STMicroelectronics STEVAL-BFA001V1B User Manual
UM2438
User manual
Predictive maintenance reference kit with sensors and IO-Link capability
Introduction
The STEVAL-BFA001V1B reference kit for condition monitoring and predictive maintenance lets you evaluate embedded vibration, environmental and acoustic algorithms for condition monitoring and predictive maintenance applications and can be used as a reference to base your own solutions on our hardware and software designs.
The kit is based on the STEVAL-IDP005V1 high performance industrial sensor platform featuring a compact design that is especially suitable for monitoring motors, pumps and fans.
Figure 1. STEVAL-BFA001V1B predictive maintenance reference kit
UM2438 - Rev 2 - March 2019 |
www.st.com |
For further information contact your local STMicroelectronics sales office. |
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UM2438
Overview
1Overview
The main board in the kit is the STEVAL-IDP005V1 sensor platform, which features a high end ARM® Cortex®-M4 32-bit microcontroller running the processing and analysis firmware for the following on-board sensors:
•an iNEMO 6DoF accelerometer and gyroscope
•a barometric pressure sensor
•a relative humidity and temperature sensor
•a digital microphone
The sensor platform comes complete with EEPROM for data Storage, an IO-Link PHY device and power management based on a step-down switching regulator and LDO regulator.
The firmware includes all the necessary drivers, libraries, application and demonstration software and utilities to deliver the following functionality:
•algorithms for advanced time and frequency domain vibration analysis
•environmental (pressure, humidity and temperature) monitoring
•audio algorithms for acoustic emission (AE)
•condition monitoring and predictive maintenance demonstration software
•a GUI to help you set up monitoring environments and plot incoming data
Sensor data results can be transmitted through one of the following serial communication channels:
1.IO-Link (stack is not included in the FW): connect with an external STEVAL-IDP004V1 IO-Link master multiport evaluation board and use one of the firmware applications or the GUI bundled in the firmware package to display sensor data and send query commands.
2.UART: display the data using a common terminal emulator like TeraTerm, through the UART communication channel.
RELATED LINKS
Visit the STEVAL-BFA001V1B web page for the most up to date resources and reference material
UM2438 - Rev 2 |
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Package components
1.1Package components
Figure 2. STEVAL-BFA001V1B package contents
•One reference design board (10 x 50 mm) - STEVAL-IDP005V1.
•One adapter for ST-LINK programming and debugging tool - STEVAL-UKI001V1.
•One 0.050” 10-pin flat cable.
•One 4-pole cable with M12 female connector.
•One 4-pole mount M12 connector plug, with male contacts.
Figure 3. STEVAL-IDP005V1 board - top
Figure 4. STEVAL-IDP005V1 board - bottom
1.2System requirements
The STEVAL-IDP005V1 is already programmed with Condition Monitoring firmware. To run the demo, you need the following items:
•A Windows™ (version 7 or higher) PC with a serial line terminal application like Putty.
•A USB type A to mini B male cable.
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UM2438
How to run the demo supplied with the firmware
•A generic power supply (range 18 to 32 V).
•An STM32 Nucleo 64 board with ST-LINK V2.1 in-circuit debugger/programmer.
To develop your own project, you will also need the following items:
•A Windows™ (version 7 or higher) PC with IAR, KEIL or System Workbench for STM32 firmware development environment.
•Microsoft.NET Framework 4.5 or higher (for the GUI only).
•ST-LINK utility for binary firmware download (find the latest embedded software version on www.st.com).
1.3How to run the demo supplied with the firmware
To run the demo, you must first unpack the STEVAL-BFA001V1B kit.
Follow the steps below to run the condition monitoring demonstration firmware (STSW-BFA001V1\Projects \Demonstrations\Condition_Monitoring\CondMonitor_SRV) loaded on the STEVAL-IDP005V1 evaluation board:
Step 1. Plug the STEVAL-UKI001V1 onto the Nucleo board.
Step 2. Connect the STEVAL-UKI001V1 plus Nucleo board assembly to the STEVAL-IDP005V1. Step 3. Supply power
Step 4. Connect the ST-LINK/V2-1 (on the STM32-NUCLEO 64 board) to the PC through the USB Type-A Male to Type-B mini cable
Step 5. Open and configure your terminal emulator. Set the following parameters:
–Name: COM Port name
–Baud Rate: 230400
–Data:8
–Parity: None
–Stop Bit: One
–Flow Control: None
Step 6. Push the Reset button on the STEVAL-UKI001V1 (or STEVAL-IDP005V1).
Step 7. Insert the new parameters and/or press ENTER, then press [Y] and [Enter] to start monitoring.
RELATED LINKS
4 How to supply power to the STEVAL-IDP005V1 board on page 15 5.1 Connection through an ST-LINK/V2-1 on page 17
7.1 Outputs for the acoustic analysis project on page 29
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STEVAL-IDP005V1 hardware architecture
2STEVAL-IDP005V1 hardware architecture
Figure 5. STEVAL-IDP005V1 top side components
•JP1 - IO-Link 4-position M12 A-coded connector
•J1 - SWD connector
•J2 - Auxiliary connector
•SW1 - Reset button
•L1 - Shielded power inductor
•U1 - L6984 step-down switching regulator
•U2 - LDK220 LDO
•U4 - ISM330DLC 3D accelerometer and 3D gyroscope
•U6 - HTS221 humidity and temperature sensor
•U8 - LPS22HB pressure sensor
Figure 6. STEVAL-IDP005V1 bottom side components
•U3 - L6362A IO-Link communication transceiver
•U7 - MP34DT05-A digital microphone
•U9 - M95M01-DF 1-Mbit serial SPI bus EEPROM
•U10 - STM32F469AI ARM® Cortex®-M4 32-bit MCU
•Y1 - 32.768 kHz crystal
•Y2 - 24 MHz crystal
The whole system consists of the following functional subsystems:
1.Power management
2.Microcontroller
3.MEMS sensors
4.EEPROM
5.Wired connectivity
6.External connectors
The sensors are connected to the microcontroller through separate bus SPI and I2C peripherals. The connectivity options are:
•UART and I2C on the expansion connectors.
•IO-Link on the M12 male socket.
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Power management
Figure 7. STEVAL-IDP005V1 functional block diagram
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LDO |
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M12 4-pin A- |
L6362A |
USART2 |
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SPI1 |
ISM330DLC |
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3D Accelerometer |
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3D Gyroscope |
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HTS221 |
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ADC3 |
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I2S2 |
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Digital Microphone |
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SPI4 |
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2.1Power management
The STEVAL-IDP005V1 power management stage can accept an 18 to 32 VDC input through the M12 A-coded 4- pin male connector (JP1) and provide 3.3 VDC / 200 mA voltage output to its digital components.
•U1 - L6984 step-down switching regulator
•U2 - LDK220 LDO
Figure 8. Power management system
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Microcontroller
2.1.1L6984
The L6984 is a step-down monolithic switching regulator able to deliver up to 400 mA DC. The output voltage adjustability ranges from 0.9 V. The fixed 3.3 V VOUT requires no external resistor divider. The “Low Consumption Mode” (LCM) maximizes the efficiency at light load with controlled output voltage ripple. The “Low Noise Mode” (LNM) makes the switching frequency almost constant over the load current range. The PGOOD open collector output can implement output voltage sequencing during the power-up phase. The synchronous rectification, designed for high efficiency at medium - heavy load, and the high switching frequency capability make the size of the application compact. Pulse-by-pulse current sensing on low-side power element implements an effective constant current protection.
2.1.2LDK220
The LDK220 is a low drop voltage regulator, which provides a maximum output current of 200 mA from an input voltage in the range of 2.5 V to 13.2 V, with a typical dropout voltage of 100 mV. A ceramic capacitor stabilizes it on the output. The very low drop voltage, low quiescent current and low noise make it suitable for industrial applications. The enable logic control function puts the LDK220 in shutdown mode allowing a total current consumption lower than 1 μA. The device also includes a short-circuit constant current limiting and thermal protection.
2.2Microcontroller
The STEVAL-IDP005V1 embeds an STM32F469AI (U10) ARM®Cortex®-M4 32-bit MCU.
The board has a Serial Wire Debug (SWD) connector (J1) for MCU programming and debugging. This connector routes UART pins as well.
The board also has a reset button (SW1) to restart the microcontroller.
Figure 9. Microcontroller subsystem
2.2.1STM32F469AI
The STM32F469AI microcontroller is based on the high-performance ARM® Cortex®-M4 32-bit RISC core operating at a frequency of up to 180 MHz. The Cortex®-M4 core features a Floating point unit (FPU)
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Sensors
single precision which supports all ARM® single-precision data processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The device incorporates high-speed embedded memories (Flash memory up to 2 Mbytes, up to 384 Kbytes of SRAM), up to 4 Kbytes of backup SRAM, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.
The device offers three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, and a true random number generator (RNG).
The microcontroller features the following standard and advanced communication interfaces:
•Up to three I2Cs.
•Six SPIs, two I2Ss full duplex. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL or via an external clock to allow synchronization.
•Four USARTs plus four UARTs.
•One SAI serial audio interface.
The STM32F469AI device operates in the -40 to +105 °C temperature range from a 1.7 to 3.6 V power supply.
2.2.2Enhanced SWD connector
The STEVAL-IDP005V1 has a 1.27 mm pitch, 10-contact, 2-row board-to-board connector. The connector can be used for the following purposes:
•To program the microcontroller via a dedicated adapter (STEVAL-UKI001V1) connected to the programming tool (e.g. ST-LINK/V2-1).
•As an expansion connector that routes the UART pins, to allow the STEVAL-IDP005V1 to connect with a PC COM port. A further IO for USER_LED is also routed.
Figure 10. Enhanced SWD connector
2.3Sensors
The STEVAL-IDP005V1 embeds several sensors to detect vibration, environmental parameters and sound parameters. The sensor data is analysed with algorithms running on the STM32F469AI microcontroller with FPU.
The following sensors are mounted on the board:
•U4 - ISM330DLC 3D accelerometer and 3D gyroscope
•U6 - HTS221 humidity and temperature sensor
•U8 - LPS22HB pressure sensor
•U7 - MP34DT05-A digital microphone
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Sensors
Figure 11. Sensor array subsystem
2.3.1ISM330DLC
The ISM330DLC is a system-in-package featuring a high performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micro machined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
In the ISM330DLC, the sensing element of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.
The ISM330DLC has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
Delivering high accuracy and stability with ultra-low power consumption (0.75 mA in high-performance, combo mode) enables, also in the industrial domain, long-lasting battery operated applications.
The ISM330DLC includes a dedicated configurable signal processing path with low latency, low noise and dedicated filtering specifically intended for control loop stability. Data from this dedicated signal path can be made available through an auxiliary SPI interface, configurable for both the gyroscope and accelerometer. Highperformance, high-quality, small size and low power consumption together with high robustness to mechanical shock makes the ISM330DLC the preferred choice of system designers for the creation and manufacturing of versatile and reliable products.
The ISM330DLC is available in a plastic, land grid array (LGA) package.
The STSW-BFA001V1 firmware package includes applications and demonstrations firmware supporting accelerometer part.
2.3.2HTS221
The HTS221 is an ultra-compact sensor for relative humidity and temperature. It includes a sensing element and a mixed signal ASIC to provide the measurement information through digital serial interfaces.
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Memory
The sensing element consists of a polymer dielectric planar capacitor structure capable of detecting relative humidity variations and is manufactured using a dedicated ST process.
The HTS221 is available in a small top-holed cap land grid array (HLGA) package guaranteed to operate over a temperature range from -40 °C to +120 °C.
2.3.3LPS22HB
The LPS22HB is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output barometer. The device comprises a sensing element and an IC interface which communicates through I2C or SPI from the sensing element to the application.
The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a dedicated process developed by ST.
The LPS22HB is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.
2.3.4MP34DT05-A
The MP34DT05-A is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors.
The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
The MP34DT05-A is a low-distortion digital microphone with a 64 dB signal-to-noise ratio and -26 dBFS ±3 dB sensitivity.
The MP34DT05-A is available in a top-port, SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
2.4Memory
The STEVAL-IDP005V1 has non-volatile memory which can store up to 1-Mbits of data.
•U9 - M95M01-DF 1-Mbit serial SPI bus EEPROM
Figure 12. EEPROM subsystem
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IO-Link communication
2.4.1M95M01-DF
The M95M01 electrically erasable programmable memory (EEPROM) id organized as 131072 x 8 bits, accessed through the SPI bus.
The M95M01-DF can operate with a supply range from 1.7 V up to 5.5 V. This device is guaranteed for the -40 °C/+85 °C temperature range.
The M95M01-DF offers an additional Identification Page (256 bytes), which can be used to store sensitive application parameters that can subsequently be permanently locked in Read-only mode.
2.5IO-Link communication
The STEVAL-IDP005V1 board has IO-Link connectivity available on the M12 A-coded connector. IO-Link is an industrial standard for hardware connectivity. The standard specifies:
•the number of wires needed for the bus installation
•the colors to distinguish supply voltage from the IO-Link bus line
•connector pinouts.
The standard also establishes two different data communication methods:
1.Pure serial data communication (SDCI) with a detailed protocol structure to manage sensor parameters and sensor data.
2.A simple level transition high to low and vice versa to signal the sensor status only.
The use of an IO-Link system offers several advantages, like:
•Automatic detection and parameterization of the IO-Link device: the operating parameters of devices are stored in the master during setup. Once connected, the master recognizes the device and enables automatic startup. If a device like a sensor fails, it can be replaced and parameterization data stored in the master is automatically downloaded to the replacement device.
•Device monitoring and diagnostics: IO-Link allows equipment components and systems to be monitored and proactively managed. Diagnostics provided by IO-Link devices lets the control system track data and trends, facilitating preventive and predictive maintenance and improving machine uptime.
•Changes on the fly: parameters can be quickly adjusted for installed devices while the machine is running, reducing time consumption.
•Reduced component costs: by exploiting the configuration capabilities of IO-Link, a device can be configured to have different output functions.
Figure 13. IO-Link subsystem
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Auxiliary connections
2.5.1L6362A
The L6362A is an IO-Link transceiver device compliant with PHY2 (3-wire connection) supporting COM1 (4.8 kbaud), COM2 (38.4 kbaud) and COM3 (230.4 kbaud) modes. The output stage can be configured as high-side, low-side or push-pull by hardware connection, and it can drive resistive, capacitive and inductive loads.
The IC can interface a sensor node to a master unit using both the Serial Data Communication Interface (SDCI) based on IO-Link protocol and the Standard I/O mode (SIO). Communication is managed using the 24 V industrial bus voltage. The L6362A is protected against reverse polarity across VCC, GND, OUTH, OUTL and I/Q pins. The IC is also protected against output short-circuits, overvoltage and fast transient conditions (±1 kV, 500 Ω and 18 μF coupling).
2.5.2IO-Link connector
The IO-Link connector is M12 A-coded 4-pin.
Figure 14. IO-Link connector and signals
2.6Auxiliary connections
The STEVAL-IDP005V1 comes with a 6-pin auxiliary connector for:
•VDD and GND
•SMBus (I2C)
•One ADC channel
The above pins can still be used as GPIOs.
The mounted auxiliary connector is a JST SM06B-NSHSS-TB. This mates with a JST NSHR-06V-S, female connector housing, that be assembled with six JST SSHL-003T-P0.2, female crimp terminal contact. These components are not part of the kit.
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STEVAL-UKI001V1
3STEVAL-UKI001V1
This tool is an adapter for Serial Wire Debug (SWD) from 10-pin 50-mil socket to 20-pin 100-mil socket (mounted on ST-LINK/V2) or to 6-pin 100-mil (mounted on ST-LINK/V2-1 on the STM32 Nucleo-64 board).
The ST-LINK/V2-1 of the STM32 Nucleo-64 board offers more features. However, you need to ensure that the target application routes the UART RX, UART TX, user button and user LED tracks correctly on the SWD.
You can use ST-LINK/V2-1 through the STEVAL-UKI001V1 board to program and debug the target application. You can also use the ST-LINK/V2-1 as a UART interface adapter via the STM32 Virtual COM Port Driver. This allows you to keep using the USB cable that connects the kit to your PC. To use this configuration, ensure that pins 2 and 3 of CN14 and pins 1 and 2 of CN15 are shorted. Refer to the schematic below.
Figure 15. STEVAL-UKI001V1 schematic
10 to 20 pin Serial Wire Debug (SWD) adapter
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50 mils 10-pin Header
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miniswitch-KMR211GLFS |
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SWCLK |
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CN14 |
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GND |
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CN3 |
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SWDIO |
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NRST |
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6-pin Female Header |
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2-pin Male Header closed
J3
1-pin Male Header
<![if ! IE]><![endif]>1
USR_LED
R1
590
D1
LED (Yellow)
<![if ! IE]><![endif]>GND
mounted on TOP
UM2438 - Rev 2 |
page 13/67 |
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UM2438
STEVAL-UKI001V1
Figure 16. STEVAL-UKI001V1 top view
Figure 17. STEVAL-UKI001V1 bottom view
UM2438 - Rev 2 |
page 14/67 |
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UM2438
How to supply power to the STEVAL-IDP005V1 board
4How to supply power to the STEVAL-IDP005V1 board
The STEVAL-BFA001V1B kit includes the necessary cable and connectors to power the STEVAL-IDP005V1 board.
Figure 18. 4-wire cable with free ends and an M12 A-coded 4-pin female connector
Figure 19. 4-pole cable mount connector plug with male contacts
RELATED LINKS
1.3 How to run the demo supplied with the firmware on page 4
4.1Supply power directly from a DC power supply
You can power the board directly from a DC power supply using only the cable provided in the kit.
Step 1. Connect the cable to an 18 – 32 VDC power supply:
–Pin 1 (brown wire) to positive
–Pin 3 (blue wire) to negative
Figure 20. STEVAL-IDP005V1 power supply connection (without IO-Link master board)
4.2Supply power through an IO-Link master board
You can supply power via an IO-Link master board using the cable and connectors provided in the kit.
Step 1. Attach the 4-pole cable mount connector plug with male contacts to the cable.
Step 2. Connect the female end to the STEVAL-IDP005V1 board and the male end to the STEVAL-IDP004V1 master board.
UM2438 - Rev 2 |
page 15/67 |
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UM2438
Supply power through an IO-Link master board
Step 3. Power the STEVAL-IDP004V1 IO-Link master board with an 18 to 32 VDC supply through screw connector CON1.
Figure 21. STEVAL-IDP005V1 power supply connection (through IO-Link master board)
UM2438 - Rev 2 |
page 16/67 |
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UM2438
STEVAL-IDP005V1 board connections
5STEVAL-IDP005V1 board connections
The STEVAL-IDP005V1 needs to be linked with a PC to manage the data coming from the board. The connection can either be through a serial communication adapter (ST-LINK/V2-1) or an IO-Link master multi-port board (STEVAL-IDP004V1).
5.1Connection through an ST-LINK/V2-1
The ST-LINK/V2-1 in-circuit debugger/programmer on the STM32 Nucleo-64 board lets you update the STEVALIDP005V1 firmware. It also allows UART communication with a PC.
To enable UART communication
Step 1. Install the STM32 Virtual COM Port Driver (STSW-STM32102) on your PC. Step 2. Run a terminal emulator like PuTTY, Tera Term, etc.
To set up a connection for firmware update.
Step 3. Plug the STEVAL-UKI001V1 on ST-LINK/V2-1 in a manner that the connectors with the same identification are overlapped.
Step 4. Connect the ST-LINK/V2-1 to the PC through the USB Type-A Male to Type-B mini cable.
Step 5. Respecting the polarity, connect an end of the 10-pin flat IDC wire cable to J2 of the STEVALUKI001V1.
Figure 22. ST-LINK/V2-1 connection
Step 6. On the STEVAL-UKI001V1, short the CN14 pin 2-3 and the CN15.
Step 7. Use the 4-wire cable with free ends and an M12 A-coded 4-pin female connector (e.g. Telemecanique Sensors XZCP1141L2).
UM2438 - Rev 2 |
page 17/67 |
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UM2438
Connection through an STEVAL-IDP004V1
Step 8. Connect the M12 A-coded 4-pin female connector of the cable to JP1 (IO-Link connector) of the STEVAL-IDP005V1.
Step 9. Connect wire 1 (VIN) and wire 3 (GND) of the cable to a power supply able to provide 18 to 32 VDC.
Step 10. Respecting the polarity, connect the free end of the 10-pin flat IDC wire cable to J1 (SWD connector) of the STEVAL-IDP005V1.
Figure 23. IO-Link and SWD connection
The STEVAL-IDP005V1 is ready to be programmed with new firmware.
RELATED LINKS
1.3 How to run the demo supplied with the firmware on page 4 6.2.4.3 Demonstrations folders on page 25
8 How to run projects via IO-Link on page 42 7.1 Outputs for the acoustic analysis project on page 29
5.2Connection through an STEVAL-IDP004V1
The physical IO-Link connection between STEVAL-IDP005V1 and the PC is made using the STEVAL-IDP004V1 multiport master board with an L6360 master IC for each IO-Link port.
Step 1. Ensure that none of the boards are connected to a power supply.
Figure 24. STEVAL-IDP004V1 vs STEVAL-IDP005V1 connections
UM2438 - Rev 2 |
page 18/67 |
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UM2438
Connection through an STEVAL-IDP004V1
Step 2. Assemble the Telemecanique Sensors XZCP1141L2 (4-wire cable) with the Telemecanique Sensors XZCC12MDM40B (4-pole connector).
You can also use a preassembled 4-wire cable (not provided in the package) with M12 A-coded 4-pin connectors, male on one end and female on the other.
Step 3. Plug the female M12 connector of the cable to the STEVAL-IDP005V1.
Step 4. Plug the male M12 connector of the cable to a free port of the four ones that are in the STEVALIDP004V1.
Step 5. Connect the RS485 dongle (not present in the package) and install the related driver to create the physical connection between PC and master board.
For correct communication, use the reference pinout on the DB9 connector shown below.
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Table 1. RS485 Connector pinout |
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PIN Number |
PIN Description |
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1 , 4 |
Inverting receiver input and inverting driver output |
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2 , 8 |
Non inverting receiver input and non-inverting driver output |
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6 , 7 , 9 |
Not connected |
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3 , 5 |
Ground |
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Step 6. Connect an 18 to 32 V (typ. 24 V) supply voltage through screw connector CON1 on the board to run the system.
RELATED LINKS
6.2.4.3 Demonstrations folders on page 25
8 How to run projects via IO-Link on page 42
9 Graphical Interface overview on page 43
UM2438 - Rev 2 |
page 19/67 |
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UM2438
Firmware overview
6Firmware overview
The STSW-BFA001V1 software is an expansion of the STM32Cube platform with functions to help you develop applications using inertial, environmental and microphone sensors. The firmware includes sample condition monitoring and predictive maintenance applications based on 3D digital accelerometer, environmental and acoustic MEMS sensors.
The software uses the following lower layers:
•Low level STM32Cube HAL layer to provide all the MCU communication peripherals APIs compatible with STM32Cube framework.
•Low level drivers to facilitate sensor configuration and data reception with dedicated APIs that are compatible with STM32Cube framework.
•Medium level board support package (BSP) layer to provide on-board sensor control and data reception at the application level.
The middleware libraries built on top of the lower layers provide the following features:
•Middleware, including algorithms for advanced time and frequency domain signal processing for vibration analysis:
–For the frequency domain:
◦Programmable FFT size (256, 512, 1024, 2048)
◦Programmable FFT input data overlapping
◦Programmable FFT input data windowing (Flat Top, Hanning, Hamming)
◦Programmable FFT output averaging
◦Programmable FFT subrange analysis
–For the time domain:
◦HP filtering to reduce accelerometer offset
◦Accelerometer max peak evaluation
◦Accelerometer integration to evaluate Speed
◦Moving RMS speed evaluation
•Middleware with microphone algorithms:
–PDM to PCM
–Sound pressure
–Audio FFT
•Sample application to monitor environmental, acoustic and vibration data and read algorithm outputs through a terminal emulator.
•Sample application with programmable warning and alarm thresholds in the time domain and across spectral bands.
•Application example firmware to communicate with STEVAL-IDP004V1 (IO-Link master multi-port evaluation board) and dedicated PC GUI.
6.1Firmware architecture
The firmware is based on the STM32Cube™ framework for applications running on the STM32 microcontroller.
The package provides a board support package (BSP) for the MEMS and Microphone sensors and other devices used for IO-Link communication. The package also contains middleware for signal and audio processing.
UM2438 - Rev 2 |
page 20/67 |
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UM2438
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Firmware architecture |
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Figure 25. STSW-BFA001V1 firmware architecture |
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User interfaces |
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UART / Windows terminal |
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STEVAL-IDP005V1 GUI |
(vibration, acoustic and |
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and utilities |
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environmental data monitoring) |
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Demonstrations |
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Applications |
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Condition |
Predictive |
Acoustic |
Vibration |
Environmental |
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Monitoring |
Maintenance |
Analysis |
Analysis |
Monitoring |
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Middleware |
Vibration Signal Processing |
Audio Lib |
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Hardware |
STM32Cube Hardware |
Board Support |
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Abstraction |
Abstraction Layer |
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STM32F469AI, ISM330DLC, LPS22HB, HTS221, MP34DT05-A |
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Hardware
STEVAL-IDP005V1
The following firmware layers access and use the hardware components:
•STM32Cube HAL layer: generic Application Programming Interfaces (APIs) which interact with higher level applications, libraries and stacks. The APIs are based on the common STM32Cube framework so other layers like middleware can function without requiring specific hardware information for a given microcontroller unit (MCU).
•Board support package (BSP) layer: provides firmware support for the STM32 (excluding MCU) peripherals. These APIs provide a programming interface for certain board-specific components like LEDs, user buttons, etc. The APIs can also fetch board serial and version information, as well as support initializing, configuring and reading data from sensors. The BSP provides the drivers for the STEVAL-IDP005V1 board peripherals to connect to the microcontroller peripherals.
This firmware package expands the functionality of the STM32Cube platform with the following features for specific industrial applications:
•Low and middle level drivers to connect all the on-board MEMS sensors:
–Pressure and temperature sensor (LPS22HB)
–Humidity and temperature sensor (HTS221)
–Accelerometer/Gyroscope motion sensors (ISM330DLC)
–Digital Microphone audio sensor (MP34DT05-A)
•Complete BSP functions to allow applications to access sensors. The data acquisition from different sensors is provided via SPI and I2C.
•Six different sample firmware projects divided into two main groups:
–Applications: examples that use motion, environmental and acoustic measurements, including middleware algorithms focused on vibration and acoustic analysis and environmental monitoring.
–Demonstrations: projects designed to demonstrate condition monitoring and predictive maintenance with the STEVAL-IDP005V1. The projects include IO-Link connectivity with the master board (STEVALIDP004V1).
•Command line interface (CLI) using a debug console on an external terminal via UART communication with a PC.
UM2438 - Rev 2 |
page 21/67 |
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