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ESDCAN03-2BM3Y
Product summary
Order code ESDCAN03-2BM3Y
ESDCAN03-2BM3Y
Automotive dual-line TVS in DFN for CAN bus
Features
• AEC-Q101 qualified
• Dual-line ESD and EOS protection
• Triggering voltage, V
• QFN-3L 1.1 x 1.0 x 0.55 package also called DFN1110
• Bidirectional device
• Max pulse power up to 3.3 A (8/20 μs)
• Low clamping factor VCL / V
• Low leakage current
• ECOPACK2 ROHS compliant component
Complies with the following standards
• UL94, V0
• J-STD-020 MSL level 1
• IPC7531 footprint and JEDEC registered package
• ISO 16750-2 (Jump start and reversed battery tests)
• ISO 10605 / IEC 61000-4-2- C = 150 pF, R = 330 Ω, exceeds level 4:
– ±15 kV (contact and air discharge)
• ISO 10605 - C = 330 pF, R = 2 kΩ:
– ±30 kV (contact and air discharge)
• ISO 10605 - C = 330 pF, R = 330 Ω:
– ±12 kV (contact and air discharge)
• ISO 7637-3:
– Pulse 3a: -150 V
– Pulse 3b: +150 V
– Pulse 2a: +/- 85 V
min = 28 V
TRIG
BR
Datasheet
Applications
Automotive controller area network where an electrostatic discharge or another
transient surge may damage the CAN transceiver or an integrated circuit (IC)
featuring a CAN PHY. This product is compliant with most of automotive interfaces.
Description
This device is a dual-line transient voltage suppressor (TVS) specifically designed
to protect the CAN H and CAN L pins of an automotive CAN transceiver against
electrostatic discharge (ESD) and ISO 7637-3.
The ESDCAN03-2BM3Y complies with all the physical layer constraints (jump start,
reverse polarity, …) without compromising the low clamping voltage for an efficient
CAN bus protection.
The low line capacitance of each ESD diode makes this CAN protection compatible
not only with CAN-FD but also with high speed and high data rate buses like
FlexRay, USB and more.
DS13559 - Rev 2 - January 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
1 Characteristics
Symbol
Parameter
V
=
Trigger voltage
I
=
Leakage current @V
V
=
Stand-off voltage
I
=
Peak pulse current
R
Trig
RM
RM
RM
PP
V
=
Clamping voltage
CL
D
=
Dynamic resistance
V
CL
V
I
I
RM
V
Trig
V
RM
V
H
I
PP
R
D
V
H
=
Holding voltage
C
LINE
=
Input capacitance per line
ESDCAN03-2BM3Y
Characteristics
Table 1. Absolute ratings (T
amb
= 25 °C)
Symbol Parameter Value Unit
IEC 61000-4-2 / ISO 10605 - C = 150 pF, R = 330 Ω:
Contact discharge
Air discharge
±15
±15
ISO 10605 - C = 330 pF, R = 330 Ω:
V
Peak pulse voltage
PP
Contact discharge
Air discharge
±12
±12
kV
ISO 10605 - C = 330 pF, R = 2 kΩ:
Contact discharge
Air discharge
I
PP
T
T
Peak pulse current (8/20 μs) 3.3 A
Operating junction temperature range -55 to +175 °C
j
Storage temperature range -55 to +175 °C
stg
±30
±30
Figure 1. Electrical characteristics (definitions)
DS13559 - Rev 2
page 2/15
ESDCAN03-2BM3Y
Characteristics
Table 2. Electrical characteristics (T
amb
= 25 °C)
Symbol Parameter Test condition Min. Typ. Max. Unit
Trigger voltage, higher voltage than V
V
Trig
guarantees the protection turn-on
Holding voltage, lower voltage than VH guarantees
V
H
the protection turn-off
I
Leakage current
RM
TRIG
VRM = 24 V
28 V
24 V
50 nA
ISO7637-3 pulse 3a at -150 V min. -36
C
ΔC
V
Clamping voltage
CL
Line capacitance
LINE
Line capacitance variation between IO1 and IO2
LINE
versus GND
ISO7637-3 pulse 3b at +150 V max. 36
8/20 µs waveform, IPP = 3 A
V
= 0 V, f = 1 MHz, V
LINE
V
= 0 V, f = 1 MHz, V
LINE
OSC
OSC
= 30 mV
= 30 mV
32 36.5
3.3 3.6 pF
0.01 0.05 pF
V
DS13559 - Rev 2
page 3/15
1.1 Characteristics (curves)
0
1
2
3
4
0 25 50 75 100 125 150 175 200
IPP(A)
Tj (°C)
8/20 µs
0.1
1
10
0.01 0.1 1
IPP(A)
Tjinitial = 25 °C
tp (ms)
0.1
1
10
20 25 30 35 40
IPP(A)
V
CL
(V)
8/20 µs
1
10
0 5 10 15 20
C (pF)
VR( V)
f = 1 MHz
V
osc
= 30 mV
RMS
Tj = 25 °C
0.1
1
10
100
25 50 75 100 125 150 175
VR = 24 V
IR (nA)
Tj( °C)
-30
-20
-10
0
10
20
30
-50 -40 -30 -20 -10 0 10 20 30 40 50
I (A)
V( V)
ESDCAN03-2BM3Y
Characteristics (curves)
Figure 2. Maximum peak current versus initial junction
temperature (8/20 µs exponential waveform)
Figure 4. Peak pulse current versus clamping voltage
(8/20 µs exponential waveform)
Figure 3. Maximum peak pulse current versus exponential
pulse duration
Figure 5. Junction capacitance versus reverse applied
voltage
Figure 6. Leakage current versus junction temperature
DS13559 - Rev 2
Figure 7. TLP
page 4/15
ESDCAN03-2BM3Y
Characteristics (curves)
Figure 8. Response to ISO 10605 -C = 150 pF, R = 330 Ω
(-8 kV contact)
Figure 10. Response to ISO 7637-3 Pulse 3a: -150 V
Figure 9. Response to ISO 10605 - C = 150 pF, R = 330 Ω
(+8 kV contact )
Figure 11. Response to ISO 7637-3 Pulse 3b : +150 V
Figure 12. Response to ISO 7637-3 pulse 2a: -85 V
Figure 13. Response to ISO 7637-3 pulse 2a: +85 V
Note: DCC (direct capacitive coupling) for Figure 10, Figure 11, Figure 12 and Figure 13.
DS13559 - Rev 2
page 5/15
Figure 14. S21 measurements results
ESDCAN03-2BM3Y
Characteristics (curves)
DS13559 - Rev 2
page 6/15
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 QFN-3L 1.1 x 1.0 x 0.55 package information
Figure 15. QFN-3L 1.1 x 1.0 x 0.55 package outline
ESDCAN03-2BM3Y
Package information
Note: The marking codes can be rotated to differentiate assembly location. In no case should this product marking be
used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.
DS13559 - Rev 2
page 7/15
ESDCAN03-2BM3Y
QFN-3L 1.1 x 1.0 x 0.55 package information
Table 3. QFN-3L 1.1 x 1.0 x 0.55 package mechanical data
Dimensions
Ref.
Min. Typ. Max. Min. Typ. Max.
A
A1 0.00 0.02 0.05 0.000 0.0008 0.0020
b 0.20 0.25 0.30 0.0079 0.0098 0.0118
D 0.95 1.00 1.05 0.0374 0.0394 0.0413
D2 0.25 0.40 0.50 0.0098 0.0157 0.0197
e 0.33 0.0130
E 1.05 1.10 1.15 0.0413 0.0433 0.0453
E2 0.65 0.80 0.90 0.0256 0.0315 0.0354
K 0.20 0.0079
L 0.15 0.25 0.35 0.0059 0.0098 0.0138
L1 0.00 0.05 0.10 0.000 0.0020 0.0039
N 3 3
CD 0.23 0.0091
CW 0.02 0.05 0.08 0.0008 0.0020 0.0031
WF 0.14 0.15 0.0055 0.0059
0.51 0.55 0.60 0.0201 0.0217 0.0236
Millimeters
Inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
DS13559 - Rev 2
page 8/15
2.2 Packing information
The marking can be rotated to differentiate assembly location
XX
Ø 60
Ø 20.2 min
Ø 180 max
Ø 13
2±0.5
14.4
205
205
30
ESDCAN03-2BM3Y
Packing information
Figure 16. Marking
Figure 18. Tape and reel orientation
Figure 17. Package orientation in reel
Figure 19. 7'' reel dimension values
DS13559 - Rev 2
Figure 20. Inner box dimension values
page 9/15
Figure 21. Tape outline
ESDCAN03-2BM3Y
Packing information
Table 4. Tape dimension values
Dimensions
Ref.
Min. Typ. Max.
D0
D1 0.55 0.60 0.65
F 3.45 3.50 3.55
K0 0.67 0.70 0.73
P0 3.90 4.00 4.10
P1 3.90 4.00 4.10
P2 1.95 2.00 2.05
W 7.90 8.00 8.10
1.50 1.55 1.60
Millimeters
DS13559 - Rev 2
page 10/15
3 Recommendation on PCB assembly
3.1 Footprint
SMD footprint design is recommended.
Figure 22. Recommended footprint in mm
ESDCAN03-2BM3Y
Recommendation on PCB assembly
3.2 Stencil opening design
1. Reference design
a. Stencil opening thickness: 100 μm / 4 mils
b. I/O (pin 1 and pin 2) pads stencil aperture ratio: 90%
c. GND (pin 3) pad stencil aperture ratio: 50%
Figure 23. Recommended stencil window position in mm
3.3
Wettable flank profile
DS13559 - Rev 2
Figure 24. Wettable flank profile
page 11/15
3.4 Solder paste
250
0
50
100
150
200
240210180150120906030 300270
-6 °C/s
240-245 °C
2 - 3 °C/s
Temperature (°C)
-2 °C/s
-3 °C/s
Time (s)
0.9 °C/s
60 sec
(90 max)
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Use solder paste with fine particles: powder particle size is 20-38 μm.
3.5 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste
and cause solder joints to short. Too low placement force can lead to insufficient contact between package
and solder paste that could cause open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be performed with a high
resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder
paste printing, pick and place and reflow soldering by using optimized tools.
ESDCAN03-2BM3Y
Solder paste
3.6 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open vias.
2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is
recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.
3.7 Reflow profile
Figure 25. ST ECOPACK recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
DS13559 - Rev 2
corresponds to the latest IPC/JEDEC J-STD-020.
page 12/15
4 Ordering information
Order code
ESDCAN03-2BM3Y YA QFN-3L 1.1 x 1.0 x 0.55 1.68 mg 5000 Tape and reel
1. The marking can be rotated by multiples of 90° to differentiate assembly location
Marking
Table 5. Ordering information
(1)
Package Weight Base qty. Delivery mode
ESDCAN03-2BM3Y
Ordering information
DS13559 - Rev 2
page 13/15
Revision history
ESDCAN03-2BM3Y
Table 6. Document revision history
Date Revision Changes
05-Nov-2020 1 First issue.
08-Jan-2021 2 Updated Table 1 and Table 2.
DS13559 - Rev 2
page 14/15
ESDCAN03-2BM3Y
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DS13559 - Rev 2
page 15/15
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