ST Microelectronics SPBT30DP2 Users Manual

Features

• Bluetooth® radio

o Fully embedded Bluetooth® v3.0

o Embedded support for MFI iAP2 profile
o Class 2 module
o Complete RF ready module

with SPP and HID profiles

SPBT3.0DP2

Bluetooth® Classic

Datasheet – preliminary data

module

o 128-bit encryption security
o Integrated antenna

• ST micro Cortex-M4 microprocessor

o up to 100 MHz
o 512 KB Flash
o 128 KB RAM memory

• Supported transmission speed with SPP

o Up to 800KBits

• General I/O

o 8 general purpose I/Os

• User interface

o AT command Data Package (DP)
o Firmware upgrade over UART

• ETSI, FCC, IC and Bluetooth® qualified

• Single voltage supply: 3.3 V typical

• Micro-sized form factor: 11.6 x 13.5 x 2.9 mm

• Operating temperature range: -40 °C to 85 °C

January

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2016 DocID0xxxxx Rev 0.17

List of tables

Contents

1 Description .......................................................................................................................................... 5

2 RoHS compliance ............................................................................................................................... 6

3 Applications ........................................................................................................................................ 6

4 Software architecture ........................................................................................................................ 7

4.1 BT stack layers ................................................................................................................................ 7

4.2 Supported Profile ........................................................................................................................... 8

4.3 AT Command set: DATA PACKAGE .......................................................................................... 8

5 Hardware specifications ................................................................................................................... 8

5.1 Recommended operating conditions

5.2 Absolute maximum ratings

.......................................................................................................... 8

5.3 High performance current consumption

5.4 Balanced performance current consumption

5.5 Pin assignment

5.6 Mechanical dimensions

............................................................................................................................. 10

.............................................................................................................. 11

........................................................................................ 8

.................................................................................. 9

......................................................................... 9

6 Hardware design ...................................................................................................................................... 13

6.1 Reflow soldering ................................................................................................................................ 13

6.2 UART interface .............................................................................................................................. 15

7 Regulatory compliance ................................................................................................................... 16

7.1 FCC certification .......................................................................................................................... 16

7.1.1 Labeling instructions ................................................................................................................. 16

7.1.2 Product manual instructions ..................................................................................................... 17

7.2 IC certification .................................................................................................................................. 18

7.2.1 Labeling instructions ................................................................................................................. 18

7.2.2 Product manual instructions ..................................................................................................... 19

7.3 Bluetooth certification ................................................................................................................. 19

7.4 CE certification .............................................................................................................................. 20

8

Traceability

......................................................................................................................................... 21

9 Ordering information ....................................................................................................................... 22

10 Revision history ................................................................................................................................ 23

January

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2016 DocID0xxxxx Rev 0.17

List of tables

List of tables

Table 1: Recommended operating conditions ................................................................................... 8

Table 2: Absolute maximum ratings ..................................................................................................... 8

Table 3: High Performance Power Consumption .............................................................................. 9

Table 4: Balanced Performance Power Consumption ..................................................................... 9

Table 4: Pin assignment ......................................................................................................................... 10

Table 5: Soldering .................................................................................................................................... 13

Table 6: Traceability information ......................................................................................................... 21

Table 7: Ordering information .............................................................................................................. 22

Table 8: Document revision history .................................................................................................... 23

January

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2016 DocID0xxxxx Rev 0.17

List of figures

List of figures

Figure 1: Software Architecture Overview .......................................................................................... 7

Figure 2: Pin connection ........................................................................................................................ 10

Figure 3: Mechanical dimensions ........................................................................................................ 11

Figure 4: Recommend land pattern top view .................................................................................... 12

Figure 5: Soldering profile ..................................................................................................................... 14

Figure 6: Connection to host device ................................................................................................... 15

Figure 7: Typical RS232 circuit ............................................................................................................ 15

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com

January

2016 DocID0xxxxx Rev 0.17

1 Description

The SPBT3.0DP2 is an easy to use Bluetooth module, compliant with Bluetooth v3.0.
The module is among the smallest form factor available which provides a complete RF platform. The

SPBT3.0DP2 enables electronic devices with wireless connectivity, not requiring any RF experience or
expertise for integration into the final product. The SPBT3.0DP2 module, being a certified solution,
optimizes the time to market of the final applications.

The module is designed for maximum performance in a minimal space including fast speed UART and 8
general purpose I/O lines, several serial interface options, and up to 800 kbps transmission speed with
SPP service active, 250kbps with iAP2 service active.

Optimized design allows the integration of a complete working Bluetooth modem, including antenna, in
the minimum possible size;

Deep Sleep Modes allows to reduce power consumption when a Bluetooth connection is not established.
Current consumption in Deep Sleep Mode can be reduce even more adding an external LPO (low power
oscillator).

The SPBT3.0DP2 is a surface mount PCB module that provides fully embedded, ready to use Bluetooth
wireless technology. The reprogrammable Flash memory contains embedded firmware for serial cable
replacement using the Bluetooth SPP profile. Embedded Bluetooth DATA PACKAGE (DP) firmware is a
friendly interface, which realizes a simple control for cable replacement, enabling communication with
most Bluetooth enabled devices, provided that the devices support the SPP profile. The SPBT3.0DP2,
supporting iAP2 profile, provides communication with Android, smartphone, and the newest Apple® iOS
Bluetooth enabled devices.

An Apple authentication IC is required to exchange data with an Apple device or access an Apple device
application. The DP FW includes the Bluetooth iAP2 profile capable of recognizing the Apple
authentication chip.

Customers using the Apple authentication IC must register as developers to become an Apple certified
MFI member. License fees may apply, for additional information visit:
http://developer.apple.com/programs/which-program/index.html.

Certified MFI developers developing electronic accessories that connect to the iPod®, iPhone®, and
iPad® gain access to technical documentation, hardware components, technical support and
certification logos.

Customized firmware for peripheral device interaction, power optimization, security, and other proprietary
features may be supported and can be ordered pre-loaded and configured.

January

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2016 DocID0xxxxx Rev 0.17

2 RoHS compliance

ST Bluetooth modules comply with the ECOPACK2 level of RoHS compliance grade.

3 Applications

The SPBT3.0DP2 is suitable for a wide range of application like:

•

Serial cable replacement

•

M2M industrial control

•

Service diagnostic

•

Data acquisition equipment

•

Machine control

•

Sensor monitoring

•

Security system

•

Mobile health

January

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2016 DocID0xxxxx Rev 0.17

Radio

Baseband

Link Manager

Bluetooth Controller

STM32 Hardware Abstraction Layer

Operating System

HCI

L2CAP

RFCOMM

SDP

Bluetooth Stack

Bluetooth Profiles

SPP

HID

iAP2

STM32F4 controller

Data Package with AT Command

Application

Figure 1: Software Architecture Overview

4 Software architecture

4.1 BT stack layers

• Bluetooth v3.0

• Device power modes: active, deep sleep

• Connection modes: active, sniff

• Wake on Bluetooth feature optimized power consumption of host CPU

• Authentication and encryption

• Encryption key length from 8 bits to 128 bits

• Persistent Flash memory for BD address and user parameter storage

• All ACL (asynchronous connection less) packet types

• Sniff mode: fully supported to maximum allowed intervals

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2016 DocID0xxxxx Rev 0.17

Rating

Min.

Typical

Max. Unit

Operating temperature range

-40 -

+ 85 °C

Supply voltage

V

IN

2.1 3.3 3.6 V Signal pin voltage

- 1.8 - V RF frequency

2402 - 2480

MHz

Rating

Min.

Typical

Max.

Unit

Storage temperature range

-40 - + 85 °C

Supply voltage,

V

IN

-0.3 - +

5.5 V

I/O pin voltage,

V

IO

-0.3 +1.8

+ 1.84 V

RF max. input power GFSK

- - 10 dBm

RF max. input power DQPSK

- - 6 dBm

RF max. input power DPSK

- - -3 dBm

• Master slave switch supported during connection and post connection

• Dedicated inquiry access code for improved inquiry scan performance

• Dynamic packet selection channel quality driven data rate to optimize link performance

• Dynamic power control

• Bluetooth radio natively supports 802.11b co-existence AFH

• RFCOMM, SDP, and L2CAP supported

4.2 Supported Profile

• Serial Port Profile (SPP)

• Human Interface Device (HID)

• iPhone Accessory Profile 2 (iAP2)

4.3 AT Command set: DATA PACKAGE

The complete command list is reported in the AT Command DATA PACKAGE user manual.

5 Hardware specifications

General conditions (V

5.1 Recommended operating conditions

= 3.3 V and 25

IN

°C).

Table 1: Recommended operating conditions

5.2 Absolute maximum ratings

January

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without notice. www.st.com

Table 2: Absolute maximum ratings

2016 DocID0xxxxx Rev 0.17

Modes (typical power consumption)

Average

Unit

No connection, Page/Inquiry Scan, no external LPO,
Deep Sleep Mode

4.75

mA

No connection, Page/Inquiry Scan, with external LPO,
Deep Sleep Mode

95

µA

No connection, Page/Inquiry Scan, no external LPO,
Active Mode

7.9

mA

No connection, Page/Inquiry Scan, with external LPO,
Active Mode

7.85

mA

No connection, No Page/Inquiry Scan, no external LPO,
Active Mode

7.65

mA
Connection, no data traffic, Master

8.85

mA

Connection, no data traffic, Slave

11.45

mA

Connection, Master, TX data

17.4

mA

Connection, Master, RX data

18.2

mA

Connection, Master, TX-RX data

20.8

mA

Modes (typical power consumption)

Average

Unit

No connection, Page/Inquiry Scan, no external LPO,
Deep Sleep Mode

1.6

mA

No connection, Page/Inquiry Scan, with external LPO,
Deep Sleep Mode

85

µA

No connection, Page/Inquiry Scan, no external LPO,
Active Mode

4.1

mA

No connection, Page/Inquiry Scan, with external LPO,
Active Mode

4.1

mA

No connection, No Page/Inquiry Scan, no external LPO,
Active Mode

3.9

mA
Connection, no data traffic, Master

5.43

mA

Connection, no data traffic, Slave

6.95

mA

Connection, Master, TX data

14.5

mA

Connection, Master, RX data

15.1

mA

Connection, Master, TX-RX data

18.3

mA

5.3 High performance current consumption

High performance configuration current consumption:

 CPU: 84 MHz
 UART: 115.2 Kbps
 Data throughput up to 100 Kbps
 Temperature: 25 °C

Table 3: High Performance Power Consumption

5.4 Balanced performance current consumption

Balanced performance configuration current consumption:

 CPU: 16 MHz
 UART: 115.2 Kbps
 Data throughput up to 100 Kbps
 Temperature: 25 °C

Table 4: Balanced Performance Power Consumption

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without notice. www.st.com

January

2016 DocID0xxxxx Rev 0.17

Pin

Name

Description

I/O

Note

1

GPIO1_BTCS

GPIO indicating BT Connection Status

- When high, BT connection is active

- When low, BT connection is not active

O

2

GPIO2

General purpose I/O

I/O

5V tolerant

3

GPIO3

General purpose I/O

I/O

5V tolerant

4

GPIO4_MLPS

GPIO indicating Module Low Power Status

- When high, device is in active mode

- When low, device is in low power mode

O

5

GPIO5 / I2C SDA

General purpose I/O or I2C_SDA line for MFI chip

I/O

5V tolerant

6

GPIO6 / I2C SCL

General purpose I/O or I2C_SCL line for MFI chip

I/O

5V tolerant

7

GND

Reference ground

NA

8 Vin

Main power supply input

NA

9 Boot 0

Boot 0 pin

I

5V tolerant

10

RESETn

Reset input (active low for 5ms)

I 11

CTS

Request to send (active low)

I 12

RTS

Clear to send (active low)

O

5V tolerant

13

RXD

Receive Data

I

5V tolerant

14

TXD

Transmit Data

O

15

LPO

Low power 32KHz oscillator input

I

16

GPIO7

General purpose I/O

I/O

5V tolerant

17

GPIO8

General purpose I/O

I/O

5V tolerant

18

+1.8V OUT

+1.8V out (max 10mA)

NA

Figure 2: Pin connection

5.5 Pin assignment

Table 5: Pin assignment

January

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com

2016 DocID0xxxxx Rev 0.17