Page 1
STEVAL-STWINMAV1
Data brief
Analog microphone array expansion for the SensorTile Wireless Industrial Node
(STWIN) kit
Features
Analog microphone array expansion for STEVAL-STWINKT1B (and STEVAL-
•
STWINKT1)
• Connects to STWIN core system board through dedicated 12-pin connector
• 3 V to 5.5 V power supply input
• 4 mm square-shaped differential microphone array
• 4x MP23ABS1 high-performance, single-ended, analog, bottom-port MEMS
microphones
• LDK130 300 mA low quiescent current very low noise LDO
• On-board audio-grade quad ADC
• Serial Audio Interface (SAI) digital output
Product summary
Analog microphone
array expansion for
STWIN kit
MEMS analog bottomport microphone
STWIN SensorTile
Wireless Industrial
Node development kit
and reference design
for industrial IoT
applications
Firmware for
STEV
AL-STWINKT1B
evaluation kit
Applications
STEVALSTWINMAV1
MP23ABS1
STEVALSTWINKT1B
STSWSTWINKT01
Factory
Automation
Sound Sensing
Description
The STEVAL-STWINMAV1 microphone array expansion adds advanced audio
sensing capabilities to the STEVAL-STWINKT1B (and STEVAL-STWINKT1)
SensorTile Wireless Industrial Node (STWIN) kit for high frequency vibration
monitoring applications.
The board includes four low-power, high signal-to-noise ratio (SNR) MP23ABS1
capacitive sensing microphones, supported by a very low drop voltage, low quiescent
current and low-noise voltage regulator ideal for batter-powered applications such as
STWIN.
The expansion board is connected via a dedicated 12-pin connector to the core
system board, which runs the STSW-STWINKT01 firmware with dedicated BSP
drivers and application examples for you to test and develop vibration monitoring
in the ultrasound frequency ranges.
DB3970 - Rev 2 - December 2020
For further information contact your local STMicroelectronics sales of
fice.
www.st.com
Page 2
2
SB2
C27
a4
a1
110k
SB3
SAI_SCK
A3V
GND1
NC
2
4
GND3
4
0R
3V3
b3
IN
1
A3V
MP23ABS1
1
SB1
GND1
2
100nF
2
3
GND2
100nF
R7
M3
C24 C25
A3V
a3
SB4
GND3
3
39k
1uF
DOUT DOUT
C21
C26
5
VDD
b1
M55-7001242R
GND1
0R
5
VDD
100nF
SAI_SD
b2
1uF
A3V
M1
A3V
M4
MP23ABS1
1
1uF
1uF
1uF
M2
GND2
a2
C28
1uF
LDK130M-R
M4
2
GND
b6
GND1
3
SAI_MCLK
C20
4
GND3
a6
M2
A3V
3V3
U2
C29
DOUT
VDD
5
4
MP23ABS1
1
5
VDD
GND2
b5
R6
M3
4
GND3
100nF
D3V3
SAI_FS
EN
3
3
GND2
C23C22
Analog VDD
Analog Mics
Connector
3.3 to 5.5 V
MP23ABS1
1
ADJ/BYP
OUT
5
b4
a5
VIN
CN1
M1
VIN
3V3
I2C_SDA
I2C_SCL
DOUT
NC
SB5 0R
DB3970 - Rev 2
1 Schematic diagrams
Figure 1. STEVAL-STWINMAV1 schematic - Mics, VDD and connector
page 2/5
STEVAL-STWINMAV1
Schematic diagrams
Page 3
ADC
D3V3
D3V3
D3V3
A3V
A3V
SAI_MCLK
SAI_SD
SAI_FS
SAI_SCK
I2C_SDA
I2C_SCL
M1
M3
M2
M4
R1
4.87k
C15
R3
U1
ADAU1978
AGND1
1
VREF
2
PLL_FILT
3
AVDD2
4
AGND2
5
PD_RST
6
MCLKIN
7
IOVDD12SDATAOUT113SDATAOUT214LRCLK15BCLK
16
AGND3
21
ADDR1_CIN
20
AGND4
22
NC2
23
NC5
26
NC6
27
AGND5
28
AGND6
29
NC7
30
SDA_COUT
17
NC1
8
SA_MODE
9
DVDD
10
DGND
11
SCL_CCLK
18
ADDR0_CLATCH
19
NC3
24
NC4
25
AVDD3
31
AIN1N
32
AIN1P
33
AIN2N
34
AIN2P
35
AIN3N
36
AIN3P
37
AIN4N
38
AIN4P
39
AVDD1
40
E
41
C13
100nF
C17 C2
C7
10uF
C1
39nF
C6
C12
C8
2200pF
C18
100nF
C11
R4
R2
3k
C10C4
C14
10uF
R5
Place close to AVDD1,
AVDD2, AVDD3 pins
Place close to
IOVDD
D3V3
A3V
C16
100nFC9100nF
C19
10uF
C5
100nF
C3
100nF
100nF
100nF 100nF
100nF
100nF
100nF
100nF100nF
47k
47k
47k
DB3970 - Rev 2
Figure 2. STEVAL-STWINMAV1 schematic - ADC
page 3/5
STEVAL-STWINMAV1
Schematic diagrams
Page 4
Revision history
Date Version Changes
08-Jul-2019 1 Initial release.
16-Dec-2020 2 Updated cover page features, description and product summary table.
STEVAL-STWINMAV1
Table 1. Document revision history
DB3970 - Rev 2
page 4/5
Page 5
STEVAL-STWINMAV1
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2020 STMicroelectronics – All rights reserved
DB3970 - Rev 2
page 5/5
Loading...