ST Microelectronics SPBT40DP Datasheet
Features
• •Bluetooth® radio
o Fully embedded Bluetooth® v4.0
o Embedded support for MFI iAP2 profile
o Class 2 module
o Complete RF ready module
with SPP and Low Energy profiles
SPBT4.0DP
Bluetooth® Smart Ready
Datasheet – preliminary data
module
o 128-bit encryption security
o Integrated antenna
• ST micro Cortex-M4 microprocessor
o up to 104 MHz
o 512 KB Flash
o 128 KB RAM memory
• Supported transmission speed with SPP
o Up to 800KBits
• General I/O
o 8 general purpose I/Os
• User interface
o AT command Data Package (DP)
o Firmware upgrade over UART
• ETSI, FCC, IC and Bluetooth® qualified
• Single voltage supply: 3.3 V typical
• Micro-sized form factor: 11.6 x 13.5 x 2.9 mm
• Operating temperature range: -40 °C to 85 °C
July
2015 DocID0xxxxx Rev 0.15
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
Contents
1 Description .......................................................................................................................... 5
2 RoHS compliance ................................................................................................................ 6
3 Applications ......................................................................................................................... 6
4 Software architecture .......................................................................................................... 7
4.1 BT stack layers ................................................................................................................. 7
4.2 Supported Profile ............................................................................................................. 7
4.3 AT Command DATA PACKAGE ....................................................................................... 7
5 Hardware specifications...................................................................................................... 8
5.1 Recommended operating conditions
5.2 Absolute maximum ratings
5.3 Modulei current absorption
5.4 Pin assignment
5.5 Mechanical dimensions
6 Hardware design .................................................................................................................... 12
6.1 Reflow soldering ............................................................................................................. 12
6.2 UART interface ............................................................................................................... 14
7 Regulatory compliance ..................................................................................................... 15
7.1 FCC certification ............................................................................................................ 15
7.1.1 Labeling instructions ............................................................................................... 15
7.1.2 Product manual instructions ................................................................................... 16
7.2 IC certification ................................................................................................................. 17
7.2.1 Labeling instructions ............................................................................................... 17
7.2.2 Product manual instructions ................................................................................... 18
................................................................................................................. 9
.............................................................................................. 8
............................................................................................. 8
................................................................................................. 10
.............................................................................. 8
7.3 Bluetooth certification .................................................................................................... 19
7.4 CE certification ............................................................................................................... 19
8
Traceability
9 Ordering information ......................................................................................................... 21
10 Revision history ................................................................................................................. 22
......................................................................................................................... 20
List of tables
List of tables
Table 1. Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 3. Pin
Table 4. Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Table 5. Traceability information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 6. Ordering
Table 7. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
assignment
information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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List of figures
List of figures
Figure 1. Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 2. Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 3. Recommend land pattern top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 4. Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 5. Connection to host device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 6. Typical RS232 circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
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1 Description
The SPBT4.0DP is an easy to use Bluetooth Smart Ready module, compliant with Bluetooth
v4.0.
The module is among the smallest form factor available which provides a complete RF
platform. The SPBT4.0DP enables electronic devices with wireless connectivity, not
requiring any RF experience or expertise for integration into the final product. The
SPBT4.0DP module, being a certified solution, optimizes the time to market of the final
applications.
The module is designed for maximum performance in a minimal space including fast speed
UART and 8 general purpose I/O lines, several serial interface options, and up to 800 kbps
transmission speed with SPP service active, 250kbps with iAP2 service active.
Optimized design allows the integration of a complete working Bluetooth modem, including
antenna, in the minimum possible size; only an additional external LPO (low power
oscillator) is required to enable low power mode capability.
The SPBT4.0DP is a surface mount PCB module that provides fully embedded, ready to
use Bluetooth wireless technology. The reprogrammable Flash memory contains
embedded firmware for serial cable replacement using the Bluetooth SPP profile.
Embedded Bluetooth DATA PACKAGE (DP) firmware is a friendly interface, which realizes a
simple control for cable replacement. The SPBT4.0DP supporting SPP, iAP2 and Bluetooth
Low Energy proprietary Data Exchange profiles, it provides communication with Android,
smartphone, and the newest Apple® iOS Bluetooth enabled devices.
An Apple authentication IC is required to exchange data with an Apple device or access an
Apple device application. The DP FW includes the Bluetooth iAP2 profile capable of
recognizing the Apple authentication chip.
Customers using the Apple authentication IC must register as developers to become an
Apple certified MFI member. License fees may apply, for additional information visit:
http://developer.apple.com/programs/which-program/index.html.
Certified MFI developers developing electronic accessories that connect to the iPod®,
iPhone®, and iPad® gain access to technical documentation, hardware components,
technical support and certification logos.
Customized firmware for peripheral device interaction, power optimization, security, and
other proprietary features may be supported and can be ordered pre-loaded and configured.
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2 RoHS compliance
ST Bluetooth modules comply with the ECOPACK2 level of RoHS compliance grade.
3 Applications
The SPBT4.0DP is suitable for a wide range of application like:
•
Serial cable replacement
•
M2M industrial control
•
Service diagnostic
•
Data acquisition equipment
•
Machine control
•
Sensor monitoring
•
Security system
•
Mobile health
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4 Software architecture
4.1 BT stack layers
•
Bluetooth v4.0
•
Device power modes: active, sleep and deep sleep
•
Wake on Bluetooth feature optimized power consumption of host CPU
•
Authentication and encryption
•
Encryption key length from 8 bits to 128 bits
•
Persistent Flash memory for BD address and user parameter storage
•
All ACL (asynchronous connection less) packet types
•
Sniff mode: fully supported to maximum allowed intervals
•
Master slave switch supported during connection and post connection
•
Dedicated inquiry access code for improved inquiry scan performance
•
Dynamic packet selection channel quality driven data rate to optimize link performance
•
Dynamic power control
•
Bluetooth radio natively supports 802.11b co-existence AFH
•
RFCOMM, SDP, and L2CAP supported
4.2 Supported Profile
Bluetooth Classic:
• Serial Port Profile (SPP)
• iPOD Accessory Protocol 2 (iAP2)
Bluetooth Low Energy:
•
Proprietary Data Exchange Profile (DEP)
4.3 AT Command DATA PACKAGE
The complete command list is reported in the AT Command DATA PACKAGE user manual.
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