Discovery kits with increased-frequency 800 MHz STM32MP157 MPUs
Introduction
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits (STM32MP157x-DKx) are designed as complete
demonstration and development platforms for STMicroelectronics Arm®-based dual Cortex®-A7 32 bits and Cortex®-M4 32
bits MPUs in the STM32MP1 Series and their STPMIC1 companion chip. They leverage the capabilities increased-frequency
800 MHz of STM32MP1 Series microprocessors to allow users to develop applications using STM32 MPU OpenSTLinux
Distribution software (such as STM32MP1Starter) for the main processor and STM32CubeMP1 software for the co-processor.
They feature 16-bit DDR3L 4 Gbits at 533 MHz, MIPI DSISM 2 lanes at 1 Gbps, USB Type-C® DRP HS port, USB Type-A Host
HS ports, audio codec with analog audio input / output, microSD™ card high-speed mode up to 50 MHz, Gigabit Ethernet,
HDMI® up to 720p60 (1280 × 720), 40-pin extended GPIOs, ARDUINO®, Wi‑Fi® 802.11b/g/n, Bluetooth® Low Energy 4.1, and
ST-LINK/V2-1 (UART console).
The STM32MP157F-DK2, shown with display removed in Figure 1 and Figure 2, is used as a reference design for user
application development. It cannot be considered as the hardware design of a final application.
The hardware features of the Discovery kits are available for users to develop their applications: USB, Ethernet, LTDC, TFT
LCD MIPI DSISM, microSD™ card, audio codec, user buttons, Wi‑Fi®, and Bluetooth® Low Energy. Extension headers allow easy
connection of an ARDUINO® board for a specific application.
An ST-LINK/V2-1 is integrated on the board, as embedded in-circuit debugger and programmer for the STM32 MPU and the
USB Virtual COM port bridge.
Figure 1.
Pictures are not contractual.
STM32MP157F-DK2 top viewFigure 2. STM32MP157F-DK2 bottom view
UM2637 - Rev 1 - November 2020
For further information contact your local STMicroelectronics sales office.
◦ARDUINO® Uno V3 expansion connectors
–On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port
and debug port
–STM32CubeMP1 and full mainline open-source Linux® STM32 MPU OpenSTLinux Distribution (such
as STM32MP1Starter) software and examples
–Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded
Workbench®, MDK-ARM, and STM32CubeIDE
•Board-specific features
–4" TFT 480×800 pixels with LED backlight, MIPI DSISM interface, and capacitive touch panel
–Wi‑Fi® 802.11b/g/n
–Bluetooth® Low Energy 4.1
Note:Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
SM
®
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Features
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Page 3
2Ordering information
To order an STM32MP157 Discovery kit, refer to Table 1. Additional information is available from the datasheet
and reference manual of the target STM32.
Order codeBoard referenceTarget STM32Differentiating feature
STM32MP1MPU series in STM32 Arm Cortex MPUsSTM32MP1 Series
XXMPU product line in the seriesSTM32MP157
Options:
Y
DKZ
•D: basic security, 800 MHz increased frequency
•F: Secure Boot, cryptography hardware, 800 MHz
increased frequency
Discovery kit configuration:
•DK1: basic
•DK2: LCD, Wi‑Fi®, and Bluetooth® Low Energy
Secure Boot, cryptography hardware,
800 MHz increased frequency
LCD, Wi‑Fi®, and Bluetooth® Low
Energy
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3Development environment
3.1System requirements
UM2637
Development environment
•Windows® OS (7, 8 and 10), Linux® 64-bit, or macOS
•USB Type-C® to USB Type-C® charger 5 V / 3 A
•USB Type-C® to Type-A cable
•USB Type-A or USB Type-C® to Micro-B cable
Note:
macOS® is a trademark of Apple Inc. registered in the U.S. and other countries.
All other trademarks are the property of their respective owners.
3.2Development toolchains
•IAR Systems - IAR Embedded Workbench
(1)
3.3
•Keil® - MDK-ARM
•STMicroelectronics - STM32CubeIDE
•GCC
1.
On Windows® only.
Demonstration software
The STM32 MPU OpenSTLinux Distribution and STM32CubeMP1 base demonstration software is preloaded in
the microSD™ for easy demonstration of the device peripherals in standalone mode. The latest versions of the
demonstration source code and associated documentation can be downloaded from www.st.com.
®
®(1)
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4Technology partners
MICRON
•4-Gbit DDR3L, 16 bits, part number MT41K256M16TW-107-P-V00H
MURATA
•Wi‑Fi® 802.11b/g/n + Bluetooth® Low Energy 4.1, part number LBEE5KL1DX-883
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Technology partners
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5Conventions
Table 3 provides the conventions used for the ON and OFF settings in the present document.
ConventionDefinition
Jumper JPx ONJumper fitted
Jumper JPx OFFJumper not fitted
Jumper JPx [1-2]Jumper fitted between Pin 1 and Pin 2
Solder bridge SBx ONSBx connections closed by 0 Ω resistor
Solder bridge SBx OFFSBx connections left open
Resistor Rx ONResistor soldered
Resistor Rx OFFResistor not soldered
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Conventions
Table 3. ON/OFF convention
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6Delivery recommendations
Before first use, check the board for any damage that might have occurred during shipment, that all socketed
components are firmly fixed in their sockets and that none are loose in the plastic bag.
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Delivery recommendations
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7Hardware layout and configuration
Figure 3. STM32MP157x-DKx hardware block diagram
5V_VIN
Type-C
®
cable
/ Type-C
®
STM32MP157x
UM2637
Hardware layout and configuration
STPMIC1
32 kHz crystal
24 MHz crystal
ST-LINK / V2.1
USB
LCD TFT
4" 480 X 800
Capacitive touch
screen multi points
USB Hub
USB Type- C
®
I2C4
Power supply
I2C1
I2C4
I2C4
RTC
HSI
UART
SWD
DSI
I2C1
USB
Host
USB
DRP
GPIO
GPIO
UART
SDMMC
SAI
LTDC
RGMII
I2C1
I2C1
User interface
4 x LEDs
User interface
RESET buttons
Bluetooth
Energy V4.1
®
Wi-Fi
802.11 b/g/n
Audio DAC &
amplifier
HDMI
Ethernet
®
®
Low
Stereo jack
line out / Mic_IN
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microSD™ card
connector
DDR3L
SDMMC
DDR
Feature not available on STM32MP157D-DK1
GPIOs
GPIOs
ARDUINO
connectors
GPIO 40-pin
connector
®
Uno
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Hardware layout and configuration
Figure 4. STM32MP157x-DKx PCB layout: top side
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Figure 5. STM32MP157x-DKx PCB layout: bottom side
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Embedded ST-LINK/V2-1
7.1Embedded ST-LINK/V2-1
7.1.1Description
To debug the on-board STM32 MPU, the ST-LINK/V2-1 programming and debugging tool is integrated in the
STM32MP157x-DKx Discovery kit. The embedded ST-LINK/V2-1 supports only SWD and VCP for STM32
devices. For information about the debugging and programming features of ST-LINK/V2-1, refer to the ST-LINK/V2 in-circuit debugger/programmer for STM8 and STM32 user manual (UM1075). It is recommended to
power the board (5V_VIN) before plugging the USB debug cable to the Micro-B connector.
Figure 6. CN11 ST-LINK USB Micro-B connector pinout
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Table 4. CN11 ST-LINK USB Micro-B connector pinout
PinPin nameSignal nameST-LINK STM32 pinFunction
1VBUS5V_USB_ST_LINK-VBUS Power
2DMUSB_STLK_NPA11DM
3DPUSB_STLK_PPA12DP
4ID-GNDID
5GNDGNDGNDGND
7.1.2Drivers
Before connecting STM32MP157x-DKx to a Windows® (7, 8, or 10) PC via the USB, a driver for ST-LINK/V2-1
must be installed (not required for Windows® 10). It is available from the www.st.com website.
In case the STM32MP157x-DKx Discovery kit is connected to the PC before the driver is installed, some
Discovery kit interfaces may be declared as “Unknown” in the PC device manager. In this case, the user must
install the dedicated driver files, and update the driver of the connected device from the device manager.
7.1.3ST-LINK/V2-1 firmware upgrade
The ST-LINK/V2-1 embeds a firmware upgrade mechanism for in-situ upgrade through the USB port. As firmware
may evolve during the lifetime of the ST-LINK/V2-1 product (addition of new functionalities, bug fixes, or support
of new microprocessor families), it is recommended to visit periodically the www.st.com website before starting to
use the STM32MP157x-DKx Discovery kit to stay up-to-date with the latest firmware version.
UM2637
Power supply
7.2Power supply
7.2.15 V power supply
The STM32MP157x-DKx Discovery kit is designed to be powered by a 5 V DC power source at 3 A maximum
such as:
•5V_VBUS connected to the CN6 connector through a USB Type-C® to USB Type-C® cable
The two lines USB_PWR_CC1 and USB_PWR_CC2 are connected to PA4 and PA5 respectively to check
what is connected to CN6 and control features enabling:
–Legacy cable
–Personal computer
–5 V DC power source at 3 A
Depending on the current needed on the devices connected to the USB port, and the board itself, power
limitations can prevent the system from working as expected. The user must ensure that the STM32MP157x-DKx
Discovery kit is supplied with the correct power source depending on the current needed. It is recommended to
use a USB Type-C® to USB Type-C® 5 V/3 A charger.
7.2.2STPMIC1 power supply
For general information concerning the STPMIC1, refer to the datasheet on the www.st.com website.
STPMIC1 supply
•VDD_CORE (BUCK1) used to supply the core of the STM32MP157x
–Value: 1.2 V
•VDD_DDR (BUCK2) used to supply the DDR core and I/Os
–Value: 1.35 V
•VDD (BUCK3) used to supply the VDDA and VDD domains of the STM32MP157x
–Value: 3.3 V
•3V3 (BUCK4) used to provide the 3.3 V to the different features available on the Discovery kit
–Value: 3.3 V
•VREF_DDR used to supply the DDR reference voltage
–Value: 1.65 V
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•VTT_DDR (LDO3) used to supply the termination resistors of the DDR
–Value: 1.65 V
•1V8_Audio (LDO1) used to supply the digital/analog of the audio codec
–Value: 1.8 V
•1V2_HDMI (LDO6) used to supply the digital core and analog part of the HDMI transceiver
–Value: 1.2 V
•3V3_HDMI (LDO2) used to supply the I/Os of the HDMI transceiver
–Value: 3.3 V
•VDD_USB (LDO4) used to supply the USB phy of the STM32MP157x
–Value: 3.3 V
7.3Clock sources
7.3.1LSE clock references
The LSE clock references on the STM32MP157x microprocessor are provided by the external crystal X2:
•32.768 kHz crystal from NDK: reference NX2012SA
7.3.2HSE clock references
The HSE clock references on the STM32MP157x microprocessor are provided by the external crystal X6:
•24 MHz crystal from NDK: reference NX2016SA
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Clock sources
7.4Reset sources
The reset signal of STM32MP157x-DKx is active low. The internal PU forces the RST signal to a high level.
The sources of reset are:
•Reset button B2 (black button)
•STPMIC1
•Embedded ST-LINK/V2-1
•ARDUINO® connector CN16: pin 3, reset from the ARDUINO® board
•STM32MP157x
7.5Boot mode
7.5.1Description
At startup, the boot source used by the internal bootROM is selected by the Boot pins. Table 5 describes the
configurations of the Boot pins.
Boot 0
000Forced USB boot for flashing.
100Not supported.
001Engineering boot.
1. Pin Boot 1 is always tied to "0" by a pull-down resistor.
101SD card on SDMMC1.
Boot 1
Table 5. Boot mode pins
(1)
Boot 2Boot mode
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Figure 7 shows the configurations of the boot-related switch SW1.
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Figure 7. Boot-mode switch SW1
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Audio
Forced USB boot
for flashing
7.6Audio
7.6.1Description
The CS42L51-CNZ codec is connected through an SAI interface to the STM32MP157x microcontroller. This
component supports the TDM feature of the SAI port. The TDM feature offers STM32MP157x the capability to
stream stereo audio channels.
7.6.2Operating voltage
The audio codec has two power supplies:
•VL, connected to the 3.3 V provided by the STPMIC1
•1V8_AUDIO, dedicated 1.8 V source provided by the STPMIC1
7.6.3Audio codec interface
Audio codec interfacing is performed through the SAI2 and I2C1 interfaces of the STM32MP157x.
Table 6 describes the I/O configuration of the audio codec interface.
I/OConfiguration
PG9PG9 used as AUDIO RESETN (active LOW)
PE0PE0 used as SAI2_MCLKA
PF11PF11 used as SAI2_SDB shared with GPIO expansion
PI7PI7 used as SAI2_FSA shared with GPIO expansion
PI5PI5 used as SAI2_SCKA shared with GPIO expansion
PI6PI6 used as SAI2_SDA shared with GPIO expansion
PD12PD12 used as I2C1_SCL shared between USB, DSI, HDMI
PF15PB7 used as I2C1_SDA shared between USB, DSI, HDMI
Engineering bootBoot from SD card
Table 6. I/O configuration for the audio interface
7.6.4Headphone outputs
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits can drive a stereo headphone. The
STM32MP157x sends the stereo audio channels to the codec via its SAI2 TDM port. The codec converts the
digital audio stream to stereo analog signals. It then boosts them for direct drive of the headphone connected to
the CN10 3.5 mm stereo jack receptacles on the board.
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The audio codec is set by an I2C bus. The address is a 7 bit address plus one bit for read/write (high for read, low
for write). The AD0 pin, connected to GND, gives the least-significant address bit. The address of the audio codec
is 0b1001010x: 0x94 to write and 0x95 to read.
7.6.5Audio jack connector
Figure 8 shows the CN10 audio jack connector pinout.
UM2637
USB Host
Figure 8. CN10 audio jack connector pinout
Table 7 describes the CN10 audio jack connector pinout.
Pin
11MIC_INMICIN1Microphone IN
22GNDGNDGND
33AOUTBAOUTBOUT_SPEAKER_RIGHT
44AOUTAAOUTAOUT_SPEAKER_LEFT
7.6.6I/O restriction
SAI2 is shared between the audio codec and the GPIO expansion connector. By default, the audio codec is
available because of solder bridges SB13, SB14, SB15, and SB16.
7.7USB Host
7.7.1Description
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits provide four USB Host ports (dual-USB
sockets CN1 and CN5) through the use of the USB2514B-AEZC USB Hub. The USB2514B-AEZC has a full
power management for each USB port: no I/O is needed from the STM32MP157x.
Table 7. CN10 audio jack connector pinout
Pin nameSignal nameCodec pinFunction
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7.7.2USB Host interface
Table 8 describes the I/O configuration for the USB Host interface.
I/OConfiguration
PD12
PF15
USB_DP1USB1_P
USB_DM1USB1_N
1. I2C1 not connected by default (SB7 and SB8 OFF).
Figure 9 shows the CN1 and CN5 USB Type-A connector pinout.
Table 8. I/O configuration for the USB Host interface
PD12 used as I2C1_SCL shared between AUDIO, DSI, and HDMI
PF15 used as I2C1_SDA shared between AUDIO, DSI, and HDMI
Figure 9. CN1 and CN5 USB Type-A connector pinout
UM2637
USB Host
(1)
(1)
Table 9 describes CN1 and CN5 USB Host connector pinout.
Table 9. CN1 and CN5 USB Host connector pinout
Pin
T1T1VBUSVBUS
T2T2USB1CN25_NDM
T3T3USB1CN25_PDP
T4T4GNDGND
B1B1VBUSVBUS
B2B2USB1CN25_NDM
B3B3USB1CN25_PDP
B4B4GNDGND
T1T1VBUSVBUS
T2T2USB1CN26_NDM
Pin nameSignal nameFunction
CN1
CN5
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USB Type-C™ HS
PinPin nameSignal nameFunction
T3T3USB1CN26_PDP
T4T4GNDGND
B1B1VBUSVBUS
B2B2USB1CN26_NDM
B3B3USB1CN26_PDP
B4B4GNDGND
UM2637
7.8
USB Type-C™ HS
7.8.1Description
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits support USB high-speed (HS) communication.
USB connector CN7 is a USB Type-C™ connector.
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits support USB Type-C™ Source mode.
7.8.2Operating voltage
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits support 5 V USB voltage from 4.75 V to
5.25 V.
7.8.3USB HS Source
When a USB Device connection to the CN7 USB Type-C™ connector of STM32MP157D-DK1 or STM32MP157FDK2 is detected, the Discovery kit starts behaving as a USB Host.
7.8.4
USB Type-C® connector
Figure 10 shows the pinout of USB Type-C® connector CN7.
A1A2A3A4A5A6A7A8A9A10A11A12
GNDTX1+TX1-VBUSCC1D+D-SBU1VBUSRX2-RX2+GND
GNDRX1+RX1-VBUSSBU2D-D+CC2VBUSTX2-TX2+GND
Figure 10. CN7 USB Type-C® connector pinout
UM2637 - Rev 1
B12B11B10B9B8B7B6B5B4B3B2B1
Table 10 describes the pinout of USB Type-C® connector CN7.
Table 10. CN7 USB Type-C® connector pinout
FunctionSTM32 pinSignal name
GND-GNDGNDA1 B12GNDGND-GND
TX1+--TX1+A2 B11RX1+--RX1+
TX1---TX1-A3 B10RX1---RX1-
VBUS--VBUSA4B9VBUS--VBUS
CC1--CC1A5B8SBU2--SBU2
D+USB_DP2USB_DP2D+A6B7D-USB_DM2USB_DM2D-
Pin
name
Pin Pin
Pin
name
Signal nameSTM32 pinFunction
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microSD™ card
FunctionSTM32 pinSignal name
D-USB_DM2USB_DM2D-A7B6D+USB_DP2USB_DP2D+
SBU1--SBU1A8B5CC2--CC2
VBUS--VBUSA9B4VBUS--VBUS
RX2---RX2-A10 B3TX2---TX2-
RX2+--RX2+A11 B2TX2+--TX2+
GND-GNDGNDA12 B1GNDGND-GND
7.9
microSD™ card
7.9.1Description
The CN15 slot for the microSD™ card is routed to STM32MP157x SDIO port (SDMMC1). This interface is
compliant with SD Memory Card Specification Version 3.01: SDR50.
7.9.2Operating voltage
The microSD™ card interface is only compatible with the 3.3 V voltage range: from 2.7 V to 3.6 V. All microSD
card types are supported (including SDHC and SDXC), but only Default and High-Speed modes (3 V) are
supported on STM32MP157D-DK1 and STM32MP157F-DK2. UHS-I modes (1.8 V) are not supported on these
Discovery kits.
Pin
name
Pin Pin
Pin
name
Signal nameSTM32 pinFunction
™
7.9.3
microSD™ card interface
The microSD™ card interface is used in the four data lines D[0:3] with one clock (CLK), one command line (CMD),
and one card detection signal (CARD_DETECT).
The SDMMC1 is a bootable interface.
Table 11 describes the I/O configuration for the SDIO interface.
Table 11. I/O configuration for the SDIO interface
I/OConfiguation
PB7PB7 is connected to µSD_DETECT
PC8PC8 is connected to SDMMC1_D0
PC9PC9 is connected to SDMMC1_D1
PC10PC10 is connected to SDMMC1_D2
PC11PC11 is connected to SDMMC1_D3
PC12PC12 is connected to SDMMC1_CLK
PD2PD2 is connected to SDMMC1_CMD
Figure 11 shows the pinout of the microSD™ connector CN15.
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Figure 11. microSD™ card connector CN15
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LEDs
Table 12 describes pinout of the microSD™ connector CN15.
Pin
1DAT2SDMMC1_D2PC10SDIO.D2
2DAT3_CDSDMMC1_D3PC11SDIO.D3
3CMDSDMMC1_CMDPD2SDIO.CMD
43V33V3-VDD_SDCARD
5CLKSDMMC1_CLKPC12SDIO.CLK
6VSSGND-GND
7DAT0SDMMC1_D0PC8SDIO.D0
8DAT1SDMMC1_D1PC9SDIO.D1
9GNDGND-GND
10CARD_DETECTuSD_DETECTPB7SDCARD_DETECT active LOW
7.10LEDs
Table 12. CN15 microSD™ connector pinout
Pin nameSignal nameSTM32 pinFunction
7.10.1Description
The LD2 LED turns green when the power cable is inserted in connector CN6.
Two general-purpose color LEDs (LD7 and LD8) are available as light indicators:
•The LD7 orange LED is used as STM32Cube examples verdict LED.
•The LD8 blue LED is used as Linux® Heartbeat LED, which is blinking as long as Linux® is alive on the
Cortex®-A.
The two user LEDs, the green LD5 and orange LD6 LEDs, are directly connected to the STM32MP157x.
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7.10.2Operating voltage
All LEDs are driven by the I/O level; they are operating in the 3.3 V voltage range.
7.10.3LED interface
Table 13 describes the I/O configuration of the LED interface.
I/OConfiguration
PA14PA14 is connected to the green LED LD4. Active Low.
PA13PA13 is connected to the red LED LD6. Active Low.
PH7PH7 is connected to the orange LED LD7. Active High.
PD11PD11 is connected to the blue LED LD8. Active High.
7.11Buttons
UM2637
Buttons
Table 13. I/O configuration of the LED interfaces
7.11.1Description
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits provide four types of buttons:
•Wake-up button (B1)
–Allows the platform to be woken up from any low-power mode
–Connected to STPMIC1 PONKEY, which generates a wake up signal on STM32MP157x PA0
•Reset button (B2)
–Used to reset the Discovery kit
•USER1 button (B3)
–Used at boot time by U-Boot to enter the USB programming mode
•USER2 button (B4)
–
Used at boot time by U-Boot to enter the Android® Fastboot mode
7.11.2I/O interface
Table 14 describes the I/O configuration for the physical user interface.
I/OConfiguration
NRSTReset button (B2). Active Low.
-Wake-up button (B1). Connected to the PONKEYn pin of the STPMIC1
PA13USER2 user button (B4)
PA14USER1 user button (B3)
Table 14. I/O configuration for the physical user interface
7.12
HDMI
®
7.12.1Description
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits offer an HDMI® connection for a TV monitor
through the use of the Lattice Semiconductor SiI9022A HDMI® transmitter.
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HDMI®
The resolution is up to 720p60 (1280 × 720).
Input signals are 24 bits digital RGB (LTDC) for the video and I2S2 for the audio. Refer to the STM32MP157x
datasheet for details.
The control signals are I2C1, one interruption, and a dedicated reset.
The Consumer Electronic Control (CEC) is also available through the HDMI® transmitter (transmitter bypassed).
7.12.2
HDMI® I/O interface
Table 15 describes the I/O configuration for the HDMI® interface.
Table 15. I/O configuration for the HDMI® interface
I/OConfiguration
PB6PB6 is connected to HDMI_CEC.
PD9PD9 is connected to LTDC_B0.
PG12PG12 is connected to LTDC_B1.
PG10PG10 is connected to LTDC_B2.
PD10PD10 is connected to LTDC_B3.
PI4PI4 is connected to LTDC_B4.
PA3PA3 is connected to LTDC_B5.
PB8PB8 is connected to LTDC_B6.
PD8PD8 is connected to LTDC_B7.
PE5PE5 is connected to LTDC_G0.
PE6PE6 is connected to LTDC_G1.
PH13PH13 is connected to LTDC_G2.
PH14PH14 is connected to LTDC_G3.
PH15PH15 is connected to LTDC_G4.
PI0PI0 is connected to LTDC_G5.
PI1PI1 is connected to LTDC_G6.
PI2PI2 is connected to LTDC_G7.
PH2PH2 is connected to LTDC_R0.
PH3PH3 is connected to LTDC_R1.
PH8PH8 is connected to LTDC_R2.
PH9PH9 is connected to LTDC_R3.
PH10PH10 is connected to LTDC_R4.
PC0PC0 is connected to LTDC_R5.
PH12PH12 is connected to LTDC_R6.
PE15PE15 is connected to LTDC_R7.
PG7PG7 is connected to LTDC_CLK.
PF10PF10 is connected to LTDC_DE.
PI10PI10 is connected to LTDC_HSYNC.
PI9PI9 is connected to LTDC_VSYNC.
PA9PA9 is connected to I2S2_CK.
PB9PB9 is connected to I2S2_WS.
PI3PI3 is connected to I2S2_SDO.
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I/OConfiguration
PG1PG1 is connected to HDMI_INT.
PD12PD12 is connected to I2C1_SCL (I2C shared).
PF15PF15 is connected to I2C1_SDA (I2C shared).
PA10PA10 is connected to HDMI_NRST
Figure 12 shows the pinout of HDMI® connector CN9.
Figure 12. CN9 HDMI® connector pinout
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HDMI®
Table 16 describes the pinout of HDMI® connector CN9.
Table 16. CN9 HDMI® connector pinout
Pin
1RX2+TX2C_P
2GNDGND
3RX2-TX2C_N
4TX1+TX1C_P
5GNDGND
6RX1-TX1C_N
7RX0+TX0C_P
8GNDGND
9RX0-TX0C_N
10RXC+TXCC_P
11GNDGND
12RXC-TXCC_N
13CECCEC_A
14--
Pin nameSignal name
UM2637 - Rev 1
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Page 22
Wi‑Fi® and Bluetooth® Low Energy
PinPin nameSignal name
15SCLDSCL
16SDADSDA
17GNDGND
18+5V5V_VIN
19DETHPD
UM2637
7.13
Wi‑Fi® and Bluetooth® Low Energy
7.13.1Description
The STM32MP157F-DK2 Discovery kit support Wi‑Fi® 802.11b/g/n and Bluetooth® Low Energy (BLE) V4.1.
These functions are supported with the LBEE5KL1DX-883 MURATA module. This module is driven by a SDIO for
the Wi‑Fi® interface, and a USART for the Bluetooth®. The PCM format is used for audio data.
7.13.2Operating voltage
The LBEE5KL1DX-883 module supports the 3.3 V voltage range.
7.13.3
Wi‑Fi® I/O interface
Table 17 describes the I/O configuration for the Wi‑Fi® interface.
I/OConfiguration
PB4PB4 is connected to SDMMC2_D3
PB3PB3 is connected to SDMMC2_D2
PB15PB15 is connected to SDMMC2_D1
PB14PB14 is connected to SDMMC2_D0
PG6PG6 is connected to SDMMC2_CMD
PE3PE3 is connected to SDMMC2_CK
PH4PH4 is connected to WL_REG_ON
PD0PD0 is connected to WL_HOST_WAKE
Table 17. I/O configuration for the Wi‑Fi® interface
7.13.4
UM2637 - Rev 1
Bluetooth® Low Energy I/O interface
Table 18 describes the I/O configuration for the Bluetooth® Low Energy interface.
Table 18. I/O configuration for the Bluetooth® Low Energy interface
I/OConfiguration
PD5PD5 is connected to USART2_TX
PD6PD6 is connected to USART2_RX
PD4PD4 is connected to USART2_RTS
PD3PD3 is connected to USART2_CTS
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Page 23
I/OConfiguration
PZ3PZ3 is connected to BT_PCM_WS
PZ2PZ2 is connected to BT_PCM_SDO
PZ1PZ1 is connected to BT_PCM_SDI
PZ0PZ0 is connected to BT_PCM_CK
PZ6PZ6 is connected to BT_REG_ON
PH5PH5 is connected to BT_HOST_WAKE
PZ7PZ7 is connected to BT_DEV_WAKE
PI8LP0_32
UM2637
MIPI DSISM LCD
7.14
MIPI DSISM LCD
The LCD is not provided with the STM32MP157D-DK1 Discovery kit.
7.14.1Description
The 40-pin FCP connector CN4 is used to connect a TFT LCD module through the MIPI DSISM interface supported
by the MB1407 board. The touch panel is embedded in the LCD module.
The LCD module is composed of the FRD397B2509V2 TFT LCD module with an OTM8009A LCD driver. The 4"
LCD supports a resolution of 480 × 800 dots in 16.7 M colors (RGB). The touch-sensitive panel drive is performed
by the FT6236 self-capacitive controller.
Figure 13 shows the LCD connection to MB1407 and MB1272.
Figure 13. LCD connection to MB1407
7.14.2Operating voltage
The LCD module power supply is connected to VDD_3V3.
UM2637 - Rev 1
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Page 24
The touch panel power supply is connected to VDD_3V3.
The backlight of the LCD is driven by the STLD40DPUR circuit on the MB1407 board connected to VDD_3V3.
7.14.3LCD interface
Table 19 describes the I/O configuration of the LCD and CTP interfaces.
I/OConfiguration
DSI_D0PDSI_D0P is used as MIPI-DSI data Lane 0 positive.
DSI_D0NDSI_D0N is used as MIPI-DSI data Lane 0 negative.
DSI_D1PDSI_D1P is used as MIPI-DSI data Lane 1 positive.
DSI_D1NDSI_D1N is used as MIPI-DSI data Lane 0 negative.
DSI_CKPDSI_CKP is used as clock Lane positive.
DSI_DKNDSI_DKN is used as clock Lane negative.
PF2PF2 is used LCD interrupt lane.
PA15
PD12PD12 used as I2C1_SCL for the touch panel, shared between USB, AUDIO, HDMI.
1. Not used. In the default configuration, backlight control is done by the LCD driver.
PF15PF15 used as I2C1_SDA for the touch panel, shared between USB, AUDIO, and HDMI.
Table 19. I/O configuration of the LCD and CTP interfaces
PA15 is used as DSI backlight control.
(1)
UM2637
MIPI DSISM LCD
Figure 14 shows the the pinout of LCD connector CN4.
Figure 14. CN4 LCD connector pinout
UM2637 - Rev 1
Table 20 describe the LCD interface and pinout of LCD connector CN4.
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Page 25
Gigabit Ethernet
Table 20. LCD interface and CN4 connector pinout
PinSTM32 pinSignal nameFunction
1-GNDGND
2DSI_D1NDSI_D1_ND1N
3DSI_D1PDSI_D1_PD1P
4-GNDGND
5DSI_CKNDSI_CK_NCKN
6DSI_CKPDSI_CK_PCKP
7-GNDGND
8DSI_D0NDSI_D0_ND0N
9DSI_D0PDSI_D0_PD0P
10-GNDGND
11PF0I2C1_SCLSCL
12PF14I2C1_SDASDA
13-GNDGND
14-3V33V3
15-3V33V3
16-GNDGND
17PF2LCD_INTINT
18PC6DSI_TETE
19PA15LCD_BL_CTRLCTRL
20PE4DSI_RESETRESET
UM2637
7.15Gigabit Ethernet
7.15.1Description
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits provide a Gigabit reduced mediumindependent interface (RGMII).
The STM32MP157x requires an external physical interface device (PHY). The Realtek RTL8211F-CG is the PHY
on the Discovery kits. The PHY is connected to the physical LAN bus using 13 signals for RGMII. It can be
clocked using the 25 MHz from the STM32MP157x or from a crystal (X2). The default configuration is 25 MHz
from the X2 crystal.
LED LD3 is blinking to indicate the data transmission.
For more details about the PHY (such as clocking or configuration), refer to the datasheet of the Realtek
RTL8211F-CG.
7.15.2Operating voltage
The Ethernet PHY is supplied directly with 3.3 V. It generates its own 1.05 V supply and digital/analog 3.3 V.
7.15.3Ethernet interface
Table 21 describes the I/O configuration of the Ethernet interface.
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Page 26
Table 21. I/O configuration of the Ethernet interface
I/OConfiguration
PG0PG0 is used as ETH_NRST active Low.
PA2PA2 is used as ETH_MDIO.
PA6PA6 is used as ETH_MDINT.
PC1PB11 is used as ETH_MDC.
PA7PA7 is used as ETH_RX_DV.
PC4PB11 is used as ETH_RXD0.
PC5PB11 is used as ETH_RXD1.
PB0PB0 is used as ETH_RXD2.
PB1PB1 is used as ETH_RXD3.
PB11PB11 is used as ETH_TX_EN.
PG13PG13 is used as ETH_TXD0.
PG14PG14 is used as ETH_TXD1.
PC2PB11 is used as ETH_TXD2.
PE2PE2 is used as ETH_TXD3.
PA1PA1 is used as ETH_RX_CLK.
PG4PG4 is used as ETH_GTX_CLK.
PG5PG5 is used as ETH_CLK125.
PB5PB5 is used as ETH_CLK not the default configuration.
UM2637
Gigabit Ethernet
Figure 15 shows the pinout of Ethernet connector CN8.
Figure 15. CN8 Ethernet connector pinout
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Page 27
Table 22. CN8 Ethernet connector pinout
PinPin nameFunction
1TX1+
2TX1-
3TX2+
4TX2-
5CT1Common connected to GND.
6CT2Common connected to GND.
7TX3+
8TX3-
9TX4+
10TX4-
11GAGreen LED anode.
12GCGreen LED cathode.
13YAYellow LED anode.
14YCYellow LED cathode.
15GNDGND.
16GNDGND.
First bidirectional pair to transmit and receive data.
Second bidirectional pair to transmit and receive data.
Third bidirectional pair to transmit and receive data.
Fourth bidirectional pair to transmit and receive data.
UM2637
ARDUINO® connectors
7.16
ARDUINO® connectors
7.16.1Description
The ARDUINO® Uno V3 connectors (CN13, CN14, CN16, and CN17) are available on the STM32MP157x-DKx
Discovery kit. Most shields designed for ARDUINO® can fit with the Discovery kit to offer flexibility in small form
factor applications.
7.16.2Operating voltage
The ARDUINO® Uno V3 connectors support 5 V, 3.3 V, and VDD for I/O compatibility.
Caution:
7.16.3
Do not supply 3.3 V or 5 V from the ARDUINO® shield. Supplying 3.3 V or 5 V from the ARDUINO® shield could
damage the Discovery kit.
ARDUINO® interface
Figure 16 shows the pinout of the ARDUINO® connectors.
UM2637 - Rev 1
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Page 28
Figure 16. ARDUINO® connectors pinout
UM2637
ARDUINO® connectors
UM2637 - Rev 1
Table 23 describes the I/O configuration of the ARDUINO® interface.
Table 23. I/O configuration of the ARDUINO® interface
I/O
PF14-PF14 is used as ARD_A0: ADC1_IN0
PF13-PF13 is used as ARD_A1: ADC1_IN1
ANA0-ANA0 is used as ARD_A2: ADC1_IN6
ANA1-ANA1 is used as ARD_A3: ADC1_IN2
PC3SB24 ON PC3 is used as ARD_A4: ADC1_IN13 Default configuration
PF12SB26 ON PF12 is used as ARD_A5: ADC1_IN14 Default configuration
PE7-PE7 is used as ARD_D0: UART7_RX
PE8-PE8 is used as ARD_D1: UART7_TX
PE1-PE1 is used as ARD_D2: IO
PD14-PD14 is used as ARD_D3: TIM4_CH3
PE10-PE10 is used as ARD_D4: IO
HWConfiguration
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Page 29
I/OHWConfiguration
PD15-PD15 is used as ARD_D5: TIM4_CH4
PE9-PE9 is used as ARD_D6: TIM4_CH1
PD1-PD1 is used as ARD_D7: IO
PG3-PG3 is used as ARD_D8: IO
PH6-PH6 is used as ARD_D9: TIM12_CH1
PE11-PE11 is used as ARD_D10: SPI4_NSS, TIM1_CH2
PE14-PE14 is used as ARD_D11: SPI4_MOSI ,TIM1_CH4
PE13-PE13 is used as ARD_D12: SPI4_MISO
PE12-PE12 is used as ARD_D13: SPI4_SCK
PA12-PA12 used as ARD_D14: I2C5_SDA shared with ARD_A4 (SB23 ON / SB24 OFF)
PA11-PA11 used as ARD_D15: I2C5_SCL shared with ARD_A5 (SB25 ON / SB26 OFF)
Table 24 describes the pinout of the ARDUINO® connectors.
UM2637
ARDUINO® connectors
Connector
CN16
CN17
CN14
CN13
Table 24. Pinout of the ARDUINO® connectors
Pin nameSignal nameSTM32 pinComment
1NC-NC (reserved for test)
23V3-IOREF 3V3
3NRSTNRSTNRST
43V3-3V3
55V-5V
6GND-GND
7GND-GND
8VINNot connected
1A0PF14ADC1_IN0
2A1PF13ADC1_IN1
3A2ANA0ADC1_IN6
4A3ANA1ADC1_IN2
5A4PC3/PA12ADC1_IN13
6A5PF12/PA11
1ARD_D0PE7USART7_RX
2ARD_D1PE8USART7_TX
3ARD_D2PE1IO
4ARD_D3PD14TIM4_CH3
5ARD_D4PE10IO
6ARD_D5PD15TIM4_CH4
7ARD_D6PE9TIM1_CH1
8ARD_D7PD1IO
1ARD_D8PG3IO
UM2637 - Rev 1
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Page 30
ConnectorPin nameSignal nameSTM32 pinComment
2ARD_D9PH6TIM12_CH1
3ARD_D10PE11SPI4_NSS and TIM1_CH2
4ARD_D11PE14SPI4_MOSI and TIM1_CH4
5ARD_D12PE13SPI4_MISO
CN13
6ARD_D13PE12SPI4_SCK
7GND-GND
8VREFP-VREF+
9ARD_D14PA12I2C5_SDA
10ARD_D15PA11I2C5_SCL
7.17GPIO expansion connectors
7.17.1Description
•The GPIO pins can be used as GPIOs or alternate functions. The available alternate functions are listed in
Table 25. GPIO connectors pinout.
•Other functions such as I2C, UART, or FDCAN can be mapped on the GPIO connectors, for instance using
the STM32CubeMX tool.
Figure 17 shows the pinout of the GPIO connectors.
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Page 31
Figure 17. GPIO connectors
UM2637
GPIO expansion connectors
Table 25 describes the pinout of the GPIO connectors.
Table 25. GPIO connectors pinout
Function
3V3-12-5V
GPIO2 / I2C5_SDAPA1234-5V
GPIO3 / I2C5_SCLPA1156-GND
GPIO4 / MCO1PA878PB10GPIO14 / USART3_TX
GND-910PB12GPIO15 / USART3_RX
GPIO17 / USART3_RTSPG81112PI5GPIO18 / SAI2_SCKA
GPIO27 / SDMMC3_D3PD71314-GND
GPIO22 / SDMMC3_CKPG151516PF1GPIO23 / SDMMC3_CMD
3V3-1718PF0GPIO24 / SDMMC3_D0
GPIO10 / SPI5_MOSIPF91920-GND
GPIO9 / SPI5_MISOPF82122PF4GPIO25 / SDMMC3_D1
GPIO11 / SPI5_SCKPF72324PF6GPIO8 / SPI5_NSS
GND-2526PF3GPIO7
I2C1_SDAPF152728PD12I2C1_SCL
GPIO5 / MCO2PG22930-GND
STM32 pinPinPinSTM32 pinFunction
UM2637 - Rev 1
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Page 32
FunctionSTM32 pinPinPinSTM32 pinFunction
GPIO6 / TIM5_CH2PH113132PD13GPIO12 / TIM4_CH2
GPIO13 /TIM3_CH2PC73334-GND
GPIO19 / SAI2_FSAPI73536PB13GPIO16 / USART3_CTS
GPIO26 / SDMMC3_D2PF53738PI6GPIO20 / SAI2_SDA
GND-3940PF11GPIO21 / SAI2_SDB
7.18VBAT connector
7.18.1Description
The voltage on the VBAT pin of the STM32MP157x-DKx can be provided by an external battery. Use connector
CN3 to plug a CR2032 battery (3 V lithium battery), wired on Molex 51021-0200, as shown in Figure 18.
Caution:Pin1: VBAT. Pin2: GND.
UM2637
VBAT connector
Figure 18. CN3 VBAT connector
2
1
UM2637 - Rev 1
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Page 33
STM32MP157x-DKx Discovery kits information
8STM32MP157x-DKx Discovery kits information
8.1Identification
The STM32MP157x-DKx product, composed of one or two boards, is identified using the product sticker with an
identification as:
•Product name
•Sales type
•FCC ID
Each board is further identified with its own dedicated board sticker.
The sticker located on the top or bottom side of the PCB board shows the information about product identification
such as board reference, revision, and serial number.
The first identification line has the following format: “MBxxxx-Variant-yzz”, where “MBxxxx” is the board reference,
“Variant” (optional) identifies the mounting variant when several exist, "y" is the PCB revision and "zz" is the
assembly revision: for example B01.
The second identification line is the board serial number used for traceability.
Evaluation tools marked as “ES” or “E” are not yet qualified and therefore not ready to be used as reference
design or in production. Any consequences deriving from such usage will not be at ST charge. In no event, ST will
be liable for any customer usage of these engineering sample tools as reference designs or in production.
“E” or “ES” marking examples of location:
•On the targeted STM32 that is soldered on the board (For an illustration of STM32 marking, refer to the
STM32 datasheet “Package information” paragraph at the www.st.com website).
•Next to the evaluation tool ordering part number that is stuck or silk-screen printed on the board.
The product and board stickers are detailed in Table 26.
UM2637
Product / board
Product
MB1272 board
MAC address00:80:E1:XX:XX:XX
MB1407 board
1. Only for STM32MP157F-DK2.
8.2
Product revision history
STM32MP157D-DK1 DK32MP157D1$AU1 and STM32MP157F-DK2 DK32MP157F2$AU1 are the initial released
versions.
8.3Known limitations
None.
Table 26. Product and board stickers
Sticker information
STM32MP157D-DK1 or STM32MP157F-DK2
DK32MP157D1$AU1 or DK32MP157F2$AU1
Contains FCC ID: VPYLB1DX
MB1272-DK1-C02 or MB1272-DK2-C02
syywwxxxxx
MB1407-LCD-C02
syywwxxxxx
(1)
(1)
UM2637 - Rev 1
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Page 34
9STM32MP157x-DKx I/O assignment
Table 27. Discovery kit I/O assignment
BallPinAssignment
A2PH5BT_HOST_WAKE
C2PH10LTDC_R4
B2PH12LTDC_R6
D1PH13LTDC_G2
C3PH14LTDC_G3
B1PH15LTDC_G4
C1PI0LTDC_G5
E3PI1LTDC_G6
E2PI2LTDC_G7
E1PI3HDMI_I2S2_MOSI
E4PI4LTDC_B4
F3PI5SAI2_SCKA
F4PI6SAI2_SDA
F2PI7SAI2_FSA
G1PZ1BT_PCM_1_SDI
G4PZ3BT_PCM_1_WS
H4PI9LTDC_VSYNC
G3PZ0BT_PCM_1_CK
J4PZ2BT_PCM_1_SDO
G2PZ4PMIC_I2C4_SCL
K4PG12LTDC_B1
H2PZ5PMIC_I2C4_SDA
H1PZ6BT_REG_ON
J3PZ7BT_DEV_WAKE
D2PD6BT_USART2_RX
L3PD14ARDUINO_D3_TIM4_CH3
J2PD15ARDUINO_D5_TIM4_CH4
K3PD8LTDC_B7
K1PD9LTDC_B0
L4PI8LPO_32OUT2
K2PC13PC13_ANTI_TAMP_PMIC_WAKEUP
N2PA13LED1_GPIO
T2PA14LED2_GPIO
P4PI11PI11_STUSB1600_IRQN_WKUP5
T1PI10LTDC_HSYNC
W4PH7LED_Y_GPIO
U1PF3GPIO7_GPIO
UM2637
STM32MP157x-DKx I/O assignment
UM2637 - Rev 1
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Page 35
STM32MP157x-DKx I/O assignment
BallPinAssignment
W2PC3ARDUINO_A4_ADC1_IN13
T4PG3ARDUINO_D8_GPIO
Y1PE2ETH_TXD3
U2PA3LTDC_B5
Y2PC2ETH_TXD2
V2PG2GPIO5_MCO2
AA1PG14ETH_TXD1
W1PG1HDMI_INT_GPIO
AA2PG13ETH_TXD0
U3ANA0ARDUINO_A0_ADC1_IN0
AB3PA0PA0_WKUP_PMIC_INT
U4ANA1ARDUINO_A1_ADC1_IN1
AA4PA1ETH_REF_CLK
V3PA5TypeC_Power_CC2_ADC1_IN19
V4PA4TypeC_Power_CC1_ADC1_IN18
AB1PB11ETH_TX_EN
AB2PG4ETH_GTX_CLK
AC3PA2ETH_MDIO
AA6PC1ETH_MDC
Y6PG5ETH_CLK125
AA3PH3LTDC_R1
AB6PB0ETH_RXD2
Y4PF15IDSD_BOARD_I2C1_SDA
AA7PB1ETH_RXD3
AC4PF14ARDUINO_A2_ADC2_IN6
Y5PF13ARDUINO_A3_ADC2_IN2
AB4PH2LTDC_R0
AB7PC5ETH_RXD1
AC7PC4ETH_RXD0
Y9PF12ARDUINO_A5_ADC1_IN6
Y10PF11SAI2_SD_B
AB8PA7ETH_RXDV
AC8PA6ETH_MDINT
AB5PC0LTDC_R5
Y3PB10GPIO14_USART3_TX
AC5PB12GPIO15_USART3_RX
AA10PB13GPIO16_USART3_CTS_NSS
Y8PB5ETH_ETH_CLK
Y7PG11STLK_UART4_TX
Y11PH6ARDUINO_D9_TIM12_CH1
UM2637
UM2637 - Rev 1
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Page 36
STM32MP157x-DKx I/O assignment
BallPinAssignment
AB10PB8LTDC_B6
AB9PG8GPIO17_USART3_RTS
AB11PG10LTDC_B2
AA9PE9ARDUINO_D6_TIM1_CH1
AA11PE7ARDUINO_D0_UART7_RX
AC10PD11LED_B_GPIO
AB12PF7GPIO11_SPI5_SCK
AC11PF8GPIO9_SPI5_MISO
Y12PF10LTDC_DE
AA13PF6GPIO8_SPI5_NSS
Y18PD12I2C1_SCL
AA14PF9GPIO10_SPI5_MOSI
AC14PG7LTDC_CLK
Y14PB6HDMI_CEC
AC13PE8ARDUINO_D1_UART7_TX
Y15PE10ARDUINO_D4_GPIO
Y16PB2STLK_UART4_RX
AA19PD13GPIO12_TIM4_CH2
Y13PG9AUDIO_RST
AB19PA12ARDUINO_D14__GPIO3_I2C5_SDA
AA18PA11ARDUINO_D15__GPIO2_I2C5_SCL
D16PC11uSD_SDMMC1_D3
D19PE4DSI_RESET_GPIO
D18PC8uSD_SDMMC1_D0
D15PC10uSD_SDMMC1_D2
B13PB4WLAN_SDMMC2_D3
D17PC9uSD_SDMMC1_D1
B11PC7GPIO13_TIM3_CH2
B14PC6DSI_TE
A14PF2DSI_LCD_INT_GPIO
D12PD2uSD_SDMMC1_CMD
A13PA8GPIO4_MCO1
C13PB14WLAN_SDMMC2_D0
D13PC12uSD_SDMMC1_CK
B12PB15WLAN_SDMMC2_D1
C11PE5LTDC_G0
A11PB3WLAN_SDMMC2_D2
A10PG6WLAN_SDMMC2_CMD
D14PD3BT_USART2_CTS_NSS
B10PB9HDMI_I2S2_NSS/2_WS
UM2637
UM2637 - Rev 1
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Page 37
STM32MP157x-DKx I/O assignment
BallPinAssignment
C19PA15DSI_LCD_BLCTRL_TIM2_CH1/2_ETR
A8PA9HDMI_I2S2_SCK/2_CK
D11PB7uSD_detect_GPIO
B9PD1ARDUINO_D7_GPIO
B8PD0WLAN_HOST_WAKE_GPIO
C9PE3WLAN_SDMMC2_CK
A7PD5BT_USART2_TX
D10PD7GPIO27_SDMMC3_D3
B7PG15GPIO22_SDMMC3_CK
C10PE6LTDC_G1
D8PF0GPIO24_SDMMC3_D0
A5PF1GPIO23_SDMMC3_CMD
D9PF4GPIO25_SDMMC3_D1
B6PD4BT_USART2_RTS
D7PF5GPIO26_SDMMC3_D2
B5PD10LTDC_B3
D6PE0SAI2_MCLK_A
C8PE1ARDUINO_D2_GPIO
D5PH8LTDC_R2
C5PH9LTDC_R3
A4PE11ARDUINO_D10_SPI4_NSS/TIM1_CH2
B4PE12ARDUINO_D13_SPI4_SCK
A3PE13ARDUINO_D12_SPI4_MISO
C4PH11GPIO6_TIM5_CH2
C6PE14ARDUINO_D11_SPI4_MOSI/TIM1_CH4
D3PE15LTDC_R7
B3PH4WLAN_REG_ON_GPIO
UM2637
UM2637 - Rev 1
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Page 38
UM2637
Federal Communications Commission (FCC) and ISED Canada Compliance Statements
10Federal Communications Commission (FCC) and ISED Canada
Compliance Statements
Identification of products: STM32MP157D-DK1 and STM32MP157F-DK2
Part 15.19
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
Part 15.21
Any changes or modifications to this equipment not expressly approved by STMicroelectronics may cause
harmful interference and void the user's authority to operate this equipment.
Part 15.105
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate
radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause
harmful interference in which case the user will be required to correct the interference at his own expense.
Note:
Use only shielded cables for USB, Ethernet, HDMI® cables. Use added ferrite clamp on audio cable (one turn).
10.1
Responsible party (in the USA)
Terry Blanchard
Americas Region Legal | Group Vice President and Regional Legal Counsel, The Americas
STMicroelectronics, Inc.
750 Canyon Drive | Suite 300 | Coppell, Texas 75019
USA
ISED Canada ICES-003
CAN ICES-3 (A) / NMB-3 (A)
Additional FCC and ISED Canada Compliance Statements for STM32MP157FDK2
Contains FCC ID: VPYLB1DX
Contains IC:772C-LB1DX
ISED Licence-Exempt Radio Apparatus
This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic
Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions:
1.This device may not cause interference.
2.This device must accept any interference, including interference that may cause undesired operation of the
device.
UM2637 - Rev 1
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Page 39
UM2637
Additional FCC and ISED Canada Compliance Statements for STM32MP157F-DK2
Appareils radio exempts de licence ISDE
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation,
Sciences et Développement économique Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
1.L’appareil ne doit pas produire de brouillage ;
2.L'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus
To satisfy FCC and ISED Canada RF Exposure requirements for mobile devices, a separation distance of 20
cm or more should be maintained between the antenna of this device and persons during operation. To ensure
compliance, operation at closer than this distance is not recommended. This transmitter must not be co-located or
operating in conjunction with any other antenna or transmitter.
Pour satisfaire aux exigences FCC et ISDE Canada concernant l'exposition aux champs RF pour les appareils
mobile, une distance de séparation de 20 cm ou plus doit être maintenu entre l'antenne de ce dispositif et les
personnes pendant le fonctionnement. Pour assurer la conformité, il est déconseillé d'utiliser cet équipement
à une distance inférieure. Cet émetteur ne doit pas être co-situé ou fonctionner conjointement avec une autre
antenne ou un autre émetteur.
UM2637 - Rev 1
page 39/48
Page 40
11CE conformity
11.1Warning
EN 55032 / CISPR32 (2012) Class A product
Warning: this device is compliant with Class A of EN55032 / CISPR32. In a residential environment, this
equipment may cause radio interference.
11.2Simplified declaration of conformity
Hereby, STMicroelectronics declares that the radio equipment types STM32MP157D-DK1 and STM32MP157FDK2 are in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available on
the next page.
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.