The following table gives a quick references to all documented device limitations of
STM32H742/743xI/G and their status:
A = limitation present, workaround available
N = limitation present, no workaround available
P = limitation present, partial workaround available
“-” = limitation absent
Applicability of a workaround may depend on specific conditions of target application.
Adoption of a workaround may cause restrictions to target application. Workaround for a
limitation is deemed partial if it only reduces the rate of occurrence and/or consequences of
the limitation, or if it is fully effective for only a subset of instances on the device or in only a
subset of operating modes, of the function concerned.
FunctionSectionLimitation
Table 3. Summary of device limitations
Status
Rev. YRev.
(1)
X
Rev.
V
Arm® 32-
bit
Cortex®-
M7 core
System
2.1.1
2.1.2Cortex®-M7 FPU interrupt not present on NVIC line 81AAA
2.2.1Timer system breaks do not workN- -
2.2.2Clock recovery system synchronization with USB SOF does not workA- -
2.2.3SysTick external clock is not HCLK/8A- -
2.2.4Option byte loading can be done with the user wait-state configurationA- -
2.2.5
2.2.6Flash ECC address register may not be updatedN- -
2.2.7PCROP-protected areas in Flash memory may be unprotectedA- -
2.2.8
2.2.9Reading from AXI SRAM may lead to data read corruptionA- -
2.2.10Clock switching does not work when LSE failure is detected by CSSA- -
2.2.11
2.2.12USB OTG_FS PHY drive limit on DP/DM pinsN- -
2.2.13Unexpected leakage current on I/Os when VIN higher that VDDA- -
2.2.14LSE oscillator driving capability selection bits are swappedA- -
Cortex®-M7 data corruption when using Data cache configured in
write-through
Flash BusFault address register may not be valid when an ECC double
error occurs
2.18.5Incorrect flexible PPS output interval under specific conditionsAAA
2.18.6
Packets dropped in RMII 10Mbps mode due to fake dribble and CRC
error
2.18.7ARP offload function not effectiveAAA
HDMI-CEC
2.19.1
Unexpected switch to Receive mode without automatic transmission
retry and notification
2.19.2CEC header not received due to unjustified Rx-Overrun detectionAAA
1. Engineering samples only.
2. This limitation applies only to STM32H743xI/G microcontrollers.
AAA
AAA
PPP
AAA
AAA
ES0392 Rev 89/44
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Description of device limitationsSTM32H742/743xI/G
2 Description of device limitations
The following sections describe device limitations of the applicable Arm
provide workarounds if available. They are grouped by device functions.
(a)
core devices and
2.1 Arm® 32-bit Cortex®-M7 core
Errata notice for the Arm® processor Cortex®-M7 core revision r1p1 is available from
http://infocenter.arm.com.
2.1.1 Cortex®-M7 data corruption when using Data cache configured in
write-through
Description
This limitation is registered under Arm® ID number 1259864 and classified into “Category
A”.
If a particular sequence of stores and loads is performed to write-through memory, and
so
me timing-based internal conditions are met, then a load might not get the last data stored
to that address.
This erratum can only occur if the loads and stores are to write-through memory. This could
due to any of the following:
be
•The
•The default memory map is being used and this address is write-through in that map.
•The memory is cacheable, and the CM7_CACR.FORCEWT bit is set.
•The memory is cacheable, shared, and the CM7_CACR.SIWT bit is set.
MPU has been programmed to set this address as write-through.
The following sequence is required for this erratum to occur:
1.The address of interest must be in the cache.
2. A write-through store to the same doubleword as the address of interest.
3. One of the following:
–A linefill is started (to a different cacheline to the address
to the same set as the address of interest.
–An ECC error.
–A cache maintenance operation without a following DSB.
4. A store to the address of interest.
5. A load from the address of interest.
If certain specific timing conditions are met,
from what was in the cache at the start of the sequence instead of the data from the second
store.
a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
10/44ES0392 Rev 8
the load will get the data from the first store, or
of interest) that allocates
STM32H742/743xI/GDescription of device limitations
The effect of this erratum is that load operations can return incorrect data.
Workaround
There is no direct workaround for this erratum.
Where possible, Arm® recommends that you use the MPU to change the attributes on any
write-through memory to write-back memory. If this is not possible, it might be necessary to
disable the cache for sections of code that access write-through memory.
2.1.2 Cortex®-M7 FPU interrupt not present on NVIC line 81
Description
Arm® Cortex®-M7 FPU interrupt is not mapped on NVIC line 81.
Note:This limitation is due to an error of implementation of the Arm core on the die, as opposed to
a limitation of the core itself.
Workaround
None.
2.2 System
2.2.1 Timer system breaks do not work
Description
System break sources (processor LOCKUP output, PVD detection, RAM ECC error, Flash
ECC error or clock security system detection) do not generate a break event on TIM1, TIM8
and HRTIM.
Workaround
None
2.2.2 Clock recovery system synchronization with USB SOF does not work
Description
The clock recovery system (CRS) synchronization by USB start-of-frame signal (SOF) does
not work.
Workaround
When available, use the LSE oscillator as synchronization source.
ES0392 Rev 811/44
40
Description of device limitationsSTM32H742/743xI/G
2.2.3 SysTick external clock is not HCLK/8
Description
The SysTick external clock is the system clock, instead of the system clock divided by 8
(HCLK/8).
Workaround
Use the system clock (HCLK) as external clock and multiply the reload value by 8 in
STK_LOAD register (take care that the maximum value is 2
24
-1).
2.2.4 Option byte loading can be done with the user wait-state configuration
Description
After an option byte change, the option byte loading is performed with the user wait-state
configuration instead of the default configuration.
Workaround
When performing option byte loading (modification), configure the correct number of waitstates or use the default value (7 wait states).
2.2.5 Flash BusFault address register may not be valid when
an ECC double error occurs
Description
When a first read operation is performed without ECC error and a master accesses data
with wait states, if a new access is done and contains an ECC double detection error, then
the error message returns the address of the first data which has not generated the error.
Workaround
When a double ECC error flag is raised, check the failing address in the Flash interface
(FAIL_ECC_ADDR1/2 in FLASH_ECC_FA1R/FA2R) and disregard the content of the
BusFault address register.
2.2.6 Flash ECC address register may not be updated
Description
When two consecutive ECC errors occur, the content of the FLASH_ECC_FA1/2 register
cannot be updated if the error correction flag (SNECCERR1/2 or DBECCERR1/2 in
FLASH_SR1/2 register) is cleared at the same time as a new ECC error occurs.
Workaround
None.
12/44ES0392 Rev 8
STM32H742/743xI/GDescription of device limitations
2.2.7 PCROP-protected areas in Flash memory may be unprotected
Description
In case of readout protection level regression from level 1 to level 0, the PCROP protected
areas in Flash memory may become unprotected.
Workaround
The user application must set the readout protection level to level 2 to avoid PCROPprotected areas from being unprotected.
When Flash memory bank swapping feature is enabled, the embedded Flash memory
interface behavior might become unpredictable.
Workaround
Do not enable the Flash memory bank swapping feature on devices revision Y.
2.2.9 Reading from AXI SRAM may lead to data read corruption
Description
Read data may be corrupted when the following conditions are met:
•Several read transactions are performed to the AXI SRAM,
•and a master delays its data acceptance while a new transfer is requested.
Workaround
Set the READ_ISS_OVERRIDE bit in the AXI_TARG7_FN_MOD register. This will reduce
the read issuing capability to 1 at AXI interconnect level and avoid data corruption.
2.2.10 Clock switching does not work when LSE failure is detected by CSS
Description
When a failure on the LSE oscillator is detected by a clock security system (CSS), the
backup domain clock source cannot be changed.
Workaround
When a clock security system detects a LSE failure, reset the backup domain and select a
functional clock source.
ES0392 Rev 813/44
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Description of device limitationsSTM32H742/743xI/G
2.2.11 RTC stopped when a system reset occurs while the LSI is used
as a clock source
Description
When the LSI clock is used as RTC clock source, the RTC is stopped (it does not received
the clock anymore) when a system reset occurs.
Workaround
1.Check the RTC clock source after each system reset.
2. If the LSI clock is selected, enable it again.
2.2.12 USB OTG_FS PHY drive limit on DP/DM pins
Description
To avoid damaging parts, the user application must avoid to load more than 5 mA on
OTG_FS_DP/DM pins.
Workaround
None
2.2.13 Unexpected leakage current on I/Os when VIN higher that VDD
Description
When VIN is higher than VDD and depending on the waveform applied to I/Os, an
unexpected leakage current might be observed when V
Note:This leakage does not impact the product reliability.
decreases.
IN
Workaround
The application must maintain VIN lower that VDD to avoid current leakage on I/Os.
2.2.14 LSE oscillator driving capability selection bits are swapped
Description
The LSEDRV[1:0] bits in the RCC_BDCR register, which are used to select LSE oscillator
driving capability, are swapped (see
LSEDRV[1:0]
Table 4. Expected vs effective LSE driving mode
01Medium-low driveMedium-high drive
10Medium-high driveMedium-low drive
Table 4).
LSE driving mode
Expected mode Effective mode
14/44ES0392 Rev 8
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