ST MICROELECTRONICS SMD 4520 Datasheet

MC14518B, MC14520B
Dual Up Counters
The MC14518B dual BCD counter and the MC14520B dual binary counter are constructed with MOS P−channel and N−channel enhancement mode devices in a single monolithic structure. Each consists of two identical, independent, internally synchronous 4−stage counters. The counter stages are type D f lip−flops, with interchangeable Clock and Enable lines for incrementing on e ither t he p ositive−going or negative−going transition as required when cascading multiple stages. Each counter can be cleared by applying a high level on the Reset line. In addition, the MC14518B will count o ut o f a ll u ndefined s tates w ithin two clock periods. These complementary MOS up counters find primary use in multi−stage synchronous or ripple counting applications requiring low power dissipation and/or high noise immunity.
Features
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Internally Synchronous for High Internal and External Speeds
Logic Edge−Clocked Design — Incremented on Positive Transition
of Clock or Negative Transition on Enable
Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load Over the Rated Temperature Range
Pb−Free Packages are Available*
MAXIMUM RATINGS (Voltages Referenced to V
Symbol
V
DD
Vin, V
Iin, I
P
T
T
stg
T
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously . If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. Maximum Ratings are those values beyond which damage to the device
may occur.
2. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, V to the range V
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
DC Supply Voltage Range −0.5 to +18.0 V Input or Output Voltage Range
out
Input or Output Current
out
Power Dissipation,
D
Operating Temperature Range −55 to +125 °C
A
Storage Temperature Range −65 to +150 °C Lead Temperature
L
SS
Parameter Value Unit
(DC or Transient)
(DC or Transient) per Pin
per Package (Note 2.)
(8−Second Soldering)
v (Vin or V
) v VDD.
out
) (Note 1.)
SS
−0.5 to VDD + 0.5 V
±10 mA
500 mW
260 °C
and V
in
should be constrained
out
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MARKING
DIAGRAMS
16
PDIP−16
P SUFFIX
CASE 648
SOIC−16 DW SUFFIX CASE 751G
SOEIAJ−16
F SUFFIX
CASE 966
xx = 18 or 20 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G = Pb−Free Indicator
MC145xxBCP
AWLYYWWG
1
16
145xxB
AWLYYWWG
1
16
MC145xxB
ALYWG
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
January , 2006 − Rev. 5
1 Publication Order Number:
MC14518B/D
MC14518B, MC14520B
PIN ASSIGNMENT
CLOCK
ENABLE
CLOCK
10
ENABLE
15
1
C
A
2
E
A
3
Q0
A
Q1
4
A
Q2
A
Q3
6
A
7
R
A
8
V
SS
BLOCK DIAGRAM
1
2
7
9
16
15
14
13
125
11
10
9
VDD = PIN 16
V
V
R
Q3
Q2
Q1
Q0
E
C
DD
B
B
B
C
C
SS
B
B
B
B
Q0
Q1 Q2
Q3
R
Q0
Q1 Q2 Q3
R
= PIN 8
3 4
5 6
11
12
13 14
TRUTH TABLE
Clock Enable Reset Action
1 0 Increment Counter
0 0 Increment Counter
X 0 No Change
X 0 No Change
0 0 No Change
1 0 No Change
X X 1 Q0 thru Q3 = 0
X = Don’t Care
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2
MC14518B, MC14520B
l
l
l
l
l
k
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
V
DD
Characteristic
Symbo
Output Voltage “0” Leve
Vin = VDD or 0
“1” Leve
Vin = 0 or V
DD
Input Voltage “0” Leve
(VO = 4.5 or 0.5 Vdc)
= 9.0 or 1.0 Vdc)
(V
O
(V
= 13.5 or 1.5 Vdc)
O
“1” Leve (VO = 0.5 or 4.5 Vdc) (V
= 1.0 or 9.0 Vdc)
O
(V
= 1.5 or 13.5 Vdc)
O
Output Drive Current
(V
= 2.5 Vdc) Source
OH
= 4.6 Vdc)
(V
OH
(V
= 9.5 Vdc)
OH
(V
= 13.5 Vdc)
OH
(V
= 0.4 Vdc) Sin
OL
(VOL = 0.5 Vdc) (V
= 1.5 Vdc)
OL
Input Current I Input Capacitance
(V
= 0)
in
Quiescent Current
(Per Package)
Total Supply Current
(4.) (5.)
(Dynamic plus Quiescent, Per Package) (C
= 50 pF on all outputs, all
L
Vdc
V
OL
5.0 10 15
V
OH
5.0 10 15
V
IL
5.0 10 15
V
IH
5.0 10 15
I
OH
5.0
5.0 10 15
I
OL
5.0 10 15
in
C
in
I
DD
15 ± 0.1 ± 0.00001 ± 0.1 ± 1.0 μAdc
5.0 7.5 pF
5.0 10 15
I
T
5.0 10 15
Min Max Min Typ
— — —
4.95
9.95
14.95
— — —
3.5
7.0 11
– 3.0
– 0.64
– 1.6 – 4.2
0.64
1.6
4.2
— — —
)
SS
− 55_C 25_C 125_C
(3.)
Max Min Max
0.05
0.05
0.05 —
— —
1.5
3.0
4.0
— — —
— — — —
— — —
5.0 10 20
— — —
4.95
9.95
14.95
— — —
3.5
7.0 11
– 2.4
– 0.51
– 1.3 – 3.4
0.51
1.3
3.4
— — —
0 0 0
5.0 10 15
2.25
4.50
6.75
2.75
5.50
8.25
– 4.2 – 0.88 – 2.25
– 8.8
0.88
2.25
8.8
0.005
0.010
0.015
IT = (0.6 μA/kHz) f + I IT = (1.2 μA/kHz) f + I IT = (1.7 μA/kHz) f + I
0.05
0.05
0.05 —
— —
1.5
3.0
4.0
— — —
— — — —
— — —
5.0 10 20
DD DD DD
— — —
4.95
9.95
14.95
— — —
3.5
7.0 11
– 1.7
– 0.36
– 0.9 – 2.4
0.36
0.9
2.4
— — —
0.05
0.05
0.05
buffers switching)
3. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
4. The formulas given are for the typical characteristics only at 25_C.
5. To calculate total supply current at loads other than 50 pF: I
) = IT(50 pF) + (CL – 50) Vfk
T(CL
where: I
is in μA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
T
— — —
1.5
3.0
4.0
— — —
— — — —
— — —
150 300 600
Unit
Vdc
Vdc
Vdc
Vdc
mAdc
mAdc
μAdc
μAdc
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3
MC14518B, MC14520B
SWITCHING CHARACTERISTICS
(6.)
(C
= 50 pF, T
L
= 25_C)
A
All Types
100
50 40
280 115
80
330 130
90
100
50 35
2.5
6.0
8.0 —
— —
220 100
70
125
55 40
– 45 – 15
– 5
(7.)
Max
200 100
80
560 230 160
650 230 170
— — —
1.5
3.0
4.0 15
5 4
— — —
— — —
— — —
Characteristic
Symbol V
Output Rise and Fall Time
t
, t
TLH
t
TLH
t
TLH
= (1.5 ns/pF) CL + 25 ns
THL
, t
= (0.75 ns/pF) CL + 12.5 ns
THL
, t
= (0.55 ns/pF) CL + 9.5 ns
THL
Propagation Delay Time
Clock to Q/Enable to Q
t
, t
PLH
t
PLH
t
PLH
= (1.7 ns/pF) CL + 215 ns
PHL
, t
= (0.66 ns/pF) CL + 97 ns
PHL
, t
= (0.5 ns/pF) CL + 75 ns
PHL
Reset to Q
t
= (1.7 ns/pF) CL + 265 ns
PHL
t
= (0.66 ns/pF) CL + 117 ns
PHL
t
= (0.66 ns/pF) CL + 95 ns
PHL
Clock Pulse Width t
Clock Pulse Frequency f
Clock or Enable Rise and Fall Time t
THL
Enable Pulse Width t
Reset Pulse Width t
Reset Removal Time t
t
TLH
t
THL
t
PLH
t
PHL
t
PHL
w(H)
t
w(L)
cl
, t
WH(E)
WH(R)
rem
,
,
TLH
5.0 10 15
5.0 10 15
5.0 10 15
5.0 10 15
5.0 10 15
5.0 10 15
5.0 10 15
5.0 10 15
5.0 10 15
DD
Min Typ
— — —
— — —
— — —
200 100
70 —
— —
— — —
440 200 140
280 120
90
– 5
15 20
6. The formulas given are for the typical characteristics only at 25_C.
7. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Unit
ns
ns
ns
ns
MHz
μs
ns
ns
ns
V
DD
C
L
20 ns
0.01 μF CERAMIC
C
L
V
SS
C
L
C
L
500 μF
PULSE
GENERATOR
20 ns
50%
VARIABLE
C
E R
I
D
90%
Q0 Q1
Q2 Q3
V
SS
10%
WIDTH
Figure 1. Power Dissipation Test Circuit and Waveform
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4
MC14518B, MC14520B
PULSE
GENERATOR
CLOCK
ENABLE
RESET
V
DD
20 ns
CLOCK
Q0
C
INPUT
Q1
Q2
E
Q3
R
V
SS
C
C
L
L
C
C
L
L
Figure 2. Switching Time Test Circuit and Waveforms
0987654321
Q0
20 ns
V
90%
DD
50%
10%
t
WH
t
PLHtPHL
t
WL
90%
Q
t
r
18
1716151413121110987654321
V
SS
50%
10%
t
f
0987654321
MC14518B
MC14520B
Q1
Q2
Q3
Q0
Q1
Q2
Q3
1312111098765432143
Figure 3. Timing Diagram
2
101514
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5
MC14518B, MC14520B
Q0 Q1 Q2 Q3
D
Q
D
Q
D
Q
D
Q
RESET
ENABLE
CLOCK
Q
C
R
Q
C
R
Q
C
R
Figure 4. Decade Counter (MC14518B) Logic Diagram
(1/2 of Device Shown)
Q0 Q1 Q2 Q3
D
Q
D
Q
D
Q
Q
C
R
D
Q
RESET
ENABLE
CLOCK
Q
C
R
Q
C
R
Q
C
R
Figure 5. Binary Counter (MC14520B) Logic Diagram
(1/2 of Device Shown)
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6
Q
C
R
MC14518B, MC14520B
ORDERING INFORMATION
Device Package Shipping
MC14518BCP PDIP−16 500 Units / Rail MC14518BCPG PDIP−16
(Pb−Free) MC14518BDW SOIC−16 47 Units / Rail MC14518BDWG SOIC−16
(Pb−Free) MC14518BDWR2 SOIC−16 1000 Units / Tape & Reel MC14518BDWR2G SOIC−16
(Pb−Free) MC14518BFEL SOEIAJ−16 2000 Units / Tape & Reel MC14518BFELG SOEIAJ−16
(Pb−Free) MC14520BCP PDIP−16 500 Units / Rail MC14520BCPG PDIP−16
(Pb−Free) MC14520BDW SOIC−16 47 Units / Rail MC14520BDWG SOIC−16
(Pb−Free) MC14520BDWR2 SOIC−16 1000 Units / Tape & Reel MC14520BDWR2G SOIC−16
(Pb−Free) MC14520BFEL SOEIAJ−16 2000 Units / Tape & Reel MC14520BFELG SOEIAJ−16
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
500 Units / Rail
47 Units / Rail
1000 Units / Tape & Reel
2000 Units / Tape & Reel
500 Units / Rail
47 Units / Rail
1000 Units / Tape & Reel
2000 Units / Tape & Reel
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7
MC14518B, MC14520B
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE T
−A−
916
B
18
F
C
S
−T−
H
G
D
D
16 9
M
16 PL
0.25 (0.010) T
K
M
A
B
H8X
M
E
0.25
81
B16X
M
0.25 B
S
A
T
B
S
A
14X
e
A1
T
L
SEATING PLANE
J
M
A
SOIC−16
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G−03
ISSUE C
_
h X 45
SEATING PLANE
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77
M
G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
____
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49 C 0.23 0.32 D 10.15 10.45
E 7.40 7.60 e 1.27 BSC
H 10.05 10.55
h 0.25 0.75 L 0.50 0.90
q 0 7
__
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8
16 9
1
Z
D
e
b
0.13 (0.005)
M
8
H
E
E
A
A
1
0.10 (0.004)
MC14518B, MC14520B
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966−01
ISSUE O
L
E
M
_
L
DETAIL P
VIEW P
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
Q
1
c
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
DIM MIN MAX MIN MAX
−−− 2.05 −−− 0.081
A A
0.05 0.20 0.002 0.008
1
0.35 0.50 0.014 0.020
b
0.18 0.27 0.007 0.011
c
9.90 10.50 0.390 0.413
D
5.10 5.45 0.201 0.215
E
1.27 BSC 0.050 BSC
e
H
7.40 8.20 0.291 0.323
E
0.50 0.85 0.020 0.033
L L
1.10 1.50 0.043 0.059
E
0
M
_
Q
0.70 0.90 0.028 0.035
1
−−− 0.78 −−− 0.031
Z
INCHES
10
_
10
0
_
_
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MC14518B/D
9
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