Page 1
SOT23-3L
Features
Unidirectional device
Low leakage current (I
V
)
BR
300 W peak pulse power (8/20 µs)
max. < 20 µA at
R
ESDAL
Dual Transil™ array for ESD protection
Datasheet - production data
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Entertainment
Signal communications
Connectivity
Comfort and convenience
Description
This device is a diode array designed to protect 1
line or 2 lines against ESD transients.
The device is ideal for applications where both
reduced line capacitance and board space saving
are required.
It can also be used as bidirectional suppressor by
connecting only pin 1 and 2.
Figure 1: Functional diagram
Benefits
High ESD protection level: up to 30 kV
High integration
Suitable for high density boards
Complies with the following
1
3
standards
IEC 61000-4-2 (exceeds level 4) :
30 kV (air discharge)
30 kV (contact discharge)
July 2017 DocID7058 Rev 5 1/11
This is information on a product in full production.
2
www.st.com
Page 2
Characteristics ESDAL
1 Characteristics
Table 1: Absolute maximum ratings (T
= 25 °C)
amb
Symbol Parameter Value Unit
Vpp Peak pulse voltage
Ppp
Ipp
Peak pulse power (8/20 μs)
Peak pulse current (8/20 μs)
IEC 61000-4-2:
(1)
Contact discharge
Air discharge
ESDA5V3L
ESDA6V1L
ESDA14V2L
ESDA25L
ESDA37L
30
kV
30
300 W
25
18
14
A
7
6.3
Tj Operating junction temperature range -40 to 150 °C
T
Storage junction temperature range -65 to 150 °C
stg
TL
Maximum lead temperature for soldering during 10 s at 5 mm from
case
260 °C
Notes:
(1)
For a surge greater than the maximum values, the diode will fail in short-circuit.
Figure 2: Electrical characteristics (definitions)
Symbol Parameter
V = Breakdown voltage
BR
V = Clamping voltage
CL
V = Stand-off voltage
RM
I = Leakage current
RM
I = Forward current
F
I = Peak pulse current
PP
I = Breakdown current
R
V = Forward voltage drop
F
C
R
α
T = Voltage temperature
= Capacitance
= Dynamic impedance
d
I
I
F
V
V
cl
BR
V
Slope = 1/Rd
RM
V
F
I
RM
I
PP
V
2/11 DocID7058 Rev 5
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ESDAL Characteristics
Order code
Table 2: Electrical characteristics (T
VBR at IR IRM at VRM R
(1)
d
αT
= 25 °C)
amb
(2)
C
VF at IF
line
Min. Max. Max. Typ. Max. Typ. at 0 V bias Max.
V V mA µA V mΩ 10-4/°C pF V mA
ESDA5V3L 5.3 5.9 1 2 3 280 5 220 1.25 200
ESDA6V1L 6.1 7.2 1 20 5.25 350 6 140 1.25 200
ESDA14V2L 14.2 15.8 1 5 12 650 10 90 1.25 200
ESDA25L 25 30 1 1 24 1000 10 50 1.2 10
ESDA37L 37 43.3 1 1 36 2400 10 48 0.9 10
Notes:
(1)
Square pulse Ipp = 15 A, tp = 2.5 µs
(2)
∆ VBR = αT x (T
-25 °C) x VBR (25 °C)
amb
DocID7058 Rev 5 3/11
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Characteristics ESDAL
ESD
A5V3LESD
A6V
1LESDA14V
2LESDA25LESD
A
0
1.1 Characteristics (curves)
Figure 3: Variation of peak pulse power versus
initial junction temperature
PPP(W)
350
300
250
200
150
100
50
0
25 50 75 100 125 150 175
37L
(°C)
T
j
Figure 5: Variation of clamping voltage versus
peak pulse current (max. values, 8/20 µs waveform)
IPP(A)
100
10
Tjinitial = 25 °C
8/20µs
ESDA5V3L
ESDA6V1L
ESDA14V2L
ESDA25L
ESDA37L
Figure 4: Peak pulse power versus exponential
pulse duration
PPP(W)
Tjinitial = 25 °C
1000
100
10
10 100 1000
maximum value
Figure 6: Relative variation of leakage current
at V
= VRM versus junction values
Ir(nA)
10000
1000
100
10
R
t
(µs)
p
1
(V)
V
0.1
0 102030405060
CL
1
0.1
T
(°C)
0.01
25 50 75 100 125 15
j
ESDA5V3L
ESDA6V1L
ESDA14V2L
ESDA25L
ESDA37L
4/11 DocID7058 Rev 5
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ESDAL
Application and design guidelines
2 Application and design guidelines
Refer to STMicroelectronics application note:
AN2689: Protection of automotive electronics from electrical hazards, guidelines for
design and component selection.
DocID7058 Rev 5 5/11
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Package information
3 Package information
ESDAL
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Epoxy meets UL 94,V0
Lead-free package
3.1 SOT23-3L mechanical data
Figure 7: SOT23-3L package outline
005 3390_I
6/11 DocID7058 Rev 5
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ESDAL
Package information
Table 3: SOT23-3L mechanical data
mm
Dim.
Min. Typ. Max.
A 0.89 1.40
A1 0 0.10
B 0.30 0.51
C 0.085 0.18
D 2.75 3.04
e 0.85 1.05
e1 1.70 2.10
E 1.20 1.75
H 2.10 3.00
L 0.60
S 0.35 0.65
L1 0.25 0.55
a 0° 8°
Figure 8: SOT23-3L recommended footprint
Dimensions are in mm.
DocID7058 Rev 5 7/11
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Recommendation on PCB assembly
4 Recommendation on PCB assembly
4.1 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed.
4. Use solder paste with fine particles: powder particle size 20-45 µm.
4.2 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system,
not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
ESDAL
4.3 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. A
symmetrical layout is recommended, to avoid any tilt phenomena caused by
asymmetrical solder paste due to solder flow away.
8/11 DocID7058 Rev 5
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ESDAL
4.4 Reflow profile
Figure 9: ST ECOPACK® recommended soldering reflow profile for PCB mounting
Recommendation on PCB assembly
Minimize air convection currents in the reflow oven to avoid component
movement.
DocID7058 Rev 5 9/11
Page 10
Ordering information
5 Ordering information
Figure 10: Ordering information scheme
ESD Array
Minimum breakdown voltage
Package
L=SOT23-3L
Table 3: Ordering information
Order code Marking
ESDA5V3L EL53
ESDA6V1L EL61
ESDA14V2L EL15
ESDA25L EL25
ESDA37L EL37 9.8 mg
Notes:
(1)
The marking can be rotated by multiples of 90° to differentiate assembly location.
(1)
Package Weight Base qty. Delivery mode
SOT23-3L
ESDA XXX L
8.7 mg
3000 Tape and reel
ESDAL
6 Revision history
Table 4: Document revision history
Date Revision Changes
31-Jul-2012 4 First issue.
20-Jul-2017 5 Added ESDA37L package information.
10/11 DocID7058 Rev 5
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ESDAL
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DocID7058 Rev 5 11/11
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