Page 1
®
BTA08, BTB08 and T8 Series
SNUBBERLESS™, LOGIC LEVEL & STANDARD
Table 1: Main Features
Symbol Value Unit
I
T(RMS)
V
DRM/VRRM
I
GT (Q1)
8A
600 and 800 V
5 to 50 mA
DESCRIPTION
Available either in through-hole or surface-mount
packages, the BTA08, BTB08 and T8 triac series
is suitable for general purpose AC switching. They
can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase
control operation in light dimmers, motor speed
controllers,...
The snubberless versions (BTA/BTB...W and T8
series) are specially recommended for use on
inductive loads, thanks to their high commutation
performances.
Logic level versions are designed to interface
directly with low power drivers such as
microcontrollers.
By using an internal ceramic pad, the BTA series
provides voltage insulated tab (rated at
2500V
) complying with UL standards (file ref.:
RMS
E81734).
A2
G
A1
A2
A1
A2
G
D2PA K
(T8-G)
A2
A1
A2
G
DPAK
(T8-B)
A1
A2
G
TO-220AB Insulated
(BTA08)
Table 2: Order Codes
Part Number Marking
BTA08-xxxxxRG
BTB08-xxxxxRG
T8xx-xxxG
See page table 8 on
T8xx-xxxH
T8xx-xxxB
8A TRIACS
A2
A1
A2
G
IPAK
(T8-H)
A1
A2
G
TO-220AB
(BTB08)
page 10
A2
REV. 6February 2006
1/11
Page 2
BTA08, BTB08 and T8 Series
Table 3: Absolute Maximum Ratings
Symbol Parameter Value Unit
2
PAK/
= 110°C
T
c
= 100°C
T
c
= 10 ms
T
= 125°C
j
= 20 µs Tj = 125°C
= 125°C
T
j
8A
36
50 A/µs
4A
1W
- 40 to + 150
- 40 to + 125
I
T(RMS)
I
TSM
²
I
tI
dI/dt
I
GM
P
G(AV)
T
stg
T
j
RMS on-state current (full sine
wave)
Non repetitive surge peak on-state
current (full cycle, T
²
t Value for fusing
initial = 25°C)
j
Critical rate of rise of on-state cur-
= 2 x IGT , tr ≤ 100 ns
rent I
G
Peak gate current
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
IPAK/D
DPAK/TO-220AB
TO-220AB Ins.
F = 50 Hz t = 20 ms 80
F = 60 Hz t = 16.7 ms 84
t
p
F = 120 Hz
t
p
A
°C
A
²
s
Tables 4: Electrical Characteristics (T
■ SNUBBERLESS and Logic Level (3 quadrants)
Symbol Test Conditions
I
(1)
GT
V
GT
V
GD
(2) IT = 100 mA
I
H
I
L
dV/dt (2)
= 12 V RL = 30 Ω
V
D
VD = V
T
= 125°C
j
IG = 1.2 I
= 67 %V
V
D
T
= 125°C
j
RL = 3.3 kΩ
DRM
GT
DRM
gate open
(dV/dt)c = 0.1 V/µs T
(dI/dt)c (2)
(dV/dt)c = 10 V/µs T
Without snubber T
= 25°C, unless otherwise specified)
j
Quad-
rant
I - II - IIIMAX.1035 5 103550mA
I - II - III MAX. 1.3 V
I - II - III MIN. 0.2 V
MAX. 15 35 10 15 35 50 mA
I - III
MAX.
II 30 60 15 30 60 80
MIN. 40 400 20 40 400 1000 V/µs
= 125°C
j
= 125°C
j
= 125°C
j
MIN.
T8 BTA08 / BTB08
T810 T835 TW SW CW BW
25 50 10 25 50 70
5.4 - 3.5 5.4 - -
2.8 - 1.5 2.98 - -
-4.5- -4.57
Unit
mA
A/ms
2/11
Page 3
■ Standard (4 quadrants)
BTA08, BTB08 and T8 Series
Symbol Test Conditions Quadrant
BTA08 / BTB08
CB
I
(1)
GT
V
GT
V
GD
I
(2) IT = 500 mA
H
I
L
dV/dt (2)
(dV/dt)c (2)
V
VD = V
IG = 1.2 I
V
(dI/dt)c = 5.3 A/ms T
= 12 V RL = 30 Ω
D
RL = 3.3 kΩ Tj = 125°C
DRM
GT
= 67 %V
D
gate open Tj = 125°C
DRM
= 125°C
j
I - II - III
IV
MAX.
ALL MAX. 1.3 V
ALL MIN. 0.2 V
MAX. 25 50 mA
I - III - IV
MAX.
II 80 100
MIN. 200 400 V/µs
MIN. 5 10 V/µs
25
50
50
100
40 50
Table 5: Static Characteristics
Symbol Test Conditions Value Unit
V
(2) ITM = 11 A tp = 380 µs Tj = 25°C
T
(2)
V
to
(2)
R
d
I
DRM
I
RRM
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1.
Threshold voltage
Dynamic resistance
V
= V
DRM
RRM
Tj = 125°C
Tj = 125°C
Tj = 25°C
T
= 125°C
j
MAX. 1.55 V
MAX. 0.85 V
MAX. 50 mΩ
5µA
MAX.
1mA
Unit
mA
mA
Table 6: Thermal resistance
Symbol Parameter Value Unit
R
th(j-c)
Junction to case (AC)
IPAK / D
2
PAK / DPAK / TO-220AB
1.6
TO-220AB Insulated 2.5
R
th(j-a)
Junction to ambient
S = 1 cm
²
S = 0.5 cm
D2PAK
²
DPAK 70
45
TO-220AB / TO-220AB Insulated 60
IPAK 100
S = Copper surface under tab.
°C/W
°C/W
3/11
Page 4
BTA08, BTB08 and T8 Series
Figure 1: Maximum power dissipation versus
RMS on-state current (full cycle)
P(W)
10
9
8
7
6
5
4
3
2
1
0
012345678
I (A)
T(RMS)
Figure 3: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35µm) (full cycle)
I (A)
T(RMS)
3.5
DPAK
2
2
DPAK
(S=1CM )
2
T (°C)
C
3.0
2.5
2.0
1.5
(S=0.5CM )
1.0
0.5
0.0
0 25 50 75 100 125
Figure 2: RMS on-state current versus case
temperature (full cycle)
I (A)
T(RMS)
10
9
8
7
6
5
4
3
2
1
0
0 25 50 75 100 125
T (°C)
C
BTB / T8
BTA
Figure 4: Relative variation of thermal
impedance versus pulse duration
K=[Z /R
1E+0
1E-1
1E-2
1E-3
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
th th
Z
th(j-c)
]
DPAK/IPAK
Z
th(j-a)
2
TO-220AB/D PAK
Z
th(j-a)
t (s)
p
Figure 5: On-state characteristics (maximum
values)
I (A)
TM
100
T max.
j
V = 0.85V
to
Ω
R = 50 m
d
10
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
4/11
T=jT max.
T = 25°Cj.
j
V (V)
TM
Figure 6: Surge peak on-state current versus
number of cycles
I (A)
TSM
90
80
70
60
50
40
30
20
10
0
1 10 100 1000
Repetitive
T =110°C
C
Non repetitive
T initial=25°C
j
Number of cycles
t=20ms
One cycle
Page 5
BTA08, BTB08 and T8 Series
Figure 7: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width t
2
t (ms)
p
t
and corresponding value of I
TSM
22
dI/dt limitation:
50A/µs
I (A), I t (A s)
1000
100
10
0.01 0.10 1.00 10.00
< 10 ms
p
T initial=25°C
j
I
TSM
2
I t
Figure 9: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Snubberless & Logic level
types)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.2
TW
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1 1.0 10.0 100.0
(dV/dt)c (V/µs)
T835/CW/BW
T810/SW
Figure 8: Relative variation of gate trigger
current, holding current and latching current
versus junction temperature (typical values)
I,I,I[T] /
GT H L j
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100 120 140
IH& I
I
GT
L
I ,I ,I [T =25°C]
GT H L j
T (°C)
j
Figure 10: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Standard types)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.1 1.0 10.0 100.0
C
B
(dV/dt)c (V/µs)
Figure 11: Relative variation of critical rate of
decrease of main current versus junction
temperature
(dI/dt)c [T ] / pecified]
6
5
4
3
2
1
0
0 25 50 75 100 125
(dI/dt)c [T s
j
j
T (°C)
j
Figure 12: DPAK and D
2
PAK Thermal resistance
junction to ambient versus copper surface under
tab (printed circuit board FR4, copper thickness:
35 µm)
R (°C/W)
th(j-a)
100
90
80
70
60
50
40
30
20
10
0
0 4 8 1216202428323640
2
DPAK
DPAK
S(cm²)
5/11
Page 6
BTA08, BTB08 and T8 Series
Figure 13: Ordering Information Scheme (BTA08 and BTB08 series)
BT A 08 - 600 BW (RG)
Triac series
Insulation
A = insulated
B = non insulated
Current
08 = 8A
Voltage
600 = 600V
800 = 800V
Sensitivity and type
B = 50mA Standard BW = 50mA Snubberless
C = 25mA Standard CW = 35mA
SW = 10mA Logic Level TW = 5mA Logic Level
Packing mode
RG = Tube
Figure 14: Ordering Information Scheme (T8 series)
Triac series
Current
8 = 8A
Sensitivity
10 = 10mA
35 = 35mA
Voltage
600 = 600V
800 = 800V
Package
B = DPAK
2
G = D PAK
2
R = I PAK
Packing mode
Blanck = Tube
-TR = Tape & Reel
Snubberless
T 8 10 - 600 B (-TR)
Table 7: Product Selector
Volt ag e ( xxx )
Part Number
600 V 800 V
Sensitivity Type
Package
BTA/BTB08-xxxB X X 50 mA Standard TO-220AB
BTA/BTB08-xxxBW X X 50 mA Snubberless TO-220AB
BTA/BTB08-xxxC X X 25 mA Standard TO-220AB
BTA/BTB08-xxxCW X X 35 mA Snubberless TO-220AB
BTA/BTB08-xxxSW X X 10 mA Logic level TO-220AB
BTA/BTB08-xxxTW X X 5 mA Logic Level TO-220AB
T810-xxxG X X 10 mA Logic Level
D
2
PAK
T810-xxxH X X 10 mA Logic Level IPAK
T835-xxxB X X 35 mA Snubberless DPAK
T835-xxxG X X 35 mA Snubberless
D
2
PAK
T835-xxxH X X 35 mA Snubberless IPAK
BTB: non insulated TO-220AB package
6/11
Page 7
Figure 15: D2PAK Package Mechanical Data
D
A
L2
L
L3
E
B2
B
G
2mm min.
FLAT ZONE
C2
A1
C
A2
R
V2
BTA08, BTB08 and T8 Series
DIMENSIONS
REF.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2 0° 8° 0° 8°
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
Figure 16: D
(in millimeters)
10.30
2
PAK Foot Print Dimensions
16.90
1.30
8.90
3.70
5.08
7/11
Page 8
BTA08, BTB08 and T8 Series
Figure 17: DPAK Package Mechanical Data
E
B2
L2
H
L4
B
G
0.60 MIN.
A1
A2
V2
A
C2
R
R
C
DIMENSIONS
REF.
Millimeters Inches
Min. Max Min. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
D
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°
Figure 18: DPAK Foot Print Dimensions
(in millimeters)
6.7 3 3
6.7
1.6
2.3
2.3
1.6
8/11
Page 9
Figure 19: TO-220AB Package Mechanical Data
B
Ø I
L
A
I4
l3
a1
l2
b1
e
a2
C
b2
F
c2
M
c1
BTA08, BTB08 and T8 Series
DIMENSIONS
REF.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
Figure 20: IPAK Package Mechanical Data
A
E
B2
H
L1
L
e
G
L2
B3
B
V1
B5
C2
A1
C
A3
DIMENSIONS
REF.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A3 0.70 1.30 0.027 0.051
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
B3 0.95 0.037
D
B5 0.30 0.035
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.019 0.023
D 6 6.20 0.236 0.244
E 6.40 6.60 0.252 0.260
e 2.28 0.090
G 4.40 4.60 0.173 0.181
H 16.10 0.634
L 9 9.40 0.354 0.370
L1 0.8 1.20 0.031 0.047
L2 0.80 1 0.031 0.039
V1 10° 10°
9/11
Page 10
BTA08, BTB08 and T8 Series
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com
Table 8: Ordering Information
Ordering type Marking Package Weight Base qty Delivery mode
BTA/BTB08-xxxyzRG BTA/BTB08-xxxyz TO-220AB 2.3 g 50 Tube
.
T8yy-xxxG T8yyxx
T8yy-xxxG-TR T8yyxx 1000 Tape & reel
2
PAK
D
1.5 g
T8yy-xxxB T8yyxx
50 Tube
75 Tube
DPAK 0.3 g
T8yy-xxxB-TR T8yyxx 2500 Tape & reel
T8yy-xxxH T8yyxx IPAK 0.4 g 75 Tube
Note: xxx = voltage, yy = sensitivity, z = type
Table 9: Revision History
Date Revision Description of Changes
Apr-2002 5A Last update.
13-Feb-2006 6
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
10/11
Page 11
BTA08, BTB08 and T8 Series
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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© 2006 STMicroelectronics - All rights reserved
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11/11
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