ST MICROELECTRONICS STM32G441RBT6 Datasheet

Arm® Cortex®-M4 32b MCU+FPU, 170 MHz / 213DMIPS, 128 KB Flash,

LQFP48 (7 x 7 mm)
LQFP64 (10 x 10 mm)
LQFP80 (12 x 12 mm)

LQFP32 (7 x 7 mm)

UFBGA64

(5 x 5 mm)

UFQFPN32 (5 x 5 mm)
UFQFPN48 (7 x 7 mm)

WLCSP49
(Pitch 0.4)

FBGA

LQFP100 (14 x 14 mm)

32 KB SRAM, rich analog, math accelerator, AES

Features

• Core: Arm® 32-bit Cortex®-M4 CPU with FPU,
Adaptive real-time accelerator (ART
Accelerator) allowing 0-wait-state execution
from Flash memory, frequency up to 170 MHz
with 213 DMIPS, MPU, DSP instructions

• Operating conditions:
– VDD, VDDA voltage range:

1.71 V to 3.6 V

• Mathematical hardware accelerators
– CORDIC for trigonometric functions

acceleration

– FMAC: Filter mathematical accelerator

• Memories
– 128 Kbytes of Flash memory with ECC

support, proprietary code readout
protection (PCROP), securable memory
area, 1 Kbyte OTP

– 22 Kbytes of SRAM, with hardware parity

check implemented on the first 16 Kbytes

– Routine booster: 10 Kbytes of SRAM on

instruction and data bus, with hardware
parity check (CCM SRAM)

• Reset and supply management
– Power-on/power-down reset

(POR/PDR/BOR)
– Programmable voltage detector (PVD)
– Low-power modes: sleep, stop, standby

and shutdown

• Clock management
–4

to 48 MHz crystal oscillator

– Internal 16 MHz RC with PLL option (± 1%)

• Up to 86 fast I/Os
– All mappable on external interrupt vectors
– Several I/Os with 5 V tolerant capability

• Interconnect matrix

• 12-channel DMA controller

STM32G441xB

Datasheet - production data

• 2 x ADCs 0.25 µs(up to 23 channels).
Resolution up to 16-bit with hardware
oversampling, 0 to 3.6 V conversion range

• 4 x 12-bit DAC channels
– 2 x buffered external channels 1 MSPS
– 2 x unbuffered internal channels 15 MSPS

• 4 x ultra-fast rail-to-rail analog comparators

• 3 x operational amplifiers that can be used in

PGA mode, all terminals accessible

• Internal voltage reference buffer (VREFBUF)
supporting three output voltages (2.048 V,

2.5 V, 2.95 V)

• 14 timers:
– 1 x 32-bit timer and 2 x 16-bit timers with up

to four IC/OC/PWM or pulse counter and
quadrature (incremental) encoder input

– 2 x 16-bit 8-channel advanced motor

control timers, with up to 8 x PWM
channels, dead time generation and
emergency stop

– 1 x 16-bit timer with 2 x IC/OCs, one

OCN/PWM, dead time generation and
emergency stop

– 2 x 16-bit timers with IC/OC/OCN/PWM,

dead time generation and emergency stop
– 2 x watchdog timers (independent, window)
– 1 x SysTick timer: 24-bit downcounter
– 2 x 16-bit basic timers
– 1 x low-power timer

• Calendar RTC with alarm, periodic wakeup
from stop/standby

May 2019 DS12960 Rev 1 1/192

This is information on a product in full production.

www.st.com

STM32G441xB

• Communication interfaces
– 1 x FDCAN controller supporting flexible

data rate

– 3 x I

2

C Fast mode plus (1 Mbit/s) with
20 mA current sink, SMBus/PMBus,
wakeup from stop

– 4 x USART/UARTs (ISO 7816 interface,

LIN, IrDA, modem control)

–1 x LPUART
– 3 x SPIs, 4 to 16 programmable bit frames,

2 x with multiplexed half duplex I

2

S

interface

– 1 x SAI (serial audio interface)

– USB 2.0 full-speed interface with LPM and

BCD support
– IRTIM (infrared interface)
– USB Type-C™ /USB power delivery

controller (UCPD)

• True random number generator (RNG)

• CRC calculation unit, 96-bit unique ID

• AES: 128/256-bit key encryption hardware

accelerator

• Development support: serial wire debug
(SWD), JTAG, Embedded trace macrocell™

Table 1. Device summary

Reference Part number

STM32G441xB STM32G441CB, STM32G441KB, STM32G441RB, STM32G441MB, STM32G441VB

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STM32G441xB Contents

Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.1 Arm® Cortex®-M4 core with FPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.2 Adaptive real-time memory accelerator (ART accelerator) . . . . . . . . . . . 17

3.3 Memory protection unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.4 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.5 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.6 Multi-AHB bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.7 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.8 CORDIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.9 Filter mathematical accelerator (FMAC) . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.10 Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 21

3.11 Power supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.11.1 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.11.2 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.11.3 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.11.4 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.11.5 Reset mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.11.6 VBAT operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.12 Interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

3.13 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3.14 General-purpose inputs/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . 27

3.15 Direct memory access controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . 27

3.16 DMA request router (DMAMux) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.17 Interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.17.1 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 28

3.17.2 Extended interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . 28

3.18 Analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

3.18.1 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

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Contents STM32G441xB

3.18.2 Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . 30

3.18.3 VBAT battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

3.19 Digital to analog converter (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

3.20 Voltage reference buffer (VREFBUF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3.21 Comparators (COMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

3.22 Operational amplifier (OPAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

3.23 Random number generator (RNG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

3.24 Advanced encryption standard hardware accelerator (AES) . . . . . . . . . . 32

3.25 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

3.25.1 Advanced motor control timer (TIM1, TIM8) . . . . . . . . . . . . . . . . . . . . . 34

3.25.2 General-purpose timers (TIM2, TIM3, TIM4, TIM15, TIM16,

TIM17) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

3.25.3 Basic timers (TIM6 and TIM7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

3.25.4 Low-power timer (LPTIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

3.25.5 Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

3.25.6 System window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

3.25.7 SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

3.26 Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 37

3.27 Tamper and backup registers (TAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

3.28 Infrared transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

3.29 Inter-integrated circuit interface (I

2

C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

3.30 Universal synchronous/asynchronous receiver transmitter (USART) . . . 40

3.31 Low-power universal asynchronous receiver transmitter (LPUART) . . . . 41

3.32 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

3.33 Serial audio interfaces (SAI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

3.33.1 SAI peripheral supports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

3.34 Controller area network (FDCAN1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

3.35 Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

3.36 USB Type-C™ / USB Power Delivery controller (UCPD) . . . . . . . . . . . . . 43

3.37 Clock recovery system (CRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

3.38 Development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

3.38.1 Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 44

3.38.2 Embedded trace macrocell™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

4 Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

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4.1 UFQFPN32 pinout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

4.2 LQFP32 pinout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

4.3 UFQFPN48 pinout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

4.4 LQFP48 pinout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

4.5 WLCSP49 ballout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

4.6 LQFP80 pinout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

4.7 UFBGA64 ballout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

4.8 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

4.9 Alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

5.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

5.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

5.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

5.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

5.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

5.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

5.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

5.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

5.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

5.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

5.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

5.3.2 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 72

5.3.3 Embedded reset and power control block characteristics . . . . . . . . . . . 72

5.3.4 Embedded voltage reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

5.3.5 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

5.3.6 Wakeup time from low-power modes and voltage scaling

transition times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

5.3.7 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 102

5.3.8 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 107

5.3.9 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

5.3.10 Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

5.3.11 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

5.3.12 Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

5.3.13 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

5.3.14 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

DS12960 Rev 1 5/192

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Contents STM32G441xB

5.3.15 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

5.3.16 Extended interrupt and event controller input (EXTI) characteristics . . 121

5.3.17 Analog switches booster . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

5.3.18 Analog-to-digital converter characteristics . . . . . . . . . . . . . . . . . . . . . . 122

5.3.19 Digital-to-Analog converter characteristics . . . . . . . . . . . . . . . . . . . . . 133

5.3.20 Voltage reference buffer characteristics . . . . . . . . . . . . . . . . . . . . . . . 140

5.3.21 Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

5.3.22 Operational amplifiers characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 144

5.3.23 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 148

5.3.24 V

5.3.25 Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149

5.3.26 Communication interfaces characteristics . . . . . . . . . . . . . . . . . . . . . . 150

5.3.27 UCPD characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160

monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148

BAT

6 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

6.1 UFQFPN32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

6.2 LQFP32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163

6.3 UFQFPN48 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167

6.4 LQFP48 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169

6.5 WLCSP49 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

6.6 LQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176

6.7 LQFP80 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179

6.8 UFBGA64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181

6.9 LQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183

6.10 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186

6.10.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187

6.10.2 Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . 188

7 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190

8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191

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STM32G441xB List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Table 2. STM32G441xB features and peripheral counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 3. STM32G441xB peripherals interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 4. DMA implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 5. Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Table 6. Internal voltage reference calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Table 7. Timer feature comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Table 8. I2C implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Table 9. USART/UART/LPUART features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Table 10. SAI implementation for the features implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Table 11. Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Table 12. STM32G441xB pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Table 13. Alternate function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Table 14. Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Table 15. Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Table 16. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

Table 17. General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Table 18. Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Table 19. Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 72

Table 20. Embedded internal voltage reference. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

Table 21. Current consumption in Run and Low-power run modes, code with data

processing running from Flash in single Bank, ART enable (Cache ON Prefetch OFF) . . 76

Table 22. Current consumption in Run and Low-power run modes,

code with data processing running from Flash in single Bank, ART disable . . . . . . . . . . . 78

Table 23. Current consumption in Run and Low-power run modes,

code with data processing running from SRAM1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

Table 24. Typical current consumption in Run and Low-power run modes, with different codes

running from Flash, ART enable (Cache ON Prefetch OFF) . . . . . . . . . . . . . . . . . . . . . . . 82

Table 25. Typical current consumption in Run and Low-power run modes,

with different codes running from Flash, ART disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Table 26. Typical current consumption in Run and Low-power run modes, with different codes

running from SRAM1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Table 27. Typical current consumption in Run and Low-power run modes, with different codes

running from SRAM2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

Table 28. Typical current consumption in Run and Low-power run modes, with different codes

running from CCM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

Table 29. Current consumption in Sleep and Low-power sleep mode Flash ON . . . . . . . . . . . . . . . . 87

Table 30. Current consumption in low-power sleep modes, Flash in power-down . . . . . . . . . . . . . . . 88

Table 31. Current consumption in Stop 1 mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

Table 32. Current consumption in Stop 0 mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Table 33. Current consumption in Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Table 34. Current consumption in Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

Table 35. Current consumption in VBAT mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Table 36. Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Table 37. Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

Table 38. Regulator modes transition times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Table 39. Wakeup time using USART/LPUART. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

Table 40. High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

DS12960 Rev 1 7/192

9

List of tables STM32G441xB

Table 41. Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Table 42. HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104

Table 43. LSE oscillator characteristics (f

= 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

LSE

Table 44. HSI16 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

Table 45. HSI48 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

Table 46. LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Table 47. PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

Table 48. Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Table 49. Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Table 50. EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Table 51. EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

Table 52. ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

Table 53. Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

Table 54. I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

Table 55. I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Table 56. Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

Table 57. I/O (except FT_c) AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

Table 58. I/O FT_c AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

Table 59. NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

Table 60. EXTI input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Table 61. Analog switches booster characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Table 62. ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

Table 63. Maximum ADC RAIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

Table 64. ADC accuracy - limited test conditions 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

Table 65. ADC accuracy - limited test conditions 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128

Table 66. ADC accuracy - limited test conditions 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

Table 67. DAC 1MSPS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

Table 68. DAC 1MSPS accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

Table 69. DAC 15MSPS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Table 70. DAC 15MSPS accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

Table 71. VREFBUF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

Table 72. COMP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

Table 73. OPAMP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144

Table 74. TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148

Table 75. V
Table 76. V

monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148

BAT

charging characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148

BAT

Table 77. TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149

Table 78. IWDG min/max timeout period at 32 kHz (LSI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

Table 79. WWDG min/max timeout value at 170 MHz (PCLK). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

Table 80. Minimum I2CCLK frequency in all I2C modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

Table 81. I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

Table 82. SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

Table 83. I2S characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155

Table 84. SAI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157

Table 85. USB electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

Table 86. USART electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

Table 87. UCPD characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160

Table 88. UFQFPN - 32 pins, 5 x 5 mm, 0.5 mm pitch ultra thin fine pitch quad flat

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162

Table 89. LQFP - 32-pin, 7 x 7 mm low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164

Table 90. UFQFPN - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

8/192 DS12960 Rev 1

STM32G441xB List of tables

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168

Table 91. LQFP - 48 pins, 7 x 7 mm low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170

Table 92. WLCSP - 49 balls, 3.15 x 3.13 mm, 0.4 mm pitch, wafer level chip scale

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174

Table 93. WLCSP49 recommended PCB design rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175

Table 94. LQFP - 64 pins, 10 x 10 mm low-profile quad flat

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176

Table 95. LQFP - 80 pins, 12 x 12 mm low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179

Table 96. UFBGA – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid

array package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181

Table 97. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA) . . . . . . . . . . . . . . . . . . 182

Table 98. LQPF - 100 pins, 14 x 14 mm low-profile quad flat package

mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183

Table 99. Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186

Table 100. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190

Table 101. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191

DS12960 Rev 1 9/192

9

List of figures STM32G441xB

List of figures

Figure 1. STM32G441xB block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 2. Multi-AHB bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 3. Voltage reference buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Figure 4. Infrared transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Figure 5. STM32G441xB UFQFPN32 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Figure 6. STM32G441xB LQFP32 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Figure 7. STM32G441xB UFQFPN48 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Figure 8. STM32G441xB LQFP48 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Figure 9. STM32G441xB WLCSP49 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Figure 10. STM32G441xB LQFP80 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Figure 11. STM32G441xB UFBGA64 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Figure 12. Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Figure 13. Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Figure 14. Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

Figure 15. Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Figure 16. VREFINT versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Figure 17. High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Figure 18. Low-speed external clock source AC timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Figure 19. Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Figure 20. Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Figure 21. HSI16 frequency versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

Figure 22. HSI48 frequency versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Figure 23. I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

Figure 24. I/O AC characteristics definition

Figure 25. Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Figure 26. ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

Figure 27. Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

Figure 28. 12-bit buffered / non-buffered DAC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

Figure 29. VREFOUT_TEMP in case VRS = 00 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

Figure 30. VREFOUT_TEMP in case VRS = 01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

Figure 31. VREFOUT_TEMP in case VRS = 10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

Figure 32. OPAMP noise density @ 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147

Figure 33. SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153

Figure 34. SPI timing diagram - slave mode and CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154

Figure 35. SPI timing diagram - master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154

Figure 36. SAI master timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158

Figure 37. SAI slave timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158

Figure 38. UFQFPN - 32 pins, 5 x 5 mm, 0.5 mm pitch ultra thin fine pitch quad flat

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

Figure 39. UFQFPN - 32 pins, 5 x 5 mm, 0.5 mm pitch ultra thin fine pitch quad flat

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162

Figure 40. LQFP - 32-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . . 163

Figure 41. LQFP - 32-pin, 7 x 7 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165

Figure 42. LQFP32, 7 x 7 mm, low-profile quad flat package top view example . . . . . . . . . . . . . . . 166

Figure 43. UFQFPN - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167

Figure 44. UFQFPN - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

(1)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

10/192 DS12960 Rev 1

STM32G441xB List of figures

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168

Figure 45. LQFP - 48 pins, 7 x 7 mm low-profile quad flat package outline. . . . . . . . . . . . . . . . . . . . 169

Figure 46. LQFP - 48 pins, 7 x 7 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

Figure 47. LQFP48, 7 x 7 mm, low-profile quad flat package top view example . . . . . . . . . . . . . . . . 172

Figure 48. WLCSP - 49 balls, 3.15 x 3.13 mm, 0.4 mm pitch, wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

Figure 49. WLCSP - 49 balls, 3.14x 3.15 mm, 0.4 mm pitch, wafer level chip scale

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175

Figure 50. LQFP - 64 pins, 10 x 10 mm low-profile quad flat package outline. . . . . . . . . . . . . . . . . . 176

Figure 51. LQFP - 64 pins, 10 x 10 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177

Figure 52. LQFP64, 10 x 10 mm, low-profile quad flat package top view example . . . . . . . . . . . . 178

Figure 53. LQFP - 80 pins, 12 x 12 mm low-profile quad flat package outline. . . . . . . . . . . . . . . . . . 179

Figure 54. LQFP - 80 pins, 12 x 12 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

Figure 55. UFBGA – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid

array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181

Figure 56. UFBGA – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid

array package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182

Figure 57. LQFP - 100 pins, 14 x 14 mm low-profile quad flat package outline. . . . . . . . . . . . . . . . . 183

Figure 58. LQFP - 100 pins, 14 x 14 mm low-profile quad flat

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184

Figure 59. LQFP100 - 14 x 14 mm, low-profile quad flat package top view example . . . . . . . . . . . . 185

DS12960 Rev 1 11/192

11

Introduction STM32G441xB

1 Introduction

This datasheet provides the ordering information and mechanical device characteristics of

the STM32G441xB microcontrollers.

This document should be read in conjunction with the reference manual RM0440

“STM32G4 Series advanced Arm

®

32-bit MCUs”. The reference manual is available from

the STMicroelectronics website www.st.com.

For information on the Arm

®(a)

Cortex®-M4 core, refer to the Cortex®-M4 technical

reference manual, available from the www.arm.com website.

a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

12/192 DS12960 Rev 1

STM32G441xB Description

2 Description

The STM32G441xB devices are based on the high-performance Arm® Cortex®-M4 32-bit

RISC core. They operate at a frequency of up to 170 MHz.

The Cortex-M4 core features a single-precision floating-point unit (FPU), which supports all

the Arm single-precision data-processing instructions and all the data types. It also

implements a full set of DSP (digital signal processing) instructions and a memory protection

unit (MPU) which enhances the application’s security.

These devices embed high-speed memories (128 Kbytes of Flash memory, and 32 Kbytes

of SRAM), an extensive range of enhanced I/Os and peripherals connected to two APB

buses, two AHB buses and a 32-bit multi-AHB bus matrix.

The devices also embed several protection mechanisms for embedded Flash memory and

SRAM: readout protection, write protection, securable memory area and proprietary code

readout protection.

The devices embed peripherals allowing mathematical/arithmetic function acceleration

(CORDIC for trigonometric functions and FMAC unit for filter functions).

They offer two fast 12-bit ADCs (5 Msps), four comparators, three operational amplifiers,

four DAC channels (2 external and 2 internal), an internal voltage reference buffer, a low-

power RTC, one general-purpose 32-bit timers, two 16-bit PWM timers dedicated to motor

control, seven general-purpose 16-bit timers, and one 16-bit low-power timer.

They also feature standard and advanced communication interfaces such as:

• Three I2Cs

• Three SPIs multiplexed with two half duplex I2Ss

• Three USARTs, one UART and one low-power UART.

• One FDCAN

• One SAI

• USB device

• UCPD

The STM32G441xB devices embed an AES.

The devices operate in the -40 to +85 °C (+105 °C junction), -40 to +105 °C (+125 °C

junction) and -40 to +125 °C (+130 °C junction) temperature ranges from a 1.71 to 3.6 V

power supply. A comprehensive set of power-saving modes allows the design of low-power

applications.

Some independent power supplies are supported including an analog independent supply

input for ADC, DAC, OPAMPs and comparators. A VBAT input allows backup of the RTC

and the registers.

The STM32G441xB family offers 9 packages from 32-pin to 100-pin.

DS12960 Rev 1 13/192

44

Description STM32G441xB

Table 2. STM32G441xB features and peripheral counts

Peripheral STM32G441KB STM32G441CB STM32G441RB STM32G441MB STM32G441VB

Flash memory 128 Kbytes 128 Kbytes 128 Kbytes 128 Kbytes 128 Kbytes

SRAM 32 (16 + 6 + 10) Kbytes

Advanced
motor

2 (16-bit)

control

General
purpose

5 (16-bit)
1 (32-bit)

Basic 2 (16-bit)

Timers

Low power 1 (16-bit)

SysTick
timer

1

Watchdog
timers
(independe

2

nt, window)

SPI(I2S)

2

I

(1)

C2 3

3 (2)

USART 2 3

UART 0 1
Comm.
interfaces

LPUART 1

FDCANs 1

USB device Yes

UCPD Yes

SAI Yes

RTC Yes

Tamper pins 1 2 3

Random number
generator

Yes

AES Yes

CORDIC Yes

FMAC Yes

GPIOs

Wakeup pins

26

38 in LQFP48

42 in

2

UFQFPN48

3

52

66

4

4

86

5

14/192 DS12960 Rev 1

STM32G441xB Description

Table 2. STM32G441xB features and peripheral counts (continued)

Peripheral STM32G441KB STM32G441CB STM32G441RB STM32G441MB STM32G441VB

2

12-bit ADCs
Number of channels

11

17 in LQFP48

18 in

UFQFPN48

23 23 23

18 in WLCSP49

12-bit DAC
Number of channels

Internal voltage
reference buffer

4 (2 external + 2 internal)

2

Yes

Analog comparator 4

Operational amplifiers 3

Max. CPU frequency 150 MHz

Operating voltage 1.71 V to 3.6 V

Operating temperature Ambient operating temperature: -40 to 85 °C / -40 to 105 °C / -40 to 125 °C

Packages

1. The SPI2/3 interfaces can work in an exclusive way in either the SPI mode or the I2S audio mode.

LQFP32/

UFQFPN32

LQFP48/

UFQFPN48

LQFP64/

TFBGA64

LQFP80 LQFP100

DS12960 Rev 1 15/192

44

GPIO PORT A

AHB/APB2

USART 2MBps

EXT IT. WKUP

140 AFP

USART 2MBps

GPIO PORT B

PB(15:0)

USART 2MBps

GPIO PORT C

PC(15:0)

USART 2MBps

RX, TX, SCK,CTS,

RTS as AF

USART 2MBps

GPIO PORT D

PD(15:0)

USART 2MBps

GPIO PORT E

PE(15:0)

USART 2MBps

SPI 1

MOSI, MISO

SCK, NSS as AF

APB2 60MHzAPB1

4 CH, ETR as AF

TIMER2

4 CH, ETR as AF

TIMER3&4

RX, TX, SCK,
CTS, RTS as AF

USART2&3

UART4

MOSI, MISO, SCK

SPI2&3

NSS, as AF

OUT1/OUT2

DAC1

TIMER6

RTC_OUT
RTC_TS
RTC_TAMPx

OSC_IN

OSC_OUT

VDD, VSS,
VDDA, VSSA,
RESET

VBAT = 1.55 to 3.6V

AHB/APB1

JTAG & SW

Arm

®

Cortex-M4

150MHz

S-BUS

ETM

MPU

TRACECK

TRACED(3:0)

JTRST, JTDI,

JTCK/SWCLK

JTDO/SWD, JTDO

GP-DMA2

GP-DMA1

6 Chan

FLASH 128 KB

ACCEL/

CACHE

AHB1

@VDDA

POR / BOR

SUPPLY

@VDD

SUPERVISION

Reset

Int

POR

XTAL OSC

4-48MHz

XTAL 32kHz

RTC

AWU

BKPREG

LSI

Standby Interface

IWDG

@VBAT

@VDD

RESET&

CLOCKCTRL

PLL

VDD = 1.71 to 3.6V
VSS

VOLT. REG.

3.3V TO 1.2V

VDD12

POWER MNGT

AHB BUS-MATRIX 5M / 7S

APB2

peripheralclocks

TinyAES

RTC Interface

FPU

WinWATCHDOG

and system

LP timer1

AHB2

SAR ADC2

Ain ADC

SysCfg

CRC

LP_UART1

I2C1&2&3

SCL, SDA, SMBAL as AF

RNG

RNB1

analog

COMP
1,2,3,4

SRAM2 6 KB

PWRCTRL

CAN1

FIFO

RX,TX as AF

Vref_Buf

CRS

6 Chan

SRAM1 16 KB

CCM SRAM 10 KB

DMAMUX

HSI

SAR ADC1

IF

@VDDA

16b trigg

TIMER7

16b trigg

USBPD

PHY

CC1
CC2

HSI48

CH2

USB

Device

PHY

D+
D-

FIFO

I2S half

duplex

CH1

OPAMP

1,2,3

USART 2MBps

GPIO PORT F

PF(10:9,2:0)

DAC3

CH2

CH1

USART 2MBps

GPIO PORT G

PG(10:10)

CORDIC

FMAC

SAI1

FS, SCK, SD,

MCLK as AF

MSv47173V1

irDA

Smcard

irDA

RX, TX, CTS,
RTS as AF

RX, TX as AF

OSC32_IN

OSC_OUT

@VDDA

NVIC

I-BUS

D-BUS

PVD, PWM

PA(15:0)

TIMER1

16b PWM

TIMER8

16b PWM

USART 2MBps

CH as AF

TIMER15

16b

USART 2MBps

CH as AF

TIMER16

16b

USART 2MBps

TIMER17

CH as AF16b

16b

4 PWM,4PWM,
ETR,BKIN as F

4 PWM,4PWM,
ETR,BKIN as F

USART1

Smcard

irDA

Description STM32G441xB

Figure 1. STM32G441xB block diagram

Note: AF: alternate function on I/O pins.

16/192 DS12960 Rev 1

STM32G441xB Functional overview

3 Functional overview

3.1 Arm® Cortex®-M4 core with FPU

The Arm® Cortex®-M4 with FPU processor is the latest generation of Arm processors for
embedded systems. It was developed to provide a low-cost platform that meets the needs of
the MCU implementation, with a reduced pin count and with low-power consumption, while
delivering outstanding computational performance and an advanced response to interrupts.

The Arm
efficiency, delivering the expected high-performance from an Arm core in a memory size
usually associated with 8-bit and 16-bit devices.

The processor supports a set of DSP instructions which allows an efficient signal processing
and a complex algorithm execution. Its single precision FPU speeds up the software
development by using metalanguage development tools to avoid saturation.

With its embedded Arm core, the STM32G441xB family is compatible with all Arm tools and
software.

Figure 1 shows the general block diagram of the STM32G441xB devices.

®

Cortex®-M4 with FPU 32-bit RISC processor features an exceptional code-

3.2 Adaptive real-time memory accelerator (ART accelerator)

The ART accelerator is a memory accelerator that is optimized for the STM32 industry­standard Arm
the Arm
processor to wait for the Flash memory at higher frequencies.

®

®

Cortex®-M4 processors. It balances the inherent performance advantage of

Cortex®-M4 over Flash memory technologies, which normally requires the

3.3 Memory protection unit

The memory protection unit (MPU) is used to manage the CPU accesses to the memory
and to prevent one task to accidentally corrupt the memory or the resources used by any
other active task. This memory area is organized into up to 8 protected areas, which can be
divided in up into 8 subareas each. The protection area sizes range between 32 bytes and
the whole 4 gigabytes of addressable memory.

The MPU is especially helpful for applications where some critical or certified code has to be
protected against the misbehavior of other tasks. It is usually managed by an RTOS (real­time operating system). If a program accesses a memory location that is prohibited by the
MPU, the RTOS can detect it and take action. In an RTOS environment, the kernel can
dynamically update the MPU area setting based on the process to be executed.

The MPU is optional and can be bypassed for applications that do not need it.

3.4 Embedded Flash memory

The STM32G441xB devices feature 128 kbytes of embedded Flash memory which is
available for storing programs and data.

Flexible protections can be configured thanks to the option bytes:

DS12960 Rev 1 17/192

44

Functional overview STM32G441xB

• Readout protection (RDP) to protect the whole memory. Three levels of protection are
available:

– Level 0: no readout protection
– Level 1: memory readout protection; the Flash memory cannot be read from or written

to if either the debug features are connected or the boot in RAM or bootloader are
selected

– Level 2: chip readout protection; the debug features (Cortex-M4 JTAG and serial

wire), the boot in RAM and the bootloader selection are disabled (JTAG fuse). This
selection is irreversible.

• Write protection (WRP): the protected area is protected against erasing and

programming.

• Proprietary code readout protection (PCROP): a part of the Flash memory can be

protected against read and write from third parties. The protected area is execute-only
and it can only be reached by the STM32 CPU as an instruction code, while all other
accesses (DMA, debug and CPU data read, write and erase) are strictly prohibited. An
additional option bit (PCROP_RDP) allows to select if the PCROP area is erased or not
when the RDP protection is changed from Level 1 to Level 0.

• Securable memory area: a part of Flash memory can be configured by option bytes to

be securable. After reset this securable memory area is not secured and it behaves like
the remainder of main Flash memory (execute, read, write access). When secured, any
access to this securable memory area generates corresponding read/write error.
Purpose of the Securable memory area is to protect sensitive code and data (secure
keys storage) which can be executed only once at boot, and never again unless a new
reset occurs.

The Flash memory embeds the error correction code (ECC) feature supporting:

• Single error detection and correction

• Double error detection

• The address of the ECC fail can be read in the ECC register

3.5 Embedded SRAM

STM32G441xB devices feature 32 Kbytes of embedded SRAM. This SRAM is split into
three blocks:

• 16 Kbytes mapped at address 0x2000 0000 (SRAM1). The CM4 can access the

SRAM1 through the System Bus or through the I-Code/D-Code bus.

• 6 Kbytes mapped at address 0x2000 4000 (SRAM2). The CM4 can access the SRAM2

through the System Bus or through the I-Code/D-Code bus. SRAM2 can be kept in
stop andstandby modes.

• 10 Kbytes mapped at address 0x1000 0000 (CCM SRAM). It is accessed by the CPU

through I-Code/D-Code bus for maximum performance.
It is also aliased at 0x2000 5800 address to be accessed by all masters (CPU, DMA1,
DMA2) through SBUS contiguously to SRAM1 and SRAM2.

18/192 DS12960 Rev 1

STM32G441xB Functional overview

MS47544V1

Cortex®-M4

with FPU

DMA1 DMA2

CCM

SRAM

AHB1

peripherals

AHB2

peripherals

SRAM1

FLASH
128 KB

ACCEL

S-bus

D-bus

ICode

DCode

I-bus

BusMatrix-S

SRAM2

3.6 Multi-AHB bus matrix

The 32-bit multi-AHB bus matrix interconnects all the masters (CPU, DMAs) and the slaves
(Flash memory, RAM, AHB and APB peripherals). It also ensures a seamless and efficient
operation even when several high-speed peripherals work simultaneously.

Figure 2. Multi-AHB bus matrix

3.7 Boot modes

At startup, a BOOT0 pin (or nBOOT0 option bit)and an nBOOT1 option bit are used to select
one of three boot options:

• Boot from user Flash

• Boot from system memory

• Boot from embedded SRAM

The BOOT0 value may come from the PB8-BOOT0 pin or from an nBOOT0 option bit
depending on the value of a user nBOOT_SEL option bit to free the GPIO pad if needed.

The boot loader is located in the system memory. It is used to reprogram the Flash memory
by using USART, I2C, SPI, and USB through the DFU (device firmware upgrade).

DS12960 Rev 1 19/192

44

Functional overview STM32G441xB

3.8 CORDIC

The CORDIC provides hardware acceleration of certain mathematical functions, notably
trigonometric, commonly used in motor control, metering, signal processing and many other
applications.

It speeds up the calculation of these functions compared to a software implementation,
allowing a lower operating frequency, or freeing up processor cycles in order to perform
other tasks.

Cordic features

• 24-bit CORDIC rotation engine

• Circular and Hyperbolic modes

• Rotation and Vectoring modes

• Functions: Sine, Cosine, Sinh, Cosh, Atan, Atan2, Atanh, Modulus, Square root,

Natural logarithm

• Programmable precision up to 20-bit

• Fast convergence: 4 bits per clock cycle

• Supports 16-bit and 32-bit fixed point input and output formats

• Low latency AHB slave interface

• Results can be read as soon as ready without polling or interrupt

• DMA read and write channels

3.9 Filter mathematical accelerator (FMAC)

The filter mathematical accelerator unit performs arithmetic operations on vectors. It
comprises a multiplier/accumulator (MAC) unit, together with address generation logic,
which allows it to index vector elements held in local memory.

The unit includes support for circular buffers on input and output, which allows digital filters
to be implemented. Both finite and infinite impulse response filters can be realized.

The unit allows frequent or lengthy filtering operations to be offloaded from the CPU, freeing
up the processor for other tasks. In many cases it can accelerate such calculations
compared to a software implementation, resulting in a speed-up of time critical tasks.

20/192 DS12960 Rev 1

STM32G441xB Functional overview

FMAC features

• 16 x 16-bit multiplier

• 24+2-bit accumulator with addition and subtraction

• 16-bit input and output data

• 256 x 16-bit local memory

• Up to three areas can be defined in memory for data buffers (two input, one output),

defined by programmable base address pointers and associated size registers

• Input and output sample buffers can be circular

• Buffer “watermark” feature reduces overhead in interrupt mode

• Filter functions: FIR, IIR (direct form 1)

• AHB slave interface

• DMA read and write data channels

3.10 Cyclic redundancy check calculation unit (CRC)

The CRC (cyclic redundancy check) calculation unit is used to get a CRC code using a
configurable generator with polynomial value and size.

Among other applications, the CRC-based techniques are used to verify data transmission
or storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a mean to verify
the Flash memory integrity.

The CRC calculation unit helps to compute a signature of the software during runtime, which
can be ulteriorly compared with a reference signature generated at link-time and which can
be stored at a given memory location.

3.11 Power supply management

3.11.1 Power supply schemes

The STM32G441xB devices require a 1.71 V to 3.6 V V
independent supplies, can be provided for specific peripherals:

• V

• V

= 1.71 V to 3.6 V

DD

V

is the external power supply for the I/Os, the internal regulator and the system

DD

analog such as reset, power management and internal clocks. It is provided externally
through the VDD pins.

= 1.62 V to 3.6 V (see Section 5: Electrical characteristics for the minimum VDDA

DDA

voltage required for ADC, DAC, COMP, OPAMP, VREFBUF operation).
V

is the external analog power supply for A/D converters, D/A converters, voltage

DDA

reference buffer, operational amplifiers and comparators. The V

operating voltage supply. Several

DD

voltage level is

DDA

DS12960 Rev 1 21/192

44

Functional overview STM32G441xB

independent from the V

DD

these peripherals are not used.

• V

= 1.55 V to 3.6 V

BAT

V

is the power supply for RTC, external clock 32 kHz oscillator and backup registers

BAT

(through power switch) when V

• V

REF-, VREF+

V

is the input reference voltage for ADCs and DACs. It is also the output of the

REF+

internal voltage reference buffer when enabled.

When V

When V

DDA

DDA

< 2 V V
 2 V V

must be equal to V

REF+

must be between 2 V and V

REF+

The internal voltage reference buffer supports three output voltages, which are
configured with VRS bits in the VREFBUF_CSR register:

–V

–V

–V

V

REF-

= 2.048 V

REF+

= 2.5 V

REF+

= 2.95 V

REF+

is double bonded with V

3.11.2 Power supply supervisor

The device has an integrated ultra-low-power brown-out reset (BOR) active in all modes
(except for Shutdown mode). The BOR ensures proper operation of the device after power­on and during power down. The device remains in reset mode when the monitored supply
voltage V

The lowest BOR level is 1.71 V at power on, and other higher thresholds can be selected
through option bytes.The device features an embedded programmable voltage detector
(PVD) that monitors the V
interrupt can be generated when V
higher than the VPVD threshold. The interrupt service routine can then generate a warning
message and/or put the MCU into a safe state. The PVD is enabled by software.

is below a specified threshold, without the need for an external reset circuit.

DD

power supply and compares it to the VPVD threshold. An

DD

voltage and should preferably be connected to VDD when

is not present.

DD

.

DDA

.

DDA

.

SSA

drops below the VPVD threshold and/or when VDD is

DD

In addition, the device embeds a peripheral voltage monitor which compares the
independent supply voltages V

, with a fixed threshold in order to ensure that the

DDA

peripheral is in its functional supply range.

3.11.3 Voltage regulator

Two embedded linear voltage regulators, main regulator (MR) and low-power regulator
(LPR), supply most of digital circuitry in the device. The MR is used in Run and Sleep
modes. The LPR is used in Low-power run, Low-power sleep and Stop modes. In Standby
and Shutdown modes, both regulators are powered down and their outputs set in high­impedance state, such as to bring their current consumption close to zero.

The device supports dynamic voltage scaling to optimize its power consumption in Run
mode. the voltage from the main regulator that supplies the logic (VCORE) can be adjusted
according to the system’s maximum operating frequency.

The main regulator (MR) operates in the following ranges:

• Range 1 boost mode with the CPU running at up to 170 MHz.

• Range 1 normal mode with CPU running at up to 150 MHz.

• Range 2 with a maximum CPU frequency of 26 MHz.

22/192 DS12960 Rev 1

STM32G441xB Functional overview

3.11.4 Low-power modes

By default, the microcontroller is in Run mode after system or power Reset. It is up to the
user to select one of the low-power modes described below:

• Sleep mode: In Sleep mode, only the CPU is stopped. All peripherals continue to

operate and can wake up the CPU when an interrupt/event occurs.

• Low-power run mode: This mode is achieved with VCORE supplied by the low-power

regulator to minimize the regulator's operating current. The code can be executed from
SRAM or from Flash, and the CPU frequency is limited to 2 MHz. The peripherals with
independent clock can be clocked by HSI16.

• Stop mode: In Stop mode, the device achieves the lowest power consumption while

retaining the SRAM and register contents. All clocks in the VCORE domain are
stopped. The PLL, as well as the HSI16 RC oscillator and the HSE crystal oscillator are
disabled. The LSE or LSI keep running. The RTC can remain active (Stop mode with
RTC, Stop mode without RTC). Some peripherals with wakeup capability can enable
the HSI16 RC during Stop mode, so as to get clock for processing the wakeup event.

• Standby mode: The Standby mode is used to achieve the lowest power consumption

with brown-out reset, BOR. The internal regulator is switched off to power down the
VCORE domain. The PLL, as well as the HSI16 RC oscillator and the HSE crystal
oscillator are also powered down. The RTC can remain active (Standby mode with
RTC, Standby mode without RTC). The BOR always remains active in Standby mode.
For each I/O, the software can determine whether a pull-up, a pull-down or no resistor
shall be applied to that I/O during Standby mode. Upon entering Standby mode, SRAM
and register contents are lost except for registers in the RTC domain and standby
circuitry. The device exits Standby mode upon external reset event (NRST pin), IWDG
reset event, wakeup event (WKUP pin, configurable rising or falling edge) or RTC
event (alarm, periodic wakeup, timestamp, tamper), or when a failure is detected on
LSE (CSS on LSE).

• Shutdown mode: The Shutdown mode allows to achieve the lowest power

consumption. The internal regulator is switched off to power down the VCORE domain.
The PLL, as well as the HSI16 and LSI RC-oscillators and HSE crystal oscillator are
also powered down. The RTC can remain active (Shutdown mode with RTC, Shutdown
mode without RTC). The BOR is not available in Shutdown mode. No power voltage
monitoring is possible in this mode. Therefore, switching to RTC domain is not
supported. SRAM and register contents are lost except for registers in the RTC
domain. The device exits Shutdown mode upon external reset event (NRST pin),
IWDG reset event, wakeup event (WKUP pin, configurable rising or falling edge) or
RTC event (alarm, periodic wakeup, timestamp, tamper).

3.11.5 Reset mode

In order to improve the consumption under reset, the I/Os state under and after reset is
“analog state” (the I/O schmitt trigger is disabled). In addition, the internal reset pull-up is
deactivated when the reset source is internal.

3.11.6 VBAT operation

The VBAT pin allows to power the device VBAT domain from an external battery, an external
supercapacitor, or from V
supercapacitor is present. The VBAT pin supplies the RTC with LSE and the backup
registers. Three anti-tamper detection pins are available in VBAT mode.

when there is no external battery and when an external

DD

DS12960 Rev 1 23/192

44

Functional overview STM32G441xB

The VBAT operation is automatically activated when VDD is not present. An internal VBAT
battery charging circuit is embedded and can be activated when V

is present.

DD

Note: When the microcontroller is supplied from VBAT, neither external interrupts nor RTC

alarm/events exit the microcontroller from the VBAT operation.

24/192 DS12960 Rev 1

STM32G441xB Functional overview

3.12 Interconnect matrix

Several peripherals have direct connections between them. This allows autonomous
communication between peripherals, saving CPU resources thus power supply
consumption. In addition, these hardware connections allow fast and predictable latency.

Depending on peripherals, these interconnections can operate in Run, Sleep and Stop
modes.

Table 3. STM32G441xB peripherals interconnect matrix

Interconnect source

TIMx

TIM16/TIM17 IRTIM Infrared interface output generation Y Y Y -

COMPx

ADCx TIM1, 8 Timer triggered by analog watchdog Y Y Y -

RTC

All clocks sources (internal
and external)

USB TIM2 Timer triggered by USB SOF Y Y - -

CSS
CPU (hard fault)
RAM (parity error)
Flash memory (ECC error)
COMPx
PVD

Interconnect

destination

TIMx Timers synchronization or chaining Y Y Y -

ADCx
DACx

DMA Memory to memory transfer trigger Y Y Y -

COMPx Comparator output blanking Y Y Y -

TIM1, 8
TIM2, 3, 4

LPTIMER1

TIM16

LPTIMER1

TIM15, 16, 17

TIM1,8
TIM15,16,17

TIMx External trigger Y Y Y -

Conversion triggers Y Y Y -

Timer input channel, trigger, break
from analog signals comparison

Low-power timer triggered by
analog signals comparison

Timer input channel from RTC
events

Low-power timer triggered by RTC
alarms or tampers

Clock source used as input channel
for RC measurement and trimming

Timer break Y Y Y -

Interconnect action

Run

Sleep

Low-power run

YYY -

YYYY

YYY -

YYYY

YYY -

Stop

GPIO

LPTIMER1 External trigger Y Y Y -

ADCx
DACx

DS12960 Rev 1 25/192

Conversion external trigger Y Y Y -

44

Functional overview STM32G441xB

3.13 Clocks and startup

The clock controller distributes the clocks coming from different oscillators to the core and
the peripherals. It also manages clock gating for low-power modes and ensures clock
robustness. It features:

• Clock prescaler: to get the best trade-off between speed and current consumption,

the clock frequency to the CPU and peripherals can be adjusted by a programmable
prescaler

• Safe clock switching: clock sources can be changed safely on the fly in run mode

through a configuration register.

• Clock management: to reduce power consumption, the clock controller can stop the

clock to the core, individual peripherals or memory.

• System clock source: three different sources can deliver SYSCLK system clock:

– 4 - 48 MHz high-speed oscillator with external crystal or ceramic resonator (HSE).

It can supply clock to system PLL. The HSE can also be configured in bypass
mode for an external clock.

– 16 MHz high-speed internal RC oscillator (HSI16), trimmable by software. It can

supply clock to system PLL.

– System PLL with maximum output frequency of 170 MHz. It can be fed with HSE

or HSI16 clocks.

• RC48 with clock recovery system (HSI48): internal HSIRC48 MHz clock source can

be used to drive the USB or the RNG peripherals.

• Auxiliary clock source: two ultra-low-power clock sources for the real-time clock

(RTC):

– 32.768 kHz low-speed oscillator with external crystal (LSE), supporting four drive

capability modes. The LSE can also be configured in bypass mode for using an
external clock.

– 32 kHz low-speed internal RC oscillator (LSI) with ±5% accuracy, also used to

clock an independent watchdog.

• Peripheral clock sources: several peripherals (I2S, USART, I2C, LPTimer, ADC, SAI,

RNG) have their own clock independent of the system clock.

• Clock security system (CSS): in the event of HSE clock failure, the system clock is

automatically switched to HSI16 and, if enabled, a software interrupt is generated. LSE
clock failure can also be detected and generate an interrupt.

• Clock-out capability:

– MCO: microcontroller clock output: it outputs one of the internal clocks for external

use by the application

– LSCO: low speed clock output: it outputs LSI or LSE in all low-power modes.

Several prescalers allow to configure the AHB frequency, the High-speed APB (APB2) and
the low speed APB (APB1) domains. The maximum frequency of the AHB and the APB
domains is 170 MHz.

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STM32G441xB Functional overview

3.14 General-purpose inputs/outputs (GPIOs)

Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as
input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the
GPIO pins are shared with digital or analog alternate functions. Fast I/O toggling can be
achieved thanks to their mapping on the AHB2 bus.

The I/Os alternate function configuration can be locked if needed following a specific
sequence in order to avoid spurious writing to the I/Os registers.

3.15 Direct memory access controller (DMA)

The device embeds 2 DMAs. Refer to Table 4: DMA implementation for the features
implementation.

Direct memory access (DMA) is used in order to provide a high-speed data transfer
between peripherals and memory as well as from memory to memory. Data can be quickly
moved by DMA without any CPU actions. This keeps the CPU resources free for other
operations.

The two DMA controllers have 12 channels in total, each one dedicated to manage memory
access requests from one or more peripherals. Each controller has an arbiter for handling
the priority between DMA requests.

The DMA supports:

• 12 independently configurable channels (requests)

– Each channel is connected to a dedicated hardware DMA request, a software

trigger is also supported on each channel. This configuration is done by software.

• Priorities between requests from channels of one DMA are both software

programmable (4 levels: very high, high, medium, low) or hardware programmable in
case of equality (request 1 has priority over request 2, etc.)

• Independent source and destination transfer size (byte, half word, word), emulating

packing and unpacking. Source/destination addresses must be aligned on the data
size.

• Support for circular buffer management

• 3 event flags (DMA half transfer, DMA transfer complete and DMA transfer error)

logically ORed together in a single interrupt request for each channel

• Memory-to-memory transfer

• Peripheral-to-memory, memory-to-peripheral, and peripheral-to-peripheral transfers

• Access to Flash, SRAM, APB and AHB peripherals as source and destination

• Programmable number of data to be transferred: up to 65536.

DMA features DMA1 DMA2

Number of regular channels 6 6

Table 4. DMA implementation

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Functional overview STM32G441xB

3.16 DMA request router (DMAMux)

When a peripheral indicates a request for DMA transfer by setting its DMA request line, the
DMA request is pending until it is served and the corresponding DMA request line is reset.
The DMA request router allows to route the DMA control lines between the peripherals and
the DMA controllers of the product.

An embedded multi-channel DMA request generator can be considered as one of such
peripherals. The routing function is ensured by a multi-channel DMA request line
multiplexer. Each channel selects a unique set of DMA control lines, unconditionally or
synchronously with events on synchronization inputs.

For simplicity, the functional description is limited to DMA request lines. The other DMA
control lines are not shown in figures or described in the text. The DMA request generator
produces DMA requests following events on DMA request trigger inputs.

3.17 Interrupts and events

3.17.1 Nested vectored interrupt controller (NVIC)

The STM32G441xB devices embed a nested vectored interrupt controller which is able to
manage 16 priority levels, and to handle up to maskable interrupt channels plus the 16
interrupt lines of the Cortex

®

-M4.

The NVIC benefits are the following:

• Closely coupled NVIC gives low latency interrupt processing

• Interrupt entry vector table address passed directly to the core

• Allows early processing of interrupts

• Processing of late arriving higher priority interrupts

• Support for tail chaining

• Processor state automatically saved

• Interrupt entry restored on interrupt exit with no instruction overhead

The NVIC hardware block provides flexible interrupt management features with minimal
interrupt latency.

3.17.2 Extended interrupt/event controller (EXTI)

The extended interrupt/event controller consists of 39 edge detector lines used to generate
interrupt/event requests and to wake-up the system from the Stop mode. Each external line
can be independently configured to select the trigger event (rising edge, falling edge, both)
and can be masked independently.

A pending register maintains the status of the interrupt requests. The internal lines are
connected to peripherals with wakeup from Stop mode capability. The EXTI can detect an
external line with a pulse width shorter than the internal clock period. Up to 86 GPIOs can
be connected to the 16 external interrupt lines.

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STM32G441xB Functional overview

3.18 Analog-to-digital converter (ADC)

The device embeds two successive approximation analog-to-digital converters with the
following features:

• 12-bit native resolution, with built-in calibration

• 4 Msps maximum conversion rate with full resolution

– Down to 25 ns sampling time

– Increased conversion rate for lower resolution (up to 6.66 Msps for 6-bit

resolution)

• One external reference pin is available on all packages, allowing the input voltage

range to be independent from the power supply

• Single-ended and differential mode inputs

• Low-power design

– Capable of low-current operation at low conversion rate (consumption decreases

linearly with speed)

– Dual clock domain architecture: ADC speed independent from CPU frequency

• Highly versatile digital interface

– Single-shot or continuous/discontinuous sequencer-based scan mode: 2 groups

of analog signals conversions can be programmed to differentiate background and
high-priority real-time conversions

– Each ADC support multiple trigger inputs for synchronization with on-chip timers

and external signals

– Results stored into a data register or in RAM with DMA controller support

– Data pre-processing: left/right alignment and per channel offset compensation

– Built-in oversampling unit for enhanced SNR

– Channel-wise programmable sampling time

– Analog watchdog for automatic voltage monitoring, generating interrupts and

trigger for selected timers

– Hardware assistant to prepare the context of the injected channels to allow fast

context switching

– Flexible sample time control

– Hardware gain and offset compensation

3.18.1 Temperature sensor

The temperature sensor (TS) generates a voltage VTS that varies linearly with temperature.
The temperature sensor is internally connected to the ADC1_IN16 input channel which is
used to convert the sensor output voltage into a digital value.

The sensor provides good linearity but it has to be calibrated to obtain good overall
accuracy of the temperature measurement. As the offset of the temperature sensor varies
from chip to chip due to process variation, the uncalibrated internal temperature sensor is
suitable for applications that detect temperature changes only.

To improve the accuracy of the temperature sensor measurement, each device is
individually factory-calibrated by ST. The temperature sensor factory calibration data are
stored by ST in the system memory area, accessible in read-only mode.

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44

Functional overview STM32G441xB

Calibration value name Description Memory address

TS_CAL1

TS_CAL2

Table 5. Temperature sensor calibration values

TS ADC raw data acquired at a
temperature of 30 °C (± 5 °C),
V

DDA

TS ADC raw data acquired at a
temperature of 110 °C (± 5 °C),
V

DDA

3.18.2 Internal voltage reference (V

The internal voltage reference (VREFINT) provides a stable (bandgap) voltage output for
the ADC and the comparators. The VREFINT is internally connected to the ADC1_IN18
input channel. The precise voltage of VREFINT is individually measured for each part by ST
during production test and stored in the system memory area. It is accessible in read-only
mode.

Calibration value name Description Memory address

Table 6. Internal voltage reference calibration values

Raw data acquired at a

VREFINT

temperature of 30 °C (± 5 °C),
V

DDA

= V

REF+

= V

REF+

REFINT

= V

REF+

0x1FFF 75A8 - 0x1FFF 75A9

= 3.0 V (± 10 mV)

0x1FFF 75CA - 0x1FFF 75CB

= 3.0 V (± 10 mV)

)

0x1FFF 75AA - 0x1FFF 75AB

= 3.0 V (± 10 mV)

3.18.3 V

battery voltage monitoring

BAT

This embedded hardware enables the application to measure the V
the internal ADC1_IN17 channel. As the V

voltage may be higher than the VDDA, and

BAT

thus outside the ADC input range, the VBAT pin is internally connected to a bridge divider by

3. As a consequence, the converted digital value is one third of the V

3.19 Digital to analog converter (DAC)

Four 12 bit DAC channels (2 external buffered and 2 internal unbuffered) can be used to
convert digital signals into analog voltage signal outputs. The chosen design structure is
composed of integrated resistor strings and an amplifier in inverting configuration.

battery voltage using

BAT

voltage.

BAT

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