STMicroelectronics SPC58XXADPT64S User Manual

User manual
SPC58XXADPT64S rev. B evaluation board

Introduction

The SPC58XXADPT64S rev. B evaluation board supports STMicroelectronics SPC582BxxE1, SPC584BxxE1 and SPC58xCxxE1 microcontrollers in eTQFP64 package.
Figure 1. SPC58XXADPT64S rev. B
UM2790
UM2790 - Rev 1 - February 2021
www.st.com

1 Overview

The SPC58XXADPT64S rev. B "mini module" is an evaluation board supporting STMicroelectronics SPC582BxxE1, SPC584BxxE1 and SPC58xCxxE1 microcontrollers in eTQFP64 package with exposed pad down.
The SPC58XXADPT64S rev. B "mini module" is designed to be connected onto the SPC58xxMB motherboard, offering a mechanism for easy customer evaluation of the SPC582BxxE1, SPC584BxxE1 and SPC58xCxxE1 microcontrollers and to facilitate hardware and software development.
High density connectors provide the interface between the EVB and MCU daughter cards and help the developers evaluate all device peripherals.
This user manual provides information on using SPC58XXADPT64S rev. B "mini module" board and its hardware features.
The "mini module" may be used as a stand-alone unit granting access to the CPU, but no access to the I/O pins as any motherboard peripherals.
The SPC58XXADPT64S rev. B "mini module" is designed to be easily configurable and to be used for SPC582BxxE1, SPC584BxxE1 and SPC58xCxxE1.
The "mini module" is configured by default for SPC582BxxE1 and easily supports SPC584BxxE1 and SPC58xCxxE1 by simply changing the following through-hole jumper JR19.
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Overview
Figure 2. Overview of SPC58XXADPT64S rev. B "mini module" - top
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Figure 3. Overview of SPC58XXADPT64S rev. B "mini module" - bottom
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Package contents

1.1 Package contents

An SPC58XXADPT64S rev. B adapter package includes the following item:
SPC58XXADPT64S rev. B "mini module"

1.2 Supported devices

The SPC58XXADPT64S rev. B "mini module" supports the following STMicroelectronics family of microcontrollers in eTQFP64 package:
SPC582BxxE1
SPC584BxxE1
SPC58xCxxE1
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License agreement

2 License agreement

The packaging of this evaluation board was sealed with a seal stating, " by breaking this seal, you agree to the terms and conditions of the evaluation board license agreement, the terms and conditions of which are available at https://www.st.com/resource/en/evaluation_board_terms_of_use/evaluationproductlicenseagreement.pdf ". Upon breaking the seal, you and STMicroelectronics entered into the evaluation board license agreement, a copy of which is also enclosed with the evaluation board for convenience.
Attention: This evaluation board only offers limited features for evaluating ST products. It has not been tested for use
with other products and is not suitable for any safety or other commercial or consumer application. This evaluation board is otherwise provided “AS IS” and STMicroelectronics disclaims all warranties, express or implied, including the implied warranties of merchantability and fitness for a particular purpose.
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3 Handling precautions

Please take care to handle the package contents in a manner such as to prevent electrostatic discharge.
Before the EVB is used or power is applied, please fully read the following sections on how to correctly configure the board. Failure to correctly configure the board may cause irreparable component, MCU or EVB damage.
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Handling precautions
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4 Hardware description

4.1 Hardware features

The SPC58XXADPT64S rev. B "mini module" board has the following features:
Connector for external power supplies input (5.0 V, 3.3 V, 1.25 V) used in stand-alone mode
Reset button with driver and led indicator
Socket for device in eTQFP64 package
Debug ports:
14-pin header connector for JTAG port
10-pin header connector for SIPI interface
40 Mhz crystal main oscillator with jumpers to optionally disconnect it
8 Mhz oscillator with jumpers to optionally disconnect it
Clock input through SMA connector to optionally disconnect it
2 X SAMTEC QSH series, 240 way connector to connect "mini module" to motherboard
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Hardware description

4.2 Hardware dimension and PCB component view

The "mini module" has the following dimensions:
PCB area: 127 mm x 114.3 mm
Top components height: 16 mm max
Bottom components height: 3.5 mm max
PCB thickness: 1.6 mm
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5 Power and system configuration

5.1 Power supplies

When the "mini module" is plugged onto the motherboard, power is supplied directly by the motherboard. In this setup, the external power supply input available on the "mini module" should NOT be used.
When the SPC58XXADPT64S rev.B "mini module" is used as a stand-alone board, external power supplies must be used (5.0 V, 3.3 V, 1.25 V).
The following jumpers are used to configure the power supply:
Table 1. Supply related jumpers
Jumper Description Default Position
Jumper to enable the use of supply
J3
3.3V_SR
Jumper to enable the use of supply
J4
5.0V_SR
Jumper to enable the use of supply
J5
1.25V_SR
VDD_HV_ADR_S voltage configuration,
J6
select from 5.0V_LR (linear), 3.3V_SR (switching) or 5.0V_SR (switching)
VDD_HV_ADV_S voltage configuration,
J7
select from 5.0V_LR (linear), 3.3V_SR (switching) or 5.0V_SR (switching)
VDD_HV_IO_MAIN voltage configuration,
J8
select from 5.0V_SR or 3.3V_SR
VDD_HV_IO_FLEX voltage configuration,
J9
select from 5.0V_SR or 3.3V_SR (for Chorus 4M with JR19 closed 2-3)
VDD_LV voltage configuration, select from
J16
1.25V_SR or from Ballast Circuit
Ballast supply voltage configuration, select
J18
from VDD_HV_IO_MAIN or from 5.0V_SR
VDD_HV_FLA voltage configuration,
JP1
connect or disconnect VDD_HV_FLA from VDD_HV_IO_MAIN
1-2 (5.0V_LR)
1-2 (5.0V_LR)
1-2 (5.0V_SR)
1-2 (5.0V_SR)
1-2 (1.25V_SR)
1-2 (5.0V_SR)
Closed
Closed
Closed
Closed
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Power and system configuration
Figure 4. SPC58XXADPT64S rev. B "mini module" -
top - D3
Figure 4. SPC58XXADPT64S rev. B "mini module" -
top - D3
Figure 4. SPC58XXADPT64S rev. B "mini module" -
top - A3
Figure 4. SPC58XXADPT64S rev. B "mini module" -
top - D2
Figure 4. SPC58XXADPT64S rev. B "mini module" -
top - D2
Figure 4. SPC58XXADPT64S rev. B "mini module" -
top - D3
Figure 4. SPC58XXADPT64S rev. B "mini module" -
top - D3
Figure 4. SPC58XXADPT64S rev. B "mini module" -
top - B3
Figure 4. SPC58XXADPT64S rev. B "mini module" -
top - A3
Figure 5. SPC58XXADPT64S rev. B "mini module" -
bottom - C3
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5.2 Microcontrollers configuration

The SPC58XXADPT64S rev. B "mini module" is designed to be easily configurable and be used for SPC582BxxE1, SPC584BxxE1 and SPC58xCxxE1.
The "mini module" is configured by default for SPC582BxxE1 and easily supports SPC584BxxE1 and SPC58xCxxE1 by simply changing the following through-hole jumper JR19.
Table 2. Microcontroller configuration related jumpers
Jumper Description Default Position
Device pin 62 port configuration / function configuration:
JR19
1-2 - PC12 for SPC582BxxE1
2-3 - VDD_HV_IO_FLEX for SPC584BxxE1 and SPC58xCxxE1

5.3 Port configuration

The following jumpers need to configure the ports:
Closed 1-2
PC12 for
SPC582BxxE1
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Microcontrollers configuration
Figure 4. SPC58XXADPT64S rev. B "mini
module" - top - B3
Jumper Description Default Position
JP13 TESTMODE settings
Device pin 6 port configuration / function
JR14
configuration:
1-2 (PC1)
2-3 (ESR0)
Device pin 56 port configuration / function configuration:
J29
1-2 (PH4) SPC582BxxE1
2-3 (BCTRL) SPC584BxxE1, SPC58xCxxE

5.4 Debug interface configuration

The following jumpers need to configure the ports:
Table 4. Debug interface configuration related jumpers
Jumper Description Default Position
RSTIN connection
J13
open (disconnect PORST)
closed (connect PORST)
JTAG/LFAST LVDS pin 9 configuration
JP2
open (disconnect ESR0)
closed (connect ESR0)
Table 3. Ports related jumpers
Close (10 KΩ pull-
down)
Open
1-2 (PH4)
SPC582BxxE1
Closed (connect
PORST)
Open (disconnect
ESR0)
Figure 4. SPC58XXADPT64S rev. B "mini module" -
Figure 4. SPC58XXADPT64S rev. B "mini module" -
Figure 4. SPC58XXADPT64S rev. B "mini
module" - top - A2
Figure 4. SPC58XXADPT64S rev. B "mini
module" - top - C3
Figure 4. SPC58XXADPT64S rev. B "mini
module" - top - A3
top - B2
top - A3
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