STMicroelectronics STEVAL-STWINKT1 User Manual
UM2622
User manual
How to use the STEVAL-STWINKT1 SensorTile Wireless Industrial Node for
condition monitoring and predictive maintenance applications
Introduction
The STWIN SensorTile wireless industrial node (STEV
prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance.
The kit features a core system board with a range of embedded industrial-grade sensors and an ultra-low-power microcontroller
for vibration analysis of 9-DoF motion sensing data across a wide range of vibration frequencies, including very high frequency
audio and ultrasound spectra, and high precision local temperature and environmental monitoring.
The development kit is complemented with a rich set of software packages and optimized firmware libraries, as well as a cloud
dashboard application, all provided to help speed up design cycles for end-to-end solutions.
The kit supports BLE wireless connectivity through an on-board module, and Wi-Fi connectivity through a special plugin
expansion board (STEVAL-STWINWFV1). Wired connectivity is also supported via an on-board RS485 transceiver. The core
system board also includes an STMod+ connector for compatible, low cost, small form factor daughter boards associated with
the STM32 family, such as the LTE Cell pack.
Apart from the core system board, the kit is provided complete with a 480 mAh Li-Po battery, an STLINK-V3MINI debugger and
a plastic box.
AL-STWINKT1) is a development kit and reference design that simplifies
Figure 1. STEVAL-STWINKT1 SensorTile Wireless Industrial Node
UM2622 - Rev 6 - November 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
1 STWIN kit components
The SensorTile Wireless Industrial Node (STWIN) is packaged with the components shown below.
Figure 2. STWIN Core System board top and bottom
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STWIN kit components
Figure 3. Protective plastic case
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Figure 4. 480mAh 3.7V Li-Po Battery
Figure 5. STLink-V3Mini Debugger/Programmer for STM32
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STWIN kit components
Figure 6. Programming cable
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2 Functional blocks
SPI3
ADC1
USART2
Enanced
SWD
Connector
UART5
I2C2
ADC3
GPIO
Auxiliary
Connector
DFSDM1
I2C2
IMP34DT05
Digital Microphone
LPS22HH
Pressure Sensor
HTS221
Humidity and
Temperature Sensor
STTS751
Temperature Sensor
IIS2MDC
3D Magnetometer
STM32L4R9ZIJ6
Microcontroller
Ultra Low Power
Cortex M4F@120MHz
32 kHz
Crystal
16 MHz
Crystal
SPBTLE-1S
BLE Application
Processor Module
STR485LV
RS485 Interface
SPI2
MP23ABS1
Analog Microphone
TS922EIJT
Low noise, low
distortion OpAmp
20-pin STMOD+
12-pin female sensor
connector
12-pin male
connector
40-pin Flex
STSAFE
Secure Element*
I2C2
SPIx, I2S,
USARTx,...
IIS2DH
3D Accelerometer
IIS3DWB
Vibrometer
ISM330DHCX
6-Axis IMU
USBLC6-2P6
USB ESD protection
ESDALC6V1-1U2
Single Line ESD
protection
EMIF06-MSD02N16
EMI filter and ESD
protection
STBC02
Li-Ion linerar battery
charger
ST1PS01EJR
step-down switching
regulator
LDK130
Low Noise LDO
Sensing
Processing
Connectivity
Power Mng.
Analog
Secure
* not mounted
connector
connector
SPI3
ADC1
DFSDM1
I2C2
IMP34DT05
Digital Microphone
LPS22HH
Pressure Sensor
HTS221
Humidity and
Temperature Sensor
STTS751
Temperature Sensor
IIS2MDC
3D Magnetometer
STM32L4R9ZIJ6
Microcontroller
Ultra Low Power
Cortex M4F@120MHz
MP23ABS1
Analog Microphone
TS922EIJT
Low noise, low
distortion OpAmp
IIS2DH
3D Accelerometer
IIS3DWB
Vibrometer
ISM330DHCX
6-Axis IMU
Sensing
Analog
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Functional blocks
Figure 7. STEV
AL-STWINKT1 functional block diagram
2.1 Sensing
The core system board offers a comprehensive range of sensors specifically designed to support and enable the
Industry 4.0 applications.
Figure 8. STEV
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The motion sensors communicate with the STM32L4R9ZIJ6 microcontroller via SPI in order to accommodate the
high data rates, while the magnetometer and environmental sensors communicate via I2C.
AL-STWINKT1 functional block diagram of sensing elements and STM32L4R9ZIJ6
page 4/43
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Sensing
The suitably filtered signal from the MP23ABS1 analog microphone is amplified by a TS922 low noise op-amp
and then sampled by the internal 12-bit ADC in the MCU, while the signal from digital microphone is directly
managed by the digital filter for Sigma-Delta modulators (DFSDM) interface in the MCU.
Figure 9. Core system board sensor locations
U2: HTS221 relative humidity and temperature sensor
U3: LPS22HH digital absolute pressure sensor
U6: STTS751 low-voltage digital local temperature sensor
U8: TS922 rail-to-rail, high output current, dual operational amplifier
U9: ISM330DHCX 3D acc. + 3D gyro iNEMO IMU with machine learning core
U1
1: IIS3DWB ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor
U12: IIS2DH ultra-low-power high performance MEMS motion sensor
U13: IIS2MDC ultra-low-power 3-axis magnetometer
M1: MP23ABS1 analog MEMS microphone
M2: IMP34DT05 industrial grade digital MEMS microphone
2.1.1 HTS221 humidity and temperature sensor
The HTS221
signal ASIC to provide measurement information through digital serial interfaces.
The sensing element consists of a polymer dielectric planar capacitor structure capable of detecting relative
humidity variations and is manufactured using a dedicated ST process.
The HTS221 is available in a small top-holed cap land grid array (HLGA) package guaranteed to operate over a
temperature range from -40 °C to +120 °C.
is an ultra-compact relative humidity and temperature sensor with a sensing element and a mixed
RELATED LINKS
Visit the product web page for the HTS221 relative humidity and temperature sensor
2.1.2 LPS22HH MEMS pressure sensor
The LPS22HH is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output
barometer
I3CSM or SPI from the sensing element to the application.
The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a
dedicated process developed by ST.
The LPS22HH is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a
temperature range extending from -40 °C to +85 °C.
. The device consists of a sensing element and an IC interface which communicates through I²C, MIPI
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RELATED LINKS
Visit the product web page for the LPS22HH MEMS pressure sensor
2.1.3 STTS751 digital temperature sensor
The STTS751
temperature is measured with a user-configurable resolution between 9 and 12 bits. At 9 bits, the smallest step
size is 0.5 °C, and at 12 bits, it is 0.0625 °C. At the default resolution (10 bits, 0.25 °C/LSB), the nominal
conversion time is 21 milliseconds.
Up to eight devices can share the same 2-wire SMBus without ambiguity, allowing a single application to monitor
multiple temperature zones.
is a digital temperature sensor which communicates over a 2-wire SMBus 2.0 compatible bus. The
RELATED LINKS
Visit the product web page for the STTS751 digital temperature sensor
2.1.4 TS922 rail-to-rail, high output current, dual operational amplifier
The TS922 is a rail-to-rail dual BiCMOS operational amplifier optimized and fully specified for 3 V and 5 V
operation. The very low noise, low distortion, low of
highly suitable for high quality, low voltage, or battery operated audio systems.
fset, and high output current capability render this device
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Sensing
RELATED LINKS
Visit the product web page for the TS922 rail-to-rail, high output current, dual operational amplifier
2.1.5 ISM330DHCX iNEMO IMU 3D Acc + 3D Gyro
The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and +3D digital
gyroscope tailored for Industry 4.0 applications.
The sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, which
ensures superior stability and robustness.
Several embedded features such as programmable FSM, FIFO, sensor hub, event decoding and interrupts allow
the implementation of smart and complex sensor nodes able to deliver high performance at very low power
RELATED LINKS
Visit the product web page for the ISM330DHCX iNEMO IMU 3D Acc + 3D Gyro
2.1.6 IIS3DWB ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor
The IIS3DWB is a system-in-package featuring a 3-axis digital accelerometer with low noise over an ultra-wide
and flat frequency range. The wide bandwidth, low noise, very stable and repeatable sensitivity
capability of operating over an extended temperature range (up to +105 °C), render the device particularly
suitable for vibration monitoring in industrial applications.
The high performance delivered at low power consumption, together with the digital output and embedded digital
features like FIFO and interrupts are of primary importance in battery-operated industrial wireless sensor nodes.
, together with the
RELATED LINKS
Visit the product web page for the IIS3DWB ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor
.
2.1.7 IIS2DH ultra-low power 3-axis high-performance accelerometer
The IIS2DH is an ultra-low-power high-performance three-axis linear accelerometer with digital I2C/SPI serial
interface standard output.
The device may be configured to generate interrupt signals from two independent inertial wake-up/free-fall events,
as well as from the position of the device itself.
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RELATED LINKS
Visit the product web page for the IIS2DH ultra-low power 3-axis high-performance accelerometer
2.1.8 IIS2MDC 3-axis magnetometer
The IIS2MDC is a high-accuracy
range up to ±50 gauss, and includes an I²C serial bus interface that supports 100 kHz, 400 kHz, 1 MHz, and
3.4 MHz rates and an SPI serial standard interface.
The device can be configured to generate an interrupt signal from magnetic field detection.
, ultra-low-power 3-axis digital magnetic sensor. It has a magnetic field dynamic
RELATED LINKS
Visit the product web page for the IIS2MDC 3-axis magnetometer
2.1.9 MP23ABS1 analog MEMS microphone
The MP23ABS1 is a compact, low-power microphone built with a capacitive sensing element and an IC interface.
The device has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio, with sensitivity
at -38 dBV ±1 dB @ 94 dBSPL, 1 kHz.
RELATED LINKS
Visit the product web page for the MP23ABS1 analog MEMS microphone
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Processing and connectivity
2.1.10 IMP34DT05 digital MEMS microphone
The IMP34DT05 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive
sensing element and an IC interface; the device features 64 dB signal-to-noise ratio and -26 dBFS ±3 dB
sensitivity.
The IC interface includes a dedicated circuit able to provide a digital signal externally in PDM format.
RELATED LINKS
Visit the product web page for the IMP34DT05 digital MEMS microphone
2.2 Processing and connectivity
The STWIN core system board features several wired and wireless connectivity options and the STM32L4R9ZI
ultra-low-power microcontroller, which is part of the STM32L4+ series MCUs based on the high-performance Arm
Cortex-M4 32-bit RISC core, operating at up to 120 MHz and equipped with 640 Kb SRAM and 2 MB Flash
memory.
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USART2
STM32L4R9ZIJ6
Microcontroller
Ultra Low Power
Cortex M4F@120MHz
32 kHz
Crystal
16 MHz
Crystal
SPBTLE-1S
BLE Application
Processor Module
STR485LV
RS485 Interface
SPI2
SPI1
Secure
Processing
Connectivity
STEVAL-STWINWFV1
12-pin male com.
connector
Processing and connectivity
Figure 10. Main connectivity components and the STM32L4R9ZI processing unit
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Each connectivity component is connected to an independent bus on the STM32L4R9ZI MCU, so they can all be
configured individually
.
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Figure 11. MCU and connectivity element locations
U4: STM32L4R9ZI Cortex-M4F 120MHz 640Kb RAM
U5: SPBTLE-1S very low power application module for Bluetooth® Smart v4.2
U7: STSAFE-A1
U17: STG3692 high bandwidth quad SPDT switch
U19: STR485 3.3V RS485 up to 20Mbps
USB: Micro-USB connector (power supply + data)
X1: 16MHz crystal oscillator
X2: 32.768 kHz crystal oscillator
J2: STDC14 programming connector for STLINK-V3
J1: RS485 interface header connector
CN3: Connectivity expansion connector (for STEVAL-STWINWFV1)
CN4: Audio/sensor expansion connector
SD: microSD card socket
10 authentication and brand protection secure solution
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Processing and connectivity
2.2.1 STM32L4R9ZI Cortex-M4F 120MHz 640Kb RAM
The STM32L4R9ZI devices is an ultra-low-power microcontroller (STM32L4+ Series MCU) based on the highperformance Arm Cortex-M4 32-bit RISC core, which operates at a frequency of up to 120 MHz.
The Cortex-M4 core features a single-precision floating-point unit (FPU), which supports all the Arm singleprecision data-processing instructions and all the data types. The Cortex-M4 core also implements a full set of
DSP (digital signal processing) instructions and a memory protection unit (MPU) which enhances application
security
These devices embed high-speed memories (2 Mbytes of Flash memory and 640 Kbytes of SRAM), a flexible
external memory controller (FSMC) for static memories (for devices with packages of 100 pins and more), two
OctoSPI Flash memory interfaces and an extensive range of enhanced I/Os and peripherals connected to two
APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.
The MCU embeds several protection mechanisms for embedded Flash memory and SRAM: readout protection,
write protection, proprietary code readout protection and a firewall.
These devices offer a fast 12-bit ADC (5 Msps), two comparators, two operational amplifiers, two DAC channels,
an internal voltage reference buffer, a low-power RTC, two general-purpose 32-bit timer, two 16-bit PWM timers
for motor control, seven general-purpose 16-bit timers, and two 16-bit low-power timers. The devices support four
digital filters for external sigma delta modulators (DFSDM). In addition, up to 24 capacitive sensing channels are
available.
They also feature standard and advanced communication interfaces such as:
• Four I2Cs
• Three SPIs
• Three USARTs, two UARTs and one low-power UART
• Two SAIs
• One SDMMC
.
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• One CAN
•
One USB OTG full-speed
• Camera interface
• DMA2D controller
The device operates in the -40 to +85 °C (+105 °C junction) and -40 to +125 °C (+130 °C junction) temperature
ranges from a 1.71 to 3.6 V for VDD power supply when using internal LDO regulator and a 1.05 to 1.32 V V
power supply when using external SMPS supply. A comprehensive set of power-saving modes allows the design
of low-power applications.
Some independent power supplies are supported, such as an analog independent supply input for ADC, DAC,
OPAMPs and comparators, a 3.3 V dedicated supply input for USB and up to 14 I/Os, which can be supplied
independently down to 1.08 V. A VBAT input allows backup of the RTC and the registers. Dedicated V
supplies can be used to bypass the internal LDO regulator when connected to an external SMPS.
RELATED LINKS
Visit the product web page for the STM32L4R9ZI micrcontroller
2.2.2 SPBTLE-1S application module for Bluetooth v4.2
The SPBTLE-1S is a Bluetooth low energy system-on-chip application processor certified module, compliant with
BT specifications v4.2 and BQE qualified. It supports multiple roles simultaneously and can act as a Bluetooth
smart master and slave device at the same time.
The module is based on the BlueNRG-1 system-on-chip, with the entire Bluetooth low energy stack and protocols
embedded in the module to provide a complete RF platform in a tiny form factor. The integrated radio, embedded
antenna and high frequency oscillators complete the certified solution that can help minimize the time to market of
final applications.
The SPBTLE-1S can be powered directly with a pair of AAA batteries or any power source from 1.7 to 3.6 V.
The RF power emitted is +5 dBm.
The RF channel center frequency of the module is 2402~2480 MHz.
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Processing and connectivity
DD12
power
DD12
RELATED LINKS
Visit the product web page for the SPBTLE-1S application module for Bluetooth v4.2
2.2.3 STEVAL-STWINWFV1 Wi-Fi expansion (not included in the kit) for the SensorTile wireless
industrial node (STWIN) kit
The STEV
Wireless Industrial Node (STWIN) kit.
Through the CN3 connectivity expansion connector, the STEVAL-STWINWFV1 can be plugged into the STWIN
core system board.
It is based on the ISM43362-M3G-L44-E Wi-Fi module and its main features are:
• 802.11 b/g/n compatible
• based on Broadcom MAC/Baseband/Radio device
• fully contained TCP/IP stack
• host interface: SPI up to 25 MHz
The RF power emitted is +9 dBm (limited by firmware).
The module operating band is 2400 MHz ~ 2483.5 MHz (2.4 GHz ISM Band).
AL-STWINWFV1 expansion board (sold separately) adds 2.4 GHz Wi-Fi connectivity to the SensorTile
RELATED LINKS
Visit the product web page for further details on the STEVAL-STWINWFV1
2.2.4 STR485LV 3.3V RS485 up to 20Mbps
The STR485 is a low power differential line transceiver for RS485 data transmission standard applications in halfduplex mode. Data and enable signals are compatible with 1.8 V or 3.3 V supplies.
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Power management
Two speeds are selectable via the SLR pin: fast data rate up to 20 Mbps or slow data rate up to 250 kbps for
extended cables.
Excessive power dissipation caused by bus contention or faults is prevented by a thermal shutdown circuit that
forces the driver outputs into a high impedance state. The receiver has a fail-safe feature that guarantees a high
output state when the inputs are left open, shorted or idle.
RELATED LINKS
Visit the product web page for the STR485LV 3.3V RS485 up to 20Mbps
2.2.5 USB connector
The Micro-USB connector on the board can be used for both power supply and data transfer (USB Device only).
Dif
ferent examples of USB class implementation can be found in STSW-STWINKT01 software package.
2.2.6 STSAFE-A110 (footprint only) authentication, state-of-the-art security for peripherals and IoT
devices
The STSAFE-A1
data management services to a local or remote host. It consists of a full turnkey solution with a secure operating
system running on the latest generation of secure microcontrollers.
The STSAFE-A110 can be integrated in IoT devices, smart-home, smart-city and industrial applications,
consumer electronics devices, consumables and accessories.
10 is a highly secure solution that acts as a secure element providing authentication and secure
RELATED LINKS
Visit the product web page for the STSAFE-A110 authentication, state-of-the-art security for peripherals and IoT devices
2.2.7 microSD card socket
On the bottom side of the STWIN core system board is a microSD Card socket that is accessible even when the
board is mounted in the plastic box. The card is accessed through a 4-bit wide SDIO port for maximum
performance.
A couple of firmware examples involving high speed data logging on the SD card are available in the STSW
STWINKT01 software package.
2.2.8 Clock sources
There are two external clock sources on the STWIN core system board:
•
X1: 16 MHz high speed external (HSE) oscillator for the MCU.
• X2: 32.768 kHz low speed external (LSE) oscillator for the RTC embedded in the MCU.
2.3 Power management
The STWIN core system board includes a range of power management features that enable very low power
consumption in final applications.
The main supply is through a lithium ion polymer battery (3.7 V
(STBC02) with Vin [4.8 -5.5 V].
-
, 480 mAh) and the integrated battery charger
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Figure 12. Power and protection components
STM32L4R9ZIJ6
Microcontroller
Ultra Low Power
Cortex M4F@120MHz
LDK130
Low Noise LDO
ESDALC6V1-1U2
Single Line ESD
protection
USBLC6-2P6
USB ESD protection
EMIF06-MSD02N16
EMI filter and ESD
protection
ST1PS01EJR
step-down
switching regulator
STBC02
Li-Ion linerar
battery charger
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Power management
Figure 13. Power and protection component locations
U1: EMIF06-MSD02N16
U10: LDK130 300 mA very low noise LDO
U14, U16: ST1PS01 400 mA Synchronous step-down converter
U15: STBC02 Li-Ion linear battery charger
U18: USBLC6-2 low capacitance ESD protection for USB
D1, D2, D3: Single-line low capacitance Transil for ESD protection
D4: Power Schottky rectifier (1A)
BATT: Battery connector
J4: Battery pins
J5: 5V Ext power supply connector
J6, J7, J9, J10: Current monitoring SMD jumper
PWR: Power button
6-line EMI filter and ESD protection for T-Flash and microSD card interfaces
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2.3.1 Battery connectors
3 2 1
2
1
VBAT
BAT_NTC
GND
VBAT
GND
STWIN core system board
USB
3V3 DCDC
U14
CN3 (Wi-Fi)
STSAFE
5V
SYS (5V or VBAT)
CN2
(AMicArray)
CN2
CN1
VBAT
J5
STBC02
Battery
Charger
Analog Mic
OpAmp
U10
2.7 LDO
DCDC_1
DCDC_2
3V3_Ext
U16
3V3 DCDC
VEXT
J3
µSDCard
RS485
SYS
V_USB
5V
STM32L4+
Sensors
BLE
The battery supply voltage (VBAT) may be provided by connecting the 480 mA LiPo battery included in the
STWIN kit to the dedicated battery connector
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Power management
, or by supplying an external voltage through the J4 connector.
Figure 14. Battery and J4 connectors for VBAT supply
2.3.2 Power supply
The STWIN core system board can receive power from different sources:
V_USB: through micro USB connector [5 V]
•
• Vin: through J5 connector [4.8-5.5 V]. The current on this port needs to be limited to 2 A
• VBAT: lithium ion polymer battery (3.7 V, 480 mAh), STBC02 battery charger integrated in the board
The battery is always optional. The STBC02 battery charger automatically checks the available power inputs and
selects one to power the system. When the battery is connected as well as one of the other sources, the STBC02
automatically charges the battery.
When battery-powered, the equipment is intended to work properly with an operating temperature of 35°C.
Without the battery, the equipment is intended to work properly with an operating temperature of 45°C.
Figure 15. Power circuits
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