ST Microelectronics SPBT30DP2 Users Manual

SPBT3.0DP2

Bluetooth® Classic module

Datasheet – preliminary data

Features

•Bluetooth® radio

o	Fully embedded	Bluetooth®	v3.0
	with SPP and HID profiles
o Embedded support for MFI iAP2 profile
o	Class 2 module
o Complete RF ready module
o 128-bit encryption security

oIntegrated antenna

•ST micro Cortex-M4 microprocessor

oup to 100 MHz

o 512 KB Flash

o128 KB RAM memory

•Supported transmission speed with SPP

oUp to 800KBits

•General I/O

o8 general purpose I/Os

•User interface

o AT command Data Package (DP)

oFirmware upgrade over UART

•ETSI, FCC, IC and Bluetooth® qualified

•Single voltage supply: 3.3 V typical

•Micro-sized form factor: 11.6 x 13.5 x 2.9 mm

•Operating temperature range: -40 °C to 85 °C

January 2016 DocID0xxxxx Rev 0.17

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com

List of tables

Contents

1	Description ..........................................................................................................................................		5
2	RoHS compliance...............................................................................................................................		6
3	Applications ........................................................................................................................................		6
4	Software architecture ........................................................................................................................		7
4.1		BT stack layers................................................................................................................................	7
4.2		Supported Profile ...........................................................................................................................	8
4.3		AT Command set: DATA PACKAGE..........................................................................................	8
5	Hardware specifications...................................................................................................................		8
5.1		Recommended operating conditions........................................................................................	8
5.2		Absolute maximum ratings ..........................................................................................................	8
5.3		High performance current consumption ..................................................................................	9
5.4		Balanced performance current consumption .........................................................................	9
5.5		Pin assignment .............................................................................................................................	10
5.6		Mechanical dimensions..............................................................................................................	11
6 Hardware design ......................................................................................................................................			13
6.1 Reflow soldering................................................................................................................................			13
6.2		UART interface ..............................................................................................................................	15
7	Regulatory compliance...................................................................................................................		16
7.1		FCC certification..........................................................................................................................	16
	7.1.1 Labeling instructions .................................................................................................................		16
	7.1.2 Product manual instructions.....................................................................................................		17
7.2 IC certification ..................................................................................................................................			18
	7.2.1 Labeling instructions .................................................................................................................		18
	7.2.2 Product manual instructions.....................................................................................................		19
7.3		Bluetooth certification .................................................................................................................	19
7.4		CE certification..............................................................................................................................	20
8	Traceability.........................................................................................................................................		21
9	Ordering information.......................................................................................................................		22
10	Revision history................................................................................................................................		23

January 2016

DocID0xxxxx Rev 0.17

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com

List of tables
List of tables
Table 1: Recommended operating conditions ...................................................................................	8
Table 2: Absolute maximum ratings .....................................................................................................	8
Table 3: High Performance Power Consumption ..............................................................................	9
Table 4: Balanced Performance Power Consumption .....................................................................	9
Table 4: Pin assignment.........................................................................................................................	10
Table 5: Soldering....................................................................................................................................	13
Table 6: Traceability information .........................................................................................................	21
Table 7: Ordering information ..............................................................................................................	22
Table 8: Document revision history....................................................................................................	23

January 2016

DocID0xxxxx Rev 0.17

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com

	List of figures
List of figures
Figure 1: Software Architecture Overview ..........................................................................................	7
Figure 2: Pin connection........................................................................................................................	10
Figure 3: Mechanical dimensions........................................................................................................	11
Figure 4: Recommend land pattern top view....................................................................................	12
Figure 5: Soldering profile.....................................................................................................................	14
Figure 6: Connection to host device...................................................................................................	15
Figure 7: Typical RS232 circuit ............................................................................................................	15

January 2016

DocID0xxxxx Rev 0.17

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com

1 Description

The SPBT3.0DP2 is an easy to use Bluetooth module, compliant with Bluetooth v3.0.

The module is among the smallest form factor available which provides a complete RF platform. The SPBT3.0DP2 enables electronic devices with wireless connectivity, not requiring any RF experience or expertise for integration into the final product. The SPBT3.0DP2 module, being a certified solution, optimizes the time to market of the final applications.

The module is designed for maximum performance in a minimal space including fast speed UART and 8 general purpose I/O lines, several serial interface options, and up to 800 kbps transmission speed with SPP service active, 250kbps with iAP2 service active.

Optimized design allows the integration of a complete working Bluetooth modem, including antenna, in the minimum possible size;

Deep Sleep Modes allows to reduce power consumption when a Bluetooth connection is not established. Current consumption in Deep Sleep Mode can be reduce even more adding an external LPO (low power oscillator).

The SPBT3.0DP2 is a surface mount PCB module that provides fully embedded, ready to use Bluetooth wireless technology. The reprogrammable Flash memory contains embedded firmware for serial cable replacement using the Bluetooth SPP profile. Embedded Bluetooth DATA PACKAGE (DP) firmware is a friendly interface, which realizes a simple control for cable replacement, enabling communication with most Bluetooth enabled devices, provided that the devices support the SPP profile. The SPBT3.0DP2, supporting iAP2 profile, provides communication with Android, smartphone, and the newest Apple® iOS Bluetooth enabled devices.

An Apple authentication IC is required to exchange data with an Apple device or access an Apple device application. The DP FW includes the Bluetooth iAP2 profile capable of recognizing the Apple authentication chip.

Customers using the Apple authentication IC must register as developers to become an Apple certified MFI member. License fees may apply, for additional information visit: http://developer.apple.com/programs/which-program/index.html.

Certified MFI developers developing electronic accessories that connect to the iPod®, iPhone®, and iPad® gain access to technical documentation, hardware components, technical support and certification logos.

Customized firmware for peripheral device interaction, power optimization, security, and other proprietary features may be supported and can be ordered pre-loaded and configured.

January 2016 DocID0xxxxx Rev 0.17

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com

2 RoHS compliance

ST Bluetooth modules comply with the ECOPACK2 level of RoHS compliance grade.

3 Applications

The SPBT3.0DP2 is suitable for a wide range of application like:

•Serial cable replacement

•M2M industrial control

•Service diagnostic

•Data acquisition equipment

•Machine control

•Sensor monitoring

•Security system

•Mobile health

January 2016 DocID0xxxxx Rev 0.17

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com

4 Software architecture

Figure 1: Software Architecture Overview

Application

Data Package with AT Command

Bluetooth Profiles
SPP	HID	iAP2

Bluetooth Stack

RFCOMM SDP

L2CAP

HCI

Operating System

STM32 Hardware Abstraction Layer

STM32F4 controller

Bluetooth Controller

Link Manager

Baseband

Radio

4.1BT stack layers

•Bluetooth v3.0

•Device power modes: active, deep sleep

•Connection modes: active, sniff

•Wake on Bluetooth feature optimized power consumption of host CPU

•Authentication and encryption

•Encryption key length from 8 bits to 128 bits

•Persistent Flash memory for BD address and user parameter storage

•All ACL (asynchronous connection less) packet types

•Sniff mode: fully supported to maximum allowed intervals

January 2016 DocID0xxxxx Rev 0.17

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•Master slave switch supported during connection and post connection

•Dedicated inquiry access code for improved inquiry scan performance

•Dynamic packet selection channel quality driven data rate to optimize link performance

•Dynamic power control

•Bluetooth radio natively supports 802.11b co-existence AFH

•RFCOMM, SDP, and L2CAP supported

4.2Supported Profile

•Serial Port Profile (SPP)

•Human Interface Device (HID)

•iPhone Accessory Profile 2 (iAP2)

4.3AT Command set: DATA PACKAGE

The complete command list is reported in the AT Command DATA PACKAGE user manual.

5 Hardware specifications

General conditions (VIN = 3.3 V and 25 °C).

5.1Recommended operating conditions

Table 1: Recommended operating conditions

Rating	Min.	Typical	Max.	Unit
Operating temperature range	-40	-	+ 85	°C
Supply voltage VIN	2.1	3.3	3.6	V
Signal pin voltage	-	1.8	-	V
RF frequency	2402	-	2480	MHz

5.2Absolute maximum ratings

Table 2: Absolute maximum ratings

	Rating	Min.	Typical	Max.	Unit
	Storage temperature range	-40	-	+ 85	°C
	Supply voltage, VIN	-0.3	-	+ 5.5	V
	I/O pin voltage, VIO	-0.3	+1.8	+ 1.84	V
	RF max. input power GFSK	-	-	10	dBm
	RF max. input power DQPSK	-	-	6	dBm
	RF max. input power DPSK	-	-	-3	dBm
January 2016		DocID0xxxxx Rev 0.17

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com

5.3 High performance current consumption

High performance configuration current consumption:

CPU: 84 MHz

UART: 115.2 Kbps

Data throughput up to 100 Kbps

Temperature: 25 °C

Table 3: High Performance Power Consumption

Modes (typical power consumption)	Average	Unit
No connection, Page/Inquiry Scan, no external LPO,	4.75	mA
Deep Sleep Mode
No connection, Page/Inquiry Scan, with external LPO,	95	µA
Deep Sleep Mode
No connection, Page/Inquiry Scan, no external LPO,	7.9	mA
Active Mode
No connection, Page/Inquiry Scan, with external LPO,	7.85	mA
Active Mode
No connection, No Page/Inquiry Scan, no external LPO,	7.65	mA
Active Mode
Connection, no data traffic, Master	8.85	mA
Connection, no data traffic, Slave	11.45	mA
Connection, Master, TX data	17.4	mA
Connection, Master, RX data	18.2	mA
Connection, Master, TX-RX data	20.8	mA

5.4 Balanced performance current consumption

Balanced performance configuration current consumption:

CPU: 16 MHz

UART: 115.2 Kbps

Data throughput up to 100 Kbps

Temperature: 25 °C

Table 4: Balanced Performance Power Consumption

Modes (typical power consumption)	Average	Unit
No connection, Page/Inquiry Scan, no external LPO,	1.6	mA
Deep Sleep Mode
No connection, Page/Inquiry Scan, with external LPO,	85	µA
Deep Sleep Mode
No connection, Page/Inquiry Scan, no external LPO,	4.1	mA
Active Mode
No connection, Page/Inquiry Scan, with external LPO,	4.1	mA
Active Mode
No connection, No Page/Inquiry Scan, no external LPO,	3.9	mA
Active Mode
Connection, no data traffic, Master	5.43	mA
Connection, no data traffic, Slave	6.95	mA
Connection, Master, TX data	14.5	mA
Connection, Master, RX data	15.1	mA
Connection, Master, TX-RX data	18.3	mA

January 2016 DocID0xxxxx Rev 0.17

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com

5.5Pin assignment

Figure 2: Pin connection

Table 5: Pin assignment

Pin	Name	Description	I/O	Note
1	GPIO1_BTCS	GPIO indicating BT Connection Status	O
		- When high, BT connection is active
		- When low, BT connection is not active
2	GPIO2	General purpose I/O	I/O	5V tolerant
3	GPIO3	General purpose I/O	I/O	5V tolerant
4	GPIO4_MLPS	GPIO indicating Module Low Power Status	O
		- When high, device is in active mode
		- When low, device is in low power mode
5	GPIO5 / I2C SDA	General purpose I/O or I2C_SDA line for MFI chip	I/O	5V tolerant
6	GPIO6 / I2C SCL	General purpose I/O or I2C_SCL line for MFI chip	I/O	5V tolerant
7	GND	Reference ground	NA
8	Vin	Main power supply input	NA
9	Boot 0	Boot 0 pin	I	5V tolerant
10	RESETn	Reset input (active low for 5ms)	I
11	CTS	Request to send (active low)	I
12	RTS	Clear to send (active low)	O	5V tolerant
13	RXD	Receive Data	I	5V tolerant
14	TXD	Transmit Data	O
15	LPO	Low power 32KHz oscillator input	I
16	GPIO7	General purpose I/O	I/O	5V tolerant
17	GPIO8	General purpose I/O	I/O	5V tolerant
18	+1.8V OUT	+1.8V out (max 10mA)	NA

January 2016 DocID0xxxxx Rev 0.17

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com