ST Microelectronics SPSGPE User Manual
SPSGPE
Sub1GHz (433 or 868 or 915 MHz) programmable transceiver module
Preliminary Datasheet
Features
LGA-SMT module
Complete RF-ready module based on:
Compact size: 27.15 mm x 16 mm x 2.5 mm
Operating on ETSI band 433.05 MHz to 434.79 MHz (SPSGPE-433)
Operating on ETSI bands 868 MHz to 868.6 MHz and 869.4 MHz to 869.65 MHz
Operating on FCC band is configured by uploading the relevant application firmware image
Operating from a single 1.9 V to 3.6 V supply
Output power up to +10.5 dBm (SPSGPE-868/SPSGPE-915) and up to +10 dBm
Data rates up to 50 kbps
Modulation scheme GFSK
Operating temperature range: -40°C to +85°C
UART and USB interface with AT command set.
o SPIRIT1 low data rate, low power sub-GHz transceiver by ST Microelectronics
o STM32L151RDY6 Ultra low power ARM-based 32-bit microcontroller by ST
Microelectronics with 32 MHz CPU, 384 KB Flash Memory and 48 KB RAM
o Embedded balun and filtering network.
(SPSGPE-868),
(see section 0) band 902.0 MHz to 928.0 MHz (SPSGPE-915).
(SPSGPE-433)
February 2017
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List of tables
Contents
1 Description .............................................................................................................................. 5
2 Hardware specifications........................................................................................................... 6
2.1 Recommended operating conditions .................................................................................. 6
2.2 Absolute maximum ratings ................................................................................................. 6
2.3 I/O operating specifications ................................................................................................ 6
2.4 Current consumption .......................................................................................................... 7
2.5 RF compliance limits .......................................................................................................... 7
2.6 RF sensitivity data .............................................................................................................. 8
2.7 Pin assignment ................................................................................................................... 9
2.8 Pin placement................................................................................................................... 10
2.9 Memory resources ............................................................................................................ 11
2.10 Hardware block diagram ............................................................................................... 11
3 Hardware design ................................................................................................................... 12
3.1 Pin usage ......................................................................................................................... 12
3.2 Typical application circuits ................................................................................................ 13
3.3 Layout guidelines ............................................................................................................. 16
3.4 Recommended footprint ................................................................................................... 18
3.5 Module reflow installation ................................................................................................. 19
4 Module operation ................................................................................................................... 20
5 Package mechanical data ...................................................................................................... 21
6 Regulatory compliance .......................................................................................................... 22
6.1 CE certification ................................................................................................................. 22
6.2 FCC certification ................................................................................................ ............... 22
6.3 IC certification................................................................................................................... 22
6.4 Labeling instructions ......................................................................................................... 23
6.5 Product manual instructions ............................................................................................. 24
7 Ordering information .............................................................................................................. 25
Appendix 1 Document revision history ........................................................................................ 26
February 2017
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List of tables
List of tables
Table 1. Recommended operating conditions. ................................................................................ 6
Table 2. Absolute maximum ratings. ............................................................................................... 6
Table 3. I/O operating specifications. .............................................................................................. 6
Table 4. Current consumption. ........................................................................................................ 7
Table 5. RF compliance limits. ........................................................................................................ 7
Table 6 RF sensitivity data. ............................................................................................................ 8
Table 7. Pin assignment. ................................................................................................................ 9
Table 7. Memory resources. ......................................................................................................... 11
Table 8. SPSGPE pins requiring connections, when the module is connected to a host
microcontroller unit. ...................................................................................................................... 12
Table 9. SPSGPE pins requiring connections, when the module is connected to a host computer
via USB. ....................................................................................................................................... 12
Table 10. Outputs to external LED by pin STAT_LED (TP10). ...................................................... 15
Table 11. Soldering profile. ........................................................................................................... 19
Table 12. Ordering information. .................................................................................................... 25
Table 13. Document revision history. ............................................................................................ 26
February 2017
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List of figures
List of figures
Figure 1. Pin Placement (top view of LGA pads placed on bottom side).Errore. Il segnalibro non è definito.
Figure 2. Hardware block diagram ................................................................................................ 11
Figure 3. Typical application circuit of SPSGPE connected to a host microcontroller. ................... 13
Figure 4. Typical application circuit of SPSGPE connected to a host computer via USB. ............. 13
Figure 5. Example of SPSGPE layout. .......................................................................................... 13
Figure 6. Recommended SPSGPE footprint. ................................................................................ 18
Figure 7. Soldering profile. ............................................................................................................ 19
Figure 8. Package mechanical data…………………………………………………………… 21
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1 Description
SPSGPE is a hardware LGA-SMT module for easy development of high performance wireless
network applications for a wide range of applications.
Compact-sized, low power and fully integrated, SPSGPE is available in 3 versions:
SPSGPE-433 operating on ETSI 433 MHz band
SPSGPE-868 operating on ETSI 868 MHz band
SPSGPE-915 operating FCC 915 MHz band.
All versions have the same pin-out and mechanical shape.
SPSGPE is based on SPIRIT1 RF sub-GHz transceiver (with integrated SMPS) and
STM32L151RDY6 microcontroller by ST Microelectronics. Balun and filtering network are
embedded in the module. An external antenna can be connected through one pin of the module
which requires an impedance-controlled track of 50 Ω. The UART host interface and USB device
interface allow simple connection to an external microcontroller with a standard firmware or a
host computer, enabling AT commands to facilitate RF configuration, data transmission and
reception, using simple point-to-point communication. Selected STM32L1 GPIO and peripherals
are available to interface external devices and enable user applications. Advanced features of
SPIRIT1 radio are also accessible.
SPSGPE is designed and engineered to build OEM solutions and applications primarily in the
following domains:
Internet of Things (IoT) and Machine-to-Machine (M2M);
Smart Cities;
Smart Grids and Energy Management;
Home & Building Automation;
Wireless Sensor Networks;
Data acquisition equipment management;
Industrial condition and asset monitoring.
February 2017
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Symbol
Parameter
Min.
Typ.
Max.
Unit
T
A
Operating ambient temperature range
-40 - +85
°C
V
DD
Operating supply voltage
(1)
1.9
3.3
3.6
V
FREQ
RF frequency 1 for SPSGPE-433
433.05
-
434.79
MHz
FREQ
RF frequency 1 in ETSI band for SPSGPE-868
868
-
868.6
MHz
FREQ
RF frequency 2 in ETSI band for SPSGPE-868
869.4
-
869.65
MHz
FREQ
RF frequency 1 in FCC band for SPSGPE-915
902.0
-
928.0
MHz
Symbol
Parameter
Min.
Typ.
Max.
Unit
T
STG
Storage temperature range
-40 - +85
°C
V
DD
Operating supply voltage
-0.3 - 3.9
V
VIO
I/O pin voltage
-0.3 - 5.5
V
Symbol
Parameter
Min.
Typ.
Max.
Unit
V
IL
(1)
I/O input low level voltage
-0.3
-
0.3 VDD
V
V
IH
(1)
I/O input high level voltage
0.7 VIN
-
VDD+0.3
V
2 Hardware specifications
Unless otherwise specified, typical data are based on TA = 25 °C, V
= 3.3 V.
DD
2.1 Recommended operating conditions
(1) USB is not functional below VDD=2.0V. Should be USB compliant from I/O voltage standpoint, the
minimum VDD is 3.0 V. For further details, please refer to STM32L151RDY6 datasheet.
Table 1. Recommended operating conditions.
2.2 Absolute maximum ratings
Table 2. Absolute maximum ratings.
2.3 I/O operating specifications
(1) For further details, please refer to STM32L151RDY6 datasheet, I/O port features.
Table 3. I/O operating specificat
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Symbol
Parameter
Test conditions
Typ.
Unit
I
DD
Supply current
Operating mode
TX, +11 dBm, freq. 868MHz
27
mA
I
DD
Supply current
Operating mode
TX, +10.5 dBm, freq. 915MHz
39
mA
IDD
Supply current
Operating mode
TX, +10 dBm, freq. 433MHz
24
mA
IDD
Supply current
Operating mode
RX, freq. 868MHz
19
mA
IDD
Supply current
Operating mode
RX, freq. 915MHz
28
mA
IDD
Supply current
Operating mode
RX, freq. 433MHz
18
mA
IDD
Supply current
Stand-by (Radio off, STM32L151RDY6 in Stop
mode with RTC)
5
µA
Standards
Parameter
Max.
Unit
FCC Part 15.207
(1)
FCC Part 15.247
(1)
EN 300 220-2 V2.4.1
(2)
EN 301 489-01 V1.9.2
(2)
EN 301 489-03 V1.4.1
(2)
Data rate
50
kbps
Output power
(ETSI 868 MHz and FCC 915 MHz band)
+10.5
dbm
Output power
(ETSI 433 MHz band)
+10
Modulation
GFSK
2.4 Current consumption
Table 4. Current consumption.
2.5 RF compliance limits
RF compliance limits for CE and FCC certifications, referring to factory loaded firmware. If applying a
custom firmware, please ensure these limits are not exceeded, voiding CE and FCC certifications.
(1) FCC standards are only applicable to SPSGPE-915 operating in the FCC 915 MHz band
(2) EN standards are only applicable to SPSGPE-433 and SPSGPE-868 operating in the ETSI
433MHz and ETSI 868MHz respectively.
Table 5. RF compliance limits.
February 2017
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Parameter
SPSGPE
version
Test conditions
Typ.
Unit
Sensitivity
(1% BER)
SPSGPE-433
FREQ = 434 MHz,
Data Rate = 50 kbps (25 kHz dev.
CH Filter=125kHz),
VDD = 3.3 V, TA = 25°C
Spirit1 SMPS enabled
-98
dBm
Sensitivity
(1% BER)
SPSGPE-868
FREQ = 868 MHz,
Data Rate = 50 kbps (25 kHz dev.
CH Filter=125kHz),
VDD = 3.3 V, TA = 25°C
Spirit1 SMPS enabled
-104
dBm
Sensitivity
(1% BER)
SPSGPE-915
FREQ = 915 MHz,
Data Rate = 50 kbps (25 kHz dev.
CH Filter=125kHz),
VDD = 3.3 V, TA = 25°C
Spirit1 SMPS enabled
-105
dBm
2.6 RF sensitivity data
RF sensitivity data for all the versions of SPSGPE are reported in Table 6.
Table 6 RF sensitivity data.
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Pin
Name
Type
Description
STM32L151RDY6
pin
(1)
TP1
I2C1_SCL
(4)
I/O
I2C clock
(3)
or general purpose input/output
PB8
TP2
SWDIO
I/O
Serial wire I/O
(2)
PA13
TP3
GPIO_11
I/O
General purpose input/output
PB7
TP4
GPIO_12
I/O
General purpose input/output
PC12
TP5
GPIO_13
I/O
General purpose input/output
PA15
TP6
RESET
I
Reset input, active low, internal pull-up
NRST
TP9
I2C1_SDA
(4)
I/O
I2C data in/out
(3)
or general purpose
input/output
PB9
TP10
STAT_LED
O
Status indicator LED
PB6
TP11
USB_DEV_CONN
I
Pull high, if USB is used/connected,
pull low, if USB is not used/connected
PB5
TP12
GPIO_8
I/O
General purpose input/output
PB4
TP13
GPIO_10
I/O
General purpose input/output
PB3
TP14
PWR_MON
O
Power ON monitor, goes high if the module
is powered on, goes low if the module is not
powered
PC11
TP15
GPIO_14
I/O
General purpose input/output
PD2
TP16
SWCLK I Serial wire clock
(2)
PA14
TP17
GND
Power
Ground
-
TP18
USB_P / RTS
I/O
USB DATA- or Request to send signal from
DTE, depending on firmware configuration
PA12
TP19
USB_N / CTS
I/O
USB DATA+ or Clear to send signal to DTE,
depending on firmware configuration
PA11
TP20
UART2_RX
I
Serial data input from DTE
PA10
TP21
UART2_TX
O
Serial data output to DTE
PA9
TP22
GPIO_9
I/O
General purpose input/output
PC6
TP23
SPI_MISO
(4)
I/O
SPI MISO or general purpose input/output
PB14
TP24
SPI_MOSI
(4)
I/O
SPI MOSI or general purpose input/output
PB15
TP25
RI O Ring indicator to DTE
PB12
TP26
SPI_CLK
(4)
I/O
SPI clock or general purpose input/output
PB13
TP27
VDD
Power
Supply input voltage
-
TP28
DTR
I
Data terminal ready from DTE
PB2
TP29
TX_AUX
O
Auxiliary serial data output for debug/test
PB10
TP30
ADC_01
I/O
ADC input or general purpose input/output
PB0
TP31
GPIO_6
I/O
General purpose input/output
PC5
TP32
GPIO_5
I/O
General purpose input/output
PC4
TP33
ON/OFF
I
Input for switching ON or OFF the module
PA0
TP34
UART1_RX
I/O
Serial data input
PA3
TP35
UART1_TX
I/O
Serial data output
PA2
TP36
ALARM/GPIO_1
I/O
Alarm output or general purpose
input/output
PCO
TP37
GPIO_4
I/O
General purpose input/output
PC3
TP38
GPIO_2/RF_TX_MON
O
RF transmitter ON monitor or general
purpose input/output
PC1
TP39
RX_AUX
I
Auxiliary serial data input for debug/test
PB11
TP40
ADC_01
I/O
ADC input or general purpose input/output
PB1
TP41
RESERVED
-
Must be left unconnected (for future uses)
PA8
TP42
GPIO_7
I/O
General purpose input/output
PA1
2.7 Pin assignment
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TP43
GPIO_3
I/O
General purpose input/output
PC2
TP44
GND
Power
Ground
-
TP45
ANT
I/O
Connection pin for external antenna (50 Ω)
-
TP46
GND
Power
Ground
-
Table 7. Pin assignment.
(1) For further details, please refer to STM32L151RDY6 datasheet, Pin descriptions section.
(2) Do not use SWD interface for any reason, unless to intentionally erase module flash memory and install
a different firmware image. Any attempt to use SWD interface will force an immediate flash memory full
erase, leaving SPSGPE in a clean state. Please notice that “FW Copy Protection Level 1” of
STM32L151RDY6 microcontroller is activated.
(3) For I2C operation at 100 kHz an external pull-up resistor of 4.7 kΩ needs to be used. For I2C operation
at 400 kHz an external pull-up resistor of 4.7 kΩ needs to be used.
(4) Pin may be configured either as the function indicated in the pin name, or as general purpose
input/output.
2.8 Pin placement
Figure 1. Pin placement (top view of LGA pads placed on bottom side).
February 2017
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