ST Microelectronics SPBT30DP1 Users Manual
Features
• Bluetooth® radio
o Fully embedded Bluetooth® v3.0
o Class 1 module
o Complete RF ready module
with SPP and HID profiles
SPBT3.0DP1
Bluetooth® Classic
Datasheet – preliminary data
module
o Embedded support for MFI iAP2 profile
o 128-bit encryption security
o Integrated antenna
• ST Cortex-M4 microprocessor
o up to 100 MHz
o 512 KB Flash
o 128 KB RAM memory
• Supported transmission speed with SPP
o Up to 800KBits
• General I/O
o 14 general purpose I/Os
• User interface
o AT command Data Package (DP)
o Firmware upgrade over UART
• ETSI, FCC, IC and Bluetooth® qualified
• Single voltage supply: 3.3 V typical
• Micro-sized form factor: 15.24 x 26.9 x 2.9 mm
• Operating temperature range: -40 °C to 85 °C
January
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
2016 DocID0xxxxx Rev 0.17
Contents
Features
1 Description .............................................................................................................................................. 4
2 RoHS compliance ................................................................................................................................... 5
3 Applications ............................................................................................................................................ 5
4 Software architecture .............................................................................................................................. 6
5 Hardware specifications .......................................................................................................................... 9
........................................................................................................................................................... 1
4.1 BT stack layers .................................................................................................................................... 6
4.2 Supported Profile ................................................................................................................................. 7
4.3 AT Command set: DATA PACKAGE ................................................................................................ 7
5.1 Recommended operating conditions ................................................................................................... 9
5.2 Absolute maximum ratings .................................................................................................................. 9
5.3 Current consumption ............................................................................................................................. 9
5.4 Pin assignment ................................................................................................................................... 10
5.5 Mechanical dimensions ..................................................................................................................... 12
6 Hardware design ................................................................................................................................... 13
6.1 Module reflow soldering ..................................................................................................................... 13
6.2 UART interface ................................................................................................................................. 15
6.3 GPIO interface .................................................................................................................................... 16
6.4 Reset circuit ........................................................................................................................................ 16
6.4.1 External reset circuit .................................................................................................................... 16
6.4.2 Internal reset circuit ......................................................................................................................... 17
7 Regulatory compliance ......................................................................................................................... 18
7.1 FCC certification .............................................................................................................................. 18
7.1.1 Labeling instructions .................................................................................................................... 18
7.1.2 Product manual instructions ......................................................................................................... 19
7.2 IC certification .................................................................................................................................... 20
7.2.1 Labeling instructions .................................................................................................................... 20
7.2.2 Product manual instructions ......................................................................................................... 21
7.3 Bluetooth certification ........................................................................................................................ 22
7.4 CE certification ................................................................................................................................... 22
8 Traceability ........................................................................................................................................... 23
9 Ordering information ............................................................................................................................ 24
10 Revision history ................................................................................................................................ 25
January
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
2016 DocID0xxxxx Rev 0.17
List of tables
Table 1: Recommended operating conditions ................................................................................... 9
Table 2: Absolute maximum ratings ..................................................................................................... 9
Table 3: High Performance Power Consumption ............................................................................ 10
Table 4: Pin assignment ......................................................................................................................... 10
Table 5: Soldering .................................................................................................................................... 14
Table 6: Traceability information ......................................................................................................... 23
Table 7: Ordering information .............................................................................................................. 24
Table 8: Document revision history .................................................................................................... 25
List of figures
Figure 1: Software Architecture Overview ..................................................................................................... 6
Figure 2: Block Diagram ................................................................................................................................ 8
Figure 3: Pin assignment ............................................................................................................................... 10
Figure 4: mechanical dimensions .................................................................................................................. 12
Figure 5: Recommend land pattern top view ................................................................................................ 13
Figure 6: Soldering profile ............................................................................................................................ 14
Figure 7: Connection to host device ............................................................................................................. 15
Figure 8: Typical RS232 circuit .................................................................................................................... 15
Figure 9: External reset circuit ...................................................................................................................... 16
January
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
2016 DocID0xxxxx Rev 0.17
1 Description
The SPBT3.0DP1 is an easy to use Bluetooth module, compliant with Bluetooth v3.0.
The module is among the smallest form factor available which provides a complete RF platform. The
SPBT3.0DP1 enables electronic devices with wireless connectivity, not requiring any RF experience or
expertise for integration into the final product. The SPBT3.0DP1 module, being a certified solution,
optimizes the time to market of the final applications.
The module is designed for maximum performance in a minimal space including fast speed UART and 14
general purpose I/O lines, and up to 800 kbps transmission speed with SPP service active, 250kbps with
iAP2 service active.
Optimized design allows the integration of a complete working Bluetooth modem, including antenna, in
the minimum possible size.
Deep Sleep Mode allows to reduce power consumption when a Bluetooth connection is not established.
The SPBT3.0DP1 is a surface mount PCB module that provides fully embedded, ready to use Bluetooth
wireless technology. The reprogrammable Flash memory contains embedded firmware for serial cable
replacement using the Bluetooth SPP profile. Embedded Bluetooth DATA PACKAGE (DP) firmware is a
friendly interface, which realizes a simple control for cable replacement, enabling communication with
most Bluetooth enabled devices, provided that the devices support the SPP profile. The SPBT3.0DP1,
supporting iAP2 profile, provides communication with Android, smartphone, and the newest Apple® iOS
Bluetooth enabled devices.
An Apple authentication IC is required to exchange data with an Apple device or access an Apple device
application. The DP FW includes the Bluetooth iAP2 profile capable of recognizing the Apple
authentication chip.
Customers using the Apple authentication IC must register as developers to become an Apple certified
MFI member. License fees may apply, for additional information visit:
http://developer.apple.com/programs/which-program/index.html.
Certified MFI developers developing electronic accessories that connect to the iPod®, iPhone®, and iPad®
gain access to technical documentation, hardware components, technical support and certification logos.
Customized firmware for peripheral device interaction, power optimization, security, and other
proprietary features may be supported and can be ordered pre-loaded and configured.
January
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
2016 DocID0xxxxx Rev 0.17
2 RoHS compliance
ST Bluetooth modules comply with the ECOPACK2 level of RoHS compliance grade.
3 Applications
The SPBT3.0DP1 is suitable for a wide range of application like:
• Serial cable replacement
• M2M industrial control
• Service diagnostic
• Data acquisition equipment
• Machine control
• Sensor monitoring
• Security system
• Mobile health
January
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
2016 DocID0xxxxx Rev 0.17
Radio
Baseband
Link Manager
Bluetooth Controller
STM32 Hardware Abstraction Layer
Operating System
HCI
L2CAP
RFCOMM
SDP
Bluetooth Stack
Bluetooth Profiles
SPP
HID
iAP2
STM32F4 controller
Data Package with AT Command
Application
DID
Figure 1: Software Architecture Overview
4 Software architecture
4.1 BT stack layers
Bluetooth v3.0
Device power modes: active, deep sleep
Connection modes: active, sniff
Wake on Bluetooth feature optimized power consumption of host CPU
Authentication and encryption
Encryption key length from 8 bits to 128 bits
Persistent Flash memory for BD address and user parameter storage
January
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2016 DocID0xxxxx Rev 0.17
All ACL (asynchronous connection less) packet types
Sniff mode: fully supported to maximum allowed intervals
Master slave switch supported during connection and post connection
Dedicated inquiry access code for improved inquiry scan performance
Dynamic packet selection channel quality driven data rate to optimize link performance
Dynamic power control
Bluetooth radio natively supports 802.11b co-existence AFH
RFCOMM, SDP, and L2CAP supported
4.2 Supported Profile
Serial Port Profile (SPP)
Human Interface Device (HID)
iPhone Accessory Profile 2 (iAP2)
Device Identification Profile (DID)
4.3 AT Command set: DATA PACKAGE
The complete command list is reported in the AT Command DATA PACKAGE user manual UMxxxxx.
January
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
2016 DocID0xxxxx Rev 0.17
RF antenna
Battery or External Supply
1.8V
32.768 kHz
SPBT 3.0DP1 Bluetooth Audio Module
INTERNAL
RF Filter
&
BALUN
Crystal
26 MHz
clock
UART
26.000 MHz
GPIO
SYSTEM
(OPTIONAL) EXTERNAL LPCLK (32.768 KHz)
1.8V
Integrated
Voltage Regulator
HCI SPI
1.8V
Bluetooth RADIO
&
AUDIO Coprocessor
STLC2690
Host Controller
interface
PCM / I2S
AUDIO
INTERFACE
PCM / I2S
I2S
ARM Cortex MCU
STM32F411CEY6
Internal / Ext.
32.768 kHz
clock
RESET
BOOT0
BOOT1,etc.
UART
user
interface
GPIO user
interface
I2S
AUDIO
INTERFACE
32.768 kHz
crystal
oscillator
1.8V
SPBT3.0DP1 Module Block Diagram
Figure 2: Block Diagram
January
2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
Rating
Min.
Typical
Max. Unit
Operating temperature range
-40 -
+ 85 °C
Supply voltage
V
IN
2.1 3.3 3.6 V Signal pin voltage
- 1.8 - V
RF frequency
2402 - 2480
MHz
Rating
Min.
Typical
Max. Unit
Storage temperature range
-40 - + 85 °C
Supply voltage,
V
IN
-0.3 - +
5.5 V
I/O pin voltage,
V
IO
-0.3 +1.8
+ 1.84 V
5 Hardware specifications
General conditions (VIN = 3.3 V and 25 °C).
5.1 Recommended operating conditions
Table 1: Recommended operating conditions
5.2 Absolute maximum ratings
Table 2: Absolute maximum ratings
5.3 Current consumption
High performance configuration current consumption:
CPU: 84 MHz
UART: 115.2 Kbps
Data throughput up to 100 Kbps
January
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without notice. www.st.com
2016 DocID0xxxxx Rev 0.17
Modes (typical power consumption)
Average
Unit
No connection, Page/Inquiry Scan, internal crystal LPO, Deep Sleep Mode
1.34
mA
No connection, Page/Inquiry Scan, no external LPO, Active Mode
6.9
mA
No connection, Page/Inquiry Scan, with external LPO, Active Mode
7.85
mA
No connection, No Page/Inquiry Scan, no external LPO, Active Mode
7.65
mA
Connection, no data traffic, Master
11.28
mA
Connection, no data traffic, Slave
11.3
mA
Pin
Name
Description
I/O
Note
1
GPIO_3
General purpose I/O
I/O
5V tolerant
2
BOOT_0
Boot pin
I
Internal 10K pulldown
3
RESET
Reset input (active low for 5ms)
I
4
GPIO_8
GPIO indicating Module Low Power Status
- When high, device is in active mode
- When low, device is in low power mode
I/O
5V tolerant
Temperature: 25 °C
5.4 Pin assignment
Table 3: High Performance Power Consumption
January
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. www.st.com
2016 DocID0xxxxx Rev 0.17
Figure 3: Pin assignment
Table 4: Pin assignment
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