STMicroelectronics STEVAL-STLKT01V1 User Manual

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www.st.com
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User manual
Getting started with the STEVAL-STLKT01V1 SensorTile
integrated development platform
Introduction
The STEVAL-STLKT01V1 development kit for the STEVAL-STLCS01V1 SensorTile board is a highly integrated development platform with a broad range of functions aimed at improving system design cycles and accelerating the delivery of results.
The tiny SensorTile core system board (13.5 x 13.5 mm) embeds high-accuracy and very-low-power inertial sensors, a barometric pressure sensor and a digital MEMS top-port microphone. The onboard 80-MHz MCU features a dedicated hardware microphone interface and ultra-low-power support. The wireless network processor provides Bluetooth Smart connectivity and the integrated balun maximizes RF performance for minimum size and design effort.
The kit includes a cradle expansion board for software and system architecture design support and a compact cradle host featuring a battery charger and SD card interface for on-field testing and data acquisition; both boards come complete with SWD programming interfaces.
The system accomplished the RF Test for FCC certification (FCC ID: S9NSTILE01) and IC certification (IC ID: 8976C-STILE01).
Figure 1: SensorTile functional block diagram
The BLUEMICROSYSTEM firmware provides a complete framework to build wearable applications. The BlueMS™ application based on the BlueST-SDK protocol allows data streaming and a serial console over BLE controls the configuration parameters for the connected boards.
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Contents
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Contents
1 Getting started ................................................................................. 5
1.1 Overview ........................................................................................... 5
1.2 Package components ........................................................................ 5
1.3 Initial setup with pre-loaded demo ..................................................... 6
1.4 System requirements ........................................................................ 8
2 STEVAL-STLCS01V1 hardware description .................................. 9
2.1 Power supply ................................................................................... 10
3 STLCX01V1 hardware description ............................................... 12
3.1 Power supply ................................................................................... 13
3.2 USB device ..................................................................................... 13
3.3 Audio DAC ...................................................................................... 13
3.4 Solder bridge details ....................................................................... 13
4 STLCR01V1 hardware description ............................................... 15
4.1 Power supply ................................................................................... 16
4.2 SensorTile and cradle assembly in form factor case ....................... 17
5 SensorTile programming interface .............................................. 18
6 Sensors and Bluetooth low energy connectivity ........................ 20
6.1 LSM6DSM ....................................................................................... 20
6.2 LSM303AGR ................................................................................... 20
6.3 LPS22HB ........................................................................................ 20
6.4 MP34DT04 ...................................................................................... 20
6.5 BLUENRG-MS ................................................................................ 21
6.6 BALF-NRG-01D3 ............................................................................ 21
7 Board schematic and bill of materials ......................................... 22
7.1 Bill of materials ................................................................................ 22
7.2 Schematic diagrams ........................................................................ 26
8 Formal notices required by the U.S. Federal Communications
Commission ("FCC") ............................................................................. 30
9 Formal notices required by the Industry Canada ("IC") ............. 31
10 Revision history ............................................................................ 32
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List of tables
Table 1: STEVAL-STLCS01V1 main components ..................................................................................... 9
Table 2: STEVAL-STLCS01V1 pinout ...................................................................................................... 10
Table 3: STLCX01V1 main components .................................................................................................. 12
Table 4: STLCX01V1 solder bridge details .............................................................................................. 13
Table 5: STLCR01V1 main components .................................................................................................. 15
Table 6: STEVAL-STLCS01V1 bill of materials ........................................................................................ 22
Table 7: STLCX01V1 bill of materials ....................................................................................................... 23
Table 8: STLCR01V1 bill of materials ....................................................................................................... 24
Table 9: Document revision history .......................................................................................................... 32
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List of figures
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List of figures
Figure 1: SensorTile functional block diagram ........................................................................................... 1
Figure 2: SensorTile kit blister .................................................................................................................... 6
Figure 3: Orientation of SensorTile and cradle expansion connectors ....................................................... 7
Figure 4: SensorTile mounted on cradle expansion ................................................................................... 7
Figure 5: STEVAL-STLCS01V1 main components and pinout .................................................................. 9
Figure 6: STEVAL-STLCS01V1 power supply block diagram .................................................................. 11
Figure 7: STLCX01V1 main components ................................................................................................. 12
Figure 8: STLCR01V1 cradle main components ...................................................................................... 15
Figure 9: SensorTile soldered onto cradle board ..................................................................................... 16
Figure 10: Battery connection and power switch ...................................................................................... 16
Figure 11: SensorTile and cradle in plastic case ...................................................................................... 17
Figure 12: STM32 Nucleo board, cradle and cradle expansion SWD connectors ................................... 18
Figure 13: SWD connections with 5-pin flat cable .................................................................................... 19
Figure 14: STEVAL-STLCS01V1 schematic diagram (1 of 2) .................................................................. 26
Figure 15: STEVAL-STLCS01V1 schematic diagram (2 of 2) .................................................................. 27
Figure 16: STLCX01V1 schematic diagram ............................................................................................. 28
Figure 17: STLCR01V1 schematic diagram ............................................................................................. 29
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1 Getting started
1.1 Overview
STEVAL-STLKT01V1 is the development kit includes everything you need to remotely sense and measure motion, environmental and acoustic parameters. It is designed to support the prototyping phases of new projects and can be used in the contexts below.
An evaluation system Evaluate high accuracy and very low power ST sensors in an optimized system
architecture
Field-test data fusion and embedded signal processing algorithms  Deploy data collection campaigns to support custom algorithm development
Reference design
Compact solution for high-accuracy, low-power motion, environmental and audio
sensor data in compact form-factor designs
Complete hardware and software examples form the starting point for new designs
with:
hardware: schematics, Gerber, BoM, 3D CAD  software: from basic examples (starter firmware) to complete applications
(BLUEMICROSYSTEM)
Embedded software development kit
Source code project examples based on the STM32Cube architecture  Fully compatible with the Open.Software embedded processing libraries, and
supported by the STM32 ODE
host board implements the Arduino UNO R3 expansion connector to enable bridging
to well-known development ecosystems such as STM32 ODE and Arduino Fast prototyping tool Plug or solder onto your prototype motherboard to instantly add its embedded sensing
and communication functions to your design Use the 3D CAD files to integrate the SensorTile in your mechanical design
1.2 Package components
Inside the STEVAL-STLKT01V1 package, you will find all the components needed to experience the demo on this optimized platform and to start developing you application
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Figure 2: SensorTile kit blister
1.3 Initial setup with pre-loaded demo
The easiest thing to do after unpacking is to run the preloaded software using the SensorTile board together with the cradle expansion (STLCX01V1).
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1
Take the SensorTile and plug it on the cradle expansion through the dedicated connector. Take care to match the orientation shown below
Figure 3: Orientation of SensorTile and cradle expansion connectors
Figure 4: SensorTile mounted on cradle expansion
2
Connect a USB type A to mini-B USB cable to turn ON the board for the first time, verify that the J2 jumper is in position 2-3 (power supply from USB). If everything works fine
then you’ll see the SensorTile LED blinking approximately every 2 seconds.
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The board is now ready to connect to the “ST BlueMS” mobile App: available on official stores for Android or iOS. For more details on the embedded software and the apps, please refer to the BLUEMICROSYSTEM2 documentation on www.st.com/bluemicrosystem.
1.4 System requirements
As the STEVAL-STLKT01V1 is already programmed with BLUEMICROSYSTEM firmware, to run the demo, you only need:
A smartphone or tablet with minimum Android™ 4.4 or iOS™ 8.0 operating systems
and minimum BLE technology 4.0 A USB type A to mini-B USB cable for power supply (connected to a PC, AC adapter
or any other source) To start designing your own project, you will need: A Windows™ PC (ver. 7 or higher) with an IAR, KEIL or AC6 firmware development
environment A USB type A to Micro USB male cable to connect the STEVAL-STLKT01V1 to the
PC for power supply An STM32 Nucleo board with ST-Link V2.1 in-circuit debugger/programmer
(preferred) or other compatible device The ST-LINK Utility for firmware download (latest embedded software version on
www.st.com)
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Reference
Device
Description
A
MP34DT04
MEMS audio sensor digital microphone
B
LD39115J18R
150 mA low quiescent current low noise LDO 1.8 V
C
STM32L476JGY6
ARM Cortex-M4 32-bit microcontroller
D
LSM6DSM
iNEMO inertial module: low-power 3D accelerometer and 3D gyroscope
E
LSM303AGR
Ultra-compact high-performance eCompass module: ultra-low power 3D accelerometer and 3D magnetometer
F
LPS22HB
MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer
G
BlueNRG-MS
Bluetooth low energy network processor
H
BALF-NRG-01D3
50 Ω balun with integrated harmonic filter
2 STEVAL-STLCS01V1 hardware description
STEVAL-STLCS01V1 (SensorTile) is a highly integrated reference design that can be plugged into form-factor prototypes, adding sensing and connectivity capabilities to new designs through a smart hub solution. It can also easily support development of monitoring
and tracking applications as standalone sensor nodes connected to iOS™/Android™
smartphone applications. The SensorTile occupies a very small 13.5x13.5 mm square outline, with all the electronic
components on the top side and small connector on the bottom side to plug it onto the cradle expansion board. The connector pinout is repeated on 18 PCB pads that render the SensorTile a solderable system on module as well.
The figure below and following two tables provide the main board component and pinout details.
Figure 5: STEVAL-STLCS01V1 main components and pinout
Table 1: STEVAL-STLCS01V1 main components
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Board
pin
CONN
pin
Pin name
MCU pin
Main functions
(1)
1
2
MIC_CLK
PC2
DFSDM1_CKOUT, ADC
2
4
VDD_OUT
VDD/VBAT
1.8V from onboard LDO
3
6
VIN / Power supply for LDO [2V-5.5V]
4
8
VDDUSB
VDDIO2 VDDUSB
Power supply for USB peripheral and VDDIO2 [1.8V-3.3V]
5
10
GND
VSS
Ground 6 12
RXD/USB_DP
PD2/PA12
USART5 RX or USB_OTG_FS DP
(2)
7
14
TXD/USB_DM
PC12/PA11
USART5 TX or USB_OTG_FS DM 1
8
16
SAI_CLK
PG9
(3)
SAI2_SCK_A, SPI3_SCK
9
15
SAI_FS
PG10
(3)
SAI2_FS_A, SPI3_MISO
10
13
SAI_MCLK
PG11
(3)
SAI2_MCLK_A, SPI3_MOSI
11
11
SAI_SD
PG12
(3)
SAI2_SD_A, SPI3_NSS
12
9
GPIO2
PB8/PB9/PC1
DFSDM_DATIN6, I2C3_SDA
13
7
GPIO3
PC0
DFSDM_DATIN4, I2C3_SCL
14
5
NRST
NRST
STM32 Reset
15
3
SWD_CLK
SWD Programming interface clock
16
1
SWD_IO
SWD Programming interface IO
17
/
GND
Ground
18
/
GND
Ground
Notes:
(1)
Refer to STM32L476 Datasheet on www.st.com for the complete set of functions of each pin
(2)
USB_OTG_FS Peripheral is functional for VDDUSB ≥ 3V
(3)
Logic level of this pins is referred to VDDIO2
Table 2: STEVAL-STLCS01V1 pinout
2.1 Power supply
The SensorTile board has the following input supply pins:
1. VIN is the input for the onboard voltage regulator generating 1.8 V (150 mA max).
2. VDDUSB is an input for the STM32L4 VDDUSB and VDDIO2 pins (to use the
STM32L4 USB OTG peripheral, VDDUSB must be ≥ 3 V) VDD is an output for 1.8 V. If the USB peripheral and other 3.3 V signals are not needed for a particular application,
you can connect VDD to VDDUSB so that one power supply can power the whole system. This connection can be done externally (e.g., SB8 on STLCX01V1) or by soldering a 0 resistor on R2 (bottom layer).
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Figure 6: STEVAL-STLCS01V1 power supply block diagram
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STLCX01V1 hardware description
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Reference
Device
Description
A
SensorTile connector and footprint
To plug or solder the SensorTile board
B
Arduino UNO R3 UNO R3 connector
For STM32 Nucleo board compatibility
C
ST2378ETTR
8-bit dual supply 1.71 V to 5.5 V level translator
D
micro-USB connector, USBLC6-2P6 (U1), LDK120M-R (U4)
micro USB power supply /communication port and 3.3 V voltage regulation
E
Audio DAC, phono jack
16-Bit, low-power stereo audio DAC and
3.5 mm stereo phono jack
F
SWD connector, Reset button
5-pin SWD connector for programming debugging and board reset button
3 STLCX01V1 hardware description
The SensorTile cradle expansion is an easy-to-use companion board for SensorTile and the SensorTile cradle boards included in the SensorTile Kit. The SensorTile board does not need to be soldered onto the cradle expansion board, but can be plugged onto the dedicated connector (see Figure 3: "Orientation of SensorTile and cradle expansion
connectors" and Figure 4: "SensorTile mounted on cradle expansion".
Apart from being a standalone host for the SensorTile board, the cradle expansion board can be connected to an STM32 Nucleo or other expansion board via the Arduino UNO R3 connectors to easily expand functionality.
Figure 7: STLCX01V1 main components
Table 3: STLCX01V1 main components
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Solder Bridge
SensorTile signal
Onboard signal
Arduino signal
SB1
Reset
CN8.2
SB2
(1)
GPIO3
DAC control – I2C SCL (pull-up)
SB3
(1)
GPIO2
DAC control – I2C SDA (pull-up)
SB4
(1)
SAI_SD
DAC Audio – I2S_SD
SB5
(1)
SAI_SCK
DAC Audio – I2S_SCK
SB6
(1)
SAI_FS
DAC Audio – I2S_WS
SB7
(1)
SAI_MCLK
DAC Audio – I2S_MCLK
SB8
VDDUSB
VDD – 1.8V from SensorTile
SB9
(1)
VDDUSB
3V3 from regulator
3.1 Power supply
The power is either supplied by the host PC via USB or by an external source through the Arduino UNO R3 connector (CN6.5).
Jumper J2 selects the power source for the onboard 3.3 V regulator (U4) and the SensorTile VIN pin:
position 1-2: 5 V external  position 2-3: 5 V via USB (default)
The 3.3 V output of the regulator can be routed to the Arduino UNO R3 connector to power on other external components by soldering SB18 (default OFF).
The VDDUSB pin of the SensorTile can be connected to two different power sources:
3.3 V – SB9 (default ON)  1.8 V (SensorTile VDD) – SB8 (default OFF)
3.2 USB device
The USB connector on the board can be used to supply power and for communication (USB_OTG_FS).
To use the USB peripheral, use the following solder bridge configuration:
SB10, SB11, SB20 and SB21 OFF (disconnect the signals from U5)  SB9 ON (supply 3.3 V to the USB peripheral of the STM32 MCU)
3.3 Audio DAC
The PCM1774 is a low-power stereo DAC designed for portable digital audio applications, and can be driven by the SensorTile to play any kind of Audio stream. A dedicated 3.5 mm audio jack makes it easy to connect headphones or active loudspeakers.
In order to use the onboard audio DAC (U3), the SAI (serial audio interface) and I²C signals must be routed to the component using the following configuration:
SB12, SB13, SB14, SB15, SB16 and SB17 OFF (disconnect the signals from Arduino
UNO R3 connector) SB2, SB3, SB4, SB5, SB6, SB7 ON (connect the signals to the DAC)
3.4 Solder bridge details
Table 4: STLCX01V1 solder bridge details
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Solder Bridge
SensorTile signal
Onboard signal
Arduino signal
SB10
RXD-USB_DP
Level Translator - UART_RX
CN9.2
SB11
RXD-USB_DP
Level Translator - UART_TX
CN9.1
SB12
SAI_SD
SPI_CS
CN5.3
SB13
SAI_MCLK
SPI_MOSI
CN5.4
SB14
SAI_FS
SPI_MISO
CN5.5
SB15
SAI_SCK
SPI_SCK
CN5.6
SB16
(1)
GPIO3
CN5.10
SB17
(1)
GPIO2
CN5.9
SB18
MIC_CLK
Level Translator - MIC_CLK_3V3
CN9.5
SB19
3V3 – 3V3_Nucleo
CN6.2 CN6.3
SB20
TXD-USB_DM
Level Translator - UART_RX
CN9.2
SB21
TXD-USB_DM
Level Translator - UART_TX
CN9.1
SB22
GPIO2
Level Translator - GPIO2_3V3
CN9.6
SB23
GPIO3
Level Translator – GPIO3_3V3
CN9.7
Notes:
(1)
closed by default
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Reference
Device
Description
A
SensorTile footprint
To solder the SensorTile board
B
HTS221
Capacitive digital sensor for relative humidity and temperature
C
STBC08PMR, STC3115, LDK120M-R, USBLC6-2P6
800 mA standalone linear Li-Ion battery charger with thermal regulation, Gas gauge IC, 200 mA low quiescent current very low noise LDO, very low capacitance ESD protection
D
Power on/off switch
E
SWD connector
5-pin SWD connector for programming and debugging
F
Micro USB connector, 3­pin battery connector
micro USB battery charging supply /communication port and connector for Li-Ion battery power supply
G
micro-SD card socket
4 STLCR01V1 hardware description
The SensorTile cradle is a small companion board for SensorTile, geared at the development of form factor prototypes. You need to solder the SensorTile board to this board to render the system robust.
The small cradle is ideal for applications requiring small, standalone, battery-powered sensor nodes.
Figure 8: STLCR01V1 cradle main components
Table 5: STLCR01V1 main components
Solder the SensorTile board onto the cradle board as shown in the figure below.
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4.1 Power supply
Figure 9: SensorTile soldered onto cradle board
The main board power supply is the 100 mAh lithium-Ion polymer battery attached to the appropriate connector on the PCB.
Figure 10: Battery connection and power switch
The battery can be recharged via USB connected to a PC or any micro-USB battery charger.
A red LED indicates the charging status:
steady ON: the USB plug is correctly connected and the board is charging  steady OFF: charging complete  blinking: battery not present
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The onboard STBC08 battery charger IC is configured by default with a maximum charging current of 50 mA. It is possible to modify this current by changing the R5 resistor value.
Equation 1:
𝐼
𝑐ℎ𝑟𝑔
1𝑉
=
∙ 1000
𝑅5
The default 20 kΩ value for R5 hence gives:
1𝑉
∙ 1000 = 50𝑚𝐴
20𝑘
During normal usage, the battery needs to be connected to the board for proper operation. When the battery is plugged, the board is turned ON via the SW1 switch. This switch enables LDK120 3V3 voltage regulator pin, which powers all board components.
4.2 SensorTile and cradle assembly in form factor case
Refer to the following image for the orientation of the soldered SensorTile and cradle boards in the dedicated form factor case.
Figure 11: SensorTile and cradle in plastic case
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5 SensorTile programming interface
To program the board, connect an external ST-LINK to the SWD connector on the cradle; a 5-pin flat cable is provided in the SensorTile Kit package.
The easiest way to obtain an ST-LINK device is to get an STM32 Nucleo board, which bundles an ST-LINK V2.1 debugger and programmer.
Ensure that CN2 jumpers are OFF and connect your STM32 Nucleo board to the SensorTile cradle via the cable provided, paying attention to the polarity of the connectors. Pin 1 is identified by:
a small circle on the PCB silkscreen STM32 Nucleo board and SensorTile cradle
expansion the square shape of the soldering pad connector on the SensorTile cradle.
Figure 12: STM32 Nucleo board, cradle and cradle expansion SWD connectors
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Figure 13: SWD connections with 5-pin flat cable
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Sensors and Bluetooth low energy connectivity
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6 Sensors and Bluetooth low energy connectivity
6.1 LSM6DSM
The LSM6DSM is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.65 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSM supports main OS requirements, offering real, virtual and batch sensors with 4 Kbytes for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing
processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSM has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps. The LSM6DSM fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI configurable for both gyroscope and accelerometer.
High robustness to mechanical shock makes the LSM6DSM the preferred choice of system designers for the creation and manufacturing of reliable products.
6.2 LSM303AGR
The LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. The Device has linear acceleration full scales of ±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.
The LSM303AGR includes an I2C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface. The system can be configured to generate an interrupt signal for free­fall, motion detection and magnetic field detection.
The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.
6.3 LPS22HB
The LPS22HB is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output barometer. The device comprises a sensing element and an IC interface which communicates through I²C or SPI from the sensing element to the application.
The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a dedicated process developed by ST.
The LPS22HB is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.
6.4 MP34DT04
The MP34DT04 is an ultra-compact, low-power, digital MEMS microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting
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acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
The MP34DT04 has an acoustic overload point of 120 dBSPL with a 64 dB signal-to-noise ratio and –26 dBFS sensitivity.
6.5 BLUENRG-MS
The BLUENRG-MS is a very low power Bluetooth Low Energy (BLE) single-mode network processor, compliant with Bluetooth specification v4.2. The BLUENRG-MS can act as master or slave. The entire Bluetooth low energy stack runs on the embedded ARM Cortex M0 core. The non-volatile Flash memory allows on-field stack upgrading.
The BLUENRG-MS allows applications to meet the tight advisable peak current requirements imposed with the use of standard coin cell batteries. The maximum peak current is only 8.2 mA at 0 dBm of output power. Ultra low-power sleep modes and very short transition times between operating modes allow very low average current consumption, resulting in longer battery life. The BLUENRG-MS offers the option of interfacing with external microcontrollers using SPI transport layer.
6.6 BALF-NRG-01D3
BALF-NRG-01D3 is a 50 Ω conjugate match to BLUENRG-MS (QFN32 package) that integrates balun transformer and harmonics filtering. It features high RF performances with a very small footprint and a RF BOM reduction. It has been chosen as the best trade-off for costs, area occupation and high radio performances. The layout has been optimized to suit a 4-layer design and a chip antenna.
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Board schematic and bill of materials
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Item
Q.ty
Ref
Value
Notes
Part number
Manufacturer
1 1 U1
ARM Cortex-M4 32b MCU Microcontroller
STM32L476JGY6T R
ST 2 1
U2
150 mA, 1.8 V
low quiescent current low noise LDO
LD39115J18R
ST
3 1 U9
Ultra-low Power Acc + Magn
LSM303AGRTR
ST
4 1 U10
Low-Power Accelerometer + Gyroscope
LSM6DSMTR
ST 5 1
U6
Bluetooth Low­Energy Chip V4.1 ­MS
BlueNRG-MSCSP
ST
6 1 U13
Low-Power Pressure sensor
LPS22HBTR
ST
7 1 U11
MEMS audio sensor digital microphone
MP34DT04
ST
8 1 U4
Bluetooth Low­Energy Balun Chip
BALF-NRG-01D3
ST 9 1
X2
CRYSTAL 32MHZ 8PF SMD
CX2016DB32000D 0FLJCC
AVX
10 1 X1
32.7680kHz, 20ppm, 4pF, 60kΩ
Crystal
ABS06-107-
32.768KHZ-T
Abracon
11 2 C2, C20
4pF 25V
CAP CER NP0 0201
CBR02C409B3GA C
Kemet
12 2 C12, C17
15pF 25V
CAP 0201 NP0
02013A150JAT2A
AVX
13 1 FT1
10pF 25V
CAP CER NP0 0201
250R05L100GV4T
Johanson Technology
14 1 R2
0 Ω
Resistor SMD R0402
Any
15 1 FT2
16 1 MT
0.40pF 25V
CAP CER NP0 0201
250R05L0R4AV4T
Johanson Technology
17 2 C32, C34
2.2µF 6.3V
CAP CERAMIC X5R, 0201
02016D225MAT2A
AVX
7 Board schematic and bill of materials
This section contains the bill of materials and schematics.
7.1 Bill of materials
Table 6: STEVAL-STLCS01V1 bill of materials
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Item
Q.ty
Ref
Value
Notes
Part number
Manufacturer
18 1 C9
0.22µF 6.3V
CAP CER X7S 0201
C0603X7S0J224K0 30BC
TDK
19 1 C30
150nF, 10V
CAP, MLCC, X5R, 0201
C0603X5R1A154K 030BB
TDK
20 2 C14, C31
100pF 25V
CAP CER NP0 0201
250R05L101JV4T
Johanson Technology
21 1 ANT1
2.4GHZ
ANTENNA SMD
ANT016008LCS24 42MA1
TDK
22
9
C4, C5, C10, C11, C13, C18, C29, C33,
C43
0.1µF 6.3V ±10%
CAP CER X5R 0201
GRM033R60J104K E19D
Murata
23 1 R1
560 Ω
Resistor SMD
Any
24
9
C1, C3,
C6, C7,
C8, C15,
C16, C19,
C44
1µF 6.3V
CAP CER X5R 0201
CL03A105KQ3CS NC
Samsung
25 1 LED
605 nm, 2 V, 10 mA, 50 mcd
LED, Low Power, Orange
KPG-0603SEC-TT
KINGBRIGHT
26 1 CONN
0.4mm
Connector Board­to-Board
BM10NB(0.8)­16DS-0.4V(51)
Hirose
27 1 L1
3.9nH 400mA 300 MΩ
FIXED IND
LQP03TN3N9B02D
Murata
28
1
SWD
Cable
2.54mm, L=15cm
5 pin ribbon cable
Item
Q.ty
Ref
Value
Notes
Part number
Manufacturer
1 1 CN2
BM10JC-16DP-
0.4V(53)
BM10JC-16DP-
0.4V(53)
Hirose
2 1 CN5
HEADER 10
SSQ-110-03-L-S
Samtec
3 2 CN6,CN9
HEADER 8
SSQ-108-03-L-S
Samtec
4 1 CN8
HEADER 6
SSQ-106-03-L-S
Samtec
5
5
C1,C5,C1
0,C13,C14
100nF
X7R
6 2 C4,C6
47uF, 6.3V
Tantal
7
4
C8,C9,C1
1,C12
4.7uF, >6.3V, <2 Ω ESR
Tantal
8 2 C15,C16
4.7uF, 10V
X5R
9 1 J1
PHONOJACK STEREO
35RASMT4BHNTR X
Switchcraft
10 1 J2
Header M 3x1
Table 7: STLCX01V1 bill of materials
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DocID029635 Rev 1
Item
Q.ty
Ref
Value
Notes
Part number
Manufacturer
11
4
J3,J4,J5,J
6
PCB Hole
12 1 RESET
SYS_MODE
PTS820 J20M SMTR LFS
C&K Components
13 1 R1
47kΩ ±1%
14 1 R2
147kΩ±1%
15
11
SB2,SB3, R3,SB4,R 4,SB5,SB 6,SB7,SB
9,SB16,S
B17
0R
16 2 R5,R6
4K7
17
14
SB1,SB8,
SB10,SB1
1,SB12,S
B13,SB14,
SB15,SB1
8,SB19,S
B20,SB21,
SB22,SB2
3
NC
18 1 SWD
CON5
19 1 USB
USB-MICRO
USB3075-30-A
GCT
20 1 U1
USBLC6-2P6
USBLC6-2P6
ST
21 1 U3
PCM1774RGP
PCM1774RGP
TI
22 1 U4
LDK120M-R
LDK120M-R
ST
23 1 U5
ST2378ETTR
ST2378ETTR
ST
Item
Q.ty
Ref
Value
Notes
Part number
Manufacturer
1 1 BATT
Battery Connector
78171-0003
Molex 2 1
CHRG
LED Red
3 3 C1,C8,C9
100nF
X7R
4
4
C2,C3,C6,
C7
10V, 4.7µF
X5R
6 1 C10
10V, 1µF
X5R
7 1 LED1
LED Green
8 1 R1
47kΩ±1%
9 1 R2
147kΩ±1%
10 1 R3
2kΩ
11 2 R4,R8
1kΩ
12 1 R5
20kΩ±1%
Table 8: STLCR01V1 bill of materials
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Item
Q.ty
Ref
Value
Notes
Part number
Manufacturer
13
3
R6,R7,R1
1
NC
14 1 R10
0 Ω
15 1 R9
50mΩ±1%, >=1/16W
16 1 SD
Micro-SD
DM3D-SF
Hirose
17 1 SWD
CON5
18 1 SW1
PWR
SSAJ120100
Alps Electric Co.
19 1 USB
USB-MICRO
USB3075-30-A
GCT
20 1 U1
USBLC6-2P6
USBLC6-2P6
ST
21 1 U2
STBC08PMR
STBC08PMR
ST
22 1 U3
LDK120M-R
LDK120M-R
ST
23 1 U4
STC3115IQT
STC3115IQT
ST
24 1 U5
HTS221
HTS221
ST
25 1 Battery
3.7V 100mAh
LiPO-501225 3pin connector
LiPO-501225
Himax electronics
26
1
Plastic
Box
Plastic Box
27 2 M2-Nut
HEX shape
HEX Nut M2 ­steel
RS or equivalent
28 1 M2-Screw
Pan head ­Phillips
10mm M2 Pan head Phillips ­steel
RS or equivalent
29 1 M2-Screw
Pan head ­Phillips
12mm M2 Pan head Phillips ­steel
RS or equivalent
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DocID029635 Rev 1
Decoupling Capacitors
LED
1
KPG-0603SEC-TT
GND
R1
LED
SAI_SD
1u1u 100n 100n1u
GND GNDGNDGND GND
1u
GND
1u
GND
C1C3 C4 C5C6C8 C15
VDD
VDD
VDD
VDD
VDD
VDD
VDDUSB
Crystal
ABS06-107-32.768KHZ-T
4p 4p
GND GND
X1
C2 C20
OSC32_OUT
OSC32_IN
Ultra-low-power DSP STM32L476xx Microcontroller
STM32L476JGY6
VDDUSB
A1
PA15
A2
PD2
A3
PG9
A4
PG14
A5
PB3
A6
PB7
A7
VSS1
A8
VDD
A9
VSS2
B1
PA14
B2
PC12
B3
PG10
B4
PG13
B5
VDDIO2
B6
PB6
B7
PC13
B8
VBAT
B9
PA12C1PA13C2PC11C3PG12C5PG11C4PB4C6PB5C7PC15C8PC14C9PA11D1PA10D2PC10D3BOOT0D7PH1D8PH0D9PC9E1PA8E2PA9
E3
PB8
E7
PB9
E8
NRST
E9
PC7
F1
PC8
F2
PC6
F3
PC2
F7
PC1
F8
PC0
F9
PB15
G1
PB14
G2
PB11
G3
PA1
G4
PA4
G5
PA2
G6
PC3
G7
VREF+
G8
VSSA
G9
PB12H1PB13H2PB10
H3
PA7H4PA6H5PA5H6PA3H7PA0
H8
VDDA
H9
VDD2
J1
VSS3
J2
PB2J3PB1J4PB0
J5
PC5J6PC4
J7
VDD3
J8
VSS4
J9
U1
BLUE_MOSI
BLUE_SCK
BLUE_IRQ
BLUE_MISO
BLUE_CS
BLUE_RST
GND
GND
GND GND
GND
GND
VDD
VDD
VDD
VDD
VDD
VDD
NRST
TXD-USB_DM
TXD-USB_DM
GPIO6
GPIO5
GPIO3 GPIO2
GPIO2
GPIO2
VDDUSB
VDDUSB
MIC_CLK
RXD-USB_DP
RXD-USB_DP
SAI_SCK
SAI_FS
SAI_MCLK
SAI_SD
INT2
INT2
INT2
INT2
INT2
INT2
MIC_DATA
OSC32_OUT
OSC32_IN
CS_AG
CS_M
CS_A
CS_P
SPI_CLK
SPI_SDA
TEST1
Low-Drop Out Voltage Regulator
LD39115J18
1u
VDD
GND GND
100n
GND GND1uGND
1u
VDD
VDD
VDD
0
ENA2GND
A1
INB2OUT
B1
U2
C7
C10 C16C19
R2
VDD
VIN
VDDUSB
Hirose bottom connector (optional)
BM10NB(0.8)-16DS-0.4V(51)
P1P1P2
P2
P3P3P4
P4
P5P5P6
P6
P7
P7
P8
P8
P9P9P10
P10
P11
P11
P12
P12
P13
P13
P14
P14
P15
P15
P16
P16
G2
G2
G1G1G4
G4
G3
G3
CONN
GND
GND
GND
GND
GND
VDD
NRST VIN
TXD-USB_DM
GPIO6 GPIO5
GPIO3 GPIO2
VDDUSB
MIC_CLK
RXD-USB_DP SAI_SCKSAI_FS
SAI_MCLK
SAI_SD
SWD_GND SWD_IO SWD_CLK
SWD_VDD
LP_UART_TX, I2C3_SDA, ADC_IN2, DFSDM_CKIN4 (DFSDM_DATIN6)
LP_UART_RX, I2C3_SCL, ADC_IN1, DFSDM_DATIN4
ADC_IN3, DFSDM_CKOUT
USART RX or USB DP
USART TX or USB DM
SWD_RST
SPI3_NSS, SAI2_SD_A SPI3_MOSI, SAI2_MCLK_A
SPI3_SCK, SAI2_SCK_A SPI3_MISO, SAI2_FS_A
Moon Pin output
GND
GND
GND
VDD
NRST
VIN
TXD-USB_DM
GPIO6 GPIO5
GPIO3 GPIO2
VDDUSB
MIC_CLK
RXD-USB_DP
SAI_SCK
SAI_FS SAI_MCLK
SAI_SD
+5V supply
3.0V - 3.6V supply
7.2 Schematic diagrams
Figure 14: STEVAL-STLCS01V1 schematic diagram (1 of 2)
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Digital Microphone
MP34DT04
GND
CLK
B3
DOUT
B4
GND
G1*4
LR
B2
VDD
B1
U11
GNDVDD MIC_CLK MIC_DATA
Accelerometer + Gyroscope
100n 100n
C11 C18
GND
GND
VDD
VDD
LSM6DS3H
SDO
P1
SDX
P2
SCX
P3
INT1
P4
VDDIOP5GND1P6GND2
P7
VDD
P8
INT2
P9
OCS
P10
NC
P11
CS
P12
SCL
P13
SDA
P14
U10
GND
GND
GND GND
VDD
VDD
VDD
INT2
CS_AG
SPI_CLK
SPI_SDA
Pressure Sensor
LPS22HB
SDO
P5
VDD_IO
P1
SCL
P2
CS
P6
INT/DRDY
P7
GND1
P8
GND2
P9
VDD
P10
RESP3SDA
P4
U13
GND
GND
GND
VDD
VDD
CS_PSPI_CLK
SPI_SDA
Accelerometer + Magnetometer
220n
GND
LSM303AGR
C9
SCL
P1
CS_XL
P2
CS_MAG
P3
SDA
P4
DRDY
P7
GND2
P8
VDD
P9
VDD_IO
P10
INT1
P12
INT2
P11
C1P5GND1
P6
U9
GND
GND
VDD VDD
CS_M
CS_A
SPI_CLK
SPI_SDA
BlueNRG - Bluetooth low energy chip
Tuning
Balun + chip antenna
Figure 15: STEVAL-STLCS01V1 schematic diagram (2 of 2)
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DocID029635 Rev 1
15
SH1
7
OUT
SensorTile
SAI_FS
18
2
5V
12
13
SWDIO
TILE_RESET
1
SensorTile Connector
USB, SWD, Power
RXD-USB_DP
SWDCLK
SB8
CN2
BM10B(0.8)-16DP-0.4V(51)
3
1
C15
4.7μF
6
3V3
14
3V3
GND
2
6
MIC_CLK
G3
VDDUSB
13
GPIO2
D1
1
GPIO3
SAI_MCLK
V_USB
G2
4
8
10
V_USB
VIN
RXD-USB_DP
GPIO2
J2
11
3
VIN
3
SB9
16
SAI_MCLK
Max 200mA
SAI_SCK
4
4
C16
4.7μF
2
TXD-USB_DM
5
3
EN
SensorTile Footprint
3
7
V_USB
2
VDD
ADJ
11
4
12
SWDCLK
SWDIO
TXD-USB_DM
G1
9
D3
TXD-USB_DM
3
VIN
16
5
8
14
GPIO3
D4
TILE_RESET
SH2
D2
VDD
4
IN
VDDUSB
1
USB-MICRO
1
5
MIC_CLK
17
5
VDDUSB
C1 100nF
SAI_SD
2
1
1
1
1
Fixing holes On the corners Hole: 2.2mm Head: 4mm
STM32 Nucleo
R2 147K
10
RXD-USB_DP
VBUS
5
SAI_SCK
VDD
416
RESET
3
C14
100nF
TILE_RESET
2
5
15
R1 47K
9
1
G4
VIN
SAI_FS
6
SAI_SD
GND
2
SAI_SCK
3
6
3
I2C_SCL
3V3
2
CN9
SB18
6
UART_TX
SB19
7
GPIO2_3V3
2
CN5
R5
4K7
SPI_CS
7
SB15
1
SB14 SB12
4
UART_RX
6
SB16
TILE_RESET
SAI_MCLK
5
3
4
6
5
GPIO3_3V3
SAI_FS
SPI_SCK
8
2
8
CN6
3
1
8
3V3_Nucleo
5
GPIO2
1
I2C_SDA
GPIO3
SB1
2
SPI_MOSI
5 4
R6
4K7
SPI_MISO
3V3
CN8
5V
SB17
10
SAI_SD
1
4
9
MIC_CLK_3V3
7
SB13
SWDCLK
3 4
TILE_RESET
5
SWD
1
VDD
SWDIO
2
SB10
4
2
C10 100nF
L6
11
UART_RX
6
GPIO3
SB20
SB23
L3
RXD-USB_DP
8
19
VCC
13
CC7
20
16
L5
TXD-USB_DM
CC3
14
CC1
U5
ST2378ETTR
UART_TX
L7
MIC_CLK_3V3
3
CC2
OE
TXD-USB_DM
L1
17
CC4
MIC_CLK
5
18
VDD
CC5
15
10
CC6
7
SB22
GPIO3_3V3
SB11
GPIO2_3V3
1
CC8
9
VL
VDD
C13 100nF
L8
RXD-USB_DP
L2
GPIO2
12
GND
SB21
L4
3V3
U4 LDK120M-R
ADR
1
VCOM
3
SAI_FS
SCKI
SAI_MCLK
SB5
R40R
17
19
+
3V3
AGND
+
SB4
11 P
13
MODE
5
J1
PHONOJACK STEREO
H_L
VDD
7
3V3
14
AIR
VIO
2
1
PAD
C4 47μF
4
LRCK
C11
4.7μF
16
SB2
PGND
GPIO3
DIN
SB6
3
4
SB7
C5
100nF
VCC
SAI_SCK
+
12
2
GPIO2
20
6
R30R
18
+
15
BCK
C9 4.7μF
9
SDA
C12
4.7μF
SAI_SD
3V3
8
DGND
AIL
H_R
+
SB3
10
SCL
C8 4.7μF
VPA
5
C6 47μF
+
U3 PCM1774RGP
U1 USBLC6-2P6
Figure 16: STLCX01V1 schematic diagram
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Figure 17: STLCR01V1 schematic diagram
Page 30
Formal notices required by the U.S. Federal
Communications Commission ("FCC")
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DocID029635 Rev 1
8 Formal notices required by the U.S. Federal
Communications Commission ("FCC")
Model: STEVAL-STLKT01V1 FCC ID: S9NSTILE01 Any changes or modifications to this equipment not expressly approved by
STMicroelectronics may cause harmful interference and void the user’s authority to operate
this equipment. This device complies with part 15 of the FCC rules. Operation is subject to the following
two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.
For Class A Digital Devices This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
For Class B Digital Devices This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference's by one or more of the following measures:
Reorient or relocate the receiving antenna.  Increase the separation between the equipment and the receiver.  Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Page 31
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Formal notices required by the Industry Canada
("IC")
DocID029635 Rev 1
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9 Formal notices required by the Industry Canada
("IC")
Model: STEVAL-STLKT01V1 IC: 8976C-STILE01 English: This Class A or B digital apparatus complies with Canadian CS-03. Changes or modifications not expressly approved by the party responsible for compliance
could void the user’s authority to operate the equipment. This device complies with Industry Canada licence-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
French: Cet appareil numérique de la classe A ou B est conforme à la norme CS-03 du Canada. Les changements ou les modifications pas expressément approuvés par la partie
responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner
l'équipement. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. 'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Page 32
Revision history
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DocID029635 Rev 1
Date
Version
Changes
17-Aug-2016
1
Initial release.
10 Revision history
Table 9: Document revision history
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