The fast SuperMESH™ series as sociate s all
advantages of reduced on-resistance, zener gate
protection and outstanding dc/dt capability with a
Fast body-drain recovery diode. Such series
complements the FDmesh™ advanced tecnology.
1. The bui lt-in b ack-to-back Zener diodes have specifically been designed to enhance not onl y the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of ex te r na l co mp on ents.
In order to meet environmental requirements, ST offers these devices in ECOPA CK ®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
10/17
STD4NK50ZD - STD4NK50ZD-1 - STF4NK50ZD - STP4NK50ZDPackag e m echa nical data
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