SPBTLE-RF
Bluetooth® V4.1 Smart module
Product preview
Features
Bluetooth Radio
-Bluetooth specification v4.1 compliant
-Master and slave Smart Bluetooth network processor module
-Embedded Bluetooth low energy protocol stack: GAP, GATT, SM, L2CAP, LL, RF-PHY
-Bluetooth low energy profiles provided separately
Preliminary module picture
11.5 mm x 13.5 mm x 2.0 mm
-Operating temperature range: -40°C to 85°C
Host Interface
-SPI, IRQ, and RESET
Antenna on board
CE, FCC, IC qualified
BQE certified
Jan 2015 - rev 0.1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
www.st.com
SPBTLE-RF
1 Description
The SPBTLE-RF is an easy to use Bluetooth® module, compliant with Bluetooth® v4.1. The module provides a complete RF platform in a tiny form factor.
The SPBTLE-RF enables wireless connectivity into electronic devices, not requiring any RF experience or expertise for integration into the final product. The SPBTLE-RF module, being a certified solution, optimizes the time to market of the final applications.
The module has been designed for maximum performance in a minimal space.
Optimized design allows the integration of a complete working Bluetooth® modem in the minimum possible size. Module interface is SPI serial interface.
2Applications
Watches
Fitness, wellness and sports
Consumer medical
Security/proximity
Remote control
Home and industrial automation
Assisted living
Mobile phone peripherals
PC peripherals
P a g e | 2 |
Rev 0.1 |
SPBTLE-RF
3 Block Diagram
Figure 1. HW block diagram
Battery or External Supply
BLUETOOTH L.E.. 2014 Module
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SUPPLY FILTER |
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INTERNAL 2.45 GHz |
Bead Ferrite |
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RF antenna |
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Host Controller |
SPI LINE |
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interface |
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RF |
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BLUETOOTH |
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BALUN |
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BLUENRG |
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+ Filter |
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32.768 kHz |
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Crystal |
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Internal / Ext. |
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32 MHz |
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32.768 kHz |
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clock |
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clock |
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External LPO (32.768 kHz)
OPTIONAL PIN FUNCTION
Rev 0.1 |
P a g e | 3 |
SPBTLE-RF
4 Software Architecture
Bluetooth Firmware implementation
Figure 2. SPBTLE-RF Application Block Diagaram
P a g e | 4 |
Rev 0.1 |
SPBTLE-RF
5 Hardware Specifications
General Conditions (VIN= 2.2V and 25°C)
5.1 Absolute Maximum Ratings |
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Table 1. Absolute maximum rating |
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Rating |
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Min |
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Typical |
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Max |
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Unit |
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Storage temperature range |
-40 |
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+85 |
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°C |
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Supply voltage, VIN |
-0.3 |
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+ 3.9 |
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Volts |
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I/O pin Voltage |
-0.3 |
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- |
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+ 3.9 |
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Volts |
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(VIO five-volt tolerant pin) |
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RF saturation input power |
- |
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8 |
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- |
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dBm |
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5.2 Recommended Operating Conditions |
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Table 2. Recommended operating conditions |
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Rating |
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Min |
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Typical |
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Max |
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Unit |
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Operating Temperature Range |
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-40 |
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85 |
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°C |
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Supply Voltage VIN |
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2.0 |
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3.3 |
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3.6 |
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Volts |
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Signals & I/O Pin Voltage |
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2.0 |
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- |
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3.6 |
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Volts |
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(according Supply Voltage) |
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RF Frequency |
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2402 |
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2480 |
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MHz |
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5.3 Pin assignement Figure 3. Pin connection
Rev 0.1 |
P a g e | 5 |
SPBTLE-RF
Table 3. Pin Assignement
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Type |
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Pin # |
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Description |
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ALT Function |
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V max. Tolerant |
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Initial State |
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SPI Interface |
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SPI_IRQ |
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O |
4 |
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SPI IRQ(SLAVE has data for MASTER) |
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Vin |
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SPI_CLK |
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I |
7 |
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SPI CLOCK (Max. 8 MHz) |
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Vin |
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SPI_MISO |
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O |
8 |
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SPI MISO (MASTER in / SLAVE out) |
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Vin |
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SPI_MOSI |
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I |
9 |
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SPI MOSI (MASTER out SLAVE in) |
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Vin |
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SPI_CS |
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I |
10 |
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SPI “Chip Select” (SPI slave select) |
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Vin |
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Power and Ground |
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Vin |
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5 |
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Vin |
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(2.0V + 3.6V max.) |
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GND |
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6 |
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GND |
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Reset |
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BT_RESET |
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I |
11 |
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Reset input (active low < 0.35 Vin) |
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(2.0V + 3.6V max.). |
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LPO |
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EXT_LPCLK |
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1 |
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Not connected / Optional pin function |
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(2.0V + Vin max.). |
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GPIO2 |
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I/O |
2 |
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Not connected |
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ANA TEST 0 |
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3 |
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Not connected |
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P a g e | 6 |
Rev 0.1 |