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STM32WB5MMG
Product summary
Order code STM32WB5MMG
Temperature
range
Package LGA 86L 10x10
Package
dimensions ( mm)
Packaging Tape and reel
-40 °C to 85 °C
7.3 x 11 x 1.342 x
0.435 pitch
STM32WB5MMG
Datasheet
Bluetooth® Low Energy 5.0 and 802.15.4 module
Features
• Integrated chip antenna
• Bluetooth® Low Energy 5.0, Zigbee® 3.0, OpenThread certified
• Dynamic and static concurrent modes
• IEEE 802.15.4-2011 MAC PHY
• Supports 2 Mbits/s
• TX output power up to +6 dBm
• RX sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm
(802.15.4)
• Range: up to 75 meters
•
Dedicated Arm® Cortex®-M0+ for radio and security tasks
•
Dedicated Arm® Cortex®-M4 CPU with FPU and ART (adaptative real-time
accelerator) up to 64 MHz speed
• 1-Mbyte Flash memory, 256-Kbyte SRAM
• Fully integrated BOM, including 32 MHz radio and 32 KHz RTC crystals
• Integrated SMPS
• Ultra-low-power modes for battery longevity
• 68 GPIOs
• Integrated IPD for best-in-class and reliable antenna matching
• 1.8 V to 3.6 V VDD range
• -40 °C to 85 °C temperature range
• Built-in security features such as: secure firmware installation (SFI) for radio
stack, customer key storage/key management services, PKA, AES 256-bit,
TRNG, PCROP, CRC, 96-bit UID, possibility to derive 802.15.4 and Bluetooth
Low Energy 48-bit UEI
• Certifications: CE, FCC, IC, JRF, SRRC, RoHS, REACH, GOST, KC, NCC
• Two layers PCB compatible (using external raw pins only)
Application
• Lighting and home automation
• Wireless audio devices
• Wellness, healthcare, personal trackers
• Gaming and toys
• Smart locks
• Beacons and accessories
• Industrial
®
DS13252 - Rev 1 - November 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
STM32WB5MMG
1 Introduction
This datasheet provides the ordering information and mechanical device characteristics of the STM32WB5MMG
module.
This document should be read in conjunction with the Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4
with FPU, Bluetooth® 5 and 802.15.4 radio solution (DS11929) and reference manual (RM0434). The reference
manual is available from the STMicroelectronics website at www.st.com.
For information on the Arm® Cortex® cores, refer to the Cortex® Technical Reference Manual, available from the
www.arm.com website
Note: Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
Introduction
DS13252 - Rev 1
page 2/31
2 Description
The STM32WB5MMG is an ultra-low-power and small form factor certified 2.4GHz wireless module. It
supports Bluetooth® Low Energy 5.0, Zigbee® 3.0, OpenThread, dynamic and static concurrent modes, and
802.15.4 proprietary protocols. Based on STMicroelectronics STM32WB55VGY wireless microcontroller, the
STM32WB5MMG provides best-in-class RF performance thanks to its good receiver sensitivity and a high
output power signal. Its low-power features enable extended battery life time, small coin-cell batteries or energy
harvesting.
The STM32WB5MMG requires no RF expertise and is the best way to speed-up any development and to reduce
associated costs. The module is completely protocol stack royalty-free.
Module overview
The module is an SiP-LGA86 package (system in package land grid array) that integrates the proven
STM32WB55VGY MCU with several external components. The package includes:
• LSE crystal
• HSE crystal
• Passive components for SMPS
• Antenna matching and antenna
• IPD for RF matching and harmonics rejection
STM32WB5MMG
Description
Figure 1. STM32WB5MMG module block diagram
Communication
interface
STM32WB55VGY
1MB Flash
256KB RAM
Antenna
matching
DS13252 - Rev 1
page 3/31
3 Available peripherals
All peripherals available in STM32WB Series microcontrollers based on the WLCSP100 package are available
and accessible on this module.
The pins on the module offer access to the following system peripherals:
• 2× DMA controllers (seven channels each) supporting ADC, SPI, I2C, USART, QSPI, SAI, AES, timers
• 1× USART (ISO 7816, IrDA, SPI master, Modbus and Smartcard mode)
• 1× LPUART (low power) – Two SPI running at 32 Mbit/s
• 2× I2C (SMBus/PMBus)
• 1× SAI (dual channel high quality audio)
• 1× USB 2.0 FS device, crystal-less, BCD and LPM
• 1× Touch sensing controller, up to 18 sensors
• 1× LCD 8x40 with step-up converter
• 1× 16-bit, four channels advanced timer
• 2× 16-bit, two channels timers
• 1× 32-bit, four channels timer
• 2× 16-bit ultra-low-power timers
• 1× independent Systick
• 1× independent watchdog
• 1× window watchdog.
STM32WB5MMG
Available peripherals
The full pin description is available in Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU,
Bluetooth® 5 and 802.15.4 radio solution (DS11929).
DS13252 - Rev 1
page 4/31
4 Pin description
The following figure shows the module pinout package bottom view.
STM32WB5MMG
Pin description
Figure 2. STM32WB5MMG module pinout: bottom view
VSS
86
PB10
PB11
PC5
NC
NC
PE4
PB12
PB2
PC4
PA8
PA9
74 75
PD9
73
PD4
72
PA6
PA7
PD8
84 77
VSS
83 78
PA4
PA5
76
PD15 PH0
PD10 PH1
PA3
VSS
ANT
_NC
85
1
6047
RF_OUT
ANT_IN
61
VSS
PA2
PA1
PA0
VREF+
62
VSS
VDDA
63
PC3
PC13
PB6
PB15
PB14
PC6
PB13
PD1
PD0
VDD
USB
31
VSS
PA11
PA12
PA10
PE3
PC7
PD3
PC9
PC8
71
82 79
PD11
70
81 80
PD6
69
68
PD2
PE2 PD14
64
PE0 PE1
65
PD5 PD13
6667
PD7 PD12
PC2
PC1
NRST
PB9
PC0
PH3-
BOOT0
PB8
VBAT
VSS
SMPS
17
PA15
PA14
PA13
PC12
PC11
PC10
PB4 PB5 PB7
PB3
VDD
SMPS
DS13252 - Rev 1
page 5/31
Table 1. STM32WB5MMG pin/ball definition
STM32WB5MMG
Pin description
Pin name
STM32WB5MMG STM32WB55VGY
1 F6
2 G6 PA1 I/O
3 G7 PA0 I/O
4 H8 VREF+ S
5 J9 VSS S
6 H9 VDDA S
7 G10 PC3 I/O
8 G9 PC2 I/O
9 G8 PC1 I/O
10 F9 NRST I/O
11 F10 PB9 I/O
12 F8 PC0 I/O
13 E8 PH3-BOOT0 I/O
14 F7 PB8 I/O
15 C10 VBAT S
16 F1 VSSSMPS S
17 D1 VDDSMPS S
18 D7 PB7 I/O
19 D6 PB5 I/O
20 C7 PB4 I/O
21 A9 PB3 I/O
22 A6 PC10 I/O
23 B6 PC11 I/O
24 C5 PC12 I/O
25 A5 PA13 I/O
26 A3 PA14 I/O
27 A4 PA15 I/O
28 B5 PA10 I/O
29 A2 PA12 I/O
30 A1 PA11 I/O
31 - VSS S
32 B3 VDDUSB S
33 C4 PD0 I/O
34 C3 PD1 I/O
35 C1 PB13 I/O
36 D2 PC6 I/O
37 E2 PB14 I/O
38 F3 PB15 I/O
39 F5 PB6 I/O
40 G5 PC13 I/O
41 G3 PB12 I/O
42 G1 PE4 I/O
45 H5 PC5 I/O
46 J6 PB11 I/O
Pin name (function after reset) Pin type
PA2 I/O
DS13252 - Rev 1
page 6/31
STM32WB5MMG
Pin description
Pin name
STM32WB5MMG STM32WB55VGY
47 K6
48 K7 PB2 I/O
49 G4 PC4 I/O
50 J7 PA8 I/O
51 K8 PA9 I/O
52 H6 PA7 I/O
53 H7 PA6 I/O
54 K9 PA5 I/O
55 K10 PA4 I/O
56 J8 PA3 I/O
57 - VSS S
58 - ANT_IN -
59 - RF_OUT -
60 - VSS S
61 E10 PH0 I/O
62 E9 PH1 I/O
63 D8 PD14 I/O
64 B10 PE1 I/O
65 C9 PD13 I/O
66 B8 PD12 I/O
67 A8 PD7 I/O
68 A7 PD2 I/O
69 B4 PC9 I/O
70 C2 PD3 I/O
71 E3 PC7 I/O
72 G2 PE3 I/O
73 D3 PD4 I/O
74 D5 PD9 I/O
75 D4 PD8 I/O
76 E7 PD15 I/O
77 E4 PD10 I/O
78 E6 PE2 I/O
79 C8 PE0 I/O
80 B7 PD5 I/O
81 C6 PD6 I/O
82 E5 PD11 I/O
83 F4 PC8 I/O
84 - VSS S
85 - ANT_NC -
86 - VSS S
- D10 PC14-OSC32_IN I/O
- D9 PC15-OSC32_OUT I/O
- H10 VSSA S
- J10 VDD S
- K5 VDD S
Pin name (function after reset) Pin type
PB10 I/O
DS13252 - Rev 1
page 7/31
STM32WB5MMG
Pin description
Pin name
STM32WB5MMG STM32WB55VGY
- J4
- K4 RF1 I/O
- K3 VSSRF S
- K2 VSSRF S
- J3 VDDRF S
- K1 VSSRF S
- J2 OSC_OUT O
- J1 OSC_IN I
- H3 AT0 O
- H4 AT1 O
- H2 PB0 I/O
- H1 PB1 I/O
- J5 VSS S
- F2 VFBSMPS S
- E1 VLXSMPS S
- B1 VDD S
- B2 VSS S
- B9 VSS S
- A10 VDD S
Pin name (function after reset) Pin type
VSSRF S
DS13252 - Rev 1
page 8/31
5 Recommendations
5.1 Pin recommendations
• ANT_IN and RF_OUT pins must be connected to GND. This module already integrates an antenna, so no
external antenna required.
• The ANT_NC is only used for soldering planarity purposes. So this pin must be soldered to an unconnected
pin on the customer board.
• A reset pull-up is already implemented in the STM32WB Series microcontrollers. The reset circuitry only
requires an external capacitor for filtering purpose (see Figure 3).
STM32WB5MMG
STM32WB5MMG
Recommendations
Figure 3. Reset circuit
PC2
PC1
NRST
PB9
PC0
8
9
10
100nF
11
12
To reset mechanism
DS13252 - Rev 1
page 9/31
5.2 Layout recommendations
5.2.1 STM32WB5MMG placement
The embedded antenna manufacturer of the STM32WB5MMG recommends to place the module on the
application board as shown below.
Figure 4. STM32WB5MMG board placement
STM32WB5MMG
Layout recommendations
This position allows the antenna to work to its maximum performance. If it cannot be placed as recommended
above, the application board performance is be reduced. This does not, however, prevent correct operation.
5.2.2 Enclosure effects
Product casing properties must be also considered when designing an RF-enabled product as the following list
illustrated;
• Conductive enclosure in close proximity (in far-field) of the antenna reflects the radiating signal and thus
decreases the transmitting / receiving power. If there has to be a metal part in the enclosure, consider a
frame rather than a box.
• Conductive enclosure in the near field affects the impedance of the antenna, also the resonant frequency. A
metal case must not be in the near field. The threshold between near and far-field is provided in Figure 5.
• Plastic enclosures can be close to the antenna, but must not touch it. Contact between the casing and the
antenna may influence the tuning of the resonant frequency and impedance matching.
• The proximity of the human body attenuates the TX and RX signals due to a certain amount of water
content. Any contact may untune frequency and impedance matching.
DS13252 - Rev 1
page 10/31
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