STMicroelectronics M48T128Y, M48T128V Technical data

5.0 or 3.3V, 1 Mbit (128 Kb x 8) TIMEKEEPER® SRAM

FEAT URES SUMMARY

REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT, BATTERY, AND CRYSTAL
BCD CODED YEAR, MONTH, DAY, DATE,
HOURS, MINUTES, AND SECONDS
AUTOMATIC POWER-FAIL CHIP
DESELECT AND WRITE PROTECT ION
WRITE PROTECT VOLTAGES
= Power-fail Deselect Voltage):
(V
PFD
M48T128Y: V
4.1V V
PFD
M48T128V*: V
2.7V V
CONVENTIONAL SRAM OPERATION;
PFD
UNLIMITED WRITE CYCLES
SOFTWARE CONTROLLED CLOCK
CALIBRATION FOR HIGH ACCURACY APPLICATIONS
10 YEARS OF DATA RETENTION AND
CLOCK OPERATION IN THE ABSENCE O F POWER
SELF-CONTAINED BATTERY AND
CRYSTAL IN THE DIP PACKAGE
PIN AND FUNCTION COMPATIBLE WITH
JEDEC STANDARD 128K x 8 SRAMs
= 4.5 to 5.5V
CC
4.5V
= 3.0 to 3.6V
CC
3.0V
M48T128Y
M48T128V*

Figure 1. 32-pi n PMDIP Mo du le

32
1
PMDIP32 (PM)
Module
* Contact local ST sales office for availability of 3.3V version.
1/22February 2005
M48T128Y, M48T128V*
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. 32-pin PMDIP Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SUMMARY DESCRIPTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 3. DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Figure 4. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
OPERATION MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 2. Operating Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
READ Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. READ Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Table 3. RE A D Mode AC Charac teristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
WRITE Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 6. WRITE Enable Controlled, WRITE AC Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 7. Chip Enable Controlled, WRITE AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 4. WRITE Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Data Retention Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
CLOCK OPERATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Reading the Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Setting the Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Stopping and Starting the Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 5. Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Calibrating the Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8. Crystal Accuracy Across Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 9. Clock Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3
V
Noise And Negative Going Transients. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
CC
Figure 10.Supply Voltage Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 6. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 7. Operating and AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 11.AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 8. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 9. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 12.Power Down/Up Mode AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 10.Power Down/Up AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 11.Power Down/Up Trip Points DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/22
M48T128Y, M48T128V*
PACKAGE MECHANICAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 13.PMDIP32 – 32-pin Plastic Module DIP, Package Outline . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 12. PMDIP32 – 32-pin Plastic Module DIP, Package Mechanical Data . . . . . . . . . . . . . . . . 19
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 13.Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 14.Document Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3/22
M48T128Y, M48T128V*

SUMMARY DESCRIPTION

The M48T128Y/V TIMEKEEPER® RAM is a 128Kb x 8 non-vol atile static RAM and real time clock. The special DIP package provides a fully in­tegrated battery back-up memory and real time clock solution. The M48T 128Y /V d irectly replaces industry standard 128Kb x 8 SRAM.

Figure 2. Logic Diagram Table 1. Signal Names

It also provides the non-vol atility of Flash without any requirement for special WRITE timing or limi­tations on the number of WRITEs that can be per­formed. The 32-pin, 600mil DIP Hybrid houses a controller chip, SRAM, quartz crystal, and a l ong life lithium button cell in a single package.
V
CC
17
A0-A16 DQ0-DQ7
W
E
G
M48T128Y M48T128V
V
SS
8

Figure 3. DIP C on ne ctions

1
NC V
2
A16 A14
3
A12
4 5
A7
6
A6
7
A5 A4 A3 A2 A1 A0
DQ0
DQ2
SS
M48T128Y
8
M48T128V
9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
AI02245
CC
A15 NC W A13 A8 A9 A11 G A10 E DQ7 DQ6 DQ5DQ1 DQ4 DQ3V
AI02244
A0-A16 Address Inputs DQ0-DQ7 Data Inputs / Outputs E G W V
CC
V
SS
NC Not Connected Internally
Chip Enable Output Enable WRITE Enable Supply Voltage Ground
4/22

Figure 4. Block Diagram

M48T128Y, M48T128V*
32,768 Hz CRYSTAL
LITHIUM
CELL
OSCILLATOR AND
CLOCK CHAIN
VOLTAGE SENSE
AND
SWITCHING
CIRCUITRY
V
CC
POWER
V
PFD
8 x 8
TIMEKEEPER
REGISTERS
131,064 x 8
SRAM ARRAY
V
SS
A0-A16
DQ0-DQ7
E
W
G
AI01804
5/22
M48T128Y, M48T128V*

OPERATION MODES

Figure 4., page 5 illus tra tes the s tatic mem ory ar-
ray and the quartz controlled clock o scillator. The clock locations contain the year, month, date, day, hour, minute, and sec ond in 24 hour BCD form at. Corrections for 28, 29 (leap year - valid until 2100), 30, and 31 day months are made a utomatically. Byte 1FFF8h is the clock control register. This byte controls user access to the clock information and also stores the clock calibration setting. The seven clock bytes (1FFFFh - 1F FF8h) are not the actual clock counters, they are memory locations consist­ing of BiPORT™ READ/WRITE memory cells within the static RAM array. T he M48T128Y /V in­cludes a clock control circuit which updates the clock bytes with current information once per sec-

Table 2. Operating Modes

4.5 to 5.5V
3.0 to 3.6V
to V
SO
V
V
or
PFD
CC
SO
(min)
(1)
(1)
E G W DQ0-DQ7 Power
V
IH
V
IL
V
IL
V
IL
X X X High Z CMOS Standby X X X High Z Battery Back-up Mode
X X High Z Standby
X V V
Mode
Deselect WRITE READ READ
Deselect Deselect
Note: X = VIH or VIL; VSO = Battery B ack-up Switc hover Voltage.
1. See Table 11., page 18 for details.
V
ond. The information can be accessed by the user in the same manner as any other location in the static memory array. The M48T128Y/V also has its own Power-Fail Detect circuit. This control circuitry constantly monitors the supply voltage for an out of tolerance condition. When V
is out of toler-
CC
ance, th e cir cuit wri te pro tect s the TIMEK EEPER Register data and external SRAM, providin g data security in the midst of unpredictable system oper­ation. As V Switchover Voltage (V
falls below the Battery Back-up
CC
), the control circuitry au-
SO
tomatically switches to the battery, maintaining data and clock operation until valid power is re­stored.
V
IL
IL
IH
V
IH
V
IH
D
IN
D
OUT
High Z Active
Active Active
®
6/22

READ Mode

The M48T128Y/V is in the READ Mode whenever
(WRITE Enable) is high and E (Chip Enable) is
W low. The unique address specified by the 17 Ad­dress Inputs defines which one of the 131,072 bytes of data is to be accessed.
Valid data will be available at the Data I/O pins within t address input signal is stable, providing the E
access times are also satisfied. If the E and G
G
(Address Access Time) after the last
AVQV
and
access t imes are n ot me t, v alid d ata w ill be av ail-

Figure 5. READ Mode AC Waveforms

M48T128Y, M48T128V*
able after the latter of the Chip Enable Access Times (t
). The state of the eight three-state Data I/O
(t
GLQV
signals is controlled by E activated before t to an indeterminate state until t dress Inputs are changed while E active, output data will remain valid for t put Data Hold Time) but will go indeterminate until the next Address Acce ss.
tAVAV
) or Output Enable Access Time
ELQV
and G. If the outputs are
, the data lines will be driven
AVQV
AVQV
and G remain
. If the Ad-
(Out-
AXQX
A0-A16
tAVQV tAXQX
tELQV
E
tELQX
G
tGLQX
DQ0-DQ7
Note: WE = High.
tGLQV
VALID
tEHQZ
tGHQZ
DATA OUT
AI01197

Table 3. READ Mode AC Characteristics

M48T128Y M48T128V
Symbol
t
AVAV
t
AVQV
t
ELQV
t
GLQV
t
ELQX
t
GLQX
t
EHQZ
t
GHQZ
t
AXQX
Note: 1. Valid for Ambient Operating Tem perature : TA = 0 to 70°C; VCC = 4.5 to 5.5V or 3. 0 to 3.6V (exc ept where noted ).
2. C
READ Cycle Time 70 85 ns Address Valid to Output Valid 70 85 ns Chip Enable Low to Output Valid 70 85 ns Output Enable Low to Output Valid 40 55 ns
(2)
Chip Enable Low to Output Transition 5 5 ns
(2)
Output Enable Low to Output Transition 5 5 ns
(2)
Chip Enable High to Output Hi-Z 25 30 ns
(2)
Output Enable High to Output Hi-Z 25 30 ns Address Transition to Output Transition 10 5 ns
= 5pF.
L
Parameter
(1)
Min Max Min Max
Unit–70 –85
7/22
M48T128Y, M48T128V*

WRITE Mode

The M48T128Y/V is in the WRITE Mode whenever
(WRITE Enable) and E (Chip Ena ble) are low
W state after the address inputs are stable.
The start of a WRITE is referenced from the latter occurring falling edge of W nated by the earlier rising edge of W
or E. A WRITE is termi-
or E. The ad­dresses must be held valid throughout the cycle. E or W must return high for a minimum of t
EHAX
from

Figure 6. WRITE Enable Controlled, WRITE AC Waveform

Chip Enable or t the initiation of another READ or WRITE cycle. Data-in must be valid t WRITE and remain valid for t should be kept high during WRITE cycles to avoid bus contention; although, if the output bus has been activated by a low on E disable the outputs t
tAVAV
from WRITE Enable prior to
WHAX
prior to the end of
DVWH
afterward. G
WHDX
and G a low on W will
after W falls.
WLQZ
A0-A16
tAVEL
E
tAVWL
W
tWLQZ
DQ0-DQ7
VALID
tAVWH
tWLWH

Figure 7. Chip Enable Controlled, WRITE AC Waveforms

tAVAV
A0-A16
tAVEL
VALID
tAVEH
tELEH
tDVWH
tWHAX
tWHQX
tWHDX
DATA INPUT
AI02382
tEHAX
8/22
E
W
DQ0-DQ7
tAVWL
DATA INPUT
tDVEH
tEHDX
AI02383
M48T128Y, M48T128V*

Table 4. WRITE Mode AC Characteristics

M48T128Y M48T128V
Symbol
t
AVAV
t
AVWL
t
AVEL
t
WLWH
t
ELEH
t
WHAX
t
EHAX
t
DVWH
t
DVEH
t
WHDX
t
EHDX
(2,3)
t
WLQZ
t
AVWH
t
AVEH
t
WHQX
Note: 1. Valid for Ambient Operating Tem perature : TA = 0 to 70°C; VCC = 4.5 to 5.5V or 3. 0 to 3.6V (exc ept where noted ).
2. C
3. If E
WRITE Cycle Time 70 85 ns Address Valid to WRITE Enable Low 0 0 ns Address Valid to Chip Enable Low 0 0 ns WRITE Enable Pulse Width 50 60 ns Chip Enable Low to Chip Enable 1 High 55 65 ns WRITE Enable High to Address Transition 5 5 ns Chip Enable High to Address Transition 10 15 ns Input Valid to WRITE Enable High 30 35 ns Input Valid to Chip Enable High 30 35 ns WRITE Enable High to Input Transition 5 5 ns Chip Enable High to Input Transition 10 15 ns
WRITE Enable Low to Output Hi-Z 25 30 ns Address Valid to WRITE Enable High 60 70 ns
Address Valid to Chip Enable High 60 70 ns
(2,3)
WRITE Enable High to Output Transition 5 5 ns
= 5pF.
L
goes low simultaneously with W going low, the outputs remai n in the high impedance stat e.
Parameter
(1)
Min Max Min Max
Unit–70 –85
9/22
M48T128Y, M48T128V*

Data Retention Mode

With valid V as a conventional BYTEWIDE™ static RAM. Should the supply voltage decay, the RAM will au­tomatically power-fail deselect, write protecting it­self when V (min) window. All outputs become high imped­ance, and all inputs are treated as “Don't care.”
Note: A power failure during a WRITE cycle may corrupt data at the currently a ddressed location, but does not jeopardize the rest of the RAM's con­tent. At voltages below V assured the memory will be i n a write protected state, provided the V The M48T128Y/V may respond t o transient noise
applied, the M48T128Y/V operates
CC
falls within the V
CC
PFD
fall time is not less than tF.
CC
(min), the user can be
PFD
(max), V
PFD
spikes on V during the time the device is sampling V
that reach into the deselect window
CC
CC
. There­fore, decoupling of the power supply lines is rec­ommended.
When V
drops below VSO, the control circuit
CC
switches power to the internal b attery, preserving data and powering the clock. The internal energy source will maintain data in the M48T128Y/ V for an accumulated period of at least 10 years at room temperature. As system power rises abo ve V
SO
the battery is disconnected, and the power supply is switched to external V
after VCC reaches V
t
REC
. Deselect continues for
CC
(max).
PFD
,
10/22

CLOCK OPERATIONS

Reading the Clock

Updates to the TIMEKEEPER be halted before clock data is read to prevent reading data in transition. The BiPORT ™ TIME­KEEPER cel ls in th e R AM a r ra y are onl y d a ta reg­isters and not the actual clock counters, so updating the registers can be halted without dis­turbing the clock itself.
Updating is halted when a '1' is written to the READ Bit, D6 in the Control Register (1FFF8h). As long as a '1' remains in that position , updating is halted. After a h alt is issu ed, the registers reflect the count; that is, the day, date, and time that were current at the moment the halt command was is­sued. All of the TI MEKEEPER regist ers are updat­ed simultaneously. A halt will not interrupt an update in progress. Updating is within a second af­ter th e bi t i s reset to a ' 0 .'

Setting the Clock

Bit D7 of the Control Register (1FFF8h) is the WRITE Bit. Setting the WRITE Bit to a '1,' like the
®
registers should
M48T128Y, M48T128V*
READ Bit, halts updates to the TIMEKEEPER reg­isters. The user can then load t hem with the cor­rect day, date, and time data in 24 hour BCD format (see Table 5., page 11). Resetting the WRITE Bit to a '0' then transfers the values of all time registers 1FFFFh-1FFF9h to the actual TIME­KEEPER counters and all ows normal operation to resume. After the WRITE Bit is reset, the next clock update will occur one second later.

Stopping and Starting the Oscillator

The oscillator may be stopped at any time. If the device is going to spend a significant amount of time on the shelf, the oscillator can be turned off to minimize current drain on the battery. The STOP Bit is located at Bit D7 within 1FFF9h. Setting it to a '1' stops the oscillator. The M48T128Y/V is shipped from STMicroelectronics with the STOP Bit set to a '1.' When reset to a '0,' the M48T128Y/ V oscillator starts after one second.

Table 5. Register Map

Address
Data
D7 D6 D5 D4 D3 D2 D1 D0
1FFFFh 10 Years Year Year 00-99
1FFFEh 0 0 0 10 M Month Month 01-12 1FFFDh 0 0 10 Date Date Date 01-31 1FFFCh 0 FT 0 0 0 Day Day 01-07 1FFFBh 0 0 10 Hours Hours Hours 00-23
1FFFAh 0 10 Minutes Minutes Minutes 00-59
1FFF9h ST 10 Seconds Seconds Seconds 00-59
1FFF8h W R S Calibration Control
Keys : S = SI G N Bit
R = READ Bit W = WRITE B i t ST = STOP Bit 0 = Must be set to '0' Z = '0' and are Read only Y = '1' or '0'
Function/Range
BCD Format
11/22
M48T128Y, M48T128V*

Calibrating the C lock

The M48T128Y/V is driven by a quartz controlled oscillator with a nominal frequency of 32,768Hz. The devices are factory calibrated at 25°C and tested for accuracy. Clock accuracy will not ex­ceed 35 ppm (parts per million) oscillator frequen­cy error at 25°C, which equates to about ±1.53 minutes per month. When the Calibration circuit is properly employed, accuracy improves to better than +1/–2 ppm at 25°C. The oscillation rate of crystals changes with temperature (see Figure
8., page 13). The M48T128Y/V design employs
periodic counter correction. The calibration circuit adds or subtracts counts from the oscillator divider circuit at the divide by 128 stage, as shown in Fig-
ure 9., page 13.
The number of times pulses are blanked (subtract­ed, negative calibration) or split (added, pos itive calibration) depends upon the value loaded into the five Calibration bits found in the Control Regis­ter. Adding counts speeds the clock up, subtract­ing counts slows the clock down. The Cali bration bits occupy the five lower order bits (D4-D0) in the Control Register 1FFF8h. These bits can be set to represent any value be tween 0 and 31 in binary form. Bit D5 is a Sign Bit; '1' indicates positive cal­ibration, '0' indicates negative calibration. Calibra­tion occurs within a 64 minute cycle. The first 62 minutes in the cycle may, once per minute, have one second either shortened by 128 or lengthened by 256 oscillator cycles. If a binary '1' is loaded into the register, only the first 2 minutes in the 64 minute cycle will be modified; if a binary 6 is load-
ed, the first 12 will be affected, and so on. There­fore, each calibration step has the effect of adding 512 or subtracting 256 oscillator cycles for every 125, 829, 120 actual oscillator cycles, that is +4.068 or –2.034 ppm o f adjustment per ca libra­tion step in the calibrat ion registe r. Assum ing that the oscillator is running at exactly 32,768Hz, each of the 31 increments in the Calibration byte wo uld represent +10.7 or –5.35 seconds per month which corresponds to a total range of +5.5 or –2.75 minutes per month.
One method is available for ascertaining how much calibration a given M48T128Y/V may re­quire. This involves setting the clock, letting it run for a month and comparing it to a known accurate reference and recording deviation over a fixed pe­riod of time.
Calibration values, including the number of sec­onds lost or gained in a given period, can be found in the STMicroelectronics Application Note, “TIMEKEEPER CALIBRATION.”
This allows the designer to give the end user the ability to calibrate the clock as the environment re­quires, even if the final product is packaged in a non-user serviceable enclosure. The designer could provide a simple utility that accesses the Calibration byte. For e xample, a devia tion of 21 seconds slow over a period of 30 days would indi­cate a –8 ppm oscillator frequency error, requiring a +2(WR100010) to be loaded into the Calibration Byte for correction.
12/22

Figure 8. Crystal Accuracy Across Temperature

ppm
20
0
-20
-40
M48T128Y, M48T128V*
-60
-80
-100 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70

Figure 9. Clock Calibration

NORMAL
POSITIVE CALIBRATION
NEGATIVE CALIBRATION
F
= -0.038 (T - T
F
ppm
T0 = 25 °C
)2 ± 10%
0
2
C
°C
AI02124
AI00594B
13/22
M48T128Y, M48T128V*

VCC Noise And Negative Going Transients

transients, including those produced by output
I
CC
switching, can produce voltage fluctuations, re­sulting in spikes on the V
bus. These transients
CC
can be reduced if capacitors are used to store en­ergy which stabilizes the V
bus. The energy
CC
stored in the bypass capacitors will be released as low going spikes are generated or energy will be absorbed when overshoots occur. A ceramic by­pass capacitor value of 0.1µF (as shown in Figure
10) is recommended in order to provide the need-
ed filtering. In addition to transients that are caused by normal
SRAM operation, power cycling can generate neg­ative voltage spikes on V below V
by as much as one volt. These negative
SS
that drive it to values
CC
spikes can cause data corruption in the SRAM while in battery backup mode. To protect from these voltage spikes, it is recommended to con­nect a schottky diode from V connected to V
, anode to VSS). Schottky diode
CC
to VSS (cathode
CC
1N5817 is recommended for through hole and MBRS120T3 is recommended for surface mount.

Figure 10. Supply Voltage Protection

V
CC
V
CC
0.1µF DEVICE
V
SS
AI02169
14/22
M48T128Y, M48T128V*

MAXIMUM RA T ING

Stressing the device above the rating l isted in t he “Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicat­ed in the Operating sections of this specification is

Table 6. Absolute Maximum Ratings

Symbol Parameter Value Unit
not implied. Exposure to Absol ute Max imum Ra t­ing conditions for extended periods may affect de­vice reliability. Refer also to the STMicroelectronics SURE Program and other rel­evant quality documents.
T
A
T
STG
(1)
T
SLD
V
IO
V
CC
I
O
P
D
Note: 1. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).
No preheat above 150°C , or di rect exposure to IR reflow (or IR preheat) al l owed, to avoid damaging the Lithium battery.
CAUTION: Negative undershoo ts bel ow –0.3V are not al l owed on any pin whi l e i n th e Battery Back-up mode.
Ambient Operating Temperature 0 to 70 °C Storage Temperature (VCC Off, Oscillator Off)
Lead Solder Temperature for 10 seconds 260 °C Input or Output Voltages –0.3 to 7 V
M48T128Y –0.3 to 7 V
Supply Voltage
M48T128V –0.3 to 4.6 Output Current 20 mA Power Dissipation 1 W
–40 to 85 °C
15/22
M48T128Y, M48T128V*

DC AND AC PARAMETERS

This section summarizes the operating and mea­surement conditions, as well as the DC and AC characteristics of the device. The parameters in the following DC and AC Characteristic tables are derived from tests performed under the Meas ure-

Table 7. Operating and AC Measurement Conditions

Parameter M48T128Y M48T128V Unit
ment Conditions listed in t he relevant tables. De­signers should check that the operating conditions in their projects match the measurement condi­tions when using the quoted parameters.
Supply Voltage (V Ambient Operating Temperature (T Load Capacitance (C
CC
)
)
A
)
L
4.5 to 5.5 3.0 to 3.6 V 0 to 70 0 to 70 °C
100 50 pF Input Rise and Fall Times ≤ 5 5ns Input Pulse Voltages 0 to 3 0 to 3 V Input and Output Timing Ref. Voltages 1.5 1.5 V
Note: Output Hi-Z is defined as the poi nt where data i s no longer dri ven.

Figure 11. AC Testin g Load Cir cuit

DEVICE
UNDER
TEST
650
CL = 100pF or 50pF
(1)
1.75V
CL includes JIG capacitance
Note: 5 0pF for M48T12 8V .
AI03630

Table 8. Capacitance

Symbol
C
IN
C
IO
Note: 1. Effec tive capacita nce measured with powe r supply at 5V. S am pled only, not 100% test ed.
2. At 25°C, f = 1MHz.
3. Out puts deselect ed.
Input Capacitance 20 pF
(3)
Input / Output Capacitance 20 pF
Parameter
16/22
(1,2)
Min Max Unit
M48T128Y, M48T128V*

Table 9. DC Characteristics

M48T128Y M48T128V
IN
V
V
IH
CC
CC
(1)
Min Max Min Max
±2 ±2 µA ±2 ±2 µA
84mA
43mA
V
CC
+ 0.3
2.2
VCC + 0.3
0.4 0.4 V
2.4 2.2 V
Symbol Parameter
I
I
LO
I
CC
I
CC1
I
CC2
V
V V V
OH
Note: 1. Valid for Ambient Operating Tem perature : TA = 0 to 70°C; VCC = 4.5 to 5.5V or 3. 0 to 3.6V (exc ept where noted ).
2. Out puts deselect ed.
Input Leakage Current
LI
(2)
Output Leakage Current Supply Current Outputs open 95 50 mA
Supply Current (Standby) TTL
Supply Current (Standby) CMOS
Input Low Voltage –0.3 0.8 –0.3 0.4 V
IL
Input High Voltage 2.2
IH
Output Low Voltage
OL
Output High Voltage
Test Condition
0V V
0V V
OUT
= V
E
= VCC – 0.2V
E
I
= 2.1mA
OL
I
= –1mA
OH
Unit–70 –85
V
17/22
M48T128Y, M48T128V*

Figure 12. Power Down/Up Mode AC Waveforms

V
CC
V
(max)
PFD
V
(min)
PFD
VSS
tDR
tRB
DON'T CARE
HIGH-Z
tREC
RECOGNIZEDRECOGNIZED
INPUTS
OUTPUTS
tF
tFB
VALID VALID

Table 10. Power Down/Up AC Characteristics

Symbol
(2)
t
F
(3)
t
FB
t
R
t
RB
t
REC
Note: 1. Valid for Ambient Operating Tem perature : TA = 0 to 70°C; VCC = 4.5 to 5.5V or 3. 0 to 3.6V (exc ept where noted ).
2. V es V
3. V
V
(max) to V
PFD
V
(min) to VSS VCC Fall Time
PFD
V
(min) to V
PFD
VSS to V V
(max) to V
PFD
(min).
PFD
(min) to VSS fall time of less than tFB may cause corruption of RAM data.
PFD
PFD
(max) to Inputs Recognized
PFD
(min) fall time of less than tF may result in deselection/write protection not occurring until 200µs after VCC pass-
PFD
Parameter
(min) VCC Fall Time
PFD
(max) VCC Rise Time
PFD
(min) VCC Rise Time
(1)
Min Max Unit
300 µs
10 µs
s 1µs
40 200 ms
AI03612

Table 11. Power Down/Up Trip Points DC Characteristics

Symbol
V
PFD
V
SO
t
DR
Note: 1. All voltages referenced to VSS.
2. Va l i d for Ambient Op erating Temp erature: T
3. At 25°C; V
Power-fail Deselect Voltage
Battery Back-up Switchover Voltage
(3)
Expected Data Retention Time 10 YEARS
= 0V.
CC
18/22
Parameter
(1,2)
M48T128Y 4.1 4.35 4.5 V M48T128V 2.7 2.9 3.0 V M48T128Y 3.0 V M48T128V
= 0 to 70°C; VCC = 4.5 to 5.5V or 3. 0 to 3.6V (exc ept where noted ).
A
Min Typ Max Unit
V
PFD
–100mV
V

PACKAG E MECHANICAL INFORMAT ION

Figure 13. PMDIP32 – 32-pin Plastic Module DIP, Package Outline

M48T128Y, M48T128V*
A1AL
S
B
e1
eA
e3
D
N
E
1
Note: D rawing is not to scale.
PMDIP

Table 12. PMDIP32 – 32-pin Plastic Module DIP, Package Mechanical Data

Symb
Typ Min Max Typ Min Max
A 9.27 9.52 0.365 0.375
A1 0.38 0.015
B 0.43 0.59 0.017 0.023 C 0.20 0.33 0.008 0.013
mm inches
C
D 42.42 43.18 1.670 1.700
E 18.03 18.80 0.710 0.740 e1 2.29 2.79 0.090 0.110 e3 34.29 41.91 1.350 1.650 eA 14.99 16.00 0.590 0.630
L 3.05 3.81 0.120 0.150 S 1.91 2.79 0.075 0.110 N32 32
19/22
M48T128Y, M48T128V*

PART NUMBERING

Table 13. Ordering Information Scheme

Example: M48T 128Y –70 PM 1 TR
Device Type
M48T
Supply Voltage and Write Protect Voltage
128Y = V 128V
Speed
–70 = 70ns (128Y) –85 = 85ns (128V)
= 4.5 to 5.5V; V
CC
(1)
= VCC = 3.0 to 3.6V; V
= 4.1 to 4.5V
PFD
= 2.7 to 3.0V
PFD
Package
PM = PMDIP32
Temperature Range
1 = 0 to 70°C
Shipping Method for SOIC
blank = Tubes TR = Tape & Reel
Note: 1. Contact local ST sales office for availability of 3.3V version.
For other options, or for more information on any aspect of this device, please contact the ST Sales Office nearest you.
20/22
M48T128Y, M48T128V*

REVISION HISTORY

Table 14. Document Revision History

Date Version Revision Details
June 1998 1.0 First Issue
01/31/00 1.1 Calibrating The Clock Paragraph changed 03/30/00 1.2 Storage Temperature changed (Table 6) 07/20/01 2.0 Reformatted; temperature information added to tables (Table 8, 9, 3, 4, 10, 11) 09/21/01 2.1 Corrected speed grade in ordering information 05/23/02 2.2 Add countries to disclaimer; add marketing status
08/07/02 2.3 Refine marketing status text 28-Mar-03 3.0 v2.2 template applied; test condition updated (Table 11) 06-Aug-04 4.0 Reformatted; updated Register Map (Table 5) 22-Feb-05 5.0 IR reflow update (Table 6)
21/22
M48T128Y, M48T128V*
Information furnished is believed to be accurate and reliable. However, STMicroelectronics a ssumes no responsibility fo r the c onsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authori zed for use as crit i cal components in life support devices or systems w i th out express written approval of STMicroelectro nics.
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22/22
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