STMicroelectronics STB60NF06, STB60NF06-1 Technical data

N-channel 60V - 0.014Ω - 60A - D2PAK/I2PA K
General features
Type V
STB60NF06-1 60V <0.016 60A
STB60NF06 60V <0.016 60
Exceptional dv/dt capability
100% avalanche tested
Application oriented characterization
DSS
Description
This Power MOSFET series realized with STMicroelectronics unique STripFET process has specifically been designed to minimize input capacitance and gate charge. It is therefore suitable as primary switch in advanced high­efficiency isolated DC-DC converters for Telecom and Computer application. It is also intended for any application with low gate charge drive requirements.
R
DS(on)
I
D
STB60NF06
STB60NF06-1
3
1
D2PAK
I2PAK
Internal schematic diagram
2
1
3
Applications
Switching application
Order codes
Part number Marking Package Packaging
2
STB60NF06T4 B60NF06 D
STB60NF06-1 B60NF06 I
June 2006 Rev 3 1/14
PAK Tape & reel
2
PA K Tu be
www.st.com
14
Contents STB60NF06 - STB60NF06-1
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14
STB60NF06 - STB60NF06-1 Electrical ratings

1 Electrical ratings

Table 1. Absolute maximum ratings

Symbol Parameter Value Unit
V
I
V
DGR
V
DM
P
I
I
DS
GS
D
D
(1)
tot
Drain-source voltage (VGS = 0) 60 V
Drain-gate voltage (RGS = 20 kΩ)60V
Gate- source voltage ± 20 V
Drain current (continuous) at TC = 25°C 60 A
Drain current (continuous) at TC = 100°C 42 A
Drain current (pulsed) 240 A
Total dissipation at TC = 25°C 110 W
Derating Factor 0.73 W/°C
(2)
dv/dt
T
stg
T
j
1. Pulse width limited by safe operating area.
2. ISD ≤ 60A, di/dt ≤400A/µs, VDD ≤ 24V, Tj ≤ T
Peak diode recovery voltage slope 4 V/ns
Storage temperature
-65 to 175 °C
Max. operating junction temperature
JMAX

Table 2. Thermal data

Rthj-case Thermal resistance junction-case max 1.36 °C/W
Rthj-amb Thermal resistance junction-ambient max 62.5 °C/W
T
J
Maximum lead temperature for soldering purpose 300 °C

Table 3. Avalanche characteristics

Symbol Parameter Max Value Unit
I
AR
E
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy
AS
(starting T
= 25 °C, ID = IAR, VDD = 30 V)
j
30 A
360 mJ
3/14
Electrical characteristics STB60NF06 - STB60NF06-1

2 Electrical characteristics

(T
=25°C unless otherwise specified)
CASE

Table 4. On/off states

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Drain-source breakdown voltage
Zero gate voltage drain current (V
GS
Gate-body leakage current (V
DS
= 0)
= 0)
ID = 250µA, VGS =0 60 V
V
= Max rating
DS
VDS = Max rating,
= 125°C
T
C
1
10
VGS = ± 20V ±100 nA
Gate threshold voltage VDS = VGS, ID = 250µA 2 4 V
Static drain-source on resistance
V
= 10V, ID = 30A 0.015 0.016
GS

Table 5. Dynamic

Symbol Parameter Test conditions Min. Typ. Max. Unit
Forward
(1)
g
fs
C
C
C
t
d(on)
t
d(off)
Q Q Q
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
transconductance
Input capacitance
iss
Output capacitance
oss
Reverse transfer
rss
capacitance
Turn-on delay time
t
Rise time
r
Turn-off delay time
t
Fall time
f
Total gate charge
g
Gate-source charge
gs
Gate-drain charge
gd
= 15V, ID= 30A 20 S
V
DS
= 25V, f = 1MHz,
V
DS
= 0
V
GS
= 30V, ID = 30A
V
DD
RG=4.7Ω VGS = 10V (see Figure 12)
VDD = 48V, ID = 60A, VGS = 10V, RG=4.7 (see Figure 13)
1810
360 125
16
108
43 20
49 18 14
66 nC
µA µA
pF pF pF
ns ns ns ns
nC nC
4/14
STB60NF06 - STB60NF06-1 Electrical characteristics

Table 6. Source drain diode

Symbol Parameter Test conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
Source-drain current Source-drain current
(1)
(pulsed)
(2)
Forward on voltage ISD = 60A, VGS = 0 1.3 V
Reverse recovery time
rr
Reverse recovery charge
rr
Reverse recovery current
ISD = 60A, di/dt = 100A/µs, VDD = 25V, Tj = 150°C (see Figure 14)
73
182
5
60
240
A A
ns
nC
A
5/14
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