ST Microelectronics SP1ML Users Manual

ST Microelectronics SP1ML Users Manual

ST CONFIDENTIAL

SPLML-868 and SP1ML-915

SPIRIT1 868 and 915 MHz Low Power RF Modules

PRELIMINARY DATASHEET

Features

Complete RF ready Spirit1 module

Integrated antenna and crystal

STM32L microcontroller up to 32 MHz

Low power consumption

UART interface with AT command set

Operates from a single 1.8V to 3.6V supply

863 to 870 MHz operation (SP1ML-868)

902 to 928 MHz operation (SP1ML-915)

Output power up to +11.6dBm

Data rates up to 500kbps

Modulation schemes: 2-FSK, GFSK, GMSK, OOK, and ASK

Compact size: 14mm x 13.4mm x 2.5mm

Operating temperature: -40 °C to 85 °C

FCC and CE regulatory approvals

Applications

Serial cable replacement

Home automation

M2M industrial control

Service diagnostic

Data acquisition equipment

Machine control

Sensor monitoring

Security systems

Mobile health and medical

February 2014

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Contents

1

Description...........................................................................................

4

2

Hardware specification........................................................................

5

 

2.1

Recommended operating conditions .........................................................................

5

 

2.2

Absolute maximum ratings........................................................................................

5

 

2.3

I/O operating characteristics .....................................................................................

5

 

2.4

Current consumption.................................................................................................

6

 

2.5

RF compliance limits.................................................................................................

6

 

2.6

Pin assignment .........................................................................................................

7

 

2.7

Pin placement ...........................................................................................................

8

 

2.8

Hardware block diagram ...........................................................................................

8

3

Hardware design..................................................................................

9

 

3.1

Pin usage..................................................................................................................

9

 

3.2

Typical application circuit ........................................................................................

10

 

3.3

Layout guidelines ....................................................................................................

11

 

3.4

Recommended footprint..........................................................................................

12

 

3.5

Module reflow installation........................................................................................

13

4

Mechanical data .................................................................................

14

 

4.1

RoHS compliance ...................................................................................................

14

5

Regulatory compliance .....................................................................

15

 

5.1

FCC certification .....................................................................................................

15

 

5.2

CE certification........................................................................................................

15

 

5.3

Labeling instructions ...............................................................................................

16

 

5.4

Product manual instructions ....................................................................................

16

6

Ordering Information.........................................................................

18

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List of tables

 

Table 1. Recommended operating conditions

.................................................................................... 5

Table 2. Absolute maximum ratings ...................................................................................................

5

Table 3. I/O operating characteristics .................................................................................................

5

Table 4.

Current consumption ............................................................................................................

6

Table 5. RF compliance limits ............................................................................................................

6

Table 6.

Pin assignment.....................................................................................................................

7

Table 7.

Module pin usage .................................................................................................................

9

Table 8.

Soldering profile .................................................................................................................

13

Table 12.

Ordering information .......................................................................................................

18

List of figures

 

Figure 1.

Pin placement ......................................................................................................................

8

Figure 2. Hardware block diagram ......................................................................................................

8

Figure 3. Typical application circuit ...................................................................................................

10

Figure 4.

Layout guidelines ...............................................................................................................

11

Figure 5.

Recommended footprint .....................................................................................................

12

Figure 6.

Soldering profile .................................................................................................................

13

Figure 7.

Mechanical data .................................................................................................................

14

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1 Description

The SP1ML-868 and SP1ML-915 are low power RF modules based on the SPIRIT1 radio, with integrated voltage regulation, antenna, crystal and microcontroller in a compact surface mount module form-factor. The module allows OEMs to easily add wireless capability to any electronic device without requiring in-depth RF experience, and has the necessary FCC modular approvals and CE compliance to reduce time to market.

The UART host interface allows simple connection to an external microcontroller. Access to module features is provided through an extended AT command set. A simple cable replacement model allows the module to be used similarly to a standard serial interface.

The microcontroller serial wire debug signals are available and allow the standard firmware to be replaced by a user application, enabling use as a wireless application module where no external microprocessor system is required. Select STM32L GPIO and peripherals are available for interfacing to external devices in the user application, and advanced features of the SPIRIT1 radio are also accessible.

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2 Hardware specification

General conditions (VIN = 3 V and TA = 25˚C).

2.1Recommended operating conditions

Table 1. Recommended operating conditions

Symbol

Parameter

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

TA

Operating ambient temperature range

-40

-

85

˚C

 

 

 

 

 

 

VDD

Operating supply voltage

1.8

3

3.6

V

 

 

 

 

 

 

FREQ

RF frequency (SP1ML-868)

863

-

870

MHz

 

 

 

 

 

 

FREQ

RF frequency (SP1ML-915)

902

-

928

MHz

 

 

 

 

 

 

2.2Absolute maximum ratings

Table 2. Absolute maximum ratings

Symbol

Parameter

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

TSTG

Storage temperature range

-40

-

85

˚C

 

 

 

 

 

 

VDD

Operating supply voltage

-0.3

-

3.9

V

 

 

 

 

 

 

VIO

I/O pin voltage

-0.3

-

5.5

V

 

 

 

 

 

 

2.3I/O operating characteristics

Table 3. I/O operating characteristics

Symbol

Parameter

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

VIL(1)

I/O input low level voltage

-0.3

-

0.3 VDD

V

VIH(1)

I/O input high level voltage

0.7 VIN

-

VDD+0.3

V

1.For more details see the STM32L151RB datasheet, I/O port characteristics.

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2.4Current consumption

Table 4.

Current consumption

 

 

 

 

 

 

 

Symbol

Parameter

Test Conditions

Typ.

Unit

 

 

 

 

 

 

 

Operating mode

20

mA

 

 

Tx, +11dBm, 2-FSK, 915 MHz

 

 

 

 

 

 

Operating mode

8

mA

 

 

Tx, -7dBm, 2-FSK, 915 MHz

 

 

 

 

 

 

Operating mode

11

mA

IDD

Supply current

Rx, 915 MHz

 

 

 

 

Operating mode – Idle

800

µA

 

 

 

 

 

 

 

Command mode

1.3

mA

 

 

 

 

 

 

 

Standby

1.4

µA

 

 

 

 

 

2.5RF compliance limits

The RF compliance limits are those tested for FCC and CE certification. These limits are enforced by the factory loaded firmware.

Table 5. RF compliance limits

Modulation

Standards

 

Parameter

Max.

Unit

 

 

 

 

 

 

 

FCC Part 15.207 (1)

 

Data rate

500

kbps

2-FSK

FCC Part 15.247 (1)

 

 

 

 

 

GFSK

EN 300 220-2 V2.4.1 (2)

 

 

 

 

 

 

MSK

EN 301 489-01 V1.9.2

(2)

Output power

+11.6

dBm

 

EN 301 489-03 V1.4.1 (2)

 

 

 

 

 

 

 

 

 

 

 

FCC Part 15.207 (1)

 

Data rate

250

kbps

OOK

FCC Part 15.249 (1)

 

 

 

 

EN 300 220-2 V2.4.1 (2)

 

 

 

ASK

 

 

 

EN 301 489-01 V1.9.2

(2)

 

 

 

 

Output power

+8.5

dBm

 

EN 301 489-03 V1.4.1 (2)

 

 

 

 

 

 

 

 

 

 

1.FCC standards are only applicable to the SP1ML-915 module.

2.EN standards are only applicable to the SP1ML-868 module.

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