ST MICROELECTRONICS 27C4001-90 Datasheet

4 Mbit (512Kb x 8) UV EPROM and OTP EPROM
Feature summary
5V ± 10% supply voltage in Read operation
Access time: 35ns
Low power consumption:
Programming voltage: 12.75V ± 0.25V
Programming time: 100µs/Word
Electronic signature
– Manufacturer Code: 20h – Device Code: 41h
Packages
– ECOPACK® compliant versions
M27C4001
32
1
FDIP32W (F)
32
1
PDIP32 (B)
PLCC32 (C)
TSOP32 (N) 8 x 20 mm
March 2006 Rev 4 1/24
www.st.com
1
Contents M27C4001
Contents
1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Two Line Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 System Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6 PRESTO II Programming Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.8 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.9 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11
3 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24
M27C4001 List of tables
List of tables
Table 1. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 3. Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 4. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 5. AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 7. Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 8. Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 9. Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 10. Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 11. Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 12. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical data. . . . . . . 18
Table 13. PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data . . . . . . . . . . . . . 19
Table 14. PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data . . . . . . . . . . . . 20
Table 15. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Mechanical Dat a. . . . 21
Table 16. Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3/24
List of figures M27C4001
List of figures
Figure 1. Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. DIP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. TSOP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 8. Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 10. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline. . . . . . . . . . . . . . 18
Figure 11. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 19
Figure 12. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 20
Figure 13. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline . . . . . . . . . . . 21
4/24
M27C4001 Summary description

1 Summary description

The M27C4001 is a 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems requiring large programs and is organised as 524,288 by 8 bits.
The FDIP32W (window ceramic frit-seal package) has a transparent lid which allows the user to expose the chip to ultra viol et light to er ase the bit pattern. A ne w pattern can then be written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not required, the M27C4001 is off er ed in PDIP32 , PLCC32 an d TSOP32 ( 8 x 20 mm) p ac kages .
In order to meet environmental requirements, ST offers the M27C4001 in ECOPACK® packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 1. Logic Diagram

V
CC
19
A0-A18 Q0-Q7
E
G

Table 1. Signal names

A0-A18 Address Inputs Q0-Q7 Data Outputs E Chip Enable G V
PP
V
CC
V
SS
M27C4001
V
SS
Output Enable Program Supply Supply Voltage Ground
V
PP
8
AI00721B
5/25
Summary description M27C4001

Figure 2. DIP Connections

1
V
PP
A15 A12
Q0
Q2 SS
A7 A6 A5 A4 A3 A2 A1 A0
2 3 4 5 6 7 8
M27C4001
9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
AI00722
V
CC
A18A16 A17 A14 A13 A8 A9 A11 G A10 E Q7 Q6 Q5Q1 Q4 Q3V

Figure 3. LCC Connections

A7 A6 A5 A4 A3 A2 A1 A0
Q0
9
A12
A15
M27C4001
Q1
Q2
A16
1
17
SS
V
VPPV
32
Q3
CC
Q4
A18
Q5
A17
25
Q6
A14 A13 A8 A9 A11 G A10 E Q7
AI00723
6/25
M27C4001 Summary description

Figure 4. TSOP Connections

A11 G
1
32 A9 A8
A13 A14 A17 A18
V
CC
V
PP
8 9
M27C4001
(Normal)
25
24
A16 A15 A12
A7 A6 A5 A4 A3
16 17
AI01155B
A10 E Q7 Q6 Q5 Q4 Q3 V
SS
Q2 Q1 Q0 A0 A1 A2
7/25
Device operation M27C4001

2 Device operation

The operating modes of the M27C4001 are listed in the Operating Modes table. A single power supply is required in t he read mod e. All inputs are TTL levels except for V on A9 for Electronic Signature.

2.1 Read Mode

The M27C4001 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E device selection. Out put Enable (G the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (t availab le a t th e outpu t aft er a de lay of t been low and the addresses have been stable f or at least t

2.2 Standby Mode

The M27C4001 has a standby mode which reduces the supply curr ent from 30mA t o 100µA. The M27C4001 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mo de, the ou tputs are in a high impedance stat e, indepe ndent of the G
input.
) is the power control and should be u sed for
) is the output control and should be used to gate data to
) is equal to the delay from E to output (t
AVQV
from the falling edge of G, assuming that E has
GLQV
AVQV-tGLQV
ELQV
.
and 12V
PP
). Data is

2.3 Two Line Output Control

Because EPROMs are usually used in larger memory arrays, this product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows:
a) the lowest possible memory power dissipation, b) complete assurance that output bus contention will not occur.
For the most efficient use of these two control lines, E primary device selecting function, while G devices in the array and connected to the READ ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device.
should be decoded and used as the
should be made a common connection to all
line from the system control bus. This
8/25
M27C4001 Device operation

2.4 System Considerations

The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the devices. The supply current, I
, has three segments that are of interest to
CC
the system designer: the standby current le v el, the activ e cur rent le v el, a nd tran sient current peaks that are produced by the f alling an d rising edges of E
. The magnitude of the tra nsient current peaks is dependent on the capacitive and inductive loading of the device at the output. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1µF ceramic capacitor be used on every de vice be tween V
and VSS. This should
CC
be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used between V
and VSS for ev ery eight devices . The bulk capacitor sh ould be located near the
CC
power supply connection point. The purpose of the bulk capacitor is to o v ercome the v oltage drop caused by the inductive effects of PCB traces.

2.5 Programming

When delivered (and after each erasur e f or UV EPR OM), all bits of t he M27C4001 are in the '1' state. Data is introduced by selectively programming '0's into the desired bit locations. Although only '0's will be programmed, both '1's and '0's can be present in the data word. The only way to change a ' 0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The M27C4001 is in the programming mode when V pulsed to V
. The data to be programmed is applied to 8 bits in parallel to the data output
IL
pins. The levels required for the address and data inputs are TTL. V
6.25V ± 0.25V.
input is at 12.75V, G is at VIH and E is
PP
is specified to be
CC

2.6 PRESTO II Programming Algorithm

PRESTO II Programming Algorithm allows the whole array to be programmed with a guaranteed margin, in a typical time of 52.5 seconds. Programming with PRESTO II consists of applying a sequence of 100µs program pulses to each byte until a correct verify occurs (see Figure 5). During programming and verify oper ation, a MARGIN MODE circuit is automatically activated in order to guarantee that each cell is programmed with enough margin. No overprogram pulse is applied since the verify in MARGIN MODE provides the necessary margin to each programmed cell.
9/25
Device operation M27C4001

Figure 5. Programming Flowchart

VCC = 6.25V, VPP = 12.75V
n = 0
E = 100µs Pulse
NO
NO
VERIFY
YES
Last
NO
Addr
YES
CHECK ALL BYTES
1st: VCC = 6V
2nd: VCC = 4.2V
++ Addr
AI00760B
YES
++n
= 25
FAIL

2.7 Program Inhibit

Programming of multiple M27C4001s in parallel with different data is also easily accomplished. Except for E
, all like inputs including G of the parallel M27C4001 may be common. A TTL low level pulse applied to a M27C4001's E program that M27C4001. A high level E programmed.

2.8 Program Verify

A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The v erify is accomplished with G V
at 6.25V.
CC

2.9 Electronic Signature

The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the M27C4001. To activate the ES mode, the progr amm ing e qui pme nt must force 11.5V to 12.5V on address line A9 of the M27C4001 with V device outputs by toggling address line A0 from V held at V
during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer
IL
code and byte 1 (A0 = V M27C4001, these two identifier bytes are given in Table 3 and can be read-out on outputs Q7 to Q0.
= V
PP
CC
) the device identifier code. For the STMicroelectronics
IH
input, with VPP at 12.75V, will
input inhibits the other M27C4001s from being
at VIL, E at VIH, VPP at 12.75V and
= 5V. Two identifier bytes may then be sequenced from the
to VIH. All other address lines must be
IL
10/25
M27C4001 Device operation

2.10 Erasure operation (applies to UV EPROM)

The erasure characteristics of the M27 C4001 are such that erasure begins when the cells are exposed to light with w a velen gths shorter than approximately 400 0 Å. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å range. Data shows that constant exposure to room level fluorescent lighting could erase a typical M27C4001 in about 3 years, while it would take approximately 1 week to cause erasure when exposed t o direct sunlight. If the M27C4001 is to be e xposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C4001 window to prevent unintentional erasure. The recommended erasure procedure for the M27C4001 is exposure to short wave ultraviolet light which has wavelength of 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 15 W-sec/cm 15 to 20 minutes using an ultrav iolet lamp with 1200 0 µW/cm should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure.

Table 2. Operating Modes

(1)
2
. The erasure time with this dosage is approximately
2
power rating. The M27C4001
Mode E G A9 V
Read V Output Disable V Program V Verify V Program Inhibit V Standby V Electronic Signature V
1. X = V

Table 3. Electronic Signature

or VIL, VID = 12V ± 0.5V.
IH
IL IL
Pulse V
IL
IH IH IH IL
V
IL
V
IH IH
V
IL
V
IH
XV XV XVPPData In XVPPData Out XVPPHi-Z
XXV
V
IL
V
ID
CC CC
CC
pp
or V or V
or V
V
CC
SS SS
SS
Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data
Manufacturer’s Code
Electronic Signature
V
V
00100000 20h
IL
01000001 41h
IH
Q7 - Q0
Data Out
Hi-Z
Hi-Z
Codes
11/25
Maximum rating M27C4001

3 Maximum rating

Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any ot her conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may aff ect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.

Table 4. Absolute Maximum Ratings

Symbol Parameter Value Unit
(1)
–40 to 125 °C
T
T
V
V
V
V
T
A
BIAS
STG
IO
CC
A9
PP
Ambient Operating Temperature Temp eratu re U nder Bias –50 to 125 °C Storage Temperature –65 to 150 °C
(2)
Input or Output Voltage (except A9) –2 to 7 V Supply Voltage –2 to 7 V
(2)
A9 Voltage –2 to 13.5 V Program Supply Voltage –2 to 14 V
1. Depends on range.
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period
less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns.
12/25
M27C4001 DC and AC parameters

4 DC and AC parameters

This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters.

Table 5. AC Measurement Conditions

High Speed Standard
Input Rise and Fall Times ≤ 10ns ≤ 20ns Input Pulse Voltages 0 to 3V 0.4 to 2.4V Input and Output Timing Ref. Voltages 1.5V 0.8 and 2V

Figure 6. AC Testing Input Output Waveform

High Speed
3V
1.5V
0V
Standard
2.4V
0.4V

Figure 7. AC Testing Load Circuit

DEVICE UNDER
TEST
CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance
2.0V
0.8V
AI01822
1.3V
1N914
3.3k
OUT
CL
AI01823B
13/25
DC and AC parameters M27C4001

Table 6. Capacitance

(1) (2)
Symbol Parameter Test Condition Min Max Unit
C
IN
C
OUT
= 25 °C, f = 1 MHz.
1. T
A
2. Sampled only, not 100% tested.
.

Table 7. Read Mode DC Characteristics

Input Capacitance VIN = 0V 6 pF Output Capacitance V
= 0V 12 pF
OUT
(1) (2)
Symbol Parameter Test Condition Min Max Unit
I
V
I
I
I
CC1
I
CC2
I V
IH
V
Input Leakage Current 0V ≤ VIN ≤ V
LI
Output Leakage Current 0V ≤ V
LO
E
CC
Supply Current
= VIL, G = VIL,
I
= 0mA, f = 5MHz
OUT
Supply Current (Standby) TTL E = V Supply Current (Standby)
CMOS Program Current VPP = V
PP
Input Low Voltage –0.3 0.8 V
IL
(3)
Input High Voltage 2 VCC + 1 V Output Low Voltage IOL = 2.1mA 0.4 V
OL
> VCC – 0.2V 100 µA
E
OUT
≤ V
IH
CC
CC
CC
±10 µA ±10 µA
30 mA
1mA
10 µA
Output High Voltage TTL IOH = –400µA2.4 V
V
OH
Output High Voltage CMOS I
1. T
= 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = V
A
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after V
3. Maximum DC voltage on Output is VCC +0.5V.

Table 8. Programming Mode DC Characteristics

= –100µAV
OH
(1) (2)
CC
CC
– 0.7V V
.
PP.
Symbol Parameter Test Condition Min M ax Unit
I
Input Leakage Current 0 ≤ VIN ≤ V
LI
I I V V
V
V
V
1. T
2. V
Supply Current 50 mA
CC
Program Current E = V
PP
Input Low Voltage –0.3 0.8 V
IL
Input High Voltage 2 VCC + 0.5 V
IH
Output Low Voltage IOL = 2.1mA 0.4 V
OL
Output High Voltage TTL IOH = –400µA2.4 V
OH
A9 Voltage 11.5 12.5 V
ID
= 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V.
A
must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
CC
14/25
CC
IL
±10 µA
50 mA
M27C4001 DC and AC parameters

Figure 8. Read Mode AC Waveforms

A0-A18
E
G
Q0-Q7

Table 9. Read Mode AC Characteristics

VALID
tAVQV
tGLQV
tELQV
(1) (2)
Symbol Alt Parameter Test Condition
t
AVQVtACC
t
ELQVtCE
Address Valid to Output Valid
Chip Enable Low to Output Valid
= VIL, G = V
E
G
= V
IL
VALID
tAXQX
tEHQZ
tGHQZ
M27C4001
(3)
-45
(3)
Min Max Min Max Min Max
IL
35 45 55 ns
35 45 55 ns
-55
AI00724B
(3)
Hi-Z
Unit-35
t
GLQVtOE
(4)
t
EHQZ
(4)
t
GHQZ
t
AXQXtOH
1. T
= 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = V
A
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after V
3. Speed obtained with High Speed AC measurement conditions.
4. Sampled only, not 100% tested.
Output Enable Low to Output Valid
Chip Enable High to
t
DF
Output Hi-Z Output Enable High
t
DF
to Output Hi-Z Address Transition
to Output Transition
= V
E
IL
= V
G
IL
E
= V
IL
= VIL, G = VIL000ns
E
20 25 30 ns
030030030ns
030030030ns
CC
PP
15/25
DC and AC parameters M27C4001

Table 10. Read Mode AC Characteristics

(1) (2)
M27C4001
Symbol Alt Parameter Test Condition
Min Max Min Max Min Max
t
AVQVtACC
t
ELQVtCE
t
GLQVtOE
(3)
t
EHQZ
(3)
t
GHQZ
t
AXQXtOH
1. T
= 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = V
A
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Sampled only, not 100% tested.
Address Valid to Output Valid
Chip Enable Lo w to Output Valid
Output Enable Low to Output Valid
Chip Enable High to
t
DF
Output Hi-Z Output Enable High
t
DF
to Output Hi-Z Address Transition
to Output Transition
= VIL, G = V
E
= V
G
E
= V
= V
G
= V
E
= VIL, G = V
E
IL
IL
IL
IL
IL
IL
70 80 100 ns
70 80 100 ns
35 40 50 ns
030030030ns
030030030ns
000ns
CC
Unit-70 -80/-90 -10/-12/-15
16/25
M27C4001 DC and AC parameters

Figure 9. Programming and Verify Modes AC Waveforms

A0-A18
tAVPL
Q0-Q7
V
PP
V
CC
E
G

Table 11. Programming Mode AC Characteristics

DATA IN DATA OUT
tQVEL
tVPHEL
tVCHEL
tELEH
PROGRAM
VALID
tEHQX
tQXGL
tGLQV
VERIFY
(1) (2) (3)
tGHQZ
tGHAX
AI00725
Symbol Alt Parameter Test Condition Min Max Unit
t
AVEL
t
QVEL
t
VPHELtVPSVPP
t
VCHELtVCSVCC
t
ELEH
t
EHQX
t
QXGLtOES
t
GLQV
t
GHQZtDFP
t
GHAX
t
Address Valid to Chip Enable Low 2 µs
AS
t
Input Valid to Chip Enable Low 2 µs
DS
High to Chip Enable Low 2 µs
High to Chip Enable Low 2 µs
t
Chip Enable Program Pulse Width 95 105 µs
PW
t
Chip Enable High to Input Transition 2 µs
DH
Input Transition to Output Enable Low 2 µs
t
Output Enable Low to Output Valid 100 ns
OE
Output Enable High to Output Hi-Z 0 130 ns Output Enable High to Address
t
AH
Transition
0ns
1. T
= 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V
A
must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. V
CC
3. Sampled only, not 100% tested.
17/25
Package mechanical M27C4001

5 Package mechanical

Figure 10. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline

A2
B1 B
D2
D
S
N
1
1. Drawing is not to scale.
T able 12. FDIP32W - 32 pin Ceramic Frit-seal DIP with window , pac kage mechanic al
A3
A1AL e
E1 E
α
C
eA eB
FDIPW-a
data
millimeters inches
Symbol
Typ Min Max Typ Min Max
A5.720.225 A1 0.51 1.40 0.020 0.055 A2 3.91 4.57 0.154 0.180 A3 3.89 4.50 0.153 0.177
B 0.41 0.56 0.016 0.022 B1 1.45 0.057
C 0.23 0.30 0.009 0.012
D 41.73 42.04 1.643 1.655
D238.10– –1.500– –
e2.54– –0.100– –
E 15.24 0.600 – E1 13.06 13.36 0.514 0.526 eA 14.99 0.590 – eB 16.18 18.03 0.637 0.710
L 3.18 4.10 0.125 0.161
N32 32
S 1.52 2.49 0.060 0.098
Ø7.11– –0.280– –
α 11° 11°
18/25
M27C4001 Package mechanical

Figure 11. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline

A2
A1AL
b1 b e
D2
D
S
N
E1 E
1
1. Drawing is not to scale.

Table 13. PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data

α
c
eA
PDIP-C
millimeters inches
Symbol
Typ Min Max Typ Min Max
A4.830.190 A1 0.38 0.015 A2 3.81 0.150
b 0.41 0.53 0.016 0.021 b1 1.14 1.65 0.045 0.065
c 0.23 0.38 0.009 0.015
D 41.78 42.29 1.645 1.665 eA 15.24 0.600
e2.54– –0.100– –
E 15.24 15.88 0.600 0.625 E1 13.46 13.97 0.530 0.550
S 1.65 2.21 0.065 0.087
L 3.05 3.56 0.120 0.140
α 15° 15°
N32 32
19/25
Package mechanical M27C4001

Figure 12. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline

D
D1
1 N
E3
D3
D2 D2
1. Drawing is not to scale.

Table 14. PLCC32 - 32 lead Plastic Leaded Chip Carrier , package mechanical data

E1 E
F
0.51 (.020)
1.14 (.045)
R
A1 A2
B1
E2
e
B
E2
A
CP
PLCC-A
millimeters inches
Symbol
Typ Min Max Typ Min Max
A 3.18 3.56 0.125 0.140 A1 1.53 2.41 0.060 0.095 A2 0.38 0.015
B 0.33 0.53 0.013 0.021 B1 0.66 0.81 0.026 0.032
CP 0.10 0.004
D 12.32 12.57 0.485 0.495
D1 11.35 11.51 0.447 0.453 D2 4.78 5.66 0.188 0.223 D3 7.62 0.300
E 14.86 15.11 0.585 0.595 E1 13.89 14.05 0.547 0.553 E2 6.05 6.93 0.238 0.273 E310.16– –0.400– –
e1.27– –0.050– –
F 0.00 0.13 0.000 0.005
R0.89– –0.035– –
N32 32
20/25
M27C4001 Package mechanical

Figure 13. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline

A2
1
N/2
D1
D
DIE
TSOP-a
1. Drawing is not to scale.
Table 15. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package
N
e
E
B
A
CP
C
LA1 α
Mechanical Data
millimeters inches
Symbol
Typ Min Max Typ Min Max
A 1.200 0.0472 A1 0.050 0.150 0.0020 0.0059 A2 0.950 1.050 0.0374 0.0413
B 0.170 0.250 0.0067 0.0098
C 0.100 0.210 0.0039 0.0083
CP 0.100 0.0039
D 19.800 20.200 0.7795 0.7953
D1 18.300 18.500 0.7205 0.7283
e 0.500 0.0197
E 7.900 8.100 0.3110 0.3189
L 0.500 0.700 0.0197 0.0276
N32 32
α
21/25
Part numbering M27C4001

6 Part numbering

Table 16. Ordering Information Scheme

Example: M27C4001 -45 X C 1
Device Type
M27
Supply Voltage
C = 5V
Device Function
4001 = 4 Mbit (512Kb x 8)
Speed
(1)
-35
= 35 ns
(1)
-45
= 45 ns
(1)
-55
= 55 ns
-70 = 70 ns
-80 = 80 ns
-90 = 90 ns
-10 = 100 ns
-12 = 120 ns
-15 = 150 ns
Tolerance
V
CC
blank = ± 10% X = ± 5%
Package
F = FDIP32W B = PDIP32 C = PLCC32 N = TSOP32: 8 x 20 mm
Temperature Range
1 = 0 to 70 °C 6 = –40 to 85 °C
1. High Speed, see AC Characteristics section for further information.
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
22/25
M27C4001 Revision history

7 Revision history

Table 17. Document revision history

Date Revision Changes
July 1998 1 First Issue
09/25/00 2 AN620 Reference removed 11/29/00 3 PLCC codification changed (Table 16.)
Document converted to new template (sections added, information moved). LCCC32W package removed. Package specifications
28-Mar-2006 4
updated (see Section 5: Package mechanical). Packages are ECOPACK® compliant. X and TR options removed from Table 16:
Ordering Information Scheme.
23/25
M27C4001
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