The SuperMESH™ series is obtained through an
extreme optimization of ST’s well established
strip-based PowerMESH™ layout. In addition to
pushing on-resistance significantly down, special
care is taken to ensure a very good dv/dt
capability for the most demanding applications.
1. The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components
Test circuitsSTB10NK60Z - STB10NK60Z-1 - STP10NK60Z/FP - STW10NK60Z
3 Test circuits
Figure 18. Switching times test circuit for
resistive load
Figure 20. Test circuit for inductive load
switching and diode recovery times
Figure 19. Gate charge test circuit
Figure 21. Unclamped Inductive load test
circuit
Figure 22. Unclamped inductive waveformFigure 23. Switching time waveform
10/19
STB10NK60Z - STB10NK60Z-1 - STP10NK60Z/FP - STW10NK60ZPackage mechanical data
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
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