STMicroelectronics STD2NK70Z, STD2NK70Z-1 User Guide

STD2NK70Z - STD2NK70Z-1
N-CHANNEL 700 V - 6 Ω - 1.6 A DPAK/IPAK
Zener-Protected SuperMESH™ MOSFET

Table 1: General Features

TYPE V
STD2NK70Z STD2NK70Z-1
TYPICAL R
ESD IMPRO VED CAPABILIT Y
100% AVALANCHE TESTED
NEW HIGH VOLTAGE BENCHMARK
GATE CHARGE MINIMIZED
DSSRDS(on)ID
700 V 700 V
(on) = 6
DS
7 7
1.6 A
1.6 A
Pw
45 W 45 W
DESCRIPTION
The Supe rME SH™
series is obtained through an
extreme optimization of ST’s well established strip-based PowerMESH™ layout. In addition to pushin g on-resis tance sign ifican tly down, special care is taken to en sur e a v er y good d v/ d t c ap ab i lity for the most demanding application. Such series compl ements ST fu ll range of high vltag e MOS­FETs i n cludi n g re vol u tion ar y MDme sh™ p r od uct s.
APPLICATIONS
SINGLE-ENDED SMPS IN MONITORS,
COMPUTER AND INDUSTRIAL APPLICATION
WELDING EQUIPMENT
FLYBACK CONFIGURATION FOR BATTERY
CHARGER

Figure 1: Package

3
1
DPAK
IPAK

Figure 2: Internal Schematic Diagram

3
2
1

Table 2: Order Codes

Sales Type Marking Package Packaging
STD2NK70ZT4 D2NK70Z DPAK TAPE & REEL
STD2NK70Z-1 D2NK70Z IPAK TUBE
Rev. 2
1/12January 2005
STD2NK70Z - STD2NK70Z-1

Table 3: Absolute Maximum ratings

Symbol Parameter Value Unit
V
V
V
I
DM
P
V
ESD(G-S)
dv/dt (1) Peak Diode Recovery voltage slope 4.5 V/ns
T
(*) Pulse width limited by safe operating area (1) I
SD

Table 4: Thermal Data

Rthj-case Thermal Resistance Junction-case Max 2.78 °C/W
Rthj-amb

Table 5: Avalanche Characteristics

Symbol Parameter Max Value Unit
I
E
Drain-source Voltage (VGS = 0)
DS
Drain-gate Voltage (RGS = 20 KΩ)
DGR
Gate- source Voltage ± 30 V
GS
Drain Current (continuous) at TC = 25°C 1.6
I
D
I
Drain Current (continuous) at TC = 100°C
D
(*)
Drain Current (pulsed) 6.4 A Total Dissipation at TC = 25°C
TOT
700 V 700 V
1A
45 W Derating Factor 0.36 W/°C Gate source ESD (HBM-C = 100pF, R = 1.5 KΩ) 2000 V
Storage Temperature
stg
T
Max. Operating Junction Temperature
j
1.6 A, di/dt 200 A/µs, VDD V
Thermal Resistance Junction-ambient Max
T
Maximum Lead Temperature For Soldering Purpose
l
Avalanche Current, Repetitive or Not-Repetitive
AR
(pulse width limited by T Single Pulse Avalanche Energy
AS
(starting T
= 25 °C, ID = IAR, VDD = 50 V)
j
(BR)DSS
max)
j
-55 to 150 °C
100 300
1.6 A
110 mJ
A
°C/W
°C

Table 6: Gate-Source Zener D iode

Symbol Parameter Test Condition Min. Typ. Max Unit
BV
Gate-Source Breakdown
GSO
Voltage
Igs= ± 1mA (Open Drain)
30 A
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external compon ents.
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STD2NK70Z - STD2NK70Z-1
TABLE 7: ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SPECIFIED)
CASE
On /Off
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
I
V
R
DS(on)
Drain-source Breakdown Voltage
Zero Gate Voltage
DSS
Drain Current (V Gate-body Leakage
GSS
Current (V Gate Threshold Voltage
GS(th)
Static Drain-source On Resistance
ID = 1 mA, VGS = 0 700 V
= Max Rating
V
= 0)
GS
= 0)
DS
DS
= Max Rating, TC = 125°C
V
DS
= ± 20 V ± 10 µA
V
GS
V
= VGS, ID = 50 µA 3
DS
3.75
1
50
4.5 V
VGS = 10 V, ID = 0.8 A 6 7

Table 8: Dynamic

Symbol Parameter Test Condi tions Min. Typ. Max. Unit
(1) Forward Transconductance VDS = 15 V,
g
fs
C
(3) Equivalent Output
oss eq.
C C C
t
d(on)
t
d(off)
Q Q Q
Capacitance Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
Capacitance Turn-on Delay Time
Rise Time
t
r
Turn-off-Delay Time Fall Time
t
f
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain Charge
gd
= 0.8 A
I
D
VGS = 0 V, VDS = 0 to 560 V 17
V
= 25 V, f = 1 MHz, VGS = 0 280
DS
V
= 350 V, ID = 0.8 A,
DD
= 4.7 Ω, V
R
G
(see Figure 17)
V
= 560 V, ID = 0.8 A,
DD
= 10 V
V
GS
(see Figure 20)
GS
= 10 V
1.4 S
35
6.5
7 17 20 35
11.4
6.8
15 nC
2
µA µA
pF pF pF
nC nC
ns ns ns ns

Table 9: Source Drain Diode

Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
I
SDM
V
SD
Q
I
RRM
Q
I
RRM
(1) Pulsed: Pulse duration = 300 µs, duty cycle 1.5% (2) Pulse width limited by safe operating area (3) C
oss eq
Source-drain Current
SD
(2)
Source-drain Current (pulsed)
(1)
Forward On Voltage
t
Reverse Recovery Time
rr
Reverse Recovery Charge
rr
Reverse Recovery Current
t
Reverse Recovery Time
rr
Reverse Recovery Charge
rr
Reverse Recovery Current
. is defined as a constant equivalent capacitance giving the same charging time as C
ISD = 1.6 A, VGS = 0 I
= 1.6, di/dt = 100 A/µs
SD
=50 V, Tj = 25°C
V
DD
(see Figure 18) I
= 1.6, di/dt = 100 A/µs
SD
= 50 V, Tj = 150°C
V
DD
(see Figure 18)
334 918
350
1050
when VDS increases from 0 to 80% V
oss
1.6
6.4
1.6 V
5.5
6
A A
ns
µC
A
ns
µC
A
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DSS
STD2NK70Z - STD2NK70Z-1

Figure 3: Safe Operating Area

Figure 4: Output Characteristics

Figure 6: Thermal Impedance

Figure 7: Transfer Characteristics

Figure 5: Transconductance

4/12

Figure 8: Static Drain-source On Resistance

STD2NK70Z - STD2NK70Z-1

Figure 9: Gate Charge vs Gate-source Voltage

Figure 10: Normalized Ga te Thereshold Volt­age vs Temp er a t ur e

Figure 12: Capacitanc e Variations

Figure 13: Normalized On Resistance vs Tem­perature
Figure 11: Dource-Drain Diode Forward Char­acteristics

Figure 14: Normalized Breakdown Voltage vs Temperature

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STD2NK70Z - STD2NK70Z-1

Figure 15: Maximum Avalanche Energy vs Temperature

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STD2NK70Z - STD2NK70Z-1
Figure 16: Unclamped Inductive Load Test Cir­cuit

Figure 17: Switching Times Test Circuit For Resist ive Load

Figure 19: Unclamped Inductive Wafeform

Figure 20: Gate Charge Test Circuit

Figure 18: Test Circuit For Inductive Load Switching and Diode Recovery Times

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STD2NK70Z - STD2NK70Z-1
P032P_B
TO-252 (DPAK) MECHANICAL DATA
DIM.
A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213
C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.252 0.260
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.398 L2 0.8 0.031 L4 0.60 1.00 0.024 0.039 V2 0
MIN. TYP. MAX. MIN. TYP. MAX.
o
mm inch
o
8
o
0
o
0
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STD2NK70Z - STD2NK70Z-1
TO-251 (IPAK) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
mm inch
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.012 B6 0.95 0.037
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039
H
C
A
B5
A3
G
= =
0068771-E
C2
A1
B3
B6
L
B
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implicatio n or ot h er wis e under an y pat e nt or pa te nt r igh ts of STMi c r oel ec tro ni c s. S pec i fi ca ti on s me nti o ne d in th is p ub l ic at ion ar e s ub jec t to change without notice. This publication supersedes and replaces all information previously supplied. STMicroel ectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
L2
The ST logo is a registered trademark of STMicroelectronics
All other names are the property of their respective owners
E
B2
= =
= =
D
2
© 2005 STMicroelectronics - All Rights Reserved
STMicroelectronics group of companies
1 3
L1
www.st.com
9/12
STD2NK70Z - STD2NK70Z-1
DPAK FOOTPRINT
All dimensions are in millimeters
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TAPE MECHANICAL DATA
DIM.
A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476
D1 1.5 0.059
K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082
W 15.7 16.3 0.618 0.641
* on sales type
mm inch
MIN. MAX. MIN. MAX.
D 1. 5 1.6 0.059 0.063
E 1.65 1.85 0.065 0.073 F 7.4 7.6 0.291 0.299
R 40 1.574
TUBE SHIPMENT (no suffix)*
All dimensions
are in millimeters
REEL MECHANICAL DATA
DIM.
mm inch
MIN. MAX. MIN. MAX.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968 T 22.4 0.881
BASE QTY BULK QTY
2500 2500
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STD2NK70Z - STD2NK70Z-1

Table 10: Revision History

Date Revision Description of Changes
07-Sep-2004 1 First Release, complete document.
24-Jan-2005 2 New curve, figure 3, and new Rds(on) value Max.
11/12
STD2NK70Z - STD2NK70Z-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implicati o n or ot h er wis e und er an y pat ent or pa te nt r igh ts of STMi cr oe l ec tro ni cs . Sp ec i fi ca ti on s ment i o ned i n th is p ub li c ati on ar e s ubj ec t to change without notice. This publication supersedes and replaces all information previously sup plied. STMicro electronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
All other names are the property of their respective owners
© 2005 STMicroelectronics - All Rights Reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
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