How to use the STEVAL-STWINKT1 SensorTile Wireless Industrial Node for
condition monitoring and predictive maintenance applications
Introduction
The STWIN SensorTile wireless industrial node (STEV
prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance.
The kit features a core system board with a range of embedded industrial-grade sensors and an ultra-low-power microcontroller
for vibration analysis of 9-DoF motion sensing data across a wide range of vibration frequencies, including very high frequency
audio and ultrasound spectra, and high precision local temperature and environmental monitoring.
The development kit is complemented with a rich set of software packages and optimized firmware libraries, as well as a cloud
dashboard application, all provided to help speed up design cycles for end-to-end solutions.
The kit supports BLE wireless connectivity through an on-board module, and Wi-Fi connectivity through a special plugin
expansion board (STEVAL-STWINWFV1). Wired connectivity is also supported via an on-board RS485 transceiver. The core
system board also includes an STMod+ connector for compatible, low cost, small form factor daughter boards associated with
the STM32 family, such as the LTE Cell pack.
Apart from the core system board, the kit is provided complete with a 480 mAh Li-Po battery, an STLINK-V3MINI debugger and
a plastic box.
AL-STWINKT1) is a development kit and reference design that simplifies
For further information contact your local STMicroelectronics sales office.
www.st.com
1STWIN kit components
The SensorTile Wireless Industrial Node (STWIN) is packaged with the components shown below.
Figure 2. STWIN Core System board top and bottom
UM2622
STWIN kit components
Figure 3. Protective plastic case
UM2622 - Rev 6
page 2/43
Figure 4. 480mAh 3.7V Li-Po Battery
Figure 5. STLink-V3Mini Debugger/Programmer for STM32
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STWIN kit components
Figure 6. Programming cable
UM2622 - Rev 6
page 3/43
2Functional blocks
SPI3
ADC1
USART2
Enanced
SWD
Connector
UART5
I2C2
ADC3
GPIO
Auxiliary
Connector
DFSDM1
I2C2
IMP34DT05
Digital Microphone
LPS22HH
Pressure Sensor
HTS221
Humidity and
Temperature Sensor
STTS751
Temperature Sensor
IIS2MDC
3D Magnetometer
STM32L4R9ZIJ6
Microcontroller
Ultra Low Power
Cortex M4F@120MHz
32 kHz
Crystal
16 MHz
Crystal
SPBTLE-1S
BLE Application
Processor Module
STR485LV
RS485 Interface
SPI2
MP23ABS1
Analog Microphone
TS922EIJT
Low noise, low
distortion OpAmp
20-pin STMOD+
12-pin female sensor
connector
12-pin male
connector
40-pin Flex
STSAFE
Secure Element*
I2C2
SPIx, I2S,
USARTx,...
IIS2DH
3D Accelerometer
IIS3DWB
Vibrometer
ISM330DHCX
6-Axis IMU
USBLC6-2P6
USB ESD protection
ESDALC6V1-1U2
Single Line ESD
protection
EMIF06-MSD02N16
EMI filter and ESD
protection
STBC02
Li-Ion linerar battery
charger
ST1PS01EJR
step-down switching
regulator
LDK130
Low Noise LDO
Sensing
Processing
Connectivity
Power Mng.
Analog
Secure
* not mounted
connector
connector
SPI3
ADC1
DFSDM1
I2C2
IMP34DT05
Digital Microphone
LPS22HH
Pressure Sensor
HTS221
Humidity and
Temperature Sensor
STTS751
Temperature Sensor
IIS2MDC
3D Magnetometer
STM32L4R9ZIJ6
Microcontroller
Ultra Low Power
Cortex M4F@120MHz
MP23ABS1
Analog Microphone
TS922EIJT
Low noise, low
distortion OpAmp
IIS2DH
3D Accelerometer
IIS3DWB
Vibrometer
ISM330DHCX
6-Axis IMU
Sensing
Analog
UM2622
Functional blocks
Figure 7. STEV
AL-STWINKT1 functional block diagram
2.1Sensing
The core system board offers a comprehensive range of sensors specifically designed to support and enable the
Industry 4.0 applications.
Figure 8. STEV
UM2622 - Rev 6
The motion sensors communicate with the STM32L4R9ZIJ6 microcontroller via SPI in order to accommodate the
high data rates, while the magnetometer and environmental sensors communicate via I2C.
AL-STWINKT1 functional block diagram of sensing elements and STM32L4R9ZIJ6
page 4/43
UM2622
Sensing
The suitably filtered signal from the MP23ABS1 analog microphone is amplified by a TS922 low noise op-amp
and then sampled by the internal 12-bit ADC in the MCU, while the signal from digital microphone is directly
managed by the digital filter for Sigma-Delta modulators (DFSDM) interface in the MCU.
Figure 9. Core system board sensor locations
U2: HTS221 relative humidity and temperature sensor
U3: LPS22HH digital absolute pressure sensor
U6: STTS751 low-voltage digital local temperature sensor
U8: TS922 rail-to-rail, high output current, dual operational amplifier
U9: ISM330DHCX 3D acc. + 3D gyro iNEMO IMU with machine learning core
U1
1: IIS3DWB ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor
U12: IIS2DH ultra-low-power high performance MEMS motion sensor
U13: IIS2MDC ultra-low-power 3-axis magnetometer
M1: MP23ABS1 analog MEMS microphone
M2: IMP34DT05 industrial grade digital MEMS microphone
2.1.1HTS221 humidity and temperature sensor
The HTS221
signal ASIC to provide measurement information through digital serial interfaces.
The sensing element consists of a polymer dielectric planar capacitor structure capable of detecting relative
humidity variations and is manufactured using a dedicated ST process.
The HTS221 is available in a small top-holed cap land grid array (HLGA) package guaranteed to operate over a
temperature range from -40 °C to +120 °C.
is an ultra-compact relative humidity and temperature sensor with a sensing element and a mixed
RELATED LINKS
Visit the product web page for the HTS221 relative humidity and temperature sensor
2.1.2LPS22HH MEMS pressure sensor
The LPS22HH is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output
barometer
I3CSM or SPI from the sensing element to the application.
The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a
dedicated process developed by ST.
The LPS22HH is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a
temperature range extending from -40 °C to +85 °C.
. The device consists of a sensing element and an IC interface which communicates through I²C, MIPI
UM2622 - Rev 6
page 5/43
RELATED LINKS
Visit the product web page for the LPS22HH MEMS pressure sensor
2.1.3STTS751 digital temperature sensor
The STTS751
temperature is measured with a user-configurable resolution between 9 and 12 bits. At 9 bits, the smallest step
size is 0.5 °C, and at 12 bits, it is 0.0625 °C. At the default resolution (10 bits, 0.25 °C/LSB), the nominal
conversion time is 21 milliseconds.
Up to eight devices can share the same 2-wire SMBus without ambiguity, allowing a single application to monitor
multiple temperature zones.
is a digital temperature sensor which communicates over a 2-wire SMBus 2.0 compatible bus. The
RELATED LINKS
Visit the product web page for the STTS751 digital temperature sensor
2.1.4TS922 rail-to-rail, high output current, dual operational amplifier
The TS922 is a rail-to-rail dual BiCMOS operational amplifier optimized and fully specified for 3 V and 5 V
operation. The very low noise, low distortion, low of
highly suitable for high quality, low voltage, or battery operated audio systems.
fset, and high output current capability render this device
UM2622
Sensing
RELATED LINKS
Visit the product web page for the TS922 rail-to-rail, high output current, dual operational amplifier
2.1.5ISM330DHCX iNEMO IMU 3D Acc + 3D Gyro
The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and +3D digital
gyroscope tailored for Industry 4.0 applications.
The sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, which
ensures superior stability and robustness.
Several embedded features such as programmable FSM, FIFO, sensor hub, event decoding and interrupts allow
the implementation of smart and complex sensor nodes able to deliver high performance at very low power
RELATED LINKS
Visit the product web page for the ISM330DHCX iNEMO IMU 3D Acc + 3D Gyro
2.1.6IIS3DWB ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor
The IIS3DWB is a system-in-package featuring a 3-axis digital accelerometer with low noise over an ultra-wide
and flat frequency range. The wide bandwidth, low noise, very stable and repeatable sensitivity
capability of operating over an extended temperature range (up to +105 °C), render the device particularly
suitable for vibration monitoring in industrial applications.
The high performance delivered at low power consumption, together with the digital output and embedded digital
features like FIFO and interrupts are of primary importance in battery-operated industrial wireless sensor nodes.
, together with the
RELATED LINKS
Visit the product web page for the IIS3DWB ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor
.
2.1.7IIS2DH ultra-low power 3-axis high-performance accelerometer
The IIS2DH is an ultra-low-power high-performance three-axis linear accelerometer with digital I2C/SPI serial
interface standard output.
The device may be configured to generate interrupt signals from two independent inertial wake-up/free-fall events,
as well as from the position of the device itself.
UM2622 - Rev 6
page 6/43
RELATED LINKS
Visit the product web page for the IIS2DH ultra-low power 3-axis high-performance accelerometer
2.1.8IIS2MDC 3-axis magnetometer
The IIS2MDC is a high-accuracy
range up to ±50 gauss, and includes an I²C serial bus interface that supports 100 kHz, 400 kHz, 1 MHz, and
3.4 MHz rates and an SPI serial standard interface.
The device can be configured to generate an interrupt signal from magnetic field detection.
, ultra-low-power 3-axis digital magnetic sensor. It has a magnetic field dynamic
RELATED LINKS
Visit the product web page for the IIS2MDC 3-axis magnetometer
2.1.9MP23ABS1 analog MEMS microphone
The MP23ABS1 is a compact, low-power microphone built with a capacitive sensing element and an IC interface.
The device has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio, with sensitivity
at -38 dBV ±1 dB @ 94 dBSPL, 1 kHz.
RELATED LINKS
Visit the product web page for the MP23ABS1 analog MEMS microphone
UM2622
Processing and connectivity
2.1.10IMP34DT05 digital MEMS microphone
The IMP34DT05 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive
sensing element and an IC interface; the device features 64 dB signal-to-noise ratio and -26 dBFS ±3 dB
sensitivity.
The IC interface includes a dedicated circuit able to provide a digital signal externally in PDM format.
RELATED LINKS
Visit the product web page for the IMP34DT05 digital MEMS microphone
2.2Processing and connectivity
The STWIN core system board features several wired and wireless connectivity options and the STM32L4R9ZI
ultra-low-power microcontroller, which is part of the STM32L4+ series MCUs based on the high-performance Arm
Cortex-M4 32-bit RISC core, operating at up to 120 MHz and equipped with 640 Kb SRAM and 2 MB Flash
memory.
UM2622 - Rev 6
page 7/43
USART2
STM32L4R9ZIJ6
Microcontroller
Ultra Low Power
Cortex M4F@120MHz
32 kHz
Crystal
16 MHz
Crystal
SPBTLE-1S
BLE Application
Processor Module
STR485LV
RS485 Interface
SPI2
SPI1
Secure
Processing
Connectivity
STEVAL-STWINWFV1
12-pin male com.
connector
Processing and connectivity
Figure 10. Main connectivity components and the STM32L4R9ZI processing unit
UM2622
Each connectivity component is connected to an independent bus on the STM32L4R9ZI MCU, so they can all be
configured individually
10 authentication and brand protection secure solution
UM2622
Processing and connectivity
2.2.1STM32L4R9ZI Cortex-M4F 120MHz 640Kb RAM
The STM32L4R9ZI devices is an ultra-low-power microcontroller (STM32L4+ Series MCU) based on the highperformance Arm Cortex-M4 32-bit RISC core, which operates at a frequency of up to 120 MHz.
The Cortex-M4 core features a single-precision floating-point unit (FPU), which supports all the Arm singleprecision data-processing instructions and all the data types. The Cortex-M4 core also implements a full set of
DSP (digital signal processing) instructions and a memory protection unit (MPU) which enhances application
security
These devices embed high-speed memories (2 Mbytes of Flash memory and 640 Kbytes of SRAM), a flexible
external memory controller (FSMC) for static memories (for devices with packages of 100 pins and more), two
OctoSPI Flash memory interfaces and an extensive range of enhanced I/Os and peripherals connected to two
APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.
The MCU embeds several protection mechanisms for embedded Flash memory and SRAM: readout protection,
write protection, proprietary code readout protection and a firewall.
These devices offer a fast 12-bit ADC (5 Msps), two comparators, two operational amplifiers, two DAC channels,
an internal voltage reference buffer, a low-power RTC, two general-purpose 32-bit timer, two 16-bit PWM timers
for motor control, seven general-purpose 16-bit timers, and two 16-bit low-power timers. The devices support four
digital filters for external sigma delta modulators (DFSDM). In addition, up to 24 capacitive sensing channels are
available.
They also feature standard and advanced communication interfaces such as:
•Four I2Cs
•Three SPIs
•Three USARTs, two UARTs and one low-power UART
•Two SAIs
•One SDMMC
.
UM2622 - Rev 6
page 9/43
•One CAN
•
One USB OTG full-speed
•Camera interface
•DMA2D controller
The device operates in the -40 to +85 °C (+105 °C junction) and -40 to +125 °C (+130 °C junction) temperature
ranges from a 1.71 to 3.6 V for VDD power supply when using internal LDO regulator and a 1.05 to 1.32 V V
power supply when using external SMPS supply. A comprehensive set of power-saving modes allows the design
of low-power applications.
Some independent power supplies are supported, such as an analog independent supply input for ADC, DAC,
OPAMPs and comparators, a 3.3 V dedicated supply input for USB and up to 14 I/Os, which can be supplied
independently down to 1.08 V. A VBAT input allows backup of the RTC and the registers. Dedicated V
supplies can be used to bypass the internal LDO regulator when connected to an external SMPS.
RELATED LINKS
Visit the product web page for the STM32L4R9ZI micrcontroller
2.2.2SPBTLE-1S application module for Bluetooth v4.2
The SPBTLE-1S is a Bluetooth low energy system-on-chip application processor certified module, compliant with
BT specifications v4.2 and BQE qualified. It supports multiple roles simultaneously and can act as a Bluetooth
smart master and slave device at the same time.
The module is based on the BlueNRG-1 system-on-chip, with the entire Bluetooth low energy stack and protocols
embedded in the module to provide a complete RF platform in a tiny form factor. The integrated radio, embedded
antenna and high frequency oscillators complete the certified solution that can help minimize the time to market of
final applications.
The SPBTLE-1S can be powered directly with a pair of AAA batteries or any power source from 1.7 to 3.6 V.
The RF power emitted is +5 dBm.
The RF channel center frequency of the module is 2402~2480 MHz.
UM2622
Processing and connectivity
DD12
power
DD12
RELATED LINKS
Visit the product web page for the SPBTLE-1S application module for Bluetooth v4.2
2.2.3STEVAL-STWINWFV1 Wi-Fi expansion (not included in the kit) for the SensorTile wireless
industrial node (STWIN) kit
The STEV
Wireless Industrial Node (STWIN) kit.
Through the CN3 connectivity expansion connector, the STEVAL-STWINWFV1 can be plugged into the STWIN
core system board.
It is based on the ISM43362-M3G-L44-E Wi-Fi module and its main features are:
•802.11 b/g/n compatible
•based on Broadcom MAC/Baseband/Radio device
•fully contained TCP/IP stack
•host interface: SPI up to 25 MHz
The RF power emitted is +9 dBm (limited by firmware).
The module operating band is 2400 MHz ~ 2483.5 MHz (2.4 GHz ISM Band).
AL-STWINWFV1 expansion board (sold separately) adds 2.4 GHz Wi-Fi connectivity to the SensorTile
RELATED LINKS
Visit the product web page for further details on the STEVAL-STWINWFV1
2.2.4STR485LV 3.3V RS485 up to 20Mbps
The STR485 is a low power differential line transceiver for RS485 data transmission standard applications in halfduplex mode. Data and enable signals are compatible with 1.8 V or 3.3 V supplies.
UM2622 - Rev 6
page 10/43
UM2622
Power management
Two speeds are selectable via the SLR pin: fast data rate up to 20 Mbps or slow data rate up to 250 kbps for
extended cables.
Excessive power dissipation caused by bus contention or faults is prevented by a thermal shutdown circuit that
forces the driver outputs into a high impedance state. The receiver has a fail-safe feature that guarantees a high
output state when the inputs are left open, shorted or idle.
RELATED LINKS
Visit the product web page for the STR485LV 3.3V RS485 up to 20Mbps
2.2.5USB connector
The Micro-USB connector on the board can be used for both power supply and data transfer (USB Device only).
Dif
ferent examples of USB class implementation can be found in STSW-STWINKT01 software package.
2.2.6STSAFE-A110 (footprint only) authentication, state-of-the-art security for peripherals and IoT
devices
The STSAFE-A1
data management services to a local or remote host. It consists of a full turnkey solution with a secure operating
system running on the latest generation of secure microcontrollers.
The STSAFE-A110 can be integrated in IoT devices, smart-home, smart-city and industrial applications,
consumer electronics devices, consumables and accessories.
10 is a highly secure solution that acts as a secure element providing authentication and secure
RELATED LINKS
Visit the product web page for the STSAFE-A110 authentication, state-of-the-art security for peripherals and IoT devices
2.2.7microSD card socket
On the bottom side of the STWIN core system board is a microSD Card socket that is accessible even when the
board is mounted in the plastic box. The card is accessed through a 4-bit wide SDIO port for maximum
performance.
A couple of firmware examples involving high speed data logging on the SD card are available in the STSW
STWINKT01 software package.
2.2.8Clock sources
There are two external clock sources on the STWIN core system board:
•
X1: 16 MHz high speed external (HSE) oscillator for the MCU.
•X2: 32.768 kHz low speed external (LSE) oscillator for the RTC embedded in the MCU.
2.3Power management
The STWIN core system board includes a range of power management features that enable very low power
consumption in final applications.
The main supply is through a lithium ion polymer battery (3.7 V
(STBC02) with Vin [4.8 -5.5 V].
-
, 480 mAh) and the integrated battery charger
UM2622 - Rev 6
page 11/43
Figure 12. Power and protection components
STM32L4R9ZIJ6
Microcontroller
Ultra Low Power
Cortex M4F@120MHz
LDK130
Low Noise LDO
ESDALC6V1-1U2
Single Line ESD
protection
USBLC6-2P6
USB ESD protection
EMIF06-MSD02N16
EMI filter and ESD
protection
ST1PS01EJR
step-down
switching regulator
STBC02
Li-Ion linerar
battery charger
UM2622
Power management
Figure 13. Power and protection component locations
U1: EMIF06-MSD02N16
U10: LDK130 300 mA very low noise LDO
U14, U16: ST1PS01 400 mA Synchronous step-down converter
U15: STBC02 Li-Ion linear battery charger
U18: USBLC6-2 low capacitance ESD protection for USB
D1, D2, D3: Single-line low capacitance Transil for ESD protection
D4: Power Schottky rectifier (1A)
BATT: Battery connector
J4: Battery pins
J5: 5V Ext power supply connector
J6, J7, J9, J10: Current monitoring SMD jumper
PWR: Power button
6-line EMI filter and ESD protection for T-Flash and microSD card interfaces
UM2622 - Rev 6
page 12/43
2.3.1Battery connectors
321
2
1
VBAT
BAT_NTC
GND
VBAT
GND
STWIN core system board
USB
3V3 DCDC
U14
CN3 (Wi-Fi)
STSAFE
5V
SYS (5V or VBAT)
CN2
(AMicArray)
CN2
CN1
VBAT
J5
STBC02
Battery
Charger
Analog Mic
OpAmp
U10
2.7 LDO
DCDC_1
DCDC_2
3V3_Ext
U16
3V3 DCDC
VEXT
J3
µSDCard
RS485
SYS
V_USB
5V
STM32L4+
Sensors
BLE
The battery supply voltage (VBAT) may be provided by connecting the 480 mA LiPo battery included in the
STWIN kit to the dedicated battery connector
UM2622
Power management
, or by supplying an external voltage through the J4 connector.
Figure 14. Battery and J4 connectors for VBAT supply
2.3.2Power supply
The STWIN core system board can receive power from different sources:
V_USB: through micro USB connector [5 V]
•
•Vin: through J5 connector [4.8-5.5 V]. The current on this port needs to be limited to 2 A
•VBAT: lithium ion polymer battery (3.7 V, 480 mAh), STBC02 battery charger integrated in the board
The battery is always optional. The STBC02 battery charger automatically checks the available power inputs and
selects one to power the system. When the battery is connected as well as one of the other sources, the STBC02
automatically charges the battery.
When battery-powered, the equipment is intended to work properly with an operating temperature of 35°C.
Without the battery, the equipment is intended to work properly with an operating temperature of 45°C.
Figure 15. Power circuits
UM2622 - Rev 6
page 13/43
2.3.3Power ON/OFF procedure
If the STWIN core system board is not powered via battery, then the board will turn on and off when you connect
and disconnect an external supply
, respectively.
Follow the steps below to power the board on and off when it is powered by a LiPo battery.
Step 1.Push the PWR button for about a second to power the board on.
Power on is managed by the STBC02 battery charger WAKE-UP hardware feature.
Step 2.Push the PWR button again to turn the board off.
In the application code examples provided with the software, the microcontroller detects the push
action and activates the battery charger SHUTDOWN command to switch the power supply off.
2.3.4Power consumption evaluation
There are several test points and jumpers on the STWIN core system board available to monitor the electrical
performance of running applications. In particular
in each of the four main power supply domains on the board.
The best way to evaluate general power consumption is to remove both the battery and the USB cable and
provide 5 V directly on the J5 connector.
J6: Sensor current monitoring
J4: Battery supply
J7: STM32 digital power supply current monitoring
J9: SPBTLE-1S BLE module current monitoring
J10: STEVAL-STWINWFV1 (Wi-Fi expansion) and STSAFE-A110 current monitoring
TP1, TP2: GND
TP3: DCDC_1 (3.3V)
UM2622
Power management
, there are four jumpers for monitoring the current consumption
Figure 16. Power monitoring points
UM2622 - Rev 6
page 14/43
2.4Buttons, LEDs and connectors
140
Figure 17. Buttons, LEDs and connectors
USR: User button
PWR: connected to the STBC02 for integrated W
RESET: connected to STM32 MCU reset pin (BLACK)
LED_C: Red LED connected to STBC02 and used for battery status feedback
LED1: Green LED connected to STM32
LED2: Orange LED connected to STM32
CN1: 40-pin flex general purpose expansion
CN2: STMod+ connector
CN3: 12-pin male connectivity expansion connector, suitable for the STEVAL-STWINWFV1 expansion board
CN4: 12-pin female sensor expansion connector, suitable for the STEVAL-STWINMAV1 analog microphone array expansion
board
Batt
UM2622
Buttons, LEDs and connectors
AKE-UP function and the STM32L4R9ZI MCU as generic USR button
2.4.1Flex expansion connector
This is a general purpose expansion connector.
Pin No.DescriptionSTM32 pinDefault Signal
1USART3_CTSPB13-
2STMOD2PD8/ PC3USART3_TX/ SPI2_MOSI
3STMOD3PD9/ PD3USART3_RX/ SPI2_MISO
4STMOD4PD1/ PB1SPI2_CLK/ USART3_RTS
5GND--
6VEXT--
Figure 18. CN1 Flex connector top view
able 1. CN1 pin descriptions
T
UM2622 - Rev 6
page 15/43
Pin No.DescriptionSTM32 pinDefault Signal
7I2C4_SCLPD12-
8SPI2_MOSI_p2PB15-
9SPI2_MISO_p2PC2-
10I2C4_SDAPD13-
11PC5/WKUP5PC5WKUP5
12EX_RESETPD11-
13EX_ADCPA5-
14EX_PWMPA15-
15VEXT--
16GND--
17PG12PG12EX_CN (ex tint)
18PG10PG10TIM
19PG9PG9TIM
20PB14PB14TIM, DSFDMD2
21PA9PA9-
22PA10PA10-
23PB11PB11DSI_TE,TIM,LPUART_TX
24PC13PC13TAMP, WKUP
25PB9PB9
26PB8PB8
27PE9PE9TIM, DSFDMCLK
283V3_Ext--
29DSI_D1_N-
30DSI_D1_P-
31GND--
32DSI_D0_N-
33DSI_D0_P-
34SYS--
35DSI_CLK_N-
36DSI_CLK_P-
373V3_Ext--
38PA0PA0ADC_IN5
39PA1PA1ADC_IN6
40SYS--
CAN, TIM, DSFDM,I2C1
STM32 Display Serial Interface (DSI) Host
STM32 Display Serial Interface (DSI) Host
STM32 Display Serial Interface (DSI) Host
UM2622
Buttons, LEDs and connectors
SAI2
UM2622 - Rev 6
RELATED LINKS
View the vendor documentation on handling FH34SRJ series connectors
page 16/43
2.4.2STMod+ connector
UM2622
Buttons, LEDs and connectors
Figure 19. STMod+ connector top views
DaughterboardHost board
Male connectorFemale connector
10
9
8
7
6
5
4
3
2
1
20
19
18
17
16
15
14
13
12
11
PCB
Edge
Border
PCB
Edge
Border
7.62 mm2.77 mm
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Table 2. STMod+ connector pin assignments and descriptions
If two functions are provided on a STMod+ connector pin, you can connect two different I/O ports from STM32: the firmware
20
manages the conflicts that may arise. MOSIs means used in Serial Daisy Chained-SPI mode and MOSIp means used in
Parallel SPI mode. More alternate functions may be available from STM32, refer to the User manual of the host board and
the corresponding STM32 datasheet available on www.st.com.
2. Instead of SPIx_NSS, a GPIO can be used as SPI Chip Select.
3. Pins 2 and 8 are the same SPIx_MOSI signals, but they must come from two different I/O ports.
(1)
Ty_CTS
/ UAR
(3)
Ty_TX Output / Output
/ UAR
(4)
Ty_RX Input / Input
/ UAR
(5)
(3)
Output
(4)
Input / Output
(5)
of the primary host mapped
Description
Output / Input
Output / Output
Input / Input
Power supply
Output
Input / Output
Input
Power supply
Output / Input
Output / Input
Output / Input
Output / Input
UM2622 - Rev 6
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4. Pins 3 and 9 are the same SPIx_MISO signals, but they must come from two different I/O ports.
b6b1
a6a1
b6b1
a6a1
5.
Power Supply is Output or Input, depending on host / daughterboard configuration.
6. INT is an interrupt line.
7. GPIO ports with many alternate functions (like UART, I²C, SPI and analog inputs/outputs) are privileged to offer optimum
flexibility.
RELATED LINKS
Read TN1238: STMod+ interface specification available on the ST website for more information
2.4.3Connectivity expansion connector
Figure 20. CN3 connectivity connector top view
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Buttons, LEDs and connectors
This connector is suitable for the STEVAL-STWINWFV1 Wi-Fi expansion board.
PinDescriptionSTM32 pinPinDefault SignalSTM32 pin
a1GND-b1WIFI_DRDYPE11
a2CS/USART3_CTSPB13b2WIFI_WAKEUPPD7
a3SPI1_CLK/USART3_RTSPB1b3WIFI_BOOT0PF12
a4SPI1_MISO/USART3_RXPD9b4WIFI_RSTPC6
a5SPI1_MOSI/USART3_TXPD8b5I2C3_SDAPG8
a63V3 Output (VDD_WIFI)-b6I2C3_SCLPG9
2.4.4Sensor expansion connector
Table 3. CN3 pin descriptions
Figure 21. CN4 sensor connector top view
This connector is suitable for the STEV
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AL-STWINMAV1 analog microphone expansion board.
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PinDescriptionSTM32 pinPinDefault SignalSTM32 pin
a15V/Batt Output-b1DFSDM1_D7PB10
a23V3 Output-b2DFSDM1_CKOUTPE9
a3SAI1_FS_A - DFSDM_D3PE4b3I2C2_SCLPF1
a4GND-b4I2C2_SDAPF0
a5SAI1_SD_A/ SAI1_SD_B/DFSDM_D2PE6b5SAI1_SCK_APE5
a6GND-b6SAI1_MCLK_A/DFSDM_D5PE2
2.5Protective plastic box
The plastic case is designed to protect and hold the STWIN core system board and the LiPo battery together.
The case can also house two magnets (not included in the STEV
wireless industrial node on appropriate metallic areas in the monitored equipment.
RELATED LINKS
The system was tested with the following 25x8x3mm magnets
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Protective plastic box
Table 4. CN4 pin descriptions
AL-STWINKT1 kit), allowing you to stick the
2.6STLINK-V3MINI debugger and programmer for STM32
The STLINK-V3MINI is a standalone debugging and programming mini probe for STM32 microcontrollers, with
AG/SWD interfaces for communication with any STM32 microcontroller located on an application board.
JT
It provides a Virtual COM port interface for host PCs to communication with target MCUs via UART.
The STLINK-V3MINI is supplied with an STDC14 to STDC14 flat cable.
Figure 22. STLINK-V3MINI and STDC14 cable
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3How to program the board
3.1How to program STWIN with STLINK-V3MINI
Follow the procedure below to program the STWIN core system board.
Step 1.Connect the STWIN core system board to the STLINK-V3MINI programmer using the 14-pin flat cable.
The programmer and the cable are included in the STEV
Step 2.Connect both the boards to a PC using micro USB cables.
Figure 23. STLINK-V3MINI connected to STWIN core system board
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How to program the board
AL-STWINKT1 hardware kit.
Step 3.Download the firmware onto the core system board; you can either:
–
download one of the sample application binaries provided using STM32CubeProgrammer or ST-
LINK Utility
–recompile one of the projects with your preferred IDE (EWARM, Keil, STM32CubeIDE)
3.2How to program STWIN without STLINK-V3MINI using STM32CubeProgrammer
"USB mode"
The STEV
To enter "Firmware upgrade" mode you must follow the procedure below:
Step 1.Unplug the STWIN core system board.
Step 2.Press the USR button.
Step 3.While keeping the button pressed, connect the USB cable to the PC.
AL-STWINKT1 can also be reprogrammed via USB using the STM32CubeProgrammer "USB mode".
Now the board is in DFU mode.
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How to program STWIN without STLINK-V3MINI using STM32CubeProgrammer "USB mode"
Step 4.Y
ou can upgrade the firmware by following the steps below:
Step 4a. Open STM32CubeProgrammer.
Step 4b. Select [USB] on the top-right corner.
Figure 24. STM32CubeProgrammer - USB mode selection
Step 4c. Click on
[Connect].
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How to program STWIN without STLINK-V3MINI using STM32CubeProgrammer "USB mode"
Figure 25. STM32CubeProgrammer - connection
Step 4d. Go to the [Erasing & Programming] tab.
Step 4e. Search for the new .bin or .hex binary file to be flashed into the board.
Step 4f.Click on
[Start Programming].
Figure 26. STM32CubeProgrammer - programming
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4STWIN assembly steps
To assemble your SensorTile Wireless Industrial Node, you need the following components:
•
STWIN core system board
•4x M3 bolts and nuts
•Plastic box (2 parts)
•Battery
•2x Magnets (optional - not included in the kit):
–RS Stock No. 177-4040 Brand Eclipse Mfr Part No.N859
Figure 27. Exploded cad drawing of STWIN node components
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STWIN assembly steps
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STWIN assembly steps
Step 1.(Optional) Insert the magnets in the rectangular recesses in the bottom of the main case.
Figure 28. Optional magnets inserted in main case
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Step 2.Slide the U-shaped bracket into the main case.
This will secure the magnets if they are present.
Step 3.Insert the STWIN core system board with the correct orientation.
Figure 29. Core system board inserted in main case
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STWIN assembly steps
Step 4.Fasten the core system board to the case using the nuts and bolts provided with the kit.
Figure 30. Core system board fastened with bolts
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UM2622
How to run the default Predictive_Maintenance_BLE application
5How to run the default Predictive_Maintenance_BLE application
The Predictive_Maintenance_BLE application is part of the FP-IND-PREDMNT1STM32Cube function pack.
It allows developing a sensor node for condition monitoring and predictive maintenance applications, featuring
digital or analog microphone, environmental and motion sensors, and performing real-time monitoring of
parameters and equipment status via BLE connectivity
It also shows an example of the signal processing (MotionSP) middleware for vibration analysis in time domain
(speed RMS and acceleration peak) and frequency domain (FFT with programmable size, averaging, overlapping
and windowing).
Predictive_Maintenance_BLE is compatible with STBLESensor application for Android/iOS.
The software gathers the temperature, humidity, pressure, audio, motion sensor drivers for the HTS221,
LPS22HH, MP23ABS1, IIS3DWB, ISM330DHCX devices.
When you first press the reset button, the Predictive_Maintenance_BLE application:
•checks whether all the sensors are present and working
•reads the Meta Data Manager
•initializes the connectivity and creates a random BLE MAC address
•initializes the BLE hardware service (adding the temperature, humidity, pressure, 3Dgyroscope, 3D
magnetometer, 3D accelerometer and microphone characteristics) and the BLE software service
•initializes the BLE console service adding the stdin/stdout and stderr characteristics
•shows the vibration parameter values present in the Flash memory and sets the accelerometer parameters
For control and debugging, you can link the STWN core system to the PC through a USB cable and set a terminal
window up for the appropriate UART communication port, used to control the initialization and the execution
phases, setting the parameteres as follows: 8N1, 115200 bauds, no hardware flow control, line endings LF or CRLF (Transmit) and LF (receive).
When an Android/iOS device is connected to the STWIN Core System board, you can control data transmitted
through the board.
28-Sep-20205Updated Section 2.3 Power management and Section 2.3.2 Power Supply.
13-Nov-20206
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Table 6. Document revision history
Updated Section 2.1 Sensing and Section 2.1.6 IIS3DWB ultra-wide bandwidth (up to 6 kHz),
lownoise, 3-axis digital vibration sensor
Added Section 4 How to run the default Predictive_Maintenance_BLE application.
Updated Figure 1. STEVAL-STWINKT1 SensorTile Wireless Industrial Node, Section 2.2.5 STSAFEA110 (footprint only) authentication, state-of-the-art security for peripherals and IoT devices, Section
5 Schematic diagrams and Section 6 Bill of materials.
Updated Section 2.3.2 Power Supply.
Added Section 3.1 How to program STWIN with STLINK-V3MINI and Section 3.2 How to program
STWIN without STLINK-V3MINI using STM32CubeProgrammer "USB mode".
Updated Section 2.2 Processing and connectivity and Section 2.2.2 SPBTLE-1S application
module for Bluetooth v4.2.
Added Section 2.2.3 STEV
SensorTile wireless industrial node (STWIN) kit.
AL-STWINWFV1 Wi-Fi expansion (not included in the kit) for the
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