This MOSFET series realized with
STMicroelectronics unique STripFET process has
specifically been designed to minimize input
capacitance and gate charge. It is therefore
suitable as primary switch in advanced highefficiency, high-frequency isolated DC-DC
converters for Telecom and Computer
applications. It is also intended for any
applications with low gate drive requirements.
Figure 6.TransconductanceFigure 7.Static drain-source on resistance
6/13
Page 7
STB75NF75LElectrical characteristics
Figure 8.Gate charge vs gate-source voltage Figure 9.Capacitance variations
Figure 10. Normalized gate threshold voltage
vs temperature
Figure 12. Source-drain diode forward
characteristics
Figure 11. Normalized on resistance vs
temperature
Figure 13. Normalized B
vs temperature
VDSS
7/13
Page 8
Test circuitSTB75NF75L
3 Test circuit
Figure 14. Switching times test circuit for
resistive load
Figure 16. Test circuit for inductive load
switching and diode recovery times
Figure 15. Gate charge test circuit
Figure 17. Unclamped Inductive load test
circuit
Figure 18. Unclamped inductive waveform
8/13
Page 9
STB75NF75LPackage mechanical data
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
9/13
Page 10
Package mechanical dataSTB75NF75L
D2PAK MECHANICAL DATA
TO-247 MECHANICAL DATA
DIM.
A4.44.60.1 730.181
A12.492.690.0980.106
A20.030.230.0010.009
B0.70.930.0270.036
B21.141.70.0440.067
C0.450.60.0170.023
C21.231.360.0 480.053
D8.959.350.3 520.368
D180.315
E1010.40.3 93
E18.50.334
G4.885.280.1920. 208
L1515.850.5900.625
L21.271.40.0500.055
L31.41.750.0550.068
M2.43.20.0940.126
R0.40.015
V20º4º
MIN.TYPMAX.MIN.TYP.MAX.
mm.inch
3
10/13
1
Page 11
STB75NF75LPackaging mechanical data
5 Packaging mechanical data
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
A33012.992
B1.50.059
C12.813.20.504 0.520
D20.20795
G24.426.40.960 1.039
N1003.937
T30.41.197
mminch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A010.510.70.413 0.421
B015.715.90.618 0.626
D1.51.60.059 0.063
D11.591.61 0.062 0.063
E1.651.850.065 0.073
F11. 411 .60.449 0.456
K04.85.00.189 0.197
P03.94.10.153 0.161
P111.912.10.468 0.476
P21.92.10.075 0.082
R501.574
T0.250.35 0.0098 0.0137
W23.724.30.933 0.956
* on sales type
mminch
MIN. MAX. MIN. MAX.
BASE QTYBULK QTY
10001000
11/13
Page 12
Revision historySTB75NF75L
6 Revision history
Table 8.Revision history
DateRevisionChanges
21-Jun-20041First release
02-Oct-20062New template, no content change
13-Jul-20073New updates on Tab l e 7
12/13
Page 13
STB75NF75L
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