STMicroelectronics SPC58XXADPT292S User Manual
Note: picture is not contractual.
SPC58XXADPT292S Rev. C evaluation board
Introduction
The evaluation board SPC58XXADPT292S Rev. C "mini module" supports STMicroelectronics SPC58XE84C3,
SPC57EM80C3, SPC58XG84C3 and SPC58XN84C3 microcontrollers in FPBGA292 package.
Figure 1. SPC58XXADPT292S Rev. C
UM2764
User manual
UM2764 - Rev 1 - January 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
1 Overview
The "mini module" is an evaluation board supporting STMicroelectronics SPC58XE84C3, SPC57EM80C3,
SPC58XG84C3 and SPC58XN84C3 microcontrollers in FPBGA292 package.
The "mini module" is designed to be connected onto the SPC58xxMB motherboard, offering a mechanism for
easy customer evaluation of the supported devices, and to facilitate hardware and software development.
The "mini module" may be used as a stand-alone unit allowing access to the CPU, but no access to the I/O pins
as any motherboard peripherals.
UM2764
Overview
Figure 2. Overview of SPC58XXADPT292S Rev. C "mini module" - top
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Figure 3. Overview of SPC58XXADPT292S Rev. C "mini module" - bottom
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Package contents
1.1 Package contents
An SPC58XXADPT292S Rev. C adapter package includes the following item:
• SPC58XXADPT292S Rev. C "mini module"
1.2 Supported devices
The "mini module" supports the following STMicroelectronics family of microcontrollers in FPBGA292 package:
• SPC58XE84C3
• SPC57EM80C3
• SPC58XG84C3
• SPC58XN84C3
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UM2764
License agreement
2 License agreement
The packaging of this evaluation board was sealed with a seal stating, " by breaking this seal, you agree to the
terms and conditions of the evaluation board license agreement, the terms and conditions of which are available
at www.st.com/ebla ". Upon breaking the seal, you and STMicroelectronics entered into the evaluation board
license agreement, a copy of which is also enclosed with the evaluation board for convenience.
Attention: This evaluation board only offers limited features for evaluating ST products. It has not been tested for use
with other products and is not suitable for any safety or other commercial or consumer application. This
evaluation board is otherwise provided “AS IS” and STMicroelectronics disclaims all warranties, express or
implied, including the implied warranties of merchantability and fitness for a particular purpose.
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3 Handling precautions
Please take care to handle the package contents in a manner such as to prevent electrostatic discharge.
Before the EVB is used or power is applied, please fully read the following sections on how to correctly configure
the board. Failure to correctly configure the board may cause irreparable component, MCU or EVB damage.
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Handling precautions
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4 Hardware description
4.1 Hardware features
The "mini module" has the following features:
• Connector for external power supplies input (5 V, 3.3 V, 1.25 V) used in stand-alone mode.
• Reset button with driver and led indicator
• Socket for device in FPBGA292 package with exposed pad down
• Debug ports:
• – 34-pin SAMTEC connector for Nexus 2
– 14-pin header connector for JTAG port
– 10-pin header connector for SIPI interface
• 40 MHz crystal main oscillator with jumpers to optionally disconnect it
• 8 MHz oscillator with jumpers to optionally disconnect it
• Clock input through SMA connector to optionally disconnect it
• 2 X Samtec QSH series, 240 way connector to connect "mini module" to motherboard
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Hardware description
4.2 Hardware dimension
The "mini module" has the following dimensions:
• PCB area: 127 mm X 114.3 mm
• Top components height: 19.4 mm max
• Bottom components height: 3.5 mm max
• PCB thickness: 1.6 mm
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5 Power and system configuration
5.1 Power supplies
When the "mini module" is plugged onto the motherboard, power is supplied directly by the motherboard. In this
setup, the external power supply input available on the "mini module" should NOT be used.
When the "mini module" is used as a stand-alone board, external power supplies must be used (5 V, 3.3 V, 1.25
V).
The following jumpers are used to configure the power supply:
Table 1. Power configuration jumpers
Jumper Description Default Position
VDD_HV_ADR voltage configuration
J1
from 5.0V_LR or 3.3V_SR
VDD_HV_ADV voltage configuration
J2
from 5.0V_LR or 3.3V_SR
VDD_HV_JTAG_OSC voltage
J3
configuration from 5.0V_SR or 3.3V_SR
VDD_HV_PMC voltage configuration
J4
from 5.0V_SR or 3.3V_SR
VDD_HV_IO_MAIN voltage
J6
configuration from 5.0V_SR or 3.3V_SR
VDD_HV_IO_FLEX voltage
J32
configuration from 5.0V_SR or 3.3V_SR
VDDPHYIO voltage configuration from
J8
5.0V_SR or 3.3V_SR
VDD_LV_STBY voltage configuration
J9
from 1.25V_SR or VDD_LV
VDD_LV voltage configuration from:
• BALLAST circuit
J35
• 1.25V_SR
SMPS_REGULATOR_OUT
Supply for BALLAST circuit
J38
configuration from VDD_HV_IO_MAIN
or 5.0V_SR
1-2 (5.0V_LR)
1-2 (5.0V_LR)
1-2 (5.0V_SR)
1-2 (5.0V_SR)
1-2 (5.0V_SR)
1-2 (5.0V_SR)
1-2 (5.0V_SR)
1-2 (1.25V_SR)
2-3 (1.25V_SR)
(VDD_HV_IO_MAIN)
1-2
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Power and system configuration
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - B2
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - B2
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - B2
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - B2
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - B2
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - C2
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - C2
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - C2
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - C4
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - D2
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5.2 Microcolntroller configuration
The jumpers described in the following table needs to configure the board to use STMicroelectronics
microcontroller SPC57EM80C3.
Table 2. Microcontroller SPC57EM80C3 configuration related jumpers
Jumper Description Default Position
Device ball T11 VDDSTBY
J33
function configuration
Device ball N19 NC
J34
function configuration
Device ball E15&D16
SW2
VDD_HV_FLA supply
configuration
The jumpers described in the following table need to configure the board to use STMicroelectronics
microcontrollers SPC58NE84C3, SPC58XG84C3 and SPC58XN84C3.
(Connect VDDSTBY with
(Device ball N19 Not Connected)
(Disconnect VDD_HV_FLA from
2-3
3.3_SR)
Open
2-3
VDD_HV_IO_MAIN)
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Microcolntroller configuration
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - C3
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - C3
Figure 5. SPC58XXADPT292S Rev. C bottom "mini
module" view - C2
Jumper
J33
J34
SW2
Table 3. SPC58NE84C3, SPC58XG84C3 and SPC58XN84C3 jumpers
Description Default Position
Device ball T11 EXTREG_SEL
function configuration:
• 2-1 (DISABLE BALLAST)
• 2-4 (ENABLE BALLAST)
Device ball N19 NC function
configuration
Device ball E15&D16
VDD_HV_FLA supply
configuration
2-1 (DISABLE BALLAST)
Close
(Connect BCTRL with
BALLAST Circuit)
2-1
(Connect VDD_HV_FLA with
VDD_HV_IO_MAIN)
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - C3
Figure 4. SPC58XXADPT292S Rev. C top "mini
module" view - C3
Figure 5. SPC58XXADPT292S Rev. C bottom
"mini module" view - C2
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