STMicroelectronics STM32H742xI/G, STM32H743xI/G User Manual

STM32H742xI/G STM32H743xI/G Errata sheet

STM32H742xI/G and STM32H743xI/G device limitations

Applicability

This document applies to the part numbers of STM32H742/743xI/G devices listed in Table 1 and their variants shown in Table 2.

Section 1 gives a summary and Section 2 a description of workarounds for device limitations, with respect to the device datasheet and reference manual RM0433.

	Table 1. Device summary
Reference	Part numbers
	STM32H742VI, STM32H742ZI, STM32H742II, STM32H742BI,
STM32H742xI/G	STM32H742XI, STM32H742AI, STM32H742VG, STM32H742ZG,
	STM32H742IG, STM32H742BG, STM32H742XG, STM32H742AG
	STM32H743VI, STM32H743ZI, STM32H743II, STM32H743BI,
STM32H743xI/G	STM32H743XI, STM32H743AI, STM32H743VG, STM32H743ZG,
	STM32H743IG, STM32H743BG, STM32H743XG, STM32H743AG

Table 2. Device variants

Reference	Silicon revision codes
	Device marking(1)		REV_ID(2)
STM32H742xI/G	V		0x2003
STM32H743xI/G	Y		0x1003
STM32H743xI/G	X		0x2001
STM32H743xI/G	V		0x2003

1.Refer to the device datasheet for how to identify this code on different types of package.

2.REV_ID[15:0] bit field of DBGMCU_IDC register. Refer to the reference manual.

February 2021

ES0392 Rev 8

1/44

www.st.com

Contents	STM32H742/743xI/G

Contents

1	Summary of device limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	. 6
2	Description of device limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	10
	2.1 Arm® 32-bit Cortex®-M7 core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	10

2.1.1Cortex®-M7 data corruption when using Data cache configured in

write-through . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1.2 Cortex®-M7 FPU interrupt not present on NVIC line 81 . . . . . . . . . . . . 11

2.2 System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

2.2.1 Timer system breaks do not work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.2.2Clock recovery system synchronization with USB SOF does not work . 11

2.2.3 SysTick external clock is not HCLK/8 . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.2.4Option byte loading can be done with the user wait-state configuration 12

2.2.5Flash BusFault address register may not be valid when

an ECC double error occurs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.2.6 Flash ECC address register may not be updated . . . . . . . . . . . . . . . . . 12 2.2.7 PCROP-protected areas in Flash memory may be unprotected . . . . . . 13

2.2.8Flash memory bank swapping might impact embedded

	Flash memory interface behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	13
2.2.9	Reading from AXI SRAM may lead to data read corruption . . . . . . . . .	13
2.2.10	Clock switching does not work when LSE failure is detected by CSS . .	13

2.2.11RTC stopped when a system reset occurs while the LSI is used

as a clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	14
2.2.12 USB OTG_FS PHY drive limit on DP/DM pins . . . . . . . . . . . . . . . . . . .	14

2.2.13Unexpected leakage current on I/Os when VIN higher that VDD . . . . . 14

2.2.14 LSE oscillator driving capability selection bits are swapped . . . . . . . . . 14 2.2.15 HRTIM internal synchronization does not work . . . . . . . . . . . . . . . . . . . 15

2.2.16Device stalled when two consecutive level regressions occur

without accessing from/to backup SRAM . . . . . . . . . . . . . . . . . . . . . . . 15 2.2.17 Invalid Flash memory CRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

2.2.18GPIO assigned to DAC cannot be used in output mode when

the DAC output is connected to on-chip peripheral . . . . . . . . . . . . . . . . 15 2.2.19 Unstable LSI when it clocks RTC or CSS on LSE . . . . . . . . . . . . . . . . . 16

2.2.20480 MHz maximum CPU frequency not available on silicon revision Y . 16

2.2.21VDDLDO is not available on TFBGA100 package

on devices revision Y and V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

2/44	ES0392 Rev 8

STM32H742/743xI/G	Contents

2.2.22WWDG not functional when VDD is lower than 2.7 V and VOS0

or VOS1 voltage level is selected . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.2.23A tamper event does not erase the backup RAM when the

backup RAM clock is disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.2.24 LSE CSS parasitic detection even when disabled . . . . . . . . . . . . . . . . . 17

2.3 FMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2.3.1 Dummy read cycles inserted when reading synchronous memories . . . 18 2.3.2 Wrong data read from a busy NAND Flash memory . . . . . . . . . . . . . . . 18 2.3.3 Missed clocks with continuous clock feature enabled . . . . . . . . . . . . . . 18

2.4 QUADSPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

2.4.1 First nibble of data is not written after a dummy phase . . . . . . . . . . . . . 19 2.4.2 QUADSPI hangs when QUADSPI_CCR is cleared . . . . . . . . . . . . . . . . 19

2.4.3QUADSPI cannot be used in Indirect read mode when only

data phase is activated . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.4.4 Memory-mapped read of last memory byte fails . . . . . . . . . . . . . . . . . . 20

2.5 ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

2.5.1 Conversion overlap may impact the ADC accuracy . . . . . . . . . . . . . . . . 20 2.5.2 ADC resolution limited by LSE activity . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.5.3 ADC maximum sampling rate when VDDA is lower than 2 V . . . . . . . . 21 2.5.4 ADC maximum resolution when VDDA is higher than 3.3 V . . . . . . . . . 21 2.5.5 First ADC injected conversion in a sequence may be corrupted . . . . . . 21

2.5.6Writing the ADC_JSQR register when JADCSTART = 1 and JQDIS = 1

may lead to incorrect behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.5.7 Conversion may be triggered by context queue register update . . . . . . 22

2.5.8Updated conversion sequence may be trigged by

context queue update . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

2.6 VREFBUF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

2.6.1	Overshoot on VREFBUF output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	23
2.6.2	VREFBUF Hold mode cannot be used . . . . . . . . . . . . . . . . . . . . . . . . .	23

2.7 OPAMP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

2.7.1 OPAMP high-speed mode must not be used . . . . . . . . . . . . . . . . . . . . . 23

2.8 LCD-TFT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

2.8.1Device stalled when accessing LTDC registers while pixel clock

is disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

2.9 TIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

2.9.1One-pulse mode trigger not detected in master-slave reset +

trigger configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.9.2 Consecutive compare event missed in specific conditions . . . . . . . . . . 24

ES0392 Rev 8

3/44

Contents		STM32H742/743xI/G
	2.9.3	Output compare clear not working with external counter reset . . . . . .	. 25
2.10	LPTIM .	. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	26
	2.10.1	MCU may remain stuck in LPTIM interrupt when entering Stop mode	. 26
2.11	RTC . .	. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	26
	2.11.1	RTC calendar registers are not locked properly . . . . . . . . . . . . . . . . .	. 26
2.12	I2C . . .	. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	27

2.12.110-bit master mode: new transfer cannot be launched if first part

of the address is not acknowledged by the slave . . . . . . . . . . . . . . . . .

27

2.12.2Wrong behavior in Stop mode when wakeup from Stop

mode is disabled in I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

2.12.3 Wrong data sampling when data setup time (tSU;DAT) is shorter than
	one I2C kernel clock period . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	28
2.12.4 Spurious bus error detection in Master mode . . . . . . . . . . . . . . . . . . . .		28
2.12.5	Last-received byte loss in Reload mode . . . . . . . . . . . . . . . . . . . . . . . .	29
2.12.6	Spurious master transfer upon own slave address match . . . . . . . . . . .	30

2.12.7START bit is cleared upon setting ADDRCF, not upon address match . 31

2.13 USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

2.13.1Underrun flag is set when the USART is used in SPI Slave

receive mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 2.13.2 DMA stream locked when transferring data to/from USART/UART . . . . 31

2.14 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

2.14.1 Spurious DMA Rx transaction after simplex Tx traffic . . . . . . . . . . . . . . 32

2.14.2Master data transfer stall at system clock much faster than SCK . . . . . 32

2.14.3 Corrupted CRC return at non-zero UDRDET setting . . . . . . . . . . . . . . . 32 2.14.4 TXP interrupt occurring while SPI/I2Sdisabled . . . . . . . . . . . . . . . . . . . 32

2.15 SDMMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

2.15.1Busy not detected when a write operation suspended

during busy phase resumes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

2.15.2Wrong data line 2 generation between two blocks

during DDR transfer with Read wait mode enabled . . . . . . . . . . . . . . . . 33

2.15.3Unwanted overrun detection when an AHB error is reported

whereas all bytes have been received . . . . . . . . . . . . . . . . . . . . . . . . . . 33

2.15.4Consecutive multiple block transfers can induce incorrect data length . 34

2.15.5 Clock stop reported during Read wait mode sequence . . . . . . . . . . . . . 34

2.16 FDCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

2.16.1 Writing FDCAN_TTTS during initialization corrupts FDCAN_TTTMC . . 34

2.16.2Wrong data may be read from Message RAM by the CPU

when using two FDCANs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

4/44	ES0392 Rev 8

STM32H742/743xI/G	Contents

2.16.3Mis-synchronization in Edge filtering mode when the falling edge at FDCAN_Rx input pin coincides with the end of the

integration phase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

2.16.4Tx FIFO messages inverted when both Tx buffer and FIFO are used and the messages in the Tx buffer have higher priority than

in the Tx FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

2.17 USB OTG_HS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

2.17.1 Possible drift of USB PHY pull-up resistor . . . . . . . . . . . . . . . . . . . . . . . 36

2.18 ETH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

2.18.1 Incorrect L4 inverse filtering results for corrupted packets . . . . . . . . . .

37

2.18.2Rx DMA may fail to recover upon DMA restart following a bus error,

with Rx timestamping enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

2.18.3Tx DMA may halt while fetching TSO header under specific conditions 37

2.18.4 Spurious receive watchdog timeout interrupt . . . . . . . . . . . . . . . . . . . . .		38
2.18.5	Incorrect flexible PPS output interval under specific conditions . . . . . .	38
2.18.6 Packets dropped in RMII 10Mbps mode due to fake dribble
	and CRC error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	38
2.18.7	ARP offload function not effective . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	39

2.19 HDMI-CEC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

2.19.1Unexpected switch to Receive mode without automatic transmission

retry and notification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 2.19.2 CEC header not received due to unjustified Rx-Overrun detection . . . . 40

3

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

41

ES0392 Rev 8

5/44

Summary of device limitations	STM32H742/743xI/G

1 Summary of device limitations

The following table gives a quick references to all documented device limitations of STM32H742/743xI/G and their status:

A = limitation present, workaround available

N = limitation present, no workaround available

P = limitation present, partial workaround available “-” = limitation absent

Applicability of a workaround may depend on specific conditions of target application. Adoption of a workaround may cause restrictions to target application. Workaround for a limitation is deemed partial if it only reduces the rate of occurrence and/or consequences of the limitation, or if it is fully effective for only a subset of instances on the device or in only a subset of operating modes, of the function concerned.

Table 3. Summary of device limitations

					Status
	Function	Section	Limitation
				Rev.	Rev.	Rev.
				Y	X(1)	V
	Arm® 32-	2.1.1	Cortex®-M7 data corruption when using Data cache configured in	A	A	A
	bit		write-through
	Cortex®-
		2.1.2	Cortex®-M7 FPU interrupt not present on NVIC line 81	A	A	A
	M7 core
		2.2.1	Timer system breaks do not work	N	-	-
		2.2.2	Clock recovery system synchronization with USB SOF does not work	A	-	-
		2.2.3	SysTick external clock is not HCLK/8	A	-	-
		2.2.4	Option byte loading can be done with the user wait-state configuration	A	-	-
		2.2.5	Flash BusFault address register may not be valid when an ECC double	A	-	-
			error occurs
		2.2.6	Flash ECC address register may not be updated	N	-	-
		2.2.7	PCROP-protected areas in Flash memory may be unprotected	A	-	-
	System	2.2.8	Flash memory bank swapping might impact embedded Flash memory	N	-	-
			interface behavior
		2.2.9	Reading from AXI SRAM may lead to data read corruption	A	-	-
		2.2.10	Clock switching does not work when LSE failure is detected by CSS	A	-	-
		2.2.11	RTC stopped when a system reset occurs while the LSI is used as a	A	-	-
			clock source
		2.2.12	USB OTG_FS PHY drive limit on DP/DM pins	N	-	-
		2.2.13	Unexpected leakage current on I/Os when VIN higher that VDD	A	-	-
		2.2.14	LSE oscillator driving capability selection bits are swapped	A	-	-
		2.2.15	HRTIM internal synchronization does not work	N	-	-

6/44	ES0392 Rev 8

	STM32H742/743xI/G			Summary of device limitations
			Table 3. Summary of device limitations (continued)
						Status
	Function	Section	Limitation
					Rev.	Rev.	Rev.
					Y	X(1)	V
		2.2.16	Device stalled when two consecutive level regressions occur without		-	A	A
			accessing from/to backup SRAM
		2.2.17	Invalid Flash memory CRC		P	-	-
		2.2.18	GPIO assigned to DAC cannot be used in output mode when the DAC		N	N	N
			output is connected to on-chip peripheral
		2.2.19	Unstable LSI when it clocks RTC or CSS on LSE		A	A	A
	System	2.2.20	480 MHz maximum CPU frequency not available on silicon revision Y		P	P	P
	(continued)
		2.2.21	VDDLDO is not available on TFBGA100 package on devices revision Y		N	N	N
			and V
		2.2.22	WWDG not functional when VDD is lower than 2.7 V and VOS0 or		N	N	N
			VOS1 voltage level is selected
		2.2.23	A tamper event does not erase the backup RAM when the backup RAM		N	N	N
			clock is disabled
		2.2.24	LSE CSS parasitic detection even when disabled		N	N	N
		2.3.1	Dummy read cycles inserted when reading synchronous memories		N	N	N
	FMC	2.3.2	Wrong data read from a busy NAND Flash memory		A	A	A
		2.3.3	Missed clocks with continuous clock feature enabled		A	-	-
		2.4.1	First nibble of data is not written after a dummy phase		A	-	-
	QUADSPI	2.4.2	QUADSPI hangs when QUADSPI_CCR is cleared		A	A	A
		2.4.3	QUADSPI cannot be used in Indirect read mode when only data		A	A	A
			phase is activated
		2.5.1	Conversion overlap may impact the ADC accuracy		A	-	-
		2.5.2	ADC resolution limited by LSE activity		A	-	-
		2.5.3	ADC maximum sampling rate when VDDA is lower than 2 V		A	-	-
		2.5.4	ADC maximum resolution when VDDA is higher than 3.3 V		A	-	-
	ADC
		2.5.5	First ADC injected conversion in a sequence may be corrupted		A	-	-
		2.5.6	Writing the ADC_JSQR register when JADCSTART = 1 and JQDIS = 1		A	-	-
			may lead to incorrect behavior
		2.5.7	Conversion may be triggered by context queue register update		A	A	A
		2.5.8	Updated conversion sequence may be trigged by context queue update		A	A	A
	VREFBUF	2.6.1	Overshoot on VREFBUF output		A	A	A
		2.6.2	VREFBUF Hold mode cannot be used		N	N	N
	OPAMP	2.7.1	OPAMP high-speed mode must not be used		N	-	-
	LCD-	2.8.1	Device stalled when accessing LTDC registers while pixel clock is		A	A	A
	TFT(2)		disabled

ES0392 Rev 8

7/44

	Summary of device limitations			STM32H742/743xI/G
			Table 3. Summary of device limitations (continued)
						Status
	Function	Section	Limitation
					Rev.	Rev.	Rev.
					Y	X(1)	V
		2.9.1	One-pulse mode trigger not detected in master-slave reset +	trigger	P	P	P
			configuration
	TIM
		2.9.2	Consecutive compare event missed in specific conditions		N	N	N
		2.9.2	Output compare clear not working with external counter reset		P	P	P
	LPTIM	2.10.1	MCU may remain stuck in LPTIM interrupt when entering Stop mode		A	-	-
	RTC	2.11.1	RTC calendar registers are not locked properly		A	-	-
		2.12.1	10-bit master mode: new transfer cannot be launched if first part of the		A	A	A
			address is not acknowledged by the slave
		2.12.2	Wrong behavior in Stop mode when wakeup from Stop mode is		A	A	A
			disabled in I2C
	I2C	2.12.3	Wrong data sampling when data setup time (tSU;DAT) is shorter than		P	-	-
			one I2C kernel clock period
		2.12.4	Spurious bus error detection in Master mode		A	A	A
		2.12.5	Last-received byte loss in Reload mode		P	-	-
		2.12.6	Spurious master transfer upon own slave address match		P	P	P
		2.12.7	START bit is cleared upon setting ADDRCF, not upon address match		P	P	P
		2.13.1	Underrun flag is set when the USART is used in SPI Slave receive		A	A	A
	USART		mode
		2.13.2	DMA stream locked when transferring data to/from USART/UART		-	A	A
		2.14.1	Spurious DMA Rx transaction after simplex Tx traffic		A	-	-
	SPI	2.14.2	Master data transfer stall at system clock much faster than SCK		A	A	A
		2.14.3	Corrupted CRC return at non-zero UDRDET setting		P	P	P
		2.14.4	TXP interrupt occurring while SPI/I2Sdisabled		A	A	A
		2.15.1	Busy not detected when a write operation suspended during busy		A	-	-
			phase resumes
		2.15.2	Wrong data line 2 generation between two blocks during DDR transfer		A	-	-
			with Read wait mode enabled
	SDMMC
		2.15.3	Unwanted overrun detection when an AHB error is reported whereas all		A	-	-
			bytes have been received
		2.15.4	Consecutive multiple block transfers can induce incorrect data length		A	-	-
		2.15.5	Clock stop reported during Read wait mode sequence		A	-	-

8/44	ES0392 Rev 8

STM32H742/743xI/G			Summary of device limitations
		Table 3. Summary of device limitations (continued)
					Status
Function	Section	Limitation
				Rev.	Rev.	Rev.
				Y	X(1)	V
	2.16.1	Writing FDCAN_TTTS during initialization corrupts FDCAN_TTTMC		A	A	A
	2.16.2	Wrong data may be read from Message RAM by the CPU when using		A	-	-
		two FDCANs
FDCAN	2.16.3	Mis-synchronization in Edge filtering mode when the falling edge at		A	A	A
		FDCAN_Rx input pin coincides with the end of the integration phase
		Tx FIFO messages inverted when both Tx buffer and FIFO are used
	2.16.4	and the messages in the Tx buffer have higher priority than in the Tx		A	A	A
		FIFO
USB	2.17.1	Possible drift of USB PHY pull-up resistor		P	-	-
OTG_HS
	2.18.1	Incorrect L4 inverse filtering results for corrupted packets		N	N	N
	2.18.2	Rx DMA may fail to recover upon DMA restart following a bus error,		P	P	P
		with Rx timestamping enabled
	2.18.3	Tx DMA may halt while fetching TSO header under specific conditions		A	A	A
ETH	2.18.4	Spurious receive watchdog timeout interrupt		A	A	A
	2.18.5	Incorrect flexible PPS output interval under specific conditions		A	A	A
	2.18.6	Packets dropped in RMII 10Mbps mode due to fake dribble and CRC		A	A	A
		error
	2.18.7	ARP offload function not effective		A	A	A
	2.19.1	Unexpected switch to Receive mode without automatic transmission		A	A	A
HDMI-CEC		retry and notification
	2.19.2	CEC header not received due to unjustified Rx-Overrun detection		A	A	A

1.Engineering samples only.

2.This limitation applies only to STM32H743xI/G microcontrollers.

ES0392 Rev 8

9/44

Description of device limitations	STM32H742/743xI/G

2 Description of device limitations

The following sections describe device limitations of the applicable Arm(a) core devices and provide workarounds if available. They are grouped by device functions.

2.1Arm® 32-bit Cortex®-M7 core

Errata notice for the Arm® processor Cortex®-M7 core revision r1p1 is available from http://infocenter.arm.com.

2.1.1Cortex®-M7 data corruption when using Data cache configured in write-through

Description

This limitation is registered under Arm® ID number 1259864 and classified into “Category A”.

If a particular sequence of stores and loads is performed to write-through memory, and some timing-based internal conditions are met, then a load might not get the last data stored to that address.

This erratum can only occur if the loads and stores are to write-through memory. This could be due to any of the following:

•The MPU has been programmed to set this address as write-through.

•The default memory map is being used and this address is write-through in that map.

•The memory is cacheable, and the CM7_CACR.FORCEWT bit is set.

•The memory is cacheable, shared, and the CM7_CACR.SIWT bit is set.

The following sequence is required for this erratum to occur:

1.The address of interest must be in the cache.

2.A write-through store to the same doubleword as the address of interest.

3.One of the following:

–A linefill is started (to a different cacheline to the address of interest) that allocates to the same set as the address of interest.

–An ECC error.

–A cache maintenance operation without a following DSB.

4.A store to the address of interest.

5.A load from the address of interest.

If certain specific timing conditions are met, the load will get the data from the first store, or from what was in the cache at the start of the sequence instead of the data from the second store.

a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

10/44

ES0392 Rev 8

STM32H742/743xI/G	Description of device limitations

The effect of this erratum is that load operations can return incorrect data.

Workaround

There is no direct workaround for this erratum.

Where possible, Arm® recommends that you use the MPU to change the attributes on any write-through memory to write-back memory. If this is not possible, it might be necessary to disable the cache for sections of code that access write-through memory.

2.1.2Cortex®-M7 FPU interrupt not present on NVIC line 81

	Description
	Arm® Cortex®-M7 FPU interrupt is not mapped on NVIC line 81.
Note:	This limitation is due to an error of implementation of the Arm core on the die, as opposed to
	a limitation of the core itself.
	Workaround
	None.

2.2System

2.2.1Timer system breaks do not work

Description

System break sources (processor LOCKUP output, PVD detection, RAM ECC error, Flash ECC error or clock security system detection) do not generate a break event on TIM1, TIM8 and HRTIM.

Workaround

None

2.2.2Clock recovery system synchronization with USB SOF does not work

Description

The clock recovery system (CRS) synchronization by USB start-of-frame signal (SOF) does not work.

Workaround

When available, use the LSE oscillator as synchronization source.

ES0392 Rev 8

11/44

Description of device limitations	STM32H742/743xI/G

2.2.3SysTick external clock is not HCLK/8

Description

The SysTick external clock is the system clock, instead of the system clock divided by 8 (HCLK/8).

Workaround

Use the system clock (HCLK) as external clock and multiply the reload value by 8 in STK_LOAD register (take care that the maximum value is 224-1).

2.2.4Option byte loading can be done with the user wait-state configuration

Description

After an option byte change, the option byte loading is performed with the user wait-state configuration instead of the default configuration.

Workaround

When performing option byte loading (modification), configure the correct number of waitstates or use the default value (7 wait states).

2.2.5Flash BusFault address register may not be valid when an ECC double error occurs

Description

When a first read operation is performed without ECC error and a master accesses data with wait states, if a new access is done and contains an ECC double detection error, then the error message returns the address of the first data which has not generated the error.

Workaround

When a double ECC error flag is raised, check the failing address in the Flash interface (FAIL_ECC_ADDR1/2 in FLASH_ECC_FA1R/FA2R) and disregard the content of the BusFault address register.

2.2.6Flash ECC address register may not be updated

Description

When two consecutive ECC errors occur, the content of the FLASH_ECC_FA1/2 register cannot be updated if the error correction flag (SNECCERR1/2 or DBECCERR1/2 in FLASH_SR1/2 register) is cleared at the same time as a new ECC error occurs.

Workaround

None.

12/44

ES0392 Rev 8

STM32H742/743xI/G	Description of device limitations

2.2.7PCROP-protected areas in Flash memory may be unprotected

Description

In case of readout protection level regression from level 1 to level 0, the PCROP protected areas in Flash memory may become unprotected.

Workaround

The user application must set the readout protection level to level 2 to avoid PCROPprotected areas from being unprotected.

2.2.8Flash memory bank swapping might impact embedded Flash memory interface behavior

Description

When Flash memory bank swapping feature is enabled, the embedded Flash memory interface behavior might become unpredictable.

Workaround

Do not enable the Flash memory bank swapping feature on devices revision Y.

2.2.9Reading from AXI SRAM may lead to data read corruption

Description

Read data may be corrupted when the following conditions are met:

•Several read transactions are performed to the AXI SRAM,

•and a master delays its data acceptance while a new transfer is requested.

Workaround

Set the READ_ISS_OVERRIDE bit in the AXI_TARG7_FN_MOD register. This will reduce the read issuing capability to 1 at AXI interconnect level and avoid data corruption.

2.2.10Clock switching does not work when LSE failure is detected by CSS

Description

When a failure on the LSE oscillator is detected by a clock security system (CSS), the backup domain clock source cannot be changed.

Workaround

When a clock security system detects a LSE failure, reset the backup domain and select a functional clock source.

ES0392 Rev 8

13/44

Description of device limitations	STM32H742/743xI/G

2.2.11RTC stopped when a system reset occurs while the LSI is used as a clock source

Description

When the LSI clock is used as RTC clock source, the RTC is stopped (it does not received the clock anymore) when a system reset occurs.

Workaround

1.Check the RTC clock source after each system reset.

2.If the LSI clock is selected, enable it again.

2.2.12USB OTG_FS PHY drive limit on DP/DM pins

Description

To avoid damaging parts, the user application must avoid to load more than 5 mA on OTG_FS_DP/DM pins.

Workaround

None

2.2.13Unexpected leakage current on I/Os when VIN higher that VDD

Description

	When VIN is higher than VDD and depending on the waveform applied to I/Os, an
	unexpected leakage current might be observed when VIN decreases.
Note:	This leakage does not impact the product reliability.

Workaround

The application must maintain VIN lower that VDD to avoid current leakage on I/Os.

2.2.14LSE oscillator driving capability selection bits are swapped

Description

The LSEDRV[1:0] bits in the RCC_BDCR register, which are used to select LSE oscillator driving capability, are swapped (see Table 4).

Table 4. Expected vs effective LSE driving mode

	LSEDRV[1:0]	LSE driving mode
		Expected mode	Effective mode
	01	Medium-low drive	Medium-high drive
	10	Medium-high drive	Medium-low drive

14/44

ES0392 Rev 8