STMicroelectronics L6599AT, L6599ATD, L6599ATDTR User guide

L6599AT

Improved high-voltage resonant controller

Datasheet - production data

Applications

LCD and PDP TV

Desktop PC, entry-level server

Telecom SMPS

High efficiency industrial SMPS

SO16N

AC-DC adapter, open frame SMPS

Features

50% duty cycle, variable frequency control of resonant half bridge

High-accuracy oscillator

Up to 500 kHz operating frequency

Two-level OCP: frequency-shift and latched shutdown

Interface with PFC controller

Latched disable input

Burst mode operation at light load

Input for power-ON/OFF sequencing or brownout protection

Non-linear soft-start for monotonic output voltage rise

600 V-rail compatible high-side gate driver with integrated bootstrap diode and high dv/dt immunity

-300/700 mA high-side and low-side gate drivers with UVLO pull-down

Guaranteed for extreme temperature ranges

Table 1. Device summary

Order code

Package

Packaging

 

 

 

L6599ATD

SO16N

Tube

 

 

L6599ATDTR

Tape and reel

 

 

 

 

March 2013

DocID15534 Rev 4

1/31

This is information on a product in full production.

www.st.com

Contents

L6599AT

 

 

Contents

1

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. 3

2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4

3

Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5

4

Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8

 

4.1

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8

 

4.2

Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8

5

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9

6

Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12

6.1 Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.2 Operation at no load or very light load . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.3 Soft-start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.4 Current sense, OCP and OLP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.5 Latched shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6.6 Line sensing function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6.7 Bootstrap section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

7

Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

28

8

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

30

2/31

DocID15534 Rev 4

L6599AT

Description

 

 

1 Description

The L6599AT is an improved revision of the previous L6599A. It is a double-ended controller specific to series-resonant half bridge topology. It provides 50% complementary duty cycle: the high-side switch and the low-side switch are driven ON/OFF 180° out-of-phase for exactly the same time. Output voltage regulation is obtained by modulating the operating frequency. A fixed deadtime inserted between the turn-off of one switch and the turn-on of the other guarantees soft-switching and enables high-frequency operation.

To drive the high-side switch with the bootstrap approach, the IC incorporates a high-voltage floating structure able to withstand more than 600 V with a synchronous-driven high-voltage DMOS that replaces the external fast-recovery bootstrap diode.

The IC enables the designer to set the operating frequency range of the converter by means of an externally programmable oscillator.

At startup, to prevent uncontrolled inrush current, the switching frequency starts from a programmable maximum value and progressively decays until it reaches the steady-state value determined by the control loop. This frequency shift is non-linear to minimize output voltage overshoots; its duration is programmable as well.

At light load the IC may enter a controlled burst mode operation that keeps the converter input consumption to a minimum.

IC functions include a not-latched active-low disable input with current hysteresis useful for power sequencing or for brownout protection, a current sense input for OCP with frequency shift and delayed shutdown with automatic restart. A higher level OCP latches off the IC if the first-level protection is not sufficient to control the primary current. Their combination offers complete protection against overload and short-circuits. An additional latched disable input (DIS) allows easy implementation of OTP and/or OVP.

An interface with the PFC controller is provided that enables the pre-regulator to be switched off during fault conditions, such as OCP shutdown and DIS high, or during burst mode operation.

DocID15534 Rev 4

3/31

STMicroelectronics L6599AT, L6599ATD, L6599ATDTR User guide
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L6599AT

Pin connection

 

 

3 Pin connection

Figure 2. Pin connection (top view)

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Table 2. Pin description

Pin N#

Type

Function

 

 

 

 

 

Soft-start. This pin connects an external capacitor to GND and a resistor to

 

 

RFmin (pin 4) that set both the maximum oscillator frequency and the time

 

 

constant for the frequency shift that occurs as the chip starts up (soft-start).

1

Css

An internal switch discharges this capacitor every time the chip turns off

 

 

(Vcc < UVLO, LINE < 1.24 V or > 6 V, DIS > 1.85 V, ISEN > 1.5 V, DELAY

 

 

> 2 V) to make sure it is soft-started next, and when the voltage on the

 

 

current sense pin (ISEN) exceeds 0.8 V, as long as it stays above 0.75 V.

 

 

 

 

 

Delayed shutdown upon overcurrent. A capacitor and a resistor are

 

 

connected from this pin to GND to set the maximum duration of an

 

 

overcurrent condition before the IC stops switching and the delay after

 

 

which the IC restarts switching. Every time the voltage on the ISEN pin

 

 

exceeds 0.8 V, the capacitor is charged by an internal 150 µA current

2

DELAY

generator and is slowly discharged by the external resistor. If the voltage

on the pin reaches 2 V, the soft-start capacitor is completely discharged so

 

 

that the switching frequency is pushed to its maximum value and the 150

 

 

µA is kept always on. As the voltage on the pin exceeds 3.5 V the IC stops

 

 

switching and the internal generator is turned off, so that the voltage on the

 

 

pin decays because of the external resistor. The IC is soft-restarted as the

 

 

voltage drops below 0.3 V. In this way, under short-circuit conditions, the

 

 

converter works intermittently with very low input average power.

 

 

 

 

 

Timing capacitor. A capacitor connected from this pin to GND is charged

3

CF

and discharged by internal current generators programmed by the external

network connected to pin 4 (RFmin) and determines the switching

 

 

 

 

frequency of the converter.

 

 

 

 

 

Minimum oscillator frequency setting. This pin provides a precise 2 V

 

 

reference and a resistor connected from this pin to GND defines a current

 

 

that is used to set the minimum oscillator frequency. To close the feedback

4

RFmin

loop that regulates the converter output voltage by modulating the

oscillator frequency, the phototransistor of an optocoupler is connected to

 

 

 

 

this pin through a resistor. The value of this resistor sets the maximum

 

 

operating frequency. An R-C series connected from this pin to GND sets

 

 

frequency shift at startup to prevent excessive energy inrush (soft-start).

 

 

 

DocID15534 Rev 4

5/31

Pin connection

 

L6599AT

 

 

 

 

 

 

 

Table 2. Pin description (continued)

 

Pin N#

Type

Function

 

 

 

 

 

 

 

Burst mode operation threshold. The pin senses some voltage related to

 

 

 

the feedback control, which is compared to an internal reference (1.24 V).

 

 

 

If the voltage on the pin is lower than the reference, the IC enters an idle

 

 

 

state and its quiescent current is reduced. The chip restarts switching as

 

5

STBY

the voltage exceeds the reference by 50 mV. Soft-start is not invoked. This

 

 

 

function realizes burst mode operation when the load falls below a level

 

 

 

that can be programmed by properly choosing the resistor connecting the

 

 

 

optocoupler to pin RFmin (see block diagram). Tie the pin to RFmin if burst

 

 

 

mode is not used.

 

 

 

 

 

 

 

Current sense input. The pin senses the primary current though a sense

 

 

 

resistor or a capacitive divider for lossless sensing. This input is not

 

 

 

intended for a cycle-by-cycle control; therefore the voltage signal must be

 

 

 

filtered to get average current information. As the voltage exceeds a 0.8 V

 

 

 

threshold (with 50 mV hysteresis), the soft-start capacitor connected to pin

 

 

 

1 is internally discharged: the frequency increases, so limiting the power

 

6

ISEN

throughput. Under output short-circuit, this normally results in a nearly

 

constant peak primary current. This condition is allowed for a maximum

 

 

 

time set at pin 2. If the current keeps on building up despite this frequency

 

 

 

increase, a second comparator referenced at 1.5 V latches the device off

 

 

 

and brings its consumption almost to a “before startup” level. The

 

 

 

information is latched and it is necessary to recycle the supply voltage of

 

 

 

the IC to enable it to restart: the latch is removed as the voltage on the Vcc

 

 

 

pin goes below the UVLO threshold. Tie the pin to GND if the function is

 

 

 

not used.

 

 

 

 

 

 

 

Line sensing input. The pin is to be connected to the high-voltage input bus

 

 

 

with a resistor divider to perform either AC or DC (in systems with PFC)

 

 

 

brownout protection. A voltage below 1.24 V shuts down (not latched) the

 

 

 

IC, lowers its consumption and discharges the soft-start capacitor. IC

 

7

LINE

operation is re-enabled (soft-started) as the voltage exceeds 1.24 V. The

 

comparator is provided with current hysteresis: an internal 13 µA current

 

 

 

generator is ON as long as the voltage applied at the pin is below 1.24 V

 

 

 

and is OFF if this value is exceeded. Bypass the pin with a capacitor to

 

 

 

GND to reduce noise pick-up. The voltage on the pin is top-limited by an

 

 

 

internal Zener. Activating the Zener causes the IC to shut down (not

 

 

 

latched). Bias the pin between 1.24 and 6 V if the function is not used.

 

 

 

 

 

 

 

Latched device shutdown. Internally, the pin connects a comparator that,

 

 

 

when the voltage on the pin exceeds 1.85 V, shuts the IC down and brings

 

8

DIS

its consumption almost to a “before startup” level. The information is

 

latched and it is necessary to recycle the supply voltage of the IC to enable

 

 

 

 

 

 

it to restart: the latch is removed as the voltage on the VCC pin goes below

 

 

 

the UVLO threshold. Tie the pin to GND if the function is not used.

 

 

 

 

 

 

 

Open-drain ON/OFF control of PFC controller. This pin, normally open, is

 

 

 

intended for stopping the PFC controller, for protection purposes or during

 

 

 

burst mode operation. It goes low when the IC is shut down by DIS>1.85 V,

 

9

PFC_STOP

ISEN > 1.5 V, LINE > 6 V and STBY < 1.24 V. The pin is pulled low also

 

 

 

when the voltage on the DELAY exceeds 2 V and goes back open as the

 

 

 

voltage falls below 0.3 V. During UVLO, it is open. Leave the pin

 

 

 

unconnected if not used.

 

 

 

 

6/31

DocID15534 Rev 4

L6599AT

 

Pin connection

 

 

 

 

 

 

 

Table 2. Pin description (continued)

 

Pin N#

Type

Function

 

 

 

 

 

 

 

Chip ground. Current return for both the low-side gate-drive current and

 

10

GND

the bias current of the IC. All of the ground connections of the bias

 

components should be tied to a track going to this pin and kept separate

 

 

 

 

 

 

from any pulsed current return.

 

 

 

 

 

 

 

Low-side gate-drive output. The driver is capable of 0.3 A min. source and

 

11

LVG

0.7 A min. sink peak current to drive the lower MOSFET of the half bridge

 

 

 

leg. The pin is actively pulled to GND during UVLO.

 

 

 

 

 

 

 

Supply voltage of both the signal part of the IC and the low-side gate

 

12

Vcc

driver. Sometimes a small bypass capacitor (0.1 µF typ.) to GND may be

 

 

 

useful to get a clean bias voltage for the signal part of the IC.

 

 

 

 

 

 

 

High-voltage spacer. The pin is not internally connected to isolate the high-

 

13

N.C.

voltage pin and ease compliance with safety regulations (creepage

 

 

 

distance) on the PCB.

 

 

 

 

 

 

 

High-side gate-drive floating ground. Current return for the high-side gate-

 

14

OUT

drive current. Layout carefully the connection of this pin to avoid too large

 

 

 

spikes below ground.

 

 

 

 

 

 

 

High-side floating gate-drive output. The driver is capable of 0.3 A min.

 

15

HVG

source and 0.7 A min. sink peak current to drive the upper MOSFET of the

 

half bridge leg. A resistor internally connected to pin 14 (OUT) ensures

 

 

 

 

 

 

that the pin is not floating during UVLO.

 

 

 

 

 

 

 

High-side gate-drive floating supply voltage. The bootstrap capacitor

 

16

VBOOT

connected between this pin and pin 14 (OUT) is fed by an internal

 

synchronous bootstrap diode driven in-phase with the low-side gate drive.

 

 

 

 

 

 

This patented structure replaces the normally used external diode.

 

 

 

 

DocID15534 Rev 4

7/31

Electrical data

L6599AT

 

 

4 Electrical data

4.1Absolute maximum ratings

Table 3. Absolute maximum rating

 

Symbol

Pin

Parameter

Value

Unit

 

 

 

 

 

 

 

VBOOT

16

Floating supply voltage

-1 to 618

V

 

HVG

15

HVG voltage

VOUT -0.3 to VBOOT +0.3

V

 

 

 

 

-3 up to a value included

 

 

VOUT

14

Floating ground voltage

in the range VBOOT -18

V

 

 

 

 

and VBOOT

 

 

dVOUT /dt

14

Floating ground max. slew rate

50

V/ns

 

Vcc

12

IC supply voltage (Icc = 25 mA)

Self-limited

V

 

 

 

 

 

 

 

LVG

11

LVG voltage

-0.3 to VCC +0.3

V

 

VPFC_STOP

9

Maximum voltage (pin open)

-0.3 to Vcc

V

 

IPFC_STOP

9

Maximum sink current (pin low)

Self-limited

A

 

VLINEmax

7

Maximum pin voltage (Ipin 1 mA)

Self-limited

V

 

IRFmin

4

Maximum source current

2

mA

 

---

1 to 6, 8

Analog inputs and outputs

-0.3 to 5

V

 

 

 

 

 

 

 

Ptot

 

Power dissipation @TA = 70 °C (DIP16)

1

W

 

 

 

Power dissipation @TA = 50 °C (SO16)

0.83

 

 

Tj

 

Junction temperature operating range

-40 to 150

°C

 

 

 

 

 

 

 

Tstg

 

Storage temperature

-55 to 150

°C

 

 

 

 

 

 

Note:

ESD immunity for pins 14, 15 and 16 is guaranteed up to 900 V.

 

4.2

Thermal data

 

 

 

 

Table 4. Thermal data

 

 

 

Symbol

Parameter

Value

Unit

 

 

 

 

 

 

Rth(JA)

Max. thermal resistance junction-to-ambient (SO16)

120

°C/W

8/31

DocID15534 Rev 4

L6599AT

Electrical characteristics

 

 

5 Electrical characteristics

TJ = - 40 to 125 °C, Vcc = 15 V, VBOOT = 15 V, CHVG = CLVG = 1 nF; CF = 470 pF; RRFmin = 12 kΩ; unless otherwise specified.

Table 5. Electrical characteristics

Symbol

Parameter

Test condition

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

 

IC supply voltage

 

 

 

 

 

 

 

 

 

 

 

 

Vcc

Operating range

After device turn-on

8.85

 

16

V

 

 

 

 

 

 

 

VccOn

Turn-on threshold

Voltage rising

10

10.7

11.4

V

VccOff

Turn-off threshold

Voltage falling

7.45

8.15

8.85

V

Hys

Hysteresis

 

 

2.55

 

V

 

 

 

 

 

 

 

VZ

Vcc clamp voltage

Iclamp = 15 mA

16

17

17.9

V

Supply current

 

 

 

 

 

 

 

 

 

 

 

 

Istart-up

Startup current

Before device turn-on

 

200

250

µA

Vcc = VccOn- 0.2 V

 

 

 

 

 

 

 

Iq

Quiescent current

Device on, VSTBY = 1 V

 

1.5

2

mA

Iop

Operating current

Device on, VSTBY = VRFmin

 

3.5

5

mA

Iq

Residual consumption

VDIS > 1.85 V or

 

300

400

µA

VDELAY > 3.5 V or VLINE <

 

 

 

1.24 V or VLINE = Vclamp

 

 

 

 

High-side floating gate-drive supply

 

 

 

 

 

 

 

 

 

 

 

 

ILKBOOT

VBOOT pin leakage current

VBOOT = 580 V

 

 

5

µA

ILKOUT

OUT pin leakage current

VOUT = 562 V

 

 

5

µA

RDS(on)

Synchronous bootstrap

VLVG = HIGH

 

150

 

Ω

diode on-resistance

 

 

Overcurrent comparator

 

 

 

 

 

 

 

 

 

 

 

 

IISEN

Input bias current

VISEN = 0 to VISENdis

 

 

-1

µA

tLEB

Leading edge blanking

After VHVG and VLVG low-

 

250

 

ns

to-high transition

 

 

V

Frequency shift threshold

Voltage rising (1)

0.76

0.8

0.84

V

ISENx

 

 

 

 

 

 

 

Hysteresis

Voltage falling

 

50

 

mV

 

 

 

 

 

 

 

VISENdis

Latch-off threshold

Voltage rising (1)

1.44

1.5

1.56

V

td(H-L)

Delay to output

 

 

300

400

ns

Line sensing

 

 

 

 

 

 

 

 

 

 

 

 

Vth

Threshold voltage

Voltage rising or falling (1)

1.2

1.24

1.28

V

IHys

Current hysteresis

VLINE = 1.1 V

10

13

16

µA

DocID15534 Rev 4

9/31

Electrical characteristics

 

 

 

 

 

L6599AT

 

 

 

 

 

 

 

 

 

 

 

Table 5. Electrical characteristics (continued)

 

 

 

 

Symbol

Parameter

 

Test condition

Min.

 

Typ.

Max.

Unit

 

 

 

 

 

 

 

 

 

 

Vclamp

Clamp level

ILINE = 1 mA

6

 

 

8

V

 

Symbol

Parameter

 

Test condition

Min.

 

Typ.

Max.

Unit

 

 

 

 

 

 

 

 

 

 

 

DIS function

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IDIS

Input bias current

VDIS = 0 to Vth

 

 

 

-1

µA

 

Vth

Disable threshold

Voltage rising (1)

1.78

 

1.85

1.92

V

 

Oscillator

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

D

Output duty cycle

Both HVG and LVG

48

 

50

52

%

 

 

 

 

 

 

 

 

 

 

 

fosc

Oscillation frequency

 

 

58.2

 

60

61.8

kHz

 

 

 

 

 

 

 

 

RRFmin = 2.7 kΩ

240

 

250

260

 

 

 

 

 

 

TD

Deadtime

Between HVG and LVG

0.2

 

0.3

0.4

µs

 

VCFp

Peak value

 

 

 

 

3.9

 

V

 

VCFv

Valley value

 

 

 

 

0.9

 

V

 

VREF

Voltage reference at pin 4

(1)

 

1.93

 

2

2.07

V

 

 

 

 

 

 

 

 

I

= -2 mA (1)

1.8

 

2

2.2

 

 

 

REF

 

 

 

 

 

 

 

KM

Current mirroring ratio

 

 

 

 

1

 

A/A

 

PFC_STOP function

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ileak

High level leakage current

VPFC_STOP = Vcc,

 

 

 

1

µA

 

VDIS = 0 V

 

 

 

 

 

 

 

 

 

 

 

 

RPFC_STOP

ON-state resistance

IPFC_STOP = 1 mA,

 

 

130

200

Ω

 

VDIS = 1.5 V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VL

Low saturation level

IPFC_STOP = 1 mA,

 

 

 

0.2

V

 

VDIS = 1.5 V

 

 

 

 

 

 

 

 

 

 

 

 

Soft-start function

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ileak

Open-state current

V(Css) = 2 V

 

 

 

0.5

µA

 

R

Discharge resistance

VISEN > VISENx

 

 

120

 

Ω

 

Standby function

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IDIS

Input bias current

VDIS = 0 to Vth

 

 

 

-1

µA

 

Vth

Disable threshold

Voltage falling (1)

1.2

 

1.24

1.28

V

 

Hys

Hysteresis

Voltage rising

 

 

50

 

mV

 

 

 

 

 

 

 

 

 

 

 

Delayed shutdown function

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ileak

Open-state current

V(DELAY) = 0

 

 

 

0.5

µA

 

ICHARGE

Charge current

VDELAY = 1 V,

100

 

150

200

µA

 

VISEN = 0.85 V

 

 

 

 

 

 

 

 

 

10/31

DocID15534 Rev 4

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