The L9396 is an integrated power management System Basis Chip targeting a large
spectrum of automotive electronics applications, in particular ABS, EPS and Transmission,
compatible with single (12
It combines a switched mode power supply for pre-regulation along with 3 independent
integrated linear regulators and a powerful configurable regulator for µC supply that can
operate either in buck or linear mode with an external FET.
The device also integrates a 4-channel flexible interface for Wheel Speed Sensor or tracking
regulation, 2 configurable pre-drivers for fail safe and motor pump, 1 configurable general
purpose outputs, wake-up detection circuitry, advanced fail-safe functionality, watchdog
control and system monitoring.
The boost regulator (optionally enabled) is intended to sustain cold cranking pulses,
stop
& start and weak battery conditions, while the buck pre-regulator drastically improves
the power efficiency and CO2 emissions.
Different combinations enable to supply the system microcontroller and external peripheral
loads and sensors with wide current ranges and adjustable voltage levels.
In addition, the L9396 provides enhanced system standby functionalities.
V) battery system.
8/109DS12539 Rev 3
L9396Overall description
FAULT
WDTDIS
Voltage Monitor
UV / OV
Wake-up Monitor
IGN
Boost
Controller
9V
300mA
2MHz
GNDBST
BSTSW
VM_OUT
VBG Reference
& Monitor
VBM
VBST
CP
GNDA
Reset
RESET
VM_OUT
WD_OUT
Control & Logic Blocks
SPI
Control &
Status Reg.
Temperature
Monitoring
Operating
Modes
Fail-Safe
Operation
FSN
Watchdog
CSN
SDI
SDO
CLK
WD_OUT
VM_OUT
TSD_OUT
Internal analog
3V3 supply
Internal digital
3V3 supply
POR & Osc.
BCKSW
VPREREG
VCC5
VCC
VCCSEL
Volt. Mon.
VCOREFDBK
Fail Safe FET
HS pre driver
(On/Off control)
Pump Motor FET
HS pre driver
(PWM control)
PDS
VDBATT
WSS / Tracking regulation Interface
RSU0H/L
WSO0
WSO1
WSO2
WSO3
AI[2/3/4]
HV Mux +
ADC Converter
Battery protected
switch
VB
VB_SW
KL30
KL15
Boost
components
option .
populated
2.2uH
22uH
‘1’
‘0’
Decoding
uC I/O supply
GCORE
VC1
VC2
Transient
Protection
VBATP
VBATP
PDG
VDS
VBATP
VDG
SCORE
System
Voltages
LS GPO driver
(PWM control)
GPOD0
Voltage
regulation
VC3
VC4
I_CORE_SH
I_CORE_SL
uC I/O & ADC
supply
VCORE
PRN
RSU1H/L
RSU2H/L
RSU3H/L
PRS
PRG
PRI
PDI
PDBATT
Volt. Mon.
AI[0/1]
GNDD
CBS
GADG1801171059PS
Lin with ext. FET
500 mA
0.8 V / 5.0 V
Buck with ext. FET
1 A
0.8 V / 5.0 V
(μC Core)
VCORE Regulator
I/O ref
Volt. Mon.
Volt. Mon.
WSS/Tracking IF
Volt. Mon.
100 mA
3.3 V / 5.0 V
(μC I/O)
LDO VCC
250 mA
5.0 V
(μC I/O & ADC)
LDO VCC5
465 kHz
1000 mA
6.5 V / 7.2 V
Controller
Buck
Charge Pump
2 Overall description
2.1 Block diagram
Figure 1. Block diagram
DS12539 Rev 39/109
108
Overall descriptionL9396
49
50
51
52
53
54
55
56
57
58
59
60
WSO0
61
62
WSO2
63
WSO3
WSO1CSPRN
CLK
SDI
SDO
GNDDNUGNDBST
BSTSW
FSN
RESET
AI4
AI3
AI2
AI1
AI0
RSUL0
RSUH0
RSUL1
RSUH1
RSUL2
RSUH2
RSUL3
RSUH3
GNDA
GPOD0
PDI
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
VC1
47
VC2
VC3
VC4
46
45
44
CP
VBST
BCKSW
VCCSEL
VCC5
VCC
I_CORE_SH
I_CORE_SL
CBS
GCORE
SCORE
VPREREG
43
42
41
40
39
38
37
36
35
34
33
VCORE
VCOREFDBK
IGN
VBM
WDTDIS
VDS
VDG
VDBATT
VB
VB_SW
PDBATT
PDS
PDG
PRS
PRG
PRI
181920212223242526272829303132
1764
FAULT
GADG1801171148PS
2.2 Pins description
Figure 2. Pins connection diagram (top view)
Table 2. Pins description
PinNameDescriptionPin type
1AI4Analog input to ADC converterILocal
2AI3Analog input to ADC converterILocal
3AI2Analog input to ADC converterILocal
4AI1Input 1 to select VCORE functionILocal
5AI0Input 0 to select VCORE functionILocal
6RSUL0WSS ground returnI/OGlobal
7RSUH0WSS / tracking regulated outputI/OGlobal
8RSUL1WSS ground returnI/OGlobal
9RSUH1WSS / tracking regulated outputI/OGlobal
10/109DS12539 Rev 3
10RSUL2WSS ground returnI/OGlobal
11RSUH2WSS outputI/OGlobal
12RSUL3WSS ground returnI/OGlobal
13RSUH3WSS outputI/OGlobal
14GNDAAnalog groundSupplyLocal
15GPOD0GPO driver drain terminalI/OGlobal
L9396Overall description
Table 2. Pins description (continued)
PinNameDescriptionPin type
16PDIMotor Pump HS FET control pin ILocal
17PRIMotor Pump recirculation FET control pinILocal
18PRGMotor Pump recirculation FET gate controlOLocal
19PRSMotor Pump recirculation FET source pinILocal
20PDGMotor Pump HS FET gate controlOLocal
21PDSMotor Pump HS FET source pinILocal
22PDBATTBattery sense for Motor Pump FET pre-driverIGlobal
23VB_SWBattery protected outputI/OLocal
24VBBattery line input SupplyGlobal
25VDBATTBattery sense for Fail Safe FET pre-driverIGlobal
26VDGFail Safe FET gate controlOLocal
27VDSFail Safe FET source pinILocal
28WDTDISWatchdog disableILocal
29VBMBattery senseILocal
30IGNWake up pin for battery connectionIGlobal
31VCOREFDBKVCORE voltage feedbackILocal
32VCOREµC core voltage supplyILocal
33SCORESource pin for VCORE regulator external FETI/OLocal
34GCOREGate control for VCORE regulator external FETI/OLocal
35CBSVCORE bootstrap capacitorI/OLocal
36I_CORE_SLShunt input for current sensing on VCORE regulatorILocal
37I_CORE_SHShunt input for current sensing on VCORE regulatorILocal
38VCC3.3 V / 5 V µC I/O supplySupplyLocal
39VCC55 V µC I/O and ADC supplyOLocal
40VPREREGPre-regulator outputSupplyLocal
41VCCSELVoltage selection for VCC regulatorILocal
42BCKSWSwitched pre-regulator outputI/OLocal
43VBSTDevice battery line input or boost regulated outputSupplyGlobal
44CPCharge pump outputSupplyLocal
nd
45VC4Charge pump 2
46VC3Charge pump 2
47VC2Charge pump 1
48VC1Charge pump 1
cap high terminalI/OLocal
nd
cap low terminalI/OLocal
st
cap high terminalI/OLocal
st
cap low terminalI/OLocal
49RESETReset output pinOLocal
50FSNFail safe negated digital outputOLocal
DS12539 Rev 311/109
108
Overall descriptionL9396
Table 2. Pins description (continued)
PinNameDescriptionPin type
51BSTSWSwitched boost regulator outputI/OLocal
52GNDBSTBoost regulator groundSupplyLocal
53NUNot used. To be connected to ground voltage.ILocal
54GNDDDigital Ground SupplyLocal
55SDOSPI data digital outputOLocal
56SDISPI data digital inputILocal
57CLKSPI clockILocal
58PRNMCU clock signalI/OLocal
59CSChip select digital inputILocal
60WSO0WSS pass-through outputOLocal
61WSO1WSS pass-through outputOLocal
62WSO2WSS pass-through outputOLocal
63WSO3WSS pass-through outputOLocal
64FAULTGeneral fault outputOLocal
12/109DS12539 Rev 3
L9396Overall description
2.3 Absolute maximum ratings
Within the maximum ratings, no damage to the component shall occur. Exposure to
absolute maximum rated conditions for extended periods may affect device reliability.
All maximum ratings can occur at the same time.
All analog and digital voltages are related to the potential at substrate ground GNDA.
SymbolParameterConditionMinTypMaxUnit
Power Supply
ABS_VB---0.3-40V
ABS_VBST---0.3-40V
ABS_VBM---0.3-40V
ABS_VB_SW---18-40V
ABS_BSTSW---0.3-40V
ABS_VPREREG---0.3-40V
ABS_I_CORE_SH---0.3-40V
ABS_I_CORE_SL---0.3-40V
Table 3. Pin absolute maximum ratings
ABS_BCKSW---1-40 V
ABS_SCORE---1-40 V
ABS_VC4--VBST-0.6-VBST+13 ≤ 51V
ABS_VC2--VBST-0.3-VBST+13 ≤ 51V
ABS_CP--VBST-0.3-VBST+13 ≤ 51V
ABS_VC1---0.3-40V
ABS_VC3---0.3-40V
ABS_CBS---0.3-
ABS_GCORE---0.3-
ABS_NU---0.3-4.6V
ABS_VCC5---0.3-40V
ABS_VCC---0.3-40V
ABS_VCOREFDBK---0.3-40V
ABS_VCORE---0.3-40V
ABS_VCCSEL---0.3-40V
ABS_IGN---0.3-40V
SCORE+
20≤40
SCORE+
20≤40
V
V
ABS_GNDA---0.3-0.3V
ABS_GNDD---0.3-0.3V
ABS_GNDBST---0.3-0.3V
DS12539 Rev 313/109
108
Overall descriptionL9396
Table 3. Pin absolute maximum ratings (continued)
SymbolParameterConditionMinTypMaxUnit
Interfaces
ABS_VDBATT---18-40V
ABS_PDBATT---18-40V
IC in sleep
-
ABS_VDG
-
-
ABS_PDG
-
-
ABS_PRG
-
mode (IGN
low)
IC in
operative
mode (IGN
high)
IC in sleep
mode (IGN
low)
IC in
operative
mode (IGN
high)
IC in sleep
mode (IGN
low)
IC in
operative
mode (IGN
high)
-0.3-VDS+12≤51V
-18-VDS+12≤51V
-0.3-PDS+12≤51V
-18-PDS+12≤51V
-0.3-PRS+12≤51V
-18-PRS+12≤51V
ABS_VDS
ABS_PDS
ABS_PRS
IC in sleep
-
-
-
-
-
-
mode (IGN
low)
IC in
operative
mode (IGN
high)
IC in sleep
mode (IGN
low)
IC in
operative
mode (IGN
high)
IC in sleep
mode (IGN
low)
IC in
operative
mode (IGN
high)
-0.3-40V
-18-40V
-0.3-40V
-18-40V
-0.3-40V
-18-40V
14/109DS12539 Rev 3
L9396Overall description
Table 3. Pin absolute maximum ratings (continued)
SymbolParameterConditionMinTypMaxUnit
ABS_WDTDIS---0.3-7V
ABS_AI0---0.3-40V
ABS_AI1---0.3-40V
ABS_AI2---0.3-40V
ABS_AI3---0.3-40V
ABS_AI4---0.3-40V
ABS_FSN---0.3-40V
ABS_FAULT---0.3-40V
ABS_PRN---0.3-40V
ABS_RESET---0.3-40V
ABS_WSO0---0.3-40V
ABS_WSO1---0.3-40V
ABS_WSO2---0.3-40V
ABS_WSO3---0.3-40V
ABS_CS---0.3-40V
ABS_CLK---0.3-40V
ABS_SDI---0.3-40V
ABS_SDO---0.3-40V
ABS_PRI---0.3-40V
ABS_PDI---0.3-40V
ABS_GPOD0---18-40V
ABS_RSUH0---18-40V
ABS_RSUH1---18-40V
ABS_RSUH2---18-40V
ABS_RSUH3---18-40V
ABS_RSUL0---18-40V
ABS_RSUL1---18-40V
ABS_RSUL2---18-40V
ABS_RSUL3---18-40V
ESD requirements
ESD according to the Human
Body Model (HBM), Q100-002
for global pins; (100pF/1.5kΩ)
ESD according to the Human
Body Model (HBM), Q100-002
for all other pins; (100pF/1,5kΩ)
----±4000V
----±2000V
DS12539 Rev 315/109
108
Overall descriptionL9396
Table 3. Pin absolute maximum ratings (continued)
SymbolParameterConditionMinTypMaxUnit
ESD according to the Charged
Device Model (CDM), Q100011 Corner pins
ESD according to the Charged
Device Model (CDM), Q100011 Non-corner pins
Temperature requirements
----±750V
----±500V
T
a
T
storage
T
j
Thermal
R
th j-a
resistance
junction to
ambient
Thermal
R
th j-c
resistance
junction to
case
2.4 Operating range
---40-135°C
---55-150°C
---40-175°C
With 2s2p
PCB std
Jedec.
Natural
convenction.
-26 - °C/W
Standard
Jedec best
JESD51-7
Bottom cold
plate in
contact with
package
bottom case
-- 2.9
°C/W
(e-pad side).
JESD51
best practice
guidlines.
Within the operating ratings the part operates as specified and without parameter
deviations. Once taken beyond the operative ratings and returned back within, the part will
recover with no damage or degradation.
Additional supply voltage and temperature conditions are given separately at the beginning
of each specification table.
Pin nameConditionMinMaxUnit
Power supply
VB, VBST, VBM--0.119V
VB_SW--119V
BSTSW, VPREREG, I_CORE_SH,
I_CORE_SL
16/109DS12539 Rev 3
Table 4. Pin operating range
--0.119V
L9396Overall description
Table 4. Pin operating range (continued)
Pin nameConditionMinMaxUnit
BCKSW, SCORE--119V
VC4-VBST-0.6VBST+10V
VC2, CP-VBST-0.3VBST+10V
VC1, VC3--0.119V
CBS, GCORE--0.1SCORE+8V
VCC5, VCC, VCOREFDBK, VCORE--0.15.5V
VCCSEL, IGN--0.119V
GNDA, GNDD, GNDBST, NU
--0.10.1V
Interfaces
VDBATT, PDBATT--0.119V
IC in sleep mode
(IGN low)
-0.3VDS+10V
VDG
IC in operative
mode (IGN high)
IC in sleep mode
(IGN low)
-7VDS+10V
-0.3PDS+10V
PDG
IC in operative
mode (IGN high)
IC in sleep mode
(IGN low)
-7PDS+10V
-0.3PRS+10V
PRG
IC in operative
mode (IGN high)
IC in sleep mode
(IGN low)
-7PRS+10V
-0.319V
VDS, PDS, PRS
IC in operative
mode (IGN high)
-719V
WDTDIS--0.15.5V
AI[0..4]--0.119V
FSN, FAULT, PRN, RESET, WSO[0..3]--0.15.5V
CS, CLK, SDI, SDO, PRI, PDI--0.15.5V
RSUH/L[0..3], GPOD0--0.119V
DS12539 Rev 317/109
108
Power supplyL9396
3 Power supply
3.1 Battery range
The device operates on 12 V system. Transient operation for these systems can reach 40 V
maximum. Particular care is to be taken in PCB manufacturing to keep thermal dissipation
to a reasonable level.
All electrical characteristics are valid for the following conditions unless otherwise noted:
-40 °C ≤ Tj ≤ +175 °C.
SymbolParameterConditions / CommentsMinTypMaxUnit
Table 5. Configuration and control DC specifications
VBATP
VBATP
NOV_OB
NOV_WB
Normal Operating
Voltage without boost
Normal Operating
Voltage with boost
Design Info61319V
Design Info
4.5
(6 to start-up)
-19V
18/109DS12539 Rev 3
L9396Power supply
Comp
BST
control
CLAMP
enable
BSTSW
VBST
GNDBST
TH
TH
VB
GADG1801171332PS
BST_DISABLE
driver &
CLAMP_EN
3.2 Boost regulator
The boost regulator can be enabled or disabled via SPI depending on the needs of the
application with respect to the operating battery level. It features an integrated power stage
and operates at 2
capability should be enough to grant full I/O pin supply and minimal µC operation.
When not used, BSTSW pin can be connected to ground and VBST directly to the protected
battery line. The device enables or keeps disabled the boost converter at start-up depending
on the external circuitry: if BSTSW pin is shorted to ground, the boost is disabled at power
up and kept disabled; in case the BSTSW experiences a high voltage at power up, given by
battery connection through the inductor, the boost is enabled. This condition is reported via
SPI with bit BOOST_KEPT_OFF of SUPPLY_CONTROL_2 register (it means that boost
has been kept off and will not operate).
Boost converter diagnostics include under voltage, reported via SPI and FAULT pin (if the
regulator is enabled). The integrated FET featuring the boost switch is protected against
short to battery by means of a thermal shutdown circuit. When thermal fault is detected the
FET is switched off and latched in this state until the related fault flag is read. In case of loss
of ground the FET is switched off and automatically reactivated as soon as ground
connection is restored. Over-voltage protection from load-dump and inductive flyback is
provided via an active clamp and a disable circuitry. A dedicated circuitry is implemented to
keep the boost off at start-up till the voltage difference between VB and VBST pins is lower
than BST_DISABLETH in order to reduce in-rush current and diagnose VBST pin loss
condition or diode loss. An SPI bit is present to report output of this comparator (bit
BOOST_READY of SUPPLY_CONTROL_2 register goes high when VBST>=VBBST_DISABLETH).
MHz to allow the use of external low cost 2.2 µH inductor. The current
State of boost regulator is reported via SPI bit BOOST_ON_FLAG in register
SUPPLY_CONTROL_2. In case boost is disabled due to diagnostic or battery voltage
above output regulation voltage this bit is cleared to 0.
Figure 3. Boost regulator block diagram
DS12539 Rev 319/109
108
Power supplyL9396
All electrical characteristics are valid for the following conditions unless otherwise noted:
The internal analog and digital part is supplied by the supply voltage VBST through
integrated voltage regulators. The generated voltage is monitored. In case of under/overvoltage, the device performs a power on reset (POR).
An undervoltage condition on VBST will lead to an internal reset of the IC. Above this
undervoltage threshold, full functionality is granted.
The device integrates two separated instances of Bandgap voltage regulators; one of these
bandgaps is used as voltage reference for the internal regulators, while the other one is
used for monitoring the voltage levels.
GNDD ground line is protected against ground loss scenarios. In case GNDD line would be
at least GNDD
GNDD is used for digital logic and charge pump while GNDA is used for analog blocks.
GNDBST is used for boost regulator only.
above the reference ground line GNDA, a POR is asserted.
OPEN
-0.5-1V
DS12539 Rev 321/109
108
Power supplyL9396
The device returns to normal operation with full functionality as soon as the POR is
released.
VDD Over-voltage / Undervoltage deglitch filter time
-3.47-3.7V
-2.7-2.9V
--10-µs
VINTAVINTA Output Voltage-3.23.33.4V
VINTA
VINTA
OV
UV
VINTA Over-voltage
threshold
VINTA Under-voltage
threshold
-3.47-3.7V
-2.95-3.13V
VINTA Over-voltage /
T
FLT_ VINTA_OV_UV
Under-voltage deglitch filter
--10-µs
time
3.4 Wake-up input
The input pin IGN can be used as a wake up source connection. In case the voltage on IGN
pin raises above WAKE
The device moves to sleep in case IGN falls below WAKE
longer than WAKE
flt_down
transceiver inhibit outputs. A filter time is implemented to reject spurious glitches. The filter
time is started when the input signal exceeds the specified threshold.
All electrical characteristics are valid for the following conditions unless otherwise noted:
-40 °C ≤ Tj ≤ +175 °C; 4.5 V ≤ VBATP ≤ 19 V.
22/109DS12539 Rev 3
for an interval longer than WAKE
high_th
. This input can be connected to ignition battery switches or
high_th
, the device wakes up.
flt_up
- WAKE
for an interval
hys
L9396Power supply
Charge Pump
CTANK
VBSTVCP
GADG1801171544PS
C1C2
VC1VC2VC3VC4
Table 8. Wake-up input electrical characteristics
SymbolParameterConditionsMinTypMaxUnit
VBATP = 19 V Wake
VB
stby_cur
Battery standby current
consumption
disable Sum of leakage
currents from BSTSW,
--30µA
VBST, VB and VBM
WAKE
WAKE
WAKE
WAKE
WAKE
WAKE
high_th
low_th
hys
pd
flt_up
flt_down
Wake-up high voltage
threshold
Wake-up low voltage
threshold
Wake-up voltage
hysteresis
Wake-up pull downIGN = 14 V300-900kΩ
Wake up ON deglitch--10-µs
Wake up OFF deglitch--10-µs
-3.5--V
---1.5V
-0.5-1.5V
KA_periodKeep-alive period--200-ms
3.5 Charge pump
A two-stage charge pump is integrated to supply the high voltage circuit in the VPREREG
and VCORE regulators and in the pump motor and fail safe pre-drivers.
The charge pump is supplied by the rail connected to VBST pin. External charging
capacitors are used to achieve a high current capability.
Figure 4. Charge pump block diagram
It features a current limitation protection when either C1 or C2 is being charged up. The
charge pump is protected against over temperature with dedicated thermal sensor. In
standby mode the charge pump is disabled.
In case the CP output voltage remains too low for longer than tfCP the CP LOW bit is
latched, which leads to shutdown of VPREREG, pump motor driver and fail safe driver. In
turn, under voltage of VPREREG leads to shutdown of VCC, VCC5 and VCORE regulators.
DS12539 Rev 323/109
108
Power supplyL9396
A second undervoltage threshold is present (V
CPLOW2
) with a higher value. It can be used
together with PDG turn-on threshold voltage to detect that low charge pump voltage is
responsible for low PDG ON voltage.
SymbolParameterConditionsMinTypMaxUnit
V
CP_5V6
V
CP_8V
V
CP_8V55
I
CP_5V6
I
CP_8V
f
CP
V
CPLOW
Charge pump
output voltage
Charge pump
output voltage
Charge pump
output voltage
Charge pump
output current
Charge pump
output current
Charge pump
frequency
Charge pump low
voltage threshold
Charge pump
V
CPLOW2
second low voltage
threshold
t
fCP
C
TAN K
, C
C
CP1
T
JSDCP
T
HYS_TSDCP
Low voltage filter
time
Output capacitorDesign Info-220-nF
Switching capacitorDesign Info-68-nF
CP2
Thermal Shutdown-175-200°C
Thermal Shutdown
hysteresis
Table 9. Charge pump electrical characteristics
VBST > 5.6 V
Iload_ext = 8 mA
VBST >8V
Iload_ext=10mA
VBST >8.55V
Iload_ext=1mA
VBST>5.6V--8mA
VBST>8V--10mA
--f
-VBST+5.6VBST+6VBST+6.8V
-VBST+7.85VBST+8.35VBST+8.85V
--10-µs
-5-15°C
VBST+7.0-VBST+11V
VBST+8.9-VBST+11V
VBST+9.1-VBST+11V
/34(0.470)-MHz
OSCINT
3.6 VPREREG buck regulator
The integrated buck regulator provides a reduced voltage supply to the remaining regulators
and to the WSS / tracking interface. Its default output level 6.5
7.2
V via register of BUCK VOLTAGE SELECTION in SPI.
This regulator is protected against short circuits and over temperature with dedicated
thermal sensor, and an over/under voltage monitor is implemented. VPREREG itself is not
shut down in case of over/under voltage at its output. VPREREG itself is not shut down in
case of overcurrent, only in case of over temperature the regulator is switched off.
This regulator is not protected against diode loss and the IC may be irreparably damaged
due to diode loss.
Under voltage of VPREREG (VPREREG_UV) leads to shutdown of VCC, VCC5 and
VCORE regulators.
24/109DS12539 Rev 3
V can be further increased to
L9396Power supply
All electrical characteristics are valid for the following conditions unless otherwise noted:
-40 °C ≤ Tj ≤ +175 °C; 6 ≤ VBST ≤ 19 V.
SymbolParameterConditionsMinTypMaxUnit
Table 10. VPREREG buck regulator
V
PREREG_H
V
PREREG_L
V
PREREG_UV
t
flt_VPREREG_UV
V
PREREG_OV
t
flt_VPREREG_OV
I
VPREREG_HI
I
VPREREG_LO
L
VPREREG
C
VPREREG
dV
SR_ac
dV
LR_ac
I
OC_VPREREG_HI
Output Voltage VBST > 8.2 V6.9847.27.416V
Output Voltage VBST > 7.5 V6.3056.56.695V
Under voltage
threshold
Under voltage
filter time
Over voltage
threshold
Over voltage
filter time
Output load
current
Output load
current
-5.055.215.32V
--12-µs
+5%
x
-
V
PREREG_
+10%
V
-
PREREG_
x
V
--12-µs
SYS_CONFIG_1[9]=10.01-1A
SYS_CONFIG_1[9]=0
(default)
0.01-0.5A
Buck inductor-17.62226.4µH
Output
capacitor
Line Transient
Response
Load Transient
Response
-14.32229.7µF
All line, load; dt = 10 µs
VBST> V
PREREG
(Typ)+3V
All line, load; dt = 10 µs
VBST> V
PREREG
(Typ)+3V
-8%-8%%
-8%-8%%
High Over
current
SYS_CONFIG_1[9]=11.8-3A
detection
I
OC_VPREREG_LO
-High side t
-High side t
Fv
preregsw
R
DSon
t
softstart
Low Over
current
detection
on
off
Operating
Frequency
High side
Rds_ON
Softstart time
SYS_CONFIG_1[9]=0
(default)
0.9-1.6A
---40ns
---40ns
f
/
--
OSCINT
34
-MHz
(0.470)
= 25 °C--0.4Ω
T
j
T
= 175 °C--0.44Ω
j
From 10% to 90% of
nominal output voltage
130-390µs
DS12539 Rev 325/109
108
Power supplyL9396
Table 10. VPREREG buck regulator (continued)
SymbolParameterConditionsMinTypMaxUnit
T
JSDVPRE
T
HYS_TSDVPRE
Thermal
Shutdown
Thermal
Shutdown
hysteresis
-175-200°C
-5-15°C
26/109DS12539 Rev 3
L9396Power supply
CP
Buck
Configuration
VCOREFDBK
GCORE
SCORE
VCORE
CBS
Linear
configuration
VCOREFDBK
GCORE
SCORE
VCORE
CP
GADG1901171138PS
I_CORE_SL
I_CORE_SH
I_CORE_SL
I_CORE_SH
(w/ Stop Mode bypass
with ext. FET
LDO)
Volt. Mon.
Volt. Mon.
22uH
VPREREG
VPREREG
L9396
L9396
3.7 VCORE regulator
This regulator provides the supply to the µC core. The flexible approach with the external
voltage divider allows the rail to be regulated from 0.8
either as a buck controller or as a linear controller, driving an external FET in both cases.
Typically 100 Ω resistor is to be inserted between GCORE pin and gate of the external FET
for buck configuration. For buck configuration, the source of the external FET should be
connected to the SCORE pin, and the output tank capacitor should be connected to the
VCORE pin. For linear configuration, the output tank capacitor should be connected with the
source of the external FET and the SCORE pin, while VCORE pin could be left either
floating, tied to ground or still connected to VCORE to allow ADC internal measurement.
The VCORE regulator has over and under voltage detections and the VCORE is not shut
down in case of over or under voltage. It is also protected against short to ground by
monitoring regulation loop for VCORE buck or over current for VCORE linear. When short to
ground is detected and lasts more than the filter time of tflt_oc_vcore, the vcore is shut down
and the restart is automatic in tflt_restart. No thermal protection is implemented for VCORE
because the power MOS is external.
Both VPREREG and VCORE regulators could be disabled by connecting I_CORE_SH pin
to ground or leaving it open. In this case, VPREREG pin should be connected to VBST pin.
Moreover two pins (AI0 and AI1) are used to configure additional features of VCORE
regulator. It's possible to disable only VCORE regulator leaving VPREREG enabled. It's
possible to change the monitor of regulated voltage (monitor on VCORE pin or monitor on
VCOREFDBK pin). All the possibilities are listed in the following table.
DS12539 Rev 327/109
108
Power supplyL9396
Table 11. Vcore configuration
AI0AI1I_CORE_SH VCORE state VPREREG stateVCORE monitor
LowLowHighEnabledEnabled
LowHighHighEnabledEnabled
HighLowHighEnabledEnabled
VCORE_UV_L,
VCORE_OV_L
VCORE_UV_H,
VCORE_OV_H
VCOREFDBK_UV,
VCOREFDBK_OV
HighHighHighDisabledEnabledDisabled
Don’t careDon’t careLowDisabledDisabledDisabled
The state of configuration pins (AI0, AI1 and I_CORE_SH) is latched at power up when
VPREREG voltage exceeds the V
PREREG_
UV threshold and stays latched until next POR
event.
Microcontroller can monitor the voltage of AI0 and AI1 pins using embedded ADC converter
and latched configuration is available via SPI bits.
All electrical characteristics are valid for the following conditions unless otherwise noted:
This regulator provides a fixed 5V rail to supply µC I/Os and ADC. The VCC5 regulator has
over and under voltage detections and is also protected against short circuits and over
temperature with shared thermal sensor with VCC regulator.
All electrical characteristics are valid for the following conditions unless otherwise noted:
This regulator provides a dedicated rail to supply µC I/Os. It can be configured via VCCSEL
pin to output either 3.3 V or 5 V. The VCC regulator has over and under voltage detections
and is also protected against short to ground and over temperature with shared thermal
sensor with VCC5.
The state of VCCSEL pin is latched at power up when VPREREG voltage exceeds the
VPREREG_UV threshold and stays latched until next POR event.
All electrical characteristics are valid for the following conditions unless otherwise noted:
The device provides a fully protected switched battery output VB_SW, always active when
the device is not in stand-by mode and WD1 is correctly served. This functionality can be
used as further battery supply, e.g. for external sensors requiring battery level, or as a pullup voltage rail.
The output can be disabled through SPI. Should the VB_SW diagnostics detect an over
current condition, the output is turned off and the over current SPI fault is set. Once an overcurrent condition is detected, the output can only be re-enabled through SPI command,
when the fault disappears, writing the bit PROTECTED BATTERY SWITCH COMMAND at
1 after the related OVER CURRENT flag is cleared on read.
All electrical characteristics are valid for the following conditions unless otherwise noted:
Wake-up signal turns on the device and initiates the regulator power up sequence as in the
figure below.
Figure 6. Power up sequence from wake up input
The device provides three different possibilities to stay in ON state:
a persistent high signal on IGN pin,
the setting of the POWERHOLD bit through SPI,
the refreshing of the KEEPALIVE bit through SPI within a specified time frame.
At each transition H->L on the wake-up pin the device enters the keep-alive mode for one
keep-alive period (KA_period).
If the device receives an SPI command to set the POWERHOLD bit within the first keepalive period the device remains awake. Similarly, if the device receives an SPI command to
refresh the KEEPALIVE bit within the first keep-alive period the device remains awake.
Once the KEEPALIVE bit is refreshed a new KA_period starts and so forth. To stay on the
keep-alive bit should be refreshed at each KA_period.
Should the KA_period elapse without any of the above 3 conditions, the device exits the
keep-alive mode and enters in power down.
The power down sequence depends on the keep alive choice being done.
In the following figure, the power down sequence related to a H->L transition on the wake-
up input pin without SPI conditioning is shown.
Figure 7. Power down sequence from wake up input
Table 16. Power up and power down
SymbolParameterConditionsMinTypMaxUnits
VCC5_dly
VCC_dly
VCORE_dly
VCC5 delay at
power-up
VCC delay at
power-up
VCORE delay at
power-down
Ton_RESETRESET hold time
From VPREREG_UV to VCC5
start
From VPREREG_UV to VCC
start
From end of KA_period
VCORE switch off
From regulators in range to
RESET High
to
-200 - µs
-200 - µs
-200 - µs
111213ms
36/109DS12539 Rev 3
L9396Pre-drivers
4 Pre-drivers
4.1 Fail safe pre-driver
The device integrates a pre-driver of an external FET for fail safe purposes. It can be used
as a HS pre-driver in case the external FET is used as a switch. The device controls the fail
safe pre-driver in On/Off via SPI. The function remains active while no internal voltage faults
or watchdog faults are detected.
This pre-driver implements a monitor against over current thanks to the diagnostics on
drain-source monitoring of the external FET (in case of overcurrent SPI bit 15 of
DRV_CONTROL_1 register goes high). If charge pump level goes below the disable
voltage, the pre-driver is turned off. When the level returns above the disable voltage, the
pre-driver returns to normal operation.
Filter time of QFS turn-onguaranteed by scan-12-µs
V(VDBATT) – V(VDS)
VDS_TH=’00’
V(VDBATT) – V(VDS)
VDS_TH=’01’
V(VDBATT) – V(VDS)
VDS_TH=’10’
V(VDBATT) – V(VDS)
VDS_TH=’11’
FAIL SAFE DRIVER
ENABLE=0
0.25-0.75V
0.75-1.25V
1.25-1.8V
1.75-2.4V
7-67µA
DS12539 Rev 337/109
108
Pre-driversL9396
4.2 Pump motor pre-driver
The device can drive a pump motor through this pre-driver for external FETs. It provides predriver circuitry for the motor high-side FET and the motor recirculation FET.
The PDG gate drive signal is referenced to PDS, and the pre-driver pair shall be able to float
below the logic ground voltage, while keeping full on/off control on the external FET. This is
required to prevent the FET from being partially turned on in the case of a ground offset
between ECU and motor ground, or in case of loss of ECU ground.
Similarly, the PRG gate drive signal shall be referenced to PRS, and the pre-driver pair shall
be able to float below the logic ground voltage, while keeping full on/off control on the
external recirculation FET.
The motor FET pre-drivers shall be controlled by logic level input pins PDI and PRI, with
logical operation defined as:
PDI PRI PDG PRG High-side FETRecirculation FET
L L L L OFF OFF
H L H L ON OFF
L H L H OFF ON
H H HL ON OFF
Table 18. Logical operation definition
The state of the PDI and PRI pins can be observed via SPI.
The device is able to generate software selectable dead time between PDG and PRG
transitions, to prevent cross-conduction on the external FETs.
In order to enable either PDG or PRG the following conditions must be met:
the watchdog reset must not be asserted,
the Enable Motor FET Driver SPI bit must be set,
no device faults preventing PDG or PRG operation must be present.
When disabled, PDG and PRG are driven to their low states.
4.3 Pump motor diagnostics
To enable MCU diagnostics, the device provides an internal pull-up current (IPDS) on PDS
and the PDS voltage can be read by the ADC and available over SPI.
After PDG is turned on, the device monitors the rising differential voltage between PDG and
PDS. If the differential voltage does not exceed the PDG turn-on voltage threshold within the
PDG switching time, the device disables the PDG pre-driver and sets the PDG Turn-On
Fault SPI bit. The device automatically re-enables the PDG pre-driver on the next rising PDI
edge.
After PDG is turned off, the device monitors the falling differential voltage between PDG and
PDS. If the differential voltage does not drop below the PDG turn-off voltage threshold within
the PDG switching time, the device disables both the PDG and PRG pre-drivers, sets the
PDG Turn-Off Fault SPI bit and clears the Enable Motor FET Driver SPI bit. The PDG and
38/109DS12539 Rev 3
L9396Pre-drivers
PRG pre-drivers remain disabled until the Enable Motor FET Driver SPI bit is re-set over
SPI. The PDG Turn-On/off Fault SPI bits are latched until read.
In case the negative flyback voltage on PDS drops below the open flyback voltage threshold
for longer than the open flyback debounce time after PDG is turned off, the device disables
both the PDG and PRG pre-drivers, sets the Open Flyback Fault SPI bit and clears the
Enable Motor FET Driver SPI bit. The PDG and PRG pre-drivers remain disabled until the
Enable Motor FET Driver SPI bit is re-set over SPI. The Open Flyback Fault SPI bit is
latched until read.
After PDG is turned on, the device monitors the falling differential voltage between PDBATT
and PDS. If the differential voltage does not drop below the QPD turn-on voltage threshold
within the QPD switching time, the device disables the PDG pre-driver and sets the QPD
Turn-On Fault SPI bit. The device automatically re-enables the PDG pre-driver on the next
rising PDI edge. The QPD Turn-On Fault SPI bit is latched until read.
After PDG is turned off, the device monitors the falling PDS voltage. If the voltage does not
drop below the QPD turn-off voltage threshold within the QPD switching time, the device
disables both the PDG and PRG pre-drivers, sets the QPD Turn-Off Fault SPI bit and clears
the Enable Motor FET Driver SPI bit. The PDG and PRG pre-drivers remain disabled until
the Enable Motor FET Driver SPI bit is re-set over SPI. The QPD Turn-Off Fault SPI bit is
latched until read.
After PRG is turned on, the device monitors the rising differential voltage between PRG and
PRS. If the differential voltage does not exceed the PRG turn-on voltage threshold within the
PRG switching time, the device sets the PRG Turn-On Fault SPI bit. The device continues
to drive the current limited PRG pin. The PRG Turn-On Fault SPI bit is latched until read.
After PRG is turned off, the device monitors the falling differential voltage between PRG and
PRS. If the differential voltage does not drop below the PRG turn-off voltage threshold within
the PRG switching time, the device disables both the PDG and PRG pre-drivers, sets the
PRG Turn-Off Fault SPI bit and clears the Enable Motor FET Driver SPI bit. The PDG and
PRG pre-drivers remain disabled until the Enable Motor FET Driver SPI bit is re-set over
SPI. The PRG Turn-On Fault SPI bit is latched until read.
All the OFF diagnostic comparators (PDG_OFF, open flyback, QPD_OFF, PRG_OFF) are
active during the entire OFF state until FETs are switched on. Output of comparators is
masked when Enable Motor FET Driver SPI bit is low while is not masked when Enable bit
is high and FETs are in off state. There is no masking of OFF diagnostic when there is
transition of Enable Motor FET Driver SPI bit from low to high. Masking time is only applied
during the transitions of FETs gate command.
In case of a device ground loss while the motor is enabled, the device disables both external
FETs. These FETs remain disabled until the device returns to the active mode.
If battery level goes below the disable voltage, the pre-driver is turned off after the delay
disable time has elapsed. When the level returns above the disable voltage, the pre-driver
returns to normal operation.
DS12539 Rev 339/109
108
Pre-driversL9396
Table 19. Pump motor diagnostics electrical characteristics
Table 19. Pump motor diagnostics electrical characteristics (continued)
SymbolParameterConditionsMinTypMaxUnits
-QPD filter timeguaranteed by scan-3-µs
-
-
PDG_Isource
PDG_Isink
PRG_ON
PRG_OFF
-
-
Rpd_PRG_PRS
-
Open flyback
threshold
Open flyback
filter time
PDG current
source
PDG current
sink
PRG On
voltage
PRG Off
voltage
PRG turn-on
threshold
voltage
PRG turn-off
threshold
voltage
Pull down
resistor at
PRG-PRS
PRG switching
time
--11--7.5V
--3-µs
V(PDG)=V(PDS)
V(CP)-V(PDG) = 2 V
152535mA
V(PDG) – V(PDS) = 1 V152535mA
(V(PRG)-V(PRS))@1 mA@VBST>5.6 V
6.8-12V
(V(PRG)-V(PRS))@1 mA--0.5V
V(PRG)-V(PRS) 5.1- 6.8V
V(PRG)-V(PRS)0.5-1V
-130-270kΩ
guaranteed by scan-6-µs
-PRG filter timeguaranteed by scan-3-µs
PRG_Isource
PRG_Isink
-
-
PDI _IH
PDI _IL
PDI _Ihys
Ipd_PDI
PRG current
source
PRG current
sink
PDI
propagation
delay
PRI
propagation
delay
PDI input high
voltage
PDI input low
voltage
PDI input
hysteresis
PDI input Pull
down current
V(PRG)=V(PRS)
V(CP)-V(PRG)=2V
152535mA
V(PRG) – V(PRS)=1V152535mA
From PDI rising edge to
PDG at turn-on threshold
-2-µs
voltage
From PRI rising edge to
PRG at turn-on threshold
-2-µs
voltage
-1.75--V
---0.75V
-100-1000mV
PDI=3.3V10-100µA
DS12539 Rev 341/109
108
Pre-driversL9396
Table 19. Pump motor diagnostics electrical characteristics (continued)
SymbolParameterConditionsMinTypMaxUnits
PRI _IH
PRI _IL
PRI _Ihys
Ri_pd_PRI
-
PRI input high
voltage
PRI input low
voltage
PRI input
hysteresis
PRI input Pull
down current
Non overlap
timing
-1.75--V
---0.75V
-100-1000mV
PRI=3.3V10-100µA
Programmable in 24 steps-0.256µs
42/109DS12539 Rev 3
L9396Remote sensor interface
5 Remote sensor interface
The device contains 4 remote sensor interfaces, capable of supporting active wheel speed
sensors or operating as an independent 2-channel tracking regulation supply.
The interface supply is internally connected to the VPREREG pin. The circuitry consists of a
power interface delivering a dedicated output voltage on RSUHx pins. This output could be
voltage regulated in case of operation as tracking supply (pins RSUH0 and RSUH1). When
WSS operation is selected, the function mirrors the current flowing in the external sensor
and transmits this current information to the decoder, which produces a digital value for
each sensor channel. RSULx pins are used as ground returns from the sensors and current
sense is carried out in low side.
Data are then output through SPI registers. Received signals can be processed to the
corresponding discrete logic output pin WSO0-WSO3.
5.1 Active wheel speed sensor
The remote sensor interface circuit conditions and interprets active wheel speed sensor
signals with various pulse widths and output currents. The following sensor types are
supported and selected through SPI configuration:
Standard active 2-level wheel speed sensors (7/14 mA);
A three-level (7/14/28 mA) VDA compliant sensor with direction and air gap information
("Requirement Specification for Standardized Interface for Wheel Speed Sensor with
Additional Information", Version 4.0);
PWM encoded 2-level sensors with 2 edges per tooth (see data sheet Infineon IC
TLE4942/BOSCH DF11);
PWM encoded 2-level sensors with 1 edge per tooth (see data sheet Allegro
ATS651LSH/BOSCH DF11).
Received wheel speed frames from all the above sensors are decoded into signals suitable
for the microcontroller through SPI or the four WSOx output pins. For all sensors, other than
the standard active 2- level sensor, additional sensor data (diagnostics, etc…) are decoded
and available within SPI registers. The user may select to have all sensor data processed
on WSOx pins through the microcontroller by selecting pass through mode. In pass through
mode, the remote sensor interface simply conditions the incoming sensor current pulses to
digital pulses, no decoding is performed.
The sensor input filter time, deglitch filter, (delay until a threshold crossing is detected) can
be configured (from 8 µs to 50 µs). Filters can be selected individually for each channel,
through the RS_CFG_x_y registers, bits [9:6].
For PWM encoded sensors with 2 edges per tooth not in pass through mode, the standstill
signal can be processed directly to the WSOx output pins. This is done in the RS_CFG_x_y
registers, bit [4].
Since the decoder has to measure the pulses in order to determine whether they are standstill pulses or not, the first standstill pulse will always be seen on the WSOx output pins and
the first not stand-still pulse after a stand-still period will be suppressed.
DS12539 Rev 343/109
108
Remote sensor interfaceL9396
GADG1901171624PS
Sensor current
WSO pin
Bit SSDIS = 1
First not stand still
pulse is suppressed
WSO pin
Bit SSDIS = 0
Stand still time
Figure 8. Standstill operation diagram
Data from the sensor are not latched: last incoming frame overwrites the previous one once
validated. Faults coming from diagnostic (i.e. over current, short to ground or battery) are
latched until the microcontroller reads them.
We have two different digital algorithms:
Auto-adjusting current trip points. With this option, the IC is able to find sensor base
current value (named IB0). Range of base current can be configured via SPI. The IC is
also able to detect the current value of the data pulse and compute the first threshold
(named Ith1): Ith1 = IB0 + (ΔIth1)/2 where ΔIth1 range is also configurable via SPI.
Besides, in case of VDA selected, the IC is also able to recognize the current value of
the speed pulse by computing a second threshold (named Ith2): Ith2 = IB0 + ΔIth1 +
(ΔIth2)/2 where ΔIth2 range is configurable via SPI.
Fixed current trip points where the thresholds are set by SPI. To avoid the risk of wrong
settings (inverted thresholds, thresholds outside WSI limits and similar) only the first
threshold can be directly programmed while, to determine the second one, an offset vs.
the first threshold must be provided. Both values, threshold and offset, can be specified
through an 8-bit word (range 0x00 → 0xFF). A fixed offset of 54 (0x36) is also added to
determine the actual thresholds in order to prevent any potential wrong setting out or
range. Complete formulas for threshold computation are the following:
93.75 µA*(108+WSI_FIRST_TH+WSI_OFFS_TH)*0.6865
–WSI_FIRST_TH: SPI programmable from 0x00 to 0xFF (default = 0x33)
–WSI_OFFS_TH: SPI programmable from 0x00 to 0xFF (default = 0x34)
44/109DS12539 Rev 3
L9396Remote sensor interface
GADG2001170743PS
Three levels current
(VDA compliant sensor
with Manchester encoded
information)
Three levels current
(Standard compliant sensor
with only speed information
information)
Two levels current PWM
(One pulse per tooth with data
encoded in pulse width)
Two levels current PWM
(Two pulses per tooth with data
and diagnostic encoded
in pulse width)
WSx pin
WSx pin
WSx pin
Data and diagnostic by SPI: Three level sensors have eight data bits and a parity bit which are written into the register upon
receiving At higher speeds not all bits can be transmitted. The data register for each wheel contains the number of data bits
received between two speed pulses.
Data by WSx pin (Pass-through model)
Data by WSx pin and Duty cycle info by SPI
(Normal mode)
WSx pin
Data by WSx pin and Duty cycle info by SPI
(Normal mode)
(Pass-through model)
(Pass-through model)
high
db0
I
THopen
I
TH1
I
TH2
db1 db2 db3 db4 db5 db6 db7 p
high highlowhighhighhighhighlow
28mA
I
TH1
14mA
7mA
45μs
45μsn x 45μs
45μs90μs90μs
I
TH1
14mA
7mA
I
TH1
14mA
7mA
7mA
Figure 9. Wheel speed sensor protocol types
DS12539 Rev 345/109
108
Remote sensor interfaceL9396
5.1.1 Wheel speed data register formats
In the wheel speed sensor interface four data registers are used (Remote Sensor Data
Register RS_DATA_RSDR_0- RS_DATA_RSDR_3).
Independent data registers are defined for each wheel speed channel and their contents are
determined by sensor type. Three-level VDA sensors have eight data bits and parity as
shown in the table below. At fast speed not all bits may be transmitted by the sensor: the IC
is able both to process normal or either truncated frames by providing together with data, a
4-bit counter to inform the microcontroller about the number of received valid bits.
For PWM encoded sensors, each pulse length is written to the sensor data register with a
typical resolution of 5 µs per bit. In case of pulse width duration equal to or higher than
1.045
ms, the standstill condition will be recognized and bit 15 in the corresponding register
will be set.
The register is updated when a PWM falling edge is detected; in case of stuck-at 1 of the
PWM signal the register is updated when the counter reaches the overflow value (0x1FF): in
this case the standstill bit not set and the counter in overflow will signal a fault to the
microcontroller.
5.1.2 Testmode
In order to test the input structures of the connected microcontroller, the device features a
wheel speed test mode that allows test patterns to be applied on the four wheel speed
outputs WSOx. The test mode can be entered via SPI and the test patterns can also be
controlled via SPI commands. Test patterns can be composed only of static high or low
signals, which can be selected via SPI. For safety reasons only one channel at a time can
be switched into test mode.
In order to enable testmode it is necessary to write to '1' bit DIAG (bit 4) of register
RS_CTRL. After that the bits of WSS_TEST register select the channel under test and the
state of output pin.
To exit this testmode it is not sufficient to clear to '0' the DIAG bit but, before that, also bits
8:2 of WSS_TEST register (Config range field) must be changed in order not to select any of
the four available outputs.
WSS_TEST register stores Static Test configurator bit-field.
This register configures a static test for WSI interface. Test consists in transferring TestBit
value on a selected (by Config range) WSI output.
TestBit: Test input value.
Table 20. WSS_TEST register
46/109DS12539 Rev 3
L9396Remote sensor interface
Table 21. WSS_TEST register bit description
Data FieldDescriptionReset valueReset Event
Config range: selects one WSI
output according to the following
range:
WSICTRL register stores Remote sensor control field.
Bits 3 down to 0 of this register are used to enable WSS interfaces. These bits can be
written only when INIT bit (bit 5) of this register is '1'. When INIT is cleared to 0, also bits 3
down to 0 are cleared to 0. Enable/Disable state of interfaces is maintained and it can be
monitored by reading back RS_DATA_RSDR registers.
Bits 8 and 9 of this register can be changed only when INIT bit is '1'. When INIT is cleared to
'0' these bits maintain their values.
Data FieldDescriptionReset ValueReset Event
WSS EN SAT FLAGS: Allow to
read WSS current saturation flags
Bit 9
available in RS_DATA_RSDR_12
0 => disable flags
1 => enable flags
Table 27. RS_CTRL register bit description
0
SSM_RESET
LBIST
Bit 8
WSS READ CURRENT: Allow to
read instantaneous converted
current in bit [9:0] of
RS_DATA_RSDR_4/5/6/7
0 => reading base current
1 => reading instantaneous current
DS12539 Rev 351/109
0
SSM_RESET
LBIST
108
Remote sensor interfaceL9396
Table 27. RS_CTRL register bit description (continued)
Data FieldDescriptionReset ValueReset Event
INIT: Allow access to RS_CFG_x
registers, RS_CTRL register bits 3
Bit 5
Bit 4
Bit 3:0
down to 0 and RS_AUX_CFG
register.
0 => Off
1 => On
DIAG: Allow access to WSS test
reg
0 => Off
1 => On
CHxEN: Channel x Output enable,
updated by Reset Event or SPI
write
0 => Off
1 => On
0
0
0
SSM_RESET
LBIST
SSM_RESET
LBIST
SSM_RESET
LBIST
Table 28. RS_AUX_CFG register
AddrNameTypeBits = 20
00
01110RS_AUX_CFGRWOffset Thr Range= 19:10, Lo Thr Range = 9:0
RS_AUX_CFG register stores WSI Thresholds for fixed current trip-point method.
Data FieldDescriptionReset ValueReset Event
Bit 19:18
Bit 17:10
Table 29. RS_AUX_CFG register bit description
SECOND_RANGE_SEL: (valid
only for adaptive thresholds):
00 => ∆Ith2
∆Ith2
MAX
01 => ∆Ith2
∆Ith2
MAX
10 => ∆Ith2
∆Ith2
MAX
11 => ∆Ith2
∆Ith2
MAX
WSI_OFFS_TH[7:0]:
In case of fixed thresholds this
represents offset from low
threshold to calculate the high
threshold (see formula in
Section 4.1).
In case of adaptive thresholds this
is the offset to calculate maximum
value of base current IB0: IB0
IB0
MIN +
In both cases LSB=93.75 µA typ.
= 12.5 mA,
MIN
= 15.5 mA;
=11.0mA,
MIN
=17.0mA;
=9.5mA,
MIN
=18.5mA;
=8.0mA,
MIN
=20.0mA;
OFFSET_IB0.
MAX
01
0x34
=
SSM_RESET
LBIST
SSM_RESET
LBIST
52/109DS12539 Rev 3
L9396Remote sensor interface
Table 29. RS_AUX_CFG register bit description (continued)
Data FieldDescriptionReset ValueReset Event
FIRST_RANGE_SEL (valid only for
adaptive thresholds):
Bit 9:8
Bit 7:0
00 ==> ∆Ith1
∆Ith1
MAX
01 ==> ∆Ith1
∆Ith1
MAX
10 ==> ∆Ith1
∆Ith1
MAX
11 ==> ∆Ith1
∆Ith1
MAX
WSI_FIRST_TH[7:0]:
In case of fixed thresholds this is
used to calculate low threshold
(see formula in 4.1).
In case of adaptive thresholds this
is the minimum value of IB0
(IB0
range from 0 to 24 mA).
MIN
In both cases LSB=93.75 µA typ.
=6.25mA,
MIN
=7.75mA;
=5.5mA,
MIN
=8.5mA;
=4.75mA,
MIN
=9.25mA;
=4.0mA,
MIN
=10.0mA;
01
0x33
SSM_RESET
LBIST
SSM_RESET
LBIST
WSI remote sensor data/fault register
ADDRNameTypeBits = 20
0010000RS_DATA_RSDR_0ROSee description
0010001RS_DATA_RSDR_1ROSee description
0010010RS_DATA_RSDR_2ROSee description
0010011RS_DATA_RSDR_3ROSee description
RS_DATA_RSDR_x register stores status bits of WSS interface. Output format depends on
the status of bit 15.
No Fault condition:
Data FieldDescriptionReset ValueReset Event
Bit 19:17
Table 31. RS_DATA_RSDR_0-3 registers bit description [Bit 15 = 0]
CRC [2:0]: CRC based on bits
[16:0] Update based on bits [16:0]
STDSTL: Standstill indication (only
Bit 16
for VDA sensor or PWM 2 edges)
0 => Valid sensor signal
1 => Standstill
NODATA: No data in buffer (valid
also for two level STD sensors but
in this case, where data bits are not
Bit 3
expected, this bit is high during
normal communication)
1
SSM_RESET
LBIST
0 => no fault
1 => fault
PULSE OVERFLOW: Pulse
duration counter overflow
Bit 2
(available only for PWM encoded
WSS)
0 => no fault
1 => fault
0
SSM_RESET
LBIST
Bit 1:0NOT USED0
Table 33. RS_DATA_RSDR_4-7 registers
SSM_RESET
LBIST
AddrNameTypeBits = 20
0010100RS_DATA_RSDR_4ROFor channel 0, See description
0010101RS_DATA_RSDR_5ROFor channel 1, See description
0010110RS_DATA_RSDR_6ROFor channel 2, See description
0010111RS_DATA_RSDR_7ROFor channel 3, See description
Table 34. RS_DATA_RSDR_4-7 registers bit description
Data FieldDescriptionReset ValueReset Event
Bit 19:10
the content of this register is value
of first delta (∆Ith1)
0x4B
SSM_RESET
LBIST
LSB=93.75 µA typ.
In case WSS_READ_CURRENT
bit = 0 the content of this register is
value of base current (IB0); in case
Bit 9:0:
WSS_READ_CURRENT bit = 1 the
content of the register is value of
instantaneous current in RSULx
0x4A
SSM_RESET
LBIST
pin.
In both cases LSB=93.75 µA typ.
56/109DS12539 Rev 3
L9396Remote sensor interface
Table 35. RS_DATA_RSDR_8-11 registers
AddrNameTypeBits = 10
0011000RS_DATA_RSDR_8ROFor channel 0, See description
0011001RS_DATA_RSDR_9ROFor channel 1, See description
0011010RS_DATA_RSDR_10ROFor channel 2, See description
0011011RS_DATA_RSDR_11ROFor channel 3, See description
Table 36. RS_DATA_RSDR_8-11 registers bit description
Data FieldDescriptionReset ValueReset Event
the content of this register is value
Bit 9:0:
of second delta (∆Ith2)
0x96 SSM_RESET
LSB = 93.75 µA typ.
Table 37. RS_DATA_RSDR_12 register
AddrNameTypeBits = 12
0011100RS_DATA_RSDR_12ROSee description
Table 38. RS_DATA_RSDR_12 register bit description
Data FieldDescriptionReset ValueReset Event
(2nd range saturation flag, 1st
range saturation flag, Base current
Bit 11:9
saturation flag) related to channel
3. Enabled only when
0x0 SSM_RESET
WSS_EN_SAT_FLAGS (bit 9 of
RSCTRL register) is 1.
(2nd range saturation flag, 1st
range saturation flag, Base current
Bit 8:6
saturation flag) related to channel
2. Enabled only when
0x0SSM_RESET
WSS_EN_SAT_FLAGS (bit 9 of
RSCTRL register) is 1.
(2nd range saturation flag, 1st
range saturation flag, Base current
Bit 5:3
saturation flag) related to channel
1. Enabled only when
0x0SSM_RESET
WSS_EN_SAT_FLAGS (bit 9 of
RSCTRL register) is 1.
(2nd range saturation flag, 1st
range saturation flag, Base current
Bit 2:0
saturation flag) related to channel
0. Enabled only when
0x0SSM_RESET
WSS_EN_SAT_FLAGS (bit 9 of
RSCTRL register) is 1.
DS12539 Rev 357/109
108
Remote sensor interfaceL9396
ADDRNAMETYPEBITS = 8
0001010RSU_STATUSRLS Over Current and Short to ground Status
Data FieldDescriptionReset ValueTYPE
Bit 7:4
Bit 3:0
Table 40. RSU_STATUS register bit description
LS OVER CURRENT channels 3:0.
(Active if the wss LS are ON)
0 => NO FAULT
1 => FAULT
LS Short To Ground channels 3:0.
(Active if the wss LS are OFF)
0 => NO FAULT
1 => FAULT
5.2 Tracking regulation
RSUH0 and RSUH1 output pins can be configured as independent tracking regulators; this
is the default configuration at start-up. Each regulator tracks the voltage reference given by
the VCC (default) or VCC5 rail, depending on the user selection via SPI command. The 2
channels can be activated or deactivated independently (default state is off). Over/under
voltage and over current monitoring are applied to RSU0/1 channels when in tracking
regulator configuration and result bits are available via SPI.
Table 39. RSU_STATUS register
0
0
SSM_RESET
LBIST
SSM_RESET
LBIST
5.3 Remote sensor interface fault protection
Each output is short circuit protected by an independent current limit and a thermal
detection circuit. Current limit and overcurrent detection are present for both RSUHx and
RSULx and they are independent of RSUHx and RSULx. In case RSUHx overcurrent is
detected the output stage is disabled after filter time while in case of RSULx overcurrent it's
not disabled. In any case if the thermal protection (shared between RSUH and RSUL) is
triggered the output stage is disabled. In case the thermal warning level would not be
reached, the current limitation circuitry will prevent damages on the channel, while operating
the output. This fault condition does not interfere with the normal operation of the IC or with
the operation of the other channels.
All RSUHx(x=0,1,2,3) are independently protected against a short to battery condition. Short
to battery protection disconnects the channel from its supply rail to guarantee that no
adverse condition occurs within the IC. The channel in short to battery is not shutdown by
this condition. Other channels are not affected in case of short of one output pin.
The sensor interface of RSULx(x=0,1,2,3) also offers open condition (only in ON state) and
short to ground detection (only in OFF state). The channel in this condition is not shutdown.
If there is open circuit for RSUHx, it will be detected by open detection of corresponding
RSULx if the sensor is still connected to RSULx.
The short to ground detection is implemented with a pull-up current (IRSUL_PU) and a
voltage comparator (V
) on RSULx (x=0,1,2,3). Requirement is that external short to
STGTH
58/109DS12539 Rev 3
L9396Remote sensor interface
ground with a resistance ≤ 7 kΩ will be detected as short condition while a short with a
resistance ≥ 19 kΩ will not be detected. This kind of diagnostic is present only when channel
is in OFF state.
The current sense is carried out in the low side through RSULx(x=0,1,2,3). The sensor
interface implements either the detection of a leakage to battery or RSUHx condition, that
will possibly raise the sensor current level. The channel in this condition is not shutdown.
The device integrates one GPO driver operating in low-side mode. GPO driver can be used
in multiple ways, depending on application needs.
Default configuration uses the GPO output interface to map the internal RSUHx signal on
the GPOD0 pin. In this way, the decoded signal from the RSUHx sensor channel can be
output as voltage information on the GPO output, even without intervention of the
microcontroller. The following assignment matrix can be configured via SPI.
-RSUH0 RSUH1RSUH2 RSUH3GPOD0_RSU_SEL
GPOD0
GPO driver can also be configured to operate in ON-OFF mode or in PWM mode setting the
desired duty cycle and frequency (128
Table 43. Assignment matrix configured via SPI
√---00 (default)
-√--01
--√-10
---√11
Hz nominal) values through SPI register.
The default state of the driver is off. The driver can be activated via SPI.
The driver output structure is designed to stand -1V on its terminals and a +1V reverse
voltage across source and drain. The GPO driver is protected against short circuits and
thermal overload conditions. The driver is switched off if SSM_reset is asserted and the
driver automatically restarts when the fault is cleared.
The device also offers an open load diagnostics while in ON state.
The device comes with a set of analog and digital design implementations:
Double independent voltage reference;
Oscillator clock monitoring;
Battery monitoring;
ECU supply voltage monitoring;
Internal (more than 30 channels) and external (up to 7 channels) analog voltage
measurements;
Double watchdog control;
Pump motor driver diagnostics;
Reset output pin;
Fault output pin;
Fail-safe configurable output pin;
Analog BIST on all analog voltage monitors;
Digital BIST;
Over temperature protection;
Temperature sensor
7.2 System monitoring and reset handling
7.2.1 Analog to Digital algorithmic converter
The device hosts an integrated 10-bit Analog to Digital converter, running at a clock
frequency of 16MHz. The ADC output is processed by a D to D converter with the following
functions:
Use of trimming bits to recover additional gain error due to resistor dividers mismatch;
Digital low-pass filtering;
Conversion from 12 to 10 bits.
10-bit data are filtered inside the digital section. The number of samples that are filtered vary
depending on the chosen conversion. The sample number can be configured by accessing
the ADC_CFG register. After low pass filter, the residual total error is +/-5 LSB. This error
figure applies to the case of a precise reference voltage: the spread of reference voltage
causes a proportional error in the conversion output.
The reference voltage of the ADC VREFH is set to 2.5 V and VREFL set to 0.1 V. Therefore
the voltage range is 2.4
The conversion time is comprised of several factors: the number of measurements loaded
into the queue, the number of samples taken for any measurement, and the various settling
times. An example of conversion time calculation for a full ADC request queue is reported in
Figure 10. The timings reported in Figure 10 are nominal ones, min/max values can be
obtained by considering the internal oscillator frequency variation reported in the DC
characteristics section.
V.
64/109DS12539 Rev 3
L9396System functional safety implementations
Pre -
ADC
T_SC IQ
REGISTER
UPDATED
IQ
IQ
IQ
IQ = Intra-Queue Settling Time = 0.5625 μs
T_ SC = Single Sample Conversion Time= 2.0625 μs
S = # of Samples (default = 4 for voltage only measurements)
Pre-AD C = Initial ADC Settling Time = 2.81 μs
T_SCT_SCT_SC
Nsum
GADG2301171629PS
Figure 10. ADC conversion time
All electrical characteristics are valid for the following conditions unless otherwise noted:
-40 °C ≤ Tj ≤ +175 °C; 6 ≤ VBST ≤ 19 V
SymbolParameterComments / ConditionsMinTypMaxUnit
Table 45. Analog to digital converter
V
ADC_RANGE
V
ADC_REF_H
ADC_RESADC resolution
-
-
ADC input voltage range -0.1-2.5V
ADC Reference voltage
(1)
Differential non linearity
error (DNL)
Integral non linearity error
(INL)
-Total error
-
-
1. LSB = (2.5 V / 1024) = 2.44 mV.
Internal BG reference
readout
Internal BG monitor
readout
7.2.2 Voltage measurement
The device includes a 10-bit ADC converter with high voltage multiplexer stage to report any
of the relevant internal voltage levels through SPI.
It further includes 3 discrete analog input pins AI2, AI3, AI4, 0.2V to 5V range, for external
generic measurements.
--3%2.5+3%V
Design Info-10-bit
--2-+2LSB
--3.5-+3.5LSB
Not including reference
voltage error
-5-+5LSB
-480492504LSB
-480492504LSB
All the channels are acquired cyclically after the SSM reset is released and the values are
available on the ADC CONV REG x registers. A digital programmable filter is implemented
in order to reduce the noise.
Setting the ADC CONFIG NSUM [2:0] bits in ADC_CFG register the filter will return the
average values calculated on N samples acquired for each channel to be converted. The
conversion time of the cycle depends on N following this table:
DS12539 Rev 365/109
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System functional safety implementationsL9396
Table 46. Conversion time
ADC CONFIG NSUMNCon. time (all channels)
“000”1 sample445 µs
“001”2 samples539 µs
“010”4 samples728 µs
“011”8 samples1106 µs
“100” to “111”16 samples1862 µs
Proper scaling is necessary for various voltage measurements. The divider ratios vary by
measurement and are summarized by function in the table below.
Table 47. Divider ratios vary by measurement are summarized by function
Divider ratio
Measurements
22:115:110:17:14:12:11:1
CP√------
VBST-√-----
GPOD0--√ ----
VB--√----
VB_SW--√----
VBM--√----
VDBATT--√----
VDS--√ ----
PDS--√ ----
IGN--√ ----
WDTDIS---√---
RSUH/L----√--
VPREREG----√--
VCC5----√--
VCC----√--
VCORE----√--
SCORE----√--
VDD----√--
VINTA----√--
AI[0..4]-----√-
Bandgap reference
(BGR/BGM)
------√
Temperature sensor------√
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L9396System functional safety implementations
Table 48. Voltage measurement electrical characteristics
SymbolParameterConditionsMinTypMaxUnits
Ratio_1Divider RatioGuaranteed by design-1-V/V
Ratio_2Divider RatioVinput_range_2 = 0.2 V … 5 V -0.8%20.8%V/V
Vinput_range_4a = 0.4 V … 10 V for
Ratio_4Divider Ratio
VCORE, SCORE;
Vinput_range_4b = 1.5 V … 10 V for
-3%43%V/V
the other
Ratio_7Divider RatioVinput_range_7 = 1.5 V … 17.5 V-3%73%V/V
Ratio_10Divider RatioVinput_range_10 = 2 V … 25 V-3%103%V/V
Ratio_15Divider RatioVinput_range_15 = 5
.5 V … 35 V-3%153%V/V
Ratio_22Divider RatioVinput_range_22 = 5.5 V … 51 V-3%223%V/V
offsetDivider OffsetHigh impedance-10-10mV
Rratio2Divider impedance Multiplexer input to GNDA200-800kΩ
Rratio4Divider impedance Multiplexer input to GNDA80-170kΩ
Rratio7Divider impedance Multiplexer input to GNDA120-300kΩ
Rratio10Divider impedance Multiplexer input to GNDA160-420kΩ
Rratio15Divider impedance Multiplexer input to GNDA200-630kΩ
Rratio22Divider impedance Multiplexer input to GNDA440-930kΩ
Multiplexer On-
I
leak_mux_on
state input
For all divider ratio except Ratio_1--60µA
leakage current
Note:For more information about L9396 ADC accuracy, please locate the "L9396 ADC
Conversion Error" calculator in the attachment section.
DS12539 Rev 367/109
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System functional safety implementationsL9396
GADG2401171129PS
GNDSUBx
GNDA
VCCx
VCORE pin
VINTD
VINTA
(Reference)
VBGR
(Monitor)
VBGM
Monitor
GNDA
Monitor
VCCx
Monitor
VCORE
Monitor
VINTD
Monitor
VINTA
VCCx_UV
VCCx_OV
VCORE_UV
VCORE_OV
VINTD_UV
VINTD_OV
VINTA_UV
VINTA_OV
Controlling all supplies
Reference for
VBG_READY
GNDA_ERR
VCCx_ERR
VCORE_ERR
VREG_ERR
7.2.3 Reset output
RESET output pin conveys the active low reset signal generated by the device in case of
over / under voltage conditions on the µC supply rails or when a watchdog error (either from
WD1 or WD2) is asserted.
It is implemented as an open drain output, therefore an external source can be connected to
this output. An external 5 kΩ typ pull-up is recommended to ensure the proper functionality.
RESET output is able to operate and force output low also in standby mode only if VBST
supply is present.
Figure 11. Reset input logic diagram
Three internal reset signals are generated by the device:
POR: Power On Reset - This reset is asserted when GNDD is open or a failure is
detected in the internal supplies or bandgap circuits. When active, all other resets are
asserted.
WSM_RESET: Watchdog State Machine Reset - This reset is generated when the POR
is active or when a failure is detected in the VCCx or VCORE supply.
SSM_RESET: System State Machine Reset - This reset is asserted when the POR or
the WSM_RESET are active, or when a failure is detected in either Watchdog state
machine.
The RESET pin is the active-low signal driven on the output pin, and is an inverted form of
SSM_RESET.
The cause of a RESET activation is latched and reported into the SUPPLY CONTROL
REGISTERS and cleared upon SPI reading.
The reset logic shall be controlled as shown in the diagram below:
The IC implements a clock frequency validation circuit. CLK ERR flag is the error signal
reporting a problem with the integrated oscillator source. If the frequency of the integrated
oscillator moves away from the desired one, the error flag is set. The check is performed by
comparing the main oscillator with a secondary one; in case the frequency of the main
oscillator shifts out of the specified range (in case of a stuck oscillator the CLOCK TIMEOUT
ERROR is activated), the secondary oscillator source will recognize it, asserting the CLK
ERROR flag.
The Clock monitor check is performed also comparing the second oscillator to the first one.
The CLK ERROR flag is asserted also in case the frequency of the second oscillator shifts
out of the specified range. To reduce the emissions of the main logic core and of the
switching circuits in general, spread spectrum is operating on the main oscillator: the central
16
MHz frequency is varied by a triangular modulation at 125 kHz. Spread spectrum is
always active and can be disabled setting the SPREAD SPECTRUM DISABLE MODE bit in
the POWER_ON register.
5 kΩ tied to VCC--0.4V
5 kΩ tied to VCC
RESET output off
0<RESET<VCC
VCC-
0.05
--V
-2-2µA
DS12539 Rev 369/109
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System functional safety implementationsL9396
6 V ≤ VBST ≤ 19 V; -40 °C ≤ Tj ≤ 175 °C unless otherwise noted.
SymbolParameterTest conditionMinTypMaxUnit
Table 50. Oscillator electrical characteristics
f
OSCINT
f
OSCINT_mod_freq
f
OSCINT_mod_id_min
f
OSCINT_mod_id_max
f
OSCINT2
Internal Oscillator main
frequency
Spread spectrum
modulation frequency
Spread spectrum minimum
modulation index
Spread spectrum maximum
modulation index
Internal second oscillator
frequency
7.3 Fault output
The device provides a digital push-pull output. In its default configuration, the output is
controlled low when the watchdogs are properly served and controlled high in case of
watchdog errors. The meaning of watchdog error for WD1 is different in interrupt mode
respect to warning lamp mode. In the first case it will be considered as a fault an event that
causes a WD COUNTER decrease, while in the second case, the fault considered is a WD1
reset (so the most critical fault for WD1). About WD2 error, all faults will be considered,
generating a reset.
-15.11616.9MHz
Guaranteed by
scan
--5--2%
-2-5%
-1.722.3MHz
-125- kHz
This output can be used as a pre-driver for a passive warning lamp using the proper SPI Bit.
With a proper SPI configuration, FAULT output pin can act as an interrupt signal to the µC in
case of:
status change on wake-up input (IGN),
over / under-voltage detections (see table below),
thermal warnings (see table below).
Feedbacks can be programmed as mask-able via SPI register ADV_CONFIG (see
Tab le 51).
In case of the above faulty conditions, with FAULT output configured in Interrupt mode, the
FAULT output is driven high for t
FAULT_ACT
in case of IGN status change and Watchdogs
errors, while it is driven high for other faults (OT and over/under voltage detections) until the
faults disappear and t
FAULT_ACT
expires.
In case of faulty conditions, with FAULT output configured as passive warning lamp driver,
the output is driven high until the faults disappear and the related flags are read.
FAULT output is enabled (exit of high impedance state) only at the end of power up cycle.
This happens only when undervoltage of regulators (VPREREG, VCC, VCC5, VCORE) is
no more present after power up.
70/109DS12539 Rev 3
L9396System functional safety implementations
After that FAULT stays enabled until power down by wake-up is triggered or undervoltage of
VPREREG is generated.
This device offers a 2-level watchdog control approach. The first control level is given by
means of a query & answer watchdog (WD1). The second control level controls the PRN
input pin to assert the proper frequency is delivered by the microcontroller (WD2).
DS12539 Rev 371/109
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SPI
Watchdog
Logic
Fault Counter
Logic
Register
Configuration
GADG2401171253PS
WD1_RESET
(WD_CNT)
T_Answ_TimeOut
T_start_REQ
T_Valid_Answ_Start
T_Valid_Answ_End
Request
Answer
T_Req _TimeOut
T_Answ_TimeOut
T_start_REQ
T_Valid_Answ_Start
T_Valid_Answ_End
Answer
...
GADG2401171309PS
7.4.1 Watchdog (WD1)
The device and the microcontroller exchange queries and answers on a defined timing
base. An internal watchdog logic is implemented to inhibit load actuation such as to send
reset signal, while it can disable directly these drivers through a second switch-off path:
1.Pump Motor Pre-Driver
2. GPO Driver
3. Fail Safe Pre Driver
4. VBAT Switch
Figure 13. WD1 block diagram
Two modes of timing checks are provided:
Mono-directional: timing check based only on answers. Microcontroller must send
queries (without timing window check) and answers on a defined time window;
Bidirectional: timings are bidirectionally checked. L9396 must receive queries on a
defined time window. Microcontroller must send answers on a defined time window.
In case time windows are not respected an error is generated.
T_start_REQMicro reads, through SPI register seed to be elaborated
T_Valid_Answ_StartStarting time interval for Valid answers
T_Valid_Answ_EndEnding time interval for Valid answers
T_Answ_TimeOutTime out for answer
T_start_ANSWMicro sends, through SPI register answer to the IC
T_Valid_Req_StartStarting time interval for next following request
T_Valid_Req_EndEnding time interval for next following request
T_Req_TimeOutTime out for request
Both the request and the answer must be sent on a predefined timing interval.
When the microcontroller finishes its boot procedures, it will send the first seed sending
request to the device. In this moment all the timing counters will start and never stop.
In order to detect a fast event, such as two consequent SPI frames, the time base is based
on the WD frequency of 250 kHz, which is obtained from the device clock period (16
MHz).
The obtained clock period WD_CLK is 4 µs. The clock used for the timing windows is a
divided version of that in order to obtain a timing resolution of WD_CLK equal to 64 µs or
256 µs depending on the WD_CLK_DIV settings.
When the microcontroller sends the request of a new seed to the device (T_start_REQ) the
WD_REQ_TMR timer starts to count. The microcontroller must send a valid answer inside
the timing interval defined by the two SPI programmable parameters T_Valid_Answ_Start
and T_Valid_Answ_End. In case the microcontroller sends an answer before
T_Valid_Answ_Start or after T_Valid_Answ_End an error will be generated.
In case the WD_TO_RST_EN is set:
If no answer will arrive before T_Answ_TimeOut has elapsed, a WD1_RESET will be
generated and the flag WD_RST_ TO_Answ will be set.
When the microcontroller sends the answer to the device (T_start_ANSW) the
WD_ANSW_TMR timer starts to count. Microcontroller must send a new seed request
inside the timing interval defined by the two SPI programmable parameters
T_Valid_Req_Start and T_Valid_Req_End. In case the Micro sends the request before
T_Valid_Req_Start or after T_Valid_Req_End an error will be generated. If no request will
DS12539 Rev 373/109
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System functional safety implementationsL9396
IDLE
WAIT
ANSWER
WAIT
REQ
IDLE
WAIT
ANSWER
WAIT
REQ
IDLE
WAIT
ANSWER
IDLE
WAIT
ANSWER
GADG2401171437PS
WD_REQ_CHECK_EN = 1
WD_TO_RST_EN = 1
WD_REQ_CHECK_EN = 1
WD_TO_RST_EN = 0
WD_REQ_CHECK_EN = 0
WD_TO_RST_EN = 1
WD_REQ_CHECK_EN = 0
WD_TO_RST_EN = 0
arrive before T_Req_TimeOut has elapsed, a WD1_RESET will be generated and the flag
WD_RST_TO_Req will be set.
In case the WD_TO_RST_EN is not set:
The error event counter, WD_CNT, will be decreased and the device starts to wait again for
the answer with the same timing procedure.
L9396 starts the WD evolution state machine in IDLE mode in which it is waiting for the first
seed request from microcontroller through SPI. In this way the starting period is completely
under the control of the microcontroller allowing to safely conclude boot procedure before
starting the WD seed request/answer mechanism. During this period WD configuration
registers can be programmed. The first seed request acts when a WD state machine start.
After this event the WD will never stop and WD configuration registers become read only
and cannot be changed. The only exception is about the T_Valid_Answ_Start and the
T_Valid_Req_Start. In case one of these parameters is changed, the timing window restarts
and WD_CNT will be decremented by a WD_cnt_bad_step number of steps.
WD_CNT is a 4-bit counter used to collect good and bad events provided by the
microcontroller.
A good event is a Request coming in the correct timing window if a Request is expected in
the FSM, or a correct Answer coming in the correct timing window when expected.
A bad event is a wrong Answer or an answer in a wrong timing window, a Request in a
wrong timing window (in bidirectional mode), a timeout event, a Request when an Answer is
expected or an Answer when a Read is expected.
Figure 16. Timing State evolution depending on WD_TO_RST_EN and
WD_REQ_CHECK_EN
Note:Also in mono-directional mode the FSM is waiting a Query after an Answer in order to send
a new seed to µC but in this configuration the Timing check on Queries is not performed and
WD_CNT is not decremented in case of request timing error except for Timeout.
74/109DS12539 Rev 3
L9396System functional safety implementations
WD_RST
Request = No Req
&&
t = T_Req_TimeOut
WD_CNT--
then WD_CNT++
Request = YES
&&
t < T_Valid_Req_Start
REQ 1
WAIT
Request = YES
&&
T_Valid_Req_Start < t < T_Valid_Req_End
WD_CNT--
Request = YES
&&
T_Valid_Req_End < t < T_Req_TimeOut
Request = No Req
&&
t = T_Valid_Req_End
Request = No Req
&&
t = T_Valid_Req_Start
REQ 3
WAIT
REQ 2
WAIT
1 Seed Request
st
ANSWER 1
WAIT
IDLE
WD_CNT--
Answer = YES
&&
T_Valid_Answ_End < t < T_Answ_TimeOut
WD_CNT--
Answer = YES
&&
t < T_Valid_Answ_Start
elseif (Answer==wrong) then WD_CNT--
If (Answer==correct) then WD_CNT++
Answer = YES
&&
T_Valid_Answ_Start < t < T_Valid_Answ_End
Answer = No Answer
&&
t = T_Valid_Answ_Start
WD_RST
Answer = No Answer
&&
t = T_Answ_TimeOut
Answer = No Answer
&&
t = T_Valid_Answ_End
ANSWER 2
WAIT
ANSWER 3
WAIT
GADG2401171444PS
Figure 17. WD1 state machine
Depending on the value of the WD_CNT counter the device will stop the drivers, will send
the WD1_RESET or will enable the drivers.
The WD_CNT will be incremented by a number of steps as defined through the SPI
configurable parameter WD_cnt_good_step each time a correct answer is given in the right
time interval or a Query arrives in the right time interval. In all the other cases, as defined in
the WD state machine, the WD_CNT will be decremented by a number of steps as defined
through the SPI configurable parameter WD_cnt_bad_step.
If WD_CNT reaches the value of zero two different behaviors are possible depending on the
value of WD_RST_EN. If WD_RST_EN is set to 1 then a WD_RST will be sent by the
device and the flag WD_RST_CNT will be set; else if WD_RST_EN is set to 0 then the
WD_RST will not be sent by the device but the flag WD_RST_CNT will be set.
Two different thresholds are defined (both programmable through SPI): WD_th_low and
WD_th_high.
If WD_CNT value is lower than WD_th_low, but greater than zero, the drivers are disabled
such as any WD_RST. If WD_CNT is greater than WD_TH_LOW and lower than
WD_TH_HIGH the load actuation is managed in hysteresis mode:
If drivers are ON it will be stopped only when WD_CNT becomes lower than WD_TH_LOW,
while if actuation was OFF it will be performed only when WD_CNT becomes equal to
WD_TH_HIGH and only when WD_CNT exceeds this threshold drivers are activated.
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0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
GADG2401171548PS
WD_RST = OFF
Driver = OFF
WD_RST = ON
Driver = OFF
WD_RST = OFF)
Driver = ON
(Previous state was:
WD_RST = OFF
Driver = ON
WD_RST = OFF
Driver = ON
WD_RST = OFF)
Driver = OFF
(Previous state was:
WD_RST = OFF
Driver = OFF
WD_th_low WD_th_high
In this way, activation of the drivers can be performed only if the watchdog has been started
and a certain number of good Request/Answer has been exchanged.
Figure 18. WD1_RESET & DRIVERS ENABLE versus WD_CNT value
All the status information is stored into the WD_Status_reg, readable through SPI. This
register will be cleaned as a consequence of each read operation. In case a WD1_RESET
is sent to the microcontroller, the device restarts the WD state machine in IDLE mode
waiting for the seed request from microcontroller through SPI. This is valid also in case
PRUN WD sends a reset to µC. WD configuration registers are preserved, but can be
modified by the microcontroller before the WD mechanism has started. In the same way,
also the status register, WD_Status_reg, is preserved and can be read through SPI.
Two cases of unexpected errors have been identified:
If a request of a new seed arrives to the device before the previous answer is received,
the device will serve the new request, sending the old seed decreasing the value of
WD_CNT by the amount WD_cnt_bad_step.
If an answer arrives to the device before a new request and after another answer, the
device will ignore this answer but it will decrease the value of WD_CNT by the amount
WD_cnt_bad_step.
Seeds are 8-bit long words generated by a 7-bit LSFR pseudo-random algorithm. A new
seed is sent into SPI word (WD_Seed) each time a new seed request (T_start_REQ) is sent
to the device (if the last answer was correct).
Seed is generated by the LSFR algorithm in Figure above. In particular the algorithm
generates a 7-bit length word, while the seed has 8 bits including a zero as MSB. In this way
the seeds are always positive. A new seed will be stored onto the WD_Seed only in case of
a correct answer received. In case of an error, the same seed will be available into the
WD_Seed until a correct answer will be received.
The answer is a 16-bit long word checked against a 16-bit word composed by two bytes,
Answer_Low and Answer_High, generated from the sent seed. Answer_Low is the logical
2's complement of the seed, while Answer_High is a replica of the seed being sent.
Current value of the Seed sent to the Micro to be used for the
Answer elaboration
Note:WD Seed and WD Answer will be into the same SPI register. When a Read operation will be
performed a new seed will be sent and the read will be treated as a new Seed request.
When an Answer write will not be treated as a new Seed request and the seed related to
that answer will be sent back.
Note:WD Seed and WD Answer will be onto the same SPI register. When a Read operation will
be performed a new seed will be sent and the read will be treated as a new Seed request.
When an Answer write will not be treated as a new Seed request and the seed related to
that answer will be sent back.
Start of the timing window inside which answers must be
T_Valid_Answ_Start80xFF
received. Absolute value.
Time = T_Valid_Answ_Start * WD_clk
End of the timing window inside which answers must be
received. The value specified is an incremental time starting
T_Valid_Answ_End_Delta60x30
from T_Valid_Answ_Start.
Time = (T_Valid_Answ_Start + T_Valid_Answ_End_Delta) *
WD_clk
End of the period for answers acceptance. Once reached, the
WD1_RESET signal will be sent independently of the Error
status (WD_CNT). The value specified is an incremental time
T_Answ_TimeOut_Delta60x00
starting from T_Valid_Answ_Start and
T_Valid_Answ_End_Delta.
Time = (T_Valid_Answ_Start + T_Valid_Answ_End_Delta +
T_Answ_TimeOut_Delta) * WD_clk
SPI parameters are programmable only before the WD mechanism starts. After the first
seed request, these parameters can be only read.
A WD1_RESET event does not clear programmed parameters; default values are applied
only as a consequence of a WSM RESET.
0: WD_RST signal not sent
1: WD_RST signal sent in case of failure
Enable for the Request timing checking.
WD_REQ_CHECK_EN10
0: Request timing check not performed
1: Request timing check performed
Enable for the RST after Timeout generation.
WD_TO_RST_EN10
0: RST not generated after a TO event
1: RST generated after a TO event
Frequency Clock division setup.
WD_CLK_DIV10
0: clock not divided (64 µs)
1: clock divided by (256 µs)
WD_Th_Low47
WD_Th_High415
WD_cnt_good_step31
WD_cnt_bad_step33
SPI parameters are programmable only before the WD mechanism starts. After the first
seed request, these parameters can be only read.
A WD1_RESET event does not clear programmed parameters; default values are applied
only as a consequence of a WSM_RESET.
Threshold level to inhibit the drivers. If WD_CNT is lower than
the threshold no drivers are activated.
WD_Th_Low must be lower than WD_Th_High and minimum 1.
Threshold level to start the actuation. If WD_CNT is lower than
the threshold actuation will be performed depending on the
previous state as shown in Figure 18.
WD_Th_High must be higher than WD_Th_Low.
Number of incremental steps for WD_CNT as consequence of
a good event
Number of incremental steps for WD_CNT as consequence of
an error
Flag set if the last answer has been sent too early related to
WD_Early_Answ10
the programmed timing parameters.
0: Ok
1: Answer sent before T_Valid_Answ_Start time
Flag set if the last answer has been sent too late related to the
WD_Late_Answ10
programmed timing parameters.
0: Ok
1: Answer sent after T_Valid_Answ_End time
Flag set if the last answer has been sent inside the right timing
window (between T_Valid_Answ_Start and T_Valid_Answ_End
WD_Bad_Answ10
time) but it isn’t the expected answer.
0: Ok
1: Wrong answer
WD_Early_Req10
WD_Late_Req10
WD_RST_ TO_Answ10
WD_RST_ TO_Req10
Flag set if the last request has been sent too early related to
the programmed timing parameters.
0: Ok
1: Request sent before T_Valid_Req_Start time
Flag set if the last request has been sent too late related to the
programmed timing parameters.
0: Ok
1: Request sent after T_Valid_Req_End time
Flag set if the WD1_RESET signal has been sent because
Answer time out elapsed.
0: Ok
1: WD1_RESET because T_Answ_Timeout elapsed
Flag set if the WD1_RESET signal has been sent because
Request time out elapsed.
0: Ok
1: WD1_RESET because T_Req_Timeout elapsed
82/109DS12539 Rev 3
L9396System functional safety implementations
GADG2501170928PS
RESET
PRN
TRH
TRL
To ff
VSTN
SPI parameter
WD_RST_ Cnt10
WD_RST_Event_Value40Current value of the WD_RST event already sent
Size
(bits)
defaultDescription
Flag set if the WD1_RESET signal has been sent because
error counter reached zero.
0: Ok
1: WD1_RESET because WD_CNT reached the value of zero
Except the WD_Cnt_Value and WD_RST_Event_Value fields, this register is automatically
cleared once read.
A WD1_RESET event does not clear programmed parameters; default values are applied
only as a consequence of a WSM_RESET.
7.4.2 Second Watchdog (WD2)
When PRN signal input via PRN pin is not in the range of certain frequency, RESET is
asserted. The watchdog logic detects the only rising edge of PRN signal on PRN pin.
When RESET is deasserted (or at WDTDIS deasserting) the WD2 is in IDLE state for at
least TWAIT in order to wait the Microcontroller's logic bist end; after TWAIT the WD2 works
normally.
When PRN signal stops for at least Toff, RESET pin generates low signal for a time equal to
TRL (equal to Ton_RESET). This signal returns to high after TRL and for a time defined as
TRH. If PRN signal is still not a proper one, the RESET signal returns low for TRL and then
back high, repeating the above sequence.
Figure 22. WD2 timing diagram
PRN frequency error is detected if the frequency is higher than 1 kHz and is not detected if
the frequency is lower than 750
edges is less than 1
ms, watchdog detects PRN over frequency and does not clear WDT
counter. If this condition continues during t
Hz. In other words, when the interval between PRN rising
, RESET pin drives low.
off
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System functional safety implementationsL9396
RESET
Note: In case that PRN frequency is higher than 1 kHz WDT counter is not cleared.
PRN
RESETRESET
tOFF
To ff
TRL
To ffTo f f
Pulse
Width
Counter
WDT
Counter
1ms (=1kHz)
GADG2501171008PS
Table 54. WD2 characteristics
SymbolParameterTest conditionMinTypMaxUnit
ADV_CONFIG[14,13] = '00'
-750
91
ADV_CONFIG[14,13] = '01'-1500
FWD
WD2 Frequency valid range
valid
ADV_CONFIG[14,13] = '10'
-750
Hz
46
ADV_CONFIG[14,13] = '11'-1500
ADV_CONFIG[14] = '0'11-16.5
T
WD2 timeout reset time
off
ADV_CONFIG[14] = '1'22-33
ms
RESET re-engagement time
TRH
between two consecutive
200--ms
assertion events
TWAIT
WD2 quiescent time at
power-up
200--ms
Figure 23. WD2 diagram
7.4.3 Watchdog Timer Disable Input (WDTDIS)
When controlled to a voltage higher than VIH_WDTDIS, this pin is used to disable the WD2
timer. It implements a passive pulldown to ensure the voltage level would not interrupt the
WD control in case of open connection. The state of this pin can be read by SPI because it
is acquired by an internal A2D converter. When WDTDIS pin is asserted, the watchdog
timer is disabled, the timer is reset to its starting value and no faults are generated. When
the watchdog timer is disabled, WD_2_RESET_FLAG bit is set to '0'.
L9396 provides the active low FSN output to let the system know the device enters the fail
safe state. It means that the device has left its functional operating range due to:
weak supply conditions or supply over/under voltage detections (see the table below
for the signals monitored),
thermal shutdown (see the table below),
wrong SPI communications or wrong watchdog operation.
During fail-safe conditions, corresponding failure bits are set until the faults disappear and
the flags are read. When the device enters a fail-safe condition, it remains in this state until
both the following criteria are met:
the failure condition disappears,
the microcontroller performs a SPI reading on the failure bit(s).
The FSN output is intended to control functional safety logic through a redundant path
(since the µC is not operational anymore) for up to ASIL-D applications.
The functional safety path is intended to control the applications loads in order to either
maintain the functionality in a degraded mode or deactivate the loads. It is fault tolerant
(programmed from 1 to 8 failures before activation) and has a programmable delay; all this
can be programmed via SPI interface. To exit the fail-safe mode a specific SPI access on
the original failure(s) has to be performed when the application recovers in order to clear the
flags and fail safe fault tolerant counter.
FSN output is enabled (can be driven low) only at the end of power up cycle. This happens
only when undervoltage of regulators (VPREREG, VCC, VCC5, VCORE) is no more present
after power up.
After that FSN stays enabled until power down by wake-up is triggered or undervoltage of
VPREREG is generated.
Here the table of masking bits and fault sources.
-
WD Q/A ERR
WD PRUN ERR
Table 56. Masking bits and fault sources
FAILSAFE / FAULT
OUTPUT
WD1 and WD2
FAULT M ASK
MASKEDFAILSAFE FAULTFAILSAFE FAULTFAILSAFE FAULT
MASKEDFAILSAFE FAULTFAILSAFE FAULTFAILSAFE FAULT
FAILSAFE / FAULT
OUTPUT
THERMAL WARNING
MASK
FAILSAFE / FAULT
OUTPUT
µC VOLTAGE FAULT
MASK
FAILSAFE / FAULT
OUTPUT
BOOST FAULT
MASK
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Table 56. Masking bits and fault sources (continued)
The device provides an internal analog temperature sensor. The sensor is aimed at having a
reference for the average junction temperature on silicon surface. The sensor is placed far
away from power dissipating stages and drivers. The output of the temperature sensor is
available via SPI through ADC conversion. The formula to calculate temperature from ADC
reading is the following one:
Device is equipped with 9 independent thermal protection circuits placed close to circuits
that can experience over temperature in fault condition.
These circuits are: 4 remote sensor interfaces (WSS), GPO driver, one shared between
VCC and VCC5, VPREREG, Charge Pump, Boost.
The effect of thermal protections and how to manage this kind of fault is described in the
paragraphs related to those blocks.
7.8 Bist
7.8.1 Logic Bist
In order to test the correct operation of the main safety relevant digital blocks, a logic bist is
implemented.
The logic bist check can be controlled via SPI using the register BIST_CTRL.
The digital blocks checked are:
1.Wheel Speed Sensor Logic
2. Driver Controllers Logic
a) BATTERY SWITCH
b) PUMP MOTOR PRE DRIVER
c) GPO
d) FAIL SAFE PRE DRIVER
3. ADC Controller Logic
If Logic BIST runs the logic under test and the SPI registers related to these digital blocks
are not available and reset to its default values at Logic Bist Exit.
Microcontroller can activate Logic bist setting the bit LOGIC BIST RUN = 1 in the register
BIST_CTRL. After that, the Logic Under Test is in BIST mode: the sequential cells are
DS12539 Rev 387/109
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System functional safety implementationsL9396
reconfigured as scan chains in order to be tested by an internal bist controller. Once µC sets
LOGIC BIST RUN =1 it can perform a polling on BIST_CTRL register (bit 1:0) in order to
read the status of Logic Bist Test.
"01" means BIST RUNNING
"10" BIST PASSED
"11" BIST FAILED
"00" BIST STOPPED
If BIST STATUS is "10" (or "11") the Logic Bist test is finished and passed (or failed).
Microcontroller can write LOGIC BIST RUN = 0 to exit from BIST mode at Logic Bist end
(PASSED or FAILED) but also during the test (BIST RUNNING).
Once LOGIC BIST RUN is set from 1 to 0 the logic under test and SPI registers are reset to
the default condition.
The IC does not take actions if the Logic Bist Test fails. The decision to enable/disable the
Duration of digital BISTDesign Information4.85.155.5ms
7.8.2 Analog Bist
Analog BIST is performed periodically during normal operation on the overvoltage and
undervoltage monitors of VDD, VINTA, VBST, VPREREG, VCORE, VCOREFDBK, VCC,
VCC5 and Tracking regulators and open of GNDD. In case of ABIST fail, the failing
comparator reports overvoltage or undervoltage or POR is asserted in case of GNDD open.
7.8.3 OTP check
In each power up cycle (POR transition from low to high) the content of internal OTP is
checked. Parity bits have been implemented to monitor the change of state of the trimming
bits. In case check is not completed or not passed a dedicated fault bit is set (OTP_STABLE
bit of ADV_CONFIG register).
88/109DS12539 Rev 3
L9396Serial Peripheral Communication
8 Serial Peripheral Communication
The SPI interface is used to configure the device, control the output and read the diagnostic
and output status registers.
The SPI protocol is defined by frames of 32 bits with 3 bits of CRC (Cyclic Redundancy
Check) both in input and output directions.
Every time the device sets a Clear on Read bit in one of the SPI registers (for example when
an error is detected), such a bit will not be cleared until the corresponding register is read
via SPI. The bit will not be reset if an SPI error occurs during the access to the register by
the microcontroller or while L9396 sends the content of the register as an answer.
8.1 CRC Field Details
SPI frame (upstream/downstream) include a 3-bit CRC field. CRC field is evaluated
/checked by using a three-degree poly G3(x) = x3+x+1 and covers the bits 0:28 in the SPI
frame.
CRC flops are initialized to 0 at the beginning of the SPI frame.
8.2 SPI frame
Bit 0 to 15Bit 16 to 31
SDI
Frame 0Frame 1
SDO
Frame 0Frame 1
SDI
FRAME 0
01 234567 8 9101112131415
W/R ADD0DATA[19..13]
FRAME 1
16171819202122232425262728293031
DATA[12..0]CRC[2..0]
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Serial Peripheral CommunicationL9396
GADG2501171231PS
0123 45678 90123456789
0
MISO
MOSI
ERR
FRAME
SHORT
W/Rn
ERR
FRAME
LONG
ERR
CRC
ADD
ERROR
TIMEOUT
CLOCK
FLAG
ERROR
CLOCK
FLAG
ERROR
CLOCK
FLAG
WSM RESET
FLAG
RESET
SSM
10 11 12 13 14 15
DATA
DATA [19 : 0]
CRC
[2 :0]
CRC
10 11 12 13 14 15
CRC
[2 :0]
CRC
FRAME 0
FRAME 1
0 : Write/Read
1...7 : Address
8 : '0'
9...28 : Data
29...31: CRC
SDO
FRAME 0
01 234567 8 9101112131415
GSW[8..0]DATA[19..13]
FRAME 1
16171819202122232425262728293031
DATA[12..0]CRC[2..0]
0…8 : SPI error
9...28 : Data
29...31: CRC
The GSW[8..0] bits are mapped as in the following figure:
Figure 24. GSW[8..0] bits
0: Short Frame Error (less than 32 bits received in the last frame)
1: Long Frame Error (more than 32 bits received in the last frame)
2: CRC Error (wrong CRC received in the last frame)
3:4: '00'
5: Clock Timeout Error (Oscillator stuck, RO)
6: Clock Error Flag / CLOCKFRERR (1st or 2nd oscillator with a wrong frequency, R/C)
7: WSM Reset Flag (R/C)
8: SSM Reset Flag (R/C)
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L9396Serial Peripheral Communication
8.3 SPI registers
The register table is on 10 pages containing 16 registers each. Address 3 MSBs indicate
page selection, the remaining address 4 LSBs indicates the register.
Maximum word length of registers is 20 bits.
The bits colored in gray are called safe registers.
After the safe registers set has been written, the MCU sends a lock frame writing the lock
word h-AAAAA into the write-protection register (address b-1000010).
From now on, it's mandatory to write consecutively the unlock words h-55555 (first access)
and h-33333 (second access) into the write-protection register in order to write again the
safe registers set.
The write-protection register echo (SDO) reports the lock-state: h-AAAAA in case of lock or
h-55555 in case of unlock.
The write-protection register initial status is unlock.
The summary of the registers is defined in Tab le 60.