Page 1
®
BTA12, BTB12 and T12 Series
SNUBBERLESS™, LOGIC LEVEL & STANDARD
Table 1: Main Features
Symbol Value Unit
I
T(RMS)
V
DRM/VRRM
I
GT (Q1)
12 A
600 and 800 V
5 to 50 mA
DESCRIPTION
Available either i n through-hole or sur face-mount
packages, the BTA12, BTB12 and T12 triac series
is suitable for general purpose AC switching. They
can be used as an ON/OFF function in applications such as static relays, heat ing regulation, induction motor starting circuits... or for phase
control operation in light dimmers, motor speed
controllers,...
The snubberless versions (BTA /BTB...W and T12
series) are specially recommended for use on
inductive loads, thanks to their hi gh commutation
performances.
Logic level versions are designed to interface
directly with low power drivers such as
microcontrollers.
By using an internal cer amic pad, the BT A series
provides voltage insulated tab (rated at
2500V
) complying with UL standards (File ref.:
RMS
E81734).
A2
G
A1
A2
A1
A2
G
A1
D2PAK
(T12-G)
A1
A2
G
A1
TO-220AB Insulated
(BTA12)
Table 2: Order Codes
Part Number Marking
BTA12-xxxxxRG
BTB12-xxxxxRG
T12xx-xxxG
See page table 8 on
T12xx-xxxG-TR
T12xx-xxxR
12A TRIACS
A2
A2
G
I2PAK
(T12-R)
A2
A2
G
TO-220AB
(BTB12)
page 9
REV. 8July 2005
1/10
Page 2
BTA12, BTB12 and T12 Series
Table 3: Absolute Maximum Ratings
Symbol Parameter Value Unit
2
PAK/D2PAK/
I
T(RMS)
I
TSM
²
I
tI
dI/dt
V
DSM/VRSM
RMS on-state current
(full sine wave)
Non repetitive surge p eak on-state
current (full cycle, T
²
t Value for fusing
initial = 25°C)
j
Critical rate of rise of on-state cur-
= 2 x IGT , tr ≤ 100 ns
rent I
G
Non repetitive surge peak off-state
voltage
I
TO-220AB
TO-220AB Ins.
F = 50 Hz t = 20 ms 120
F = 60 Hz t = 16.7 ms 126
t
= 10 ms
p
F = 120 Hz
= 10 ms Tj = 25°C
t
p
= 105°C
T
c
= 90°C
T
c
T
= 125°C
j
12 A
78
50 A/µs
V
DRM/VRRM
+ 100
A
²
s
A
V
I
GM
P
G(AV)
T
stg
T
j
Tables 4: Electrical Characteristics (T
■ SNUBBERLESS and Logic Level (3 quadrants)
Peak gate current
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
= 25°C, unless otherwise specified)
j
t
Symbol Test Conditions Quadrant
T1205 T1235 TW SW CW BW
I
(1)
GT
V
GT
= 12 V
V
D
R
= 30 Ω
L
VD = V
R
V
GD
(2) IT = 100 mA
I
H
I
L
= 3.3 kΩ
L
T
= 125°C
j
IG = 1.2 I
DRM
GT
I - II - III MAX. 5 35 5 10 35 50 mA
I - II - III MAX. 1.3 V
I - II - III MIN. 0.2 V
MAX. 10 35 10 15 35 50 mA
I - III
MAX.
II 15 60 15 30 60 80
= 20 µs Tj = 125°C
p
T
= 125°C
j
4A
1W
- 40 to + 150
- 40 to + 125
T12 BTA12 / BTB12
10 50 10 25 50 70
°C
Unit
mA
dV/dt (2)
(dI/dt)c (2)
2/10
V
= 67 %V
D
T
= 125°C
j
gate open
DRM
(dV/dt)c = 0.1 V/µs
Tj = 125°C
(dV/dt)c = 10 V/µs
T
= 125°C
j
Without snubber
T
= 125°C
j
MIN. 20 500 20 40 500 1000 V/µs
3.5 3.5 6.5
MIN.
112.9
A/ms
6.5 6.5 12
Page 3
■ Standard (4 quadrants)
BTA12, BTB12 and T12 Series
Symbol Test Conditions Quadrant
BTA12 / BTB12
CB
I
(1)
GT
V
= 12 V RL = 30 Ω
D
V
GT
V
GD
(2) IT = 500 mA MAX. 25 50 mA
I
H
I
L
dV/dt (2) V
VD = V
IG = 1.2 I
= 67 %V
D
(dV/dt)c (2) (dI/dt)c = 5.3 A/ms T
RL = 3.3 kΩ Tj = 125°C ALL MIN. 0.2 V
DRM
GT
gate open Tj = 125°C MIN. 200 400 V/µs
DRM
= 125°C MIN. 5 10 V/µs
j
I - II - III
IV
MAX. 25
50
50
100
ALL MAX. 1.3 V
I - III - IV MAX. 40 50 mA
II 80 100
Table 5: Static Characteristics
Symbol Test Conditions V alue Unit
V
(2) ITM = 17 A tp = 380 µs Tj = 25°C
T
(2)
V
t0
(2)
R
d
I
DRM
I
RRM
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1.
Threshold voltage
Dynamic resi st anc e
V
= V
DRM
RRM
Tj = 125°C
Tj = 125°C
Tj = 25°C
T
= 125°C
j
MAX. 1.55 V
MAX. 0.85 V
MAX. 35 mΩ
5µA
MAX.
1mA
Unit
mA
Table 6: Thermal resistance
Symbol Parameter Value Unit
R
th(j-c)
Junction to case (AC)
2
I
PAK / D2PAK / TO-220AB
1.4
TO-220AB Insulated 2.3
Junction to ambient
R
th(j-a)
S = Copper surface under tab.
S = 1 cm
²D2
PAK
TO-220AB / I
TO-220AB Insulated
2
PAK
45
60
°C/W
°C/W
3/10
Page 4
BTA12, BTB12 and T12 Series
Figure 1: Maximum power dissipat ion versus
RMS on-state current (full cycle)
P(W)
16
14
12
10
8
6
4
2
0
0 1 2 3 4 5 6 7 8 9 10 11 12
I(A)
T(RMS)
Figure 3: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35µm) (full cycle)
I(A)
T(RMS)
3.5
2
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0 25 50 75 100 125
T (°C)
C
DPAK
(S=1cm )
2
Figure 2: RMS on-state current versus case
temperature (full cycle)
I(A)
T(RMS)
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
25 50 75 100 125
T (°C)
C
BTB / T12
BTA
Figure 4: Relative variation of thermal
impedance versus pulse duration
K=[Z /R
1E+0
1E-1
1E-2
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
th th
Z
th(j-c)
]
Z
th(j-a)
t(s)
p
Figure 5: On-state characteristics (maximum
values)
I (A)
TM
100
T max.
j
V = 0.85V
to
Ω
R = 35 m
d
T=jT max.
j
10
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
4/10
T = 25°Cj.
V (V)
TM
Figure 6: Surge peak on-state current versus
number of cycles
I(A)
TSM
130
120
110
100
90
80
70
60
Repetitive
T =90°C
50
40
30
20
10
C
0
1
Non repetitive
T initial=25°C
j
Number of cycles
10 100 1000
t=20ms
One cycle
Page 5
BTA12, BTB12 and T12 Series
Figure 7: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width t
2
t(ms)
p
t
and corresponding value of I
TSM
dI/dt limitation:
22
50A/µs
I (A), I t (A s)
1000
100
10
0.01 0.10 1.00 10.00
I
TSM
2
I t
< 10 ms
p
T initial=25°C
j
Figure 9: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (BW/CW/T1235)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
SW
C
B
T1235/CW/BW
(dV/dt)c (V/µs)
0.1 1.0 10.0 100.0
Figure 8: Relative variation of gate trigger
current, holding current and latching current
versus junction temperature (typical values)
I,I,I[T] /
GT H L j
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100 120 140
I ,I ,I [T =25°C]
GT H L j
I
GT
IH& I
L
T (°C)
j
Figure 10: Relative variation of critical rate of
decrease of main current versus (dV/dt)c
(typical values) (TW/T1205)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
TW
(dV/dt)c (V/µs)
0.1
1.0 10.0 100.0
Figure 11 : Relative varia tion of cri tical rate of
decrease of main current versus junction
temperature
(dI/dt)c [T ] / pecified]
6
5
4
3
2
1
0
0 25 50 75 100 125
(dI/dt)c [T s
j
j
T (°C)
j
2
Figure 12: D
P AK T hermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 µm)
R (°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
2
DPAK
0 4 8 1216202428323640
S(cm²)
5/10
Page 6
BTA12, BTB12 and T12 Series
Figure 13: Ordering Information Scheme (BTA and BTB series)
BT A 12 - 600 BW RG
Triac series
Insulation
A = insulated
B = non insulated
Current
12 = 12A
Voltage
600 = 600V
800 = 800V
Sensitivity and type
B = 50mA Standard BW = 50mA Snubberless
C = 25mA Standard CW = 35mA
Snubberless
SW = 10mA Logic Level TW = 5mA Logic Level
Packing mode
RG = Tube
Figure 14: Ordering Information Scheme (T12 series)
T 12 35 - 600 G (-TR)T 12 35 - 600 G (-TR)
Triac series
Current
12 = 12A
Sensitivity
35 = 35mA
05 = 5mA
Voltage
600 = 600V
800 = 800V
Package
2
G = D PAK
2
R = I PAK
Packing mode
Blanck =Tube
-TR = Tape & Reel
Table 7: Product Selector
Voltage (xxx)
Part Number
600 V 800 V
Sensitivity Type
Package
BTA/BTB12-xxxBRG X X 50 mA Standard TO-220AB
BTA/BTB12-xxxBWRG X X 50 mA Snubberless TO-220AB
BTA/BTB12-xxxCRG X X 25 mA Standard TO-220AB
BTA/BTB12-xxxCWRG X X 35 mA Snubberless TO-220AB
BTA/BTB12-xxxSWRG X X 10 mA Logic Level TO-220AB
BTA/BTB12-xxxTWRG X X 5 mA Logic Level TO-220AB
T1205-xxxG X X 5 mA Snubberless
T1235-xxxG X X 35 mA Snubberless
T1235-xxxR X X 35 mA Snubberless
D
D
I
2
PAK
2
PAK
2
PAK
BTB: non insulated TO-220AB package
6/10
Page 7
Figure 15: D2PAK Package Mechanical Data
A
L2
L
L3
E
B2
B
G
2.0 MIN.
FLAT ZONE
A1
C2
C
A2
R
V2
BTA12, BTB12 and T12 Series
DIMENSIONS
REF.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
D
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2 0° 8° 0° 8°
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
Figure 16: D
(in millimeters)
10.30
2
PAK Foot Print Dimensions
16.90
1.30
8.90
3.70
5.08
7/10
Page 8
BTA12, BTB12 and T12 Series
Figure 17: TO-220AB Insulated and non insulated) Package Mechanical Data
B
C
b2
REF.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
DIMENSIONS
L
I
A
F
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
b1 0.61 0.88 0.024 0.034
l4
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
a1
l3
l2
a2
c2
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
I 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
b1
e
M
c1
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102
Figure 18: I
2
PAK Package Mechanical Data
DIMENSIONS
REF.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
B 0.70 0.93 0.028 0.037
B1 1.20 1.38 0.047 0.054
B2 1.25 1.40 0.049 0.055
C 0.45 0.60 0.018 0.024
C2 1.21 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
e 2.44 2.64 0.096 0.104
E 10.00 10.28 0.394 0.405
L 13.10 13.60 0.516 0.535
L1 3.75 0.147
L2 1.27 1.40 0.050 0.055
V5° 5°
V4 45° 45°
8/10
Page 9
BTA12, BTB12 and T12 Series
Table 8: Ordering Information
Ordering type Marking Package Weight Base qty Delivery mode
BTA/BTB12-xxxyzRG BTA/BTB12-xxxyz TO-220AB 2.3 g 50 Tube
T1205-xxxG T1205-xxxG
T1205-xxxG-TR T1205-xxxG 1000 Tape and reel
T1235-xxxG T1235xxxG
T1235-xxxG-TR T1235xxxG 1000 Tape & reel
T1235-xxxR T1235-xxxR
Note: xxx = voltage, yy = sensitivity, z = type
D
D
I
2
PAK
2
PAK
2
PAK
1.5 g
1.5 g
1.5 g 50 Tube
50 Tube
50 Tube
Table 9: Revision History
Date Revision Description of Changes
Sep-2002 6A Last update.
2
1. I
01-Jun-2005 7
PAK package added.
2. TO-220AB delivery mode changed from bulk to tube.
28-Jul-2005 8 T1205 added
9/10
Page 10
BTA12, BTB12 and T12 Series
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by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
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