.34 14A 160W
DSS
R
DS(on)ID
Pw
TO-220
3
2
1
TO-220FP
TO-247
2
1
Extremely high dv/dt capability
100% avalanche tested
Gate charge minimized
Very low intrinsic capacitances
Very good manufacturing repeatibility
Description
The SuperMESH™ series is obtained through an extreme optimization of ST’s well established strip-based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications. Such series complements ST full range of high voltage MOSFETs including revolutionary MDmesh™ products.
Applications
Switching application
3
2
2
I
1
PAK
2
D
PAK
Internal schematic diagram
3
1
Order codes
Part number Marking Package Packaging
STP15NK50Z P15NK50Z TO-220 Tube
STP15NK50ZFP P15NK50ZFP TO-220FP Tube
2
STB15NK50ZT4 B15NK50Z D
STB15NK50Z B15NK50Z D
STB15NK50Z-1 B15NK50Z I
STW15NK50Z W15NK50Z TO-247 Tube
January 2007 Rev 4 1/19
PAK Tape & reel
2
PAK Tube
2
PA K Tu be
www.st.com
19
Contents STP15NK50Z - STP15NK50ZFP - STB15NK50Z - STB15NK50Z-1 - STW15NK50Z
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/19
STP15NK50Z - STP15NK50ZFP - STB15NK50Z - STB15NK50Z-1 - STW15NK50Z Electrical ratings

1 Electrical ratings

Table 1. Absolute maximum ratings
Val ue
Symbol Parameter
Drain-source voltage (VGS = 0) 500 V
DS
Drain-gate voltage (RGS = 20KΩ) 500 V
Gate-source voltage ± 30 V
GS
Drain current (continuous) at TC =
D
25°C
Drain current (continuous) at
D
TC=100°C
(2)
Drain current (pulsed) 56 56
Total dissipation at TC = 25°C 160 40 W
V
I
P
V
DGR
V
I
I
DM
TOT
TO-220/D
2
I
2
PAK
PAK /T O- 24 7
14 14
8.8 8.8
TO-220FP
(1)
(1)
(1)
Derating Factor 1.28 0.32 W/°C
I
GS
Gate-source current (DC) ± 20 mA
Vesd(G-S) G-S ESD (HBM C=100pF, R=1.5kΩ) 4000 KV
(3)
dv/dt
Peak diode recovery voltage slope 4.5 V/ns
Insulation withstand voltage (RMS)
V
ISO
from all three leads to external heat
-- 2500 V
sink (t=1s;TC=25°C)
T
T
1. Limited only by maximum temperature allowed
2. Pulse width limited by safe operating area
3. ISD 14A, di/dt 200A/µs,VDD V
Operating junction temperature
J
Storage temperature
stg
(BR)DSS
, Tj ≤ T
JMAX
-50 to 150°C °C
Unit
A
A
A
Table 2. Thermal data
Symbol Parameter
R
thj-case
Rthj-pcb
Thermal resistance junction-case Max
(1)
Thermal resistance junction-pcb max 60 °C/W
Val ue
TO-220
2
I
PAK
2
PAK TO-220FP TO-247
D
0.78 3.1 0.78 °C/W
Unit
3/19
Electrical ratings STP15NK50Z - STP15NK50ZFP - STB15NK50Z - STB15NK50Z-1 - STW15NK50Z
Table 2. Thermal data
R
thj-a
T
1. When mounted on minimum foot-print
Thermal resistance junction-ambient max
Maximum lead temperature for
l
soldering purpose
62.5 50 °C/W
300 °C
Table 3. Avalanche characteristics
Symbol Parameter Value Unit
I
AR
E
AS
Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max)
Single pulse avalanche energy (starting Tj=25°C, Id=I
, VDD=50V)
AR
14 A
300 mJ
Table 4. Gate-source zener diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
(1)
BV
GSO
1. The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components.
Gate-source breakdown voltage
Igs=±1mA (Open Drain)
30 V
4/19
STP15NK50Z - STP15NK50ZFP - STB15NK50Z - STB15NK50Z-1 - STW15NK50Z Electrical charac-

2 Electrical characteristics

(T
=25°C unless otherwise specified)
CASE
Table 5. On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Drain-source breakdown voltage
Zero gate voltage drain current (VGS = 0)
Gate body leakage current
= 0)
(V
DS
Gate threshold voltage
Static drain-source on resistance
= 1mA, VGS= 0
I
D
V
= Max rating,
DS
V
= Max rating @125°C
DS
= ±20V
V
GS
= VGS, ID = 100µA
V
DS
VGS= 10V, ID= 7A
500 V
1
50
±10 µA
33.754.5 V
0.30 0.34
Table 6. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
(1)
g
fs
C
C
C
C
oss eq
Q
Q
Q
t
d(on)
t
d(off)
1. Pulsed: pulse duration=300µs, duty cycle 1.5%
2. C inceases from 0 to 80% V
Forward transconductance
Input capacitance
iss
Output capacitance
oss
Reverse transfer
rss
capacitance
(2)
Equivalent output
.
capacitance
g
Total gate charge Gate-source charge
gs
Gate-drain charge
gd
Turn-on delay time
t
Rise time
r
Turn-off delay time Fall time
t
f
is defined as a constant equivalent capacitance giving the same charging time as C
oss eq.
DSS
V
=15V, ID = 7A
DS
=25V, f=1 MHz, VGS=0
V
DS
VGS=0, V
=400V, ID = 14A
V
DD
=10V
V
GS
=250 V, ID=7A,
V
DD
=4.7Ω, VGS=10V
R
G
=0V to 400V
DS
(see Figure 18)
12 S
2260
264
64
150 pF
76
106 nC 15 40
20 23 62 15
when VDS
oss
µA µA
pF pF pF
nC nC
ns ns ns ns
5/19
Electrical characteristics STP15NK50Z - STP15NK50ZFP - STB15NK50Z - STB15NK50Z-1 -
Table 7. Source drain diode
Symbol Parameter Test conditions Min Typ. Max Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration=300µs, duty cycle 1.5%
Source-drain current 14 A
(1)
Source-drain current (pulsed) 56 A
(2)
Forward on voltage
rr
Reverse recovery time Reverse recovery charge
rr
Reverse recovery current
I
=14A, VGS=0
SD
=14A,
I
SD
di/dt = 100A/µs, V
=29V, Tj=150°C
DD
428
4.2 20
1.6 V
ns
µC
A
6/19
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