®
BTA16, BTB16 and T16 Series
SNUBBERLESS™, LOGIC LEVEL & STANDARD
Table 1: Main Features
Symbol Value Unit
I
T(RMS)
V
DRM/VRRM
I
GT (Q1)
600, 700 and 800 V
16 A
10 to 50 mA
DESCRIPTION
Available either in through-hole or surface-mount
packages, the BTA16, BTB16 and T16 triac series
is suitable for general purpose AC switching. They
can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase
control operation in light dimmers, motor speed
controllers, ...
The snubberless versions (BTA/BTB...W and T16
series) are specially recommended for use on inductive loads, thanks to their high commutation
performances. By using an internal ceramic pad,
the BTA series provides voltage insulated tab (rated at 2500V
) complying with UL standards
RMS
(File ref.: E81734).
A2
G
A1
A2
A1
A2
G
D2PAK
(T16-G)
A1
A2
G
TO-220AB Insulated
(BTA16)
Table 2: Order Codes
Part Number Marking
BTA16-xxxxxRG
BTB16-xxxxxRG
See page table 8 on
T16xx-xxxG
16A TRIACS
A2
A1
A2
G
TO-220AB
(BTB16)
page 8
REV. 7February 2006
1/9
BTA16, BTB16 and T16 Series
Table 3: Absolute Maximum Ratings
Symbol Parameter Value Unit
2
PAK /
I
T(RMS)
I
TSM
²
I
tI
dI/dt
V
DSM/VRSM
RMS on-state current (full sine
wave)
Non repetitive surge peak on-state
current (full cycle, T
²
t Value for fusing
initial = 25°C)
j
Critical rate of rise of on-state cur-
= 2 x IGT , tr ≤ 100 ns
rent I
G
Non repetitive surge peak off-state
voltage
D
TO-220AB
TO-220AB Ins.
F = 50 Hz t = 20 ms 160
F = 60 Hz t = 16.7 ms 168
t
= 10 ms
p
F = 120 Hz
= 10 ms Tj = 25°C
t
p
= 100°C
T
c
= 15°C
T
c
T
= 125°C
j
16 A
144
50 A/µs
V
DSM/VRSM
+ 100
A
²
s
A
V
I
GM
P
G(AV)
T
stg
T
j
Tables 4: Electrical Characteristics (T
■ SNUBBERLESS and Logic Level (3 quadrants)
Peak gate current
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
= 25°C, unless otherwise specified)
j
t
= 20 µs Tj = 125°C
p
Symbol Test Conditions Quadrant
I
(1)
GT
V
GT
V
GD
(2) IT = 500 mA
I
H
I
L
dV/dt (2)
V
VD = V
T
IG = 1.2 I
V
(dV/dt)c = 0.1 V/µs
(dI/dt)c (2)
Without snubber
= 12 V RL = 33 Ω
D
RL = 3.3 kΩ
DRM
= 125°C
j
GT
= 67 %V
D
gate open Tj = 125°C
DRM
I - II - III MAX. 35 10 35 50 mA
I - II - III MAX. 1.3 V
I - II - III MIN. 0.2 V
I - III
II 60 30 60 80
T
= 125°C
j
T
= 125°C
j
= 125°C
T
j
4A
T
= 125°C
j
1W
- 40 to + 150
- 40 to + 125
°C
T16 BTA16 / BTB16
Unit
T1635 SW CW BW
MAX. 35 15 35 50 mA
50 25 50 70
MAX.
mA
MIN. 500 40 500 1000 V/µs
-8.5- -
MIN.
-3.0- -
A/ms(dV/dt)c = 10 V/µs
8.5 - 8.5 14
2/9
■ Standard (4 quadrants)
BTA16, BTB16 and T16 Series
Symbol Test Conditions Quadrant
BTA16 / BTB16
CB
I
(1)
GT
V
GT
V
GD
I
(2) IT = 500 mA
H
I
L
dV/dt (2)
V
= 12 V RL = 33 Ω
D
VD = V
IG = 1.2 I
= 67 %V
V
D
RL = 3.3 kΩ Tj = 125°C
DRM
GT
gate open Tj = 125°C
DRM
(dV/dt)c (2) (dI/dt)c = 7 A/ms
I - II - III
IV
MAX.
ALL MAX. 1.3 V
ALL MIN. 0.2 V
MAX. 25 50 mA
I - III - IV
MAX.
II 80 120
MIN. 200 400 V/µs
T
= 125°C
j
MIN. 5 10 V/µs
25
50
50
100
40 60
Table 5: Static Characteristics
Symbol Test Conditions Value Unit
V
(2) ITM = 22.5 A tp = 380 µs Tj = 25°C
T
(2)
V
to
(2)
R
d
I
DRM
I
RRM
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1.
Threshold voltage
Dynamic resistance
V
= V
DRM
RRM
Tj = 125°C
Tj = 125°C
Tj = 25°C
T
= 125°C
j
MAX. 1.55 V
MAX. 0.85 V
MAX. 25 mΩ
5µA
MAX.
2mA
Unit
mA
mA
Table 6: Thermal resistance
Symbol Parameter Value Unit
R
th(j-c)
Junction to case (AC)
2
D
PAK / TO-220AB
1.2
TO-220AB Insulated 2.1
R
th(j-a)
S = Copper surface under tab.
Junction to ambient
S = 1 cm
²
D2PAK
TO-220AB / TO-220AB Insulated 60
45
°C/W
°C/W
3/9
BTA16, BTB16 and T16 Series
Figure 1: Maximum power dissipation versus
RMS on-state current (full cycle)
P(W)
20
18
16
14
12
10
8
6
4
2
0
0246810121416
I (A)
T(RMS)
Figure 3: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35µm) (full cycle)
I (A)
T(RMS)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0 25 50 75 100 125
T (°C)
C
2
DPAK
(S=1cm )
2
Figure 2: RMS on-state current versus case
temperature (full cycle)
I (A)
T(RMS)
18
16
14
12
10
8
6
4
2
0
0 25 50 75 100 125
T (°C)
C
BTA
BTB / T16
Figure 4: Relative variation of thermal
impedance versus pulse duration
K=[Z /R
1E+0
1E-1
1E-2
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
th th
Z
th(j-c)
]
Z
th(j-a)
t (s)
p
Figure 5: On-state characteristics (maximum
values)
I (A)
TM
200
T max.
j
V = 0.85V
to
100
R = 25 m
Ω
d
T=jT max.
j
10
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
4/9
T = 25°Cj.
V (V)
TM
Figure 6: Surge peak on-state current versus
number of cycles
I (A)
TSM
180
160
140
120
100
Repetitive
80
60
40
20
T =85°C
C
0
1 10 100 1000
Non repetitive
T initial=25°C
j
Number of cycles
t=20ms
One cycle
BTA16, BTB16 and T16 Series
Figure 7: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width t
2
t (ms)
p
t
I
TSM
and corresponding value of I
TSM
dI/dt limitation:
22
50A/µs
I (A), I t (A s)
3000
1000
100
0.01 0.10 1.00 10.00
2
I t
< 10 ms
p
T initial=25°C
j
Figure 9: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Snubberless & Logic level
types)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.1 1.0 10.0 100.0
SW
C
B
T1635/CW/BW
(dV/dt)c (V/µs)
Figure 8: Relative variation of gate trigger
current, holding current and latching current
versus junction temperature (typical values)
I,I,I[T] /
GT H L j
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100 120 140
I ,I ,I [T =25°C]
GT H L j
I
GT
IH& I
L
T (°C)
j
Figure 10: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (Standard types)
(dI/dt)c [T ] / pecified]
6
5
4
3
2
1
0
0 25 50 75 100 125
(dI/dt)c [T s
j
j
T (°C)
j
Figure 11: D
2
PAK Thermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 µm)
R (°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
2
DPAK
S(cm²)
0 4 8 1216202428323640
5/9
BTA16, BTB16 and T16 Series
Figure 12: Ordering Information Scheme (BTA16 and BTB16 series)
BT A 16 - 600 BW RG
Triac series
Insulation
A = insulated
B = non insulated
Current
16 = 16A
Voltage
600 = 600V
700 = 700V
800 = 800V
Sensitivity and type
B = 50mA Standard BW = 50mA Snubberless
C = 25mA Standard CW = 35mA
SW = 10mA Logic Level
Packing mode
RG = Tube
Snubberless
Figure 13: Ordering Information Scheme (T16 series)
T 16 35 - 600 G (-TR)
Triac series
Current
16 = 16A
Sensitivity
35 = 35mA
Voltage
600 = 600V
800 = 800V
Package
2
G = D PAK
Packing mode
Blanck = Tube
-TR = Tape & Reel
Table 7: Product Selector
Volt ag e ( xx x)
Part Numbers
Sensitivity Type Package
600 V 700 V 800 V
BTA/BTB16-xxxB X X X 50 mA Standard TO-220AB
BTA/BTB16-xxxBW X X X 50 mA Snubberless TO-220AB
BTA/BTB16-xxxC X X X 25 mA Standard TO-220AB
BTA/BTB16-xxxCW X X X 35 mA Snubberless TO-220AB
BTA/BTB16-xxxSW X X X 10 mA Logic level TO-220AB
T1635-xxxG X X 35 mA Snubberless
BTB: non insulated TO-220AB package
6/9
D
2
PAK
Figure 14: D2PAK Package Mechanical Data
D
A
L2
L
L3
E
B2
B
G
2mm min.
FLAT ZONE
C2
A1
C
A2
R
V2
BTA16, BTB16 and T16 Series
DIMENSIONS
REF.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2 0° 8° 0° 8°
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
Figure 15: D
(in millimeters)
10.30
2
PAK Foot Print Dimensions
16.90
1.30
8.90
3.70
5.08
7/9
BTA16, BTB16 and T16 Series
Figure 16: TO-220AB Package Mechanical Data
B
Ø I
L
A
I4
l3
a1
l2
b1
e
a2
C
b2
F
c2
M
c1
DIMENSIONS
REF.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com
.
Table 8: Ordering Information
Ordering type Marking Package Weight Base qty Delivery mode
BTA/BTB16-xxxyzRG BTA/BTB16xxxyz TO-220AB 2.3 g 50 Tube
T1635-xxxG T1635xxxG
T1635-xxxG-TR T1635xxxG 1000 Tape & reel
Note: xxx = voltage, yy = sensitivity, z = type
2
D
PAK
1.5 g
50 Tube
Table 9: Revision History
Date Revision Description of Changes
Oct-2002 6A Last update.
13-Feb-2006 7
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
8/9
BTA16, BTB16 and T16 Series
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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9/9
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