ST Microelectronics SPBT30DP1 Users Manual
SPBT3.0DP1
Bluetooth® Classic module
Datasheet – preliminary data
Features
•Bluetooth® radio
o |
Fully |
embedded |
Bluetooth® |
v3.0 |
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with SPP and HID profiles |
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o |
Class 1 module |
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o Complete RF ready module
o Embedded support for MFI iAP2 profile o 128-bit encryption security
oIntegrated antenna
•ST Cortex-M4 microprocessor
oup to 100 MHz
o 512 KB Flash
o128 KB RAM memory
•Supported transmission speed with SPP
oUp to 800KBits
•General I/O
o14 general purpose I/Os
•User interface
o AT command Data Package (DP)
oFirmware upgrade over UART
•ETSI, FCC, IC and Bluetooth® qualified
•Single voltage supply: 3.3 V typical
•Micro-sized form factor: 15.24 x 26.9 x 2.9 mm
•Operating temperature range: -40 °C to 85 °C
January 2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
Contents
Features ........................................................................................................................................................... |
1 |
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1 |
Description.............................................................................................................................................. |
4 |
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2 |
RoHS compliance ................................................................................................................................... |
5 |
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3 |
Applications ............................................................................................................................................ |
5 |
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4 |
Software architecture .............................................................................................................................. |
6 |
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4.1 |
BT stack layers .................................................................................................................................... |
6 |
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4.2 |
Supported Profile................................................................................................................................. |
7 |
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4.3 |
AT Command set: DATA PACKAGE................................................................................................ |
7 |
5 |
Hardware specifications.......................................................................................................................... |
9 |
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5.1 |
Recommended operating conditions ................................................................................................... |
9 |
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5.2 |
Absolute maximum ratings.................................................................................................................. |
9 |
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5.3 |
Current consumption............................................................................................................................. |
9 |
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5.4 |
Pin assignment................................................................................................................................... |
10 |
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5.5 |
Mechanical dimensions ..................................................................................................................... |
12 |
6 |
Hardware design ................................................................................................................................... |
13 |
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6.1 |
Module reflow soldering..................................................................................................................... |
13 |
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6.2 |
UART interface ................................................................................................................................. |
15 |
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6.3 |
GPIO interface .................................................................................................................................... |
16 |
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6.4 |
Reset circuit ........................................................................................................................................ |
16 |
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6.4.1 External reset circuit .................................................................................................................... |
16 |
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6.4.2 Internal reset circuit ......................................................................................................................... |
17 |
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7 |
Regulatory compliance ......................................................................................................................... |
18 |
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7.1 |
FCC certification .............................................................................................................................. |
18 |
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7.1.1 Labeling instructions.................................................................................................................... |
18 |
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7.1.2 Product manual instructions......................................................................................................... |
19 |
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7.2 |
IC certification .................................................................................................................................... |
20 |
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7.2.1 Labeling instructions.................................................................................................................... |
20 |
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7.2.2 Product manual instructions......................................................................................................... |
21 |
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7.3 |
Bluetooth certification ........................................................................................................................ |
22 |
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7.4 |
CE certification ................................................................................................................................... |
22 |
8 |
Traceability ........................................................................................................................................... |
23 |
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9 |
Ordering information ............................................................................................................................ |
24 |
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10 |
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Revision history ................................................................................................................................ |
25 |
January 2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
List of tables |
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Table 1: Recommended operating conditions ................................................................................... |
9 |
Table 2: Absolute maximum ratings ..................................................................................................... |
9 |
Table 3: High Performance Power Consumption ............................................................................ |
10 |
Table 4: Pin assignment......................................................................................................................... |
10 |
Table 5: Soldering.................................................................................................................................... |
14 |
Table 6: Traceability information ......................................................................................................... |
23 |
Table 7: Ordering information .............................................................................................................. |
24 |
Table 8: Document revision history.................................................................................................... |
25 |
List of figures |
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Figure 1: Software Architecture Overview ..................................................................................................... |
6 |
Figure 2: Block Diagram ................................................................................................................................ |
8 |
Figure 3: Pin assignment............................................................................................................................... |
10 |
Figure 4: mechanical dimensions.................................................................................................................. |
12 |
Figure 5: Recommend land pattern top view ................................................................................................ |
13 |
Figure 6: Soldering profile............................................................................................................................ |
14 |
Figure 7: Connection to host device ............................................................................................................. |
15 |
Figure 8: Typical RS232 circuit.................................................................................................................... |
15 |
Figure 9: External reset circuit...................................................................................................................... |
16 |
January 2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
1 Description
The SPBT3.0DP1 is an easy to use Bluetooth module, compliant with Bluetooth v3.0.
The module is among the smallest form factor available which provides a complete RF platform. The SPBT3.0DP1 enables electronic devices with wireless connectivity, not requiring any RF experience or expertise for integration into the final product. The SPBT3.0DP1 module, being a certified solution, optimizes the time to market of the final applications.
The module is designed for maximum performance in a minimal space including fast speed UART and 14 general purpose I/O lines, and up to 800 kbps transmission speed with SPP service active, 250kbps with iAP2 service active.
Optimized design allows the integration of a complete working Bluetooth modem, including antenna, in the minimum possible size.
Deep Sleep Mode allows to reduce power consumption when a Bluetooth connection is not established.
The SPBT3.0DP1 is a surface mount PCB module that provides fully embedded, ready to use Bluetooth wireless technology. The reprogrammable Flash memory contains embedded firmware for serial cable replacement using the Bluetooth SPP profile. Embedded Bluetooth DATA PACKAGE (DP) firmware is a friendly interface, which realizes a simple control for cable replacement, enabling communication with most Bluetooth enabled devices, provided that the devices support the SPP profile. The SPBT3.0DP1, supporting iAP2 profile, provides communication with Android, smartphone, and the newest Apple® iOS Bluetooth enabled devices.
An Apple authentication IC is required to exchange data with an Apple device or access an Apple device application. The DP FW includes the Bluetooth iAP2 profile capable of recognizing the Apple authentication chip.
Customers using the Apple authentication IC must register as developers to become an Apple certified MFI member. License fees may apply, for additional information visit: http://developer.apple.com/programs/which-program/index.html.
Certified MFI developers developing electronic accessories that connect to the iPod®, iPhone®, and iPad® gain access to technical documentation, hardware components, technical support and certification logos.
Customized firmware for peripheral device interaction, power optimization, security, and other proprietary features may be supported and can be ordered pre-loaded and configured.
January 2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
2 RoHS compliance
ST Bluetooth modules comply with the ECOPACK2 level of RoHS compliance grade.
3 Applications
The SPBT3.0DP1 is suitable for a wide range of application like:
•Serial cable replacement
•M2M industrial control
•Service diagnostic
•Data acquisition equipment
•Machine control
•Sensor monitoring
•Security system
•Mobile health
January 2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
4 Software architecture
Application
Data Package with AT Command
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Bluetooth Profiles |
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SPP |
DID |
HID |
iAP2 |
Bluetooth Stack
RFCOMM SDP
L2CAP
HCI
Operating System
STM32 Hardware Abstraction Layer
STM32F4 controller
Bluetooth Controller
Link Manager
Baseband
Radio
Figure 1: Software Architecture Overview
4.1BT stack layers
Bluetooth v3.0
Device power modes: active, deep sleep
Connection modes: active, sniff
Wake on Bluetooth feature optimized power consumption of host CPU
Authentication and encryption
Encryption key length from 8 bits to 128 bits
Persistent Flash memory for BD address and user parameter storage
January 2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
All ACL (asynchronous connection less) packet types
Sniff mode: fully supported to maximum allowed intervals
Master slave switch supported during connection and post connection
Dedicated inquiry access code for improved inquiry scan performance
Dynamic packet selection channel quality driven data rate to optimize link performance
Dynamic power control
Bluetooth radio natively supports 802.11b co-existence AFH
RFCOMM, SDP, and L2CAP supported
4.2Supported Profile
Serial Port Profile (SPP)
Human Interface Device (HID)
iPhone Accessory Profile 2 (iAP2)
Device Identification Profile (DID)
4.3AT Command set: DATA PACKAGE
The complete command list is reported in the AT Command DATA PACKAGE user manual UMxxxxx.
January 2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
SPBT3.0DP1 Module Block Diagram
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Battery or External Supply |
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SPBT 3.0DP1 |
Bluetooth Audio Module |
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1.8V |
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Integrated |
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Voltage Regulator |
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INTERNAL |
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RF antenna |
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1.8V |
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1.8V |
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I2S |
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AUDIO |
I2S |
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INTERFACE |
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Host Controller |
HCI SPI |
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interface |
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GPIO user |
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GPIO |
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interface |
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RF Filter |
PCM / I2S |
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ARM Cortex MCU |
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& |
AUDIO |
PCM / I2S |
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STM32F411CEY6 |
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BALUN |
INTERFACE |
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UART |
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user |
UART |
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Bluetooth RADIO |
26.000 MHz |
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interface |
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& |
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AUDIO Coprocessor |
32.768 kHz |
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STLC2690 |
Internal / Ext. |
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RESET |
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32.768 kHz |
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BOOT0 |
SYSTEM |
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clock |
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BOOT1,etc. |
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1.8V |
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32.768 kHz |
Crystal |
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crystal |
26 MHz |
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oscillator |
clock |
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(OPTIONAL) EXTERNAL LPCLK (32.768 KHz) |
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Figure 2: Block Diagram
January 2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
5 Hardware specifications
General conditions (VIN = 3.3 V and 25 °C).
5.1Recommended operating conditions
Table 1: Recommended operating conditions
Rating |
Min. |
Typical |
Max. |
Unit |
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Operating temperature range |
-40 |
- |
+ 85 |
°C |
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Supply voltage VIN |
2.1 |
3.3 |
3.6 |
V |
Signal pin voltage |
- |
1.8 |
- |
V |
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RF frequency |
2402 |
- |
2480 |
MHz |
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5.2Absolute maximum ratings
Table 2: Absolute maximum ratings
Rating |
Min. |
Typical |
Max. |
Unit |
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Storage temperature range |
-40 |
- |
+ 85 |
°C |
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Supply voltage, VIN |
-0.3 |
- |
+ 5.5 |
V |
I/O pin voltage, VIO |
-0.3 |
+1.8 |
+ 1.84 |
V |
5.3 Current consumption
High performance configuration current consumption:
CPU: 84 MHz
UART: 115.2 Kbps
Data throughput up to 100 Kbps
January 2016 DocID0xxxxx Rev 0.17
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
Temperature: 25 °C
Table 3: High Performance Power Consumption
Modes (typical power consumption) |
Average |
Unit |
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No connection, Page/Inquiry Scan, internal crystal LPO, Deep Sleep Mode |
1.34 |
mA |
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No connection, Page/Inquiry Scan, no external LPO, Active Mode |
6.9 |
mA |
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No connection, Page/Inquiry Scan, with external LPO, Active Mode |
7.85 |
mA |
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No connection, No Page/Inquiry Scan, no external LPO, Active Mode |
7.65 |
mA |
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Connection, no data traffic, Master |
11.28 |
mA |
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Connection, no data traffic, Slave |
11.3 |
mA |
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5.4Pin assignment
Figure 3: Pin assignment
Table 4: Pin assignment
Pin |
Name |
Description |
I/O |
Note |
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1 |
GPIO_3 |
General purpose I/O |
I/O |
5V tolerant |
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2 |
BOOT_0 |
Boot pin |
I |
Internal 10K pull- |
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down |
3 |
RESET |
Reset input (active low for 5ms) |
I |
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4 |
GPIO_8 |
GPIO indicating Module Low Power Status |
I/O |
5V tolerant |
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- When high, device is in active mode |
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- When low, device is in low power mode |
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January 2016 |
DocID0xxxxx Rev 0.17 |
|
|
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
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