ST VNQ830P-E User Manual

VNQ830P-E

Quad channel high-side driver

Features

Typ e R

VNQ830P-E 65 mΩ

1. Per each channel.

■ ECOPACK

■ Automotive Grade: compliance with AEC

DS(on)

(1)

®

: lead free and RoHS compliant

guidelines

■ Very low standby current

■ CMOS compatible input

■ On-state open-load detection

■ Off-state open-load detection

■ Thermal shutdown protection and diagnosis

■ Undervoltage shutdown

■ Overvoltage clamp

■ Output stuck to V

■ Load current limitation

■ Reverse battery protection

■ Electrostatic discharge protection

CC

I

OUT

6A 36V

detection

V

CC

SO-28 (double island)

Description

The VNQ830P-E is a quad HSD formed by
assembling two VND830P-E chips in the same
SO-28 package. The VND830P-E is a monolithic
device made using| STMicroelectronics™
VIPower™ M0-3 technology. The VNQ830P-E is
intended for driving any type of multiple load with
one side connected to ground.

The active V
device against low energy spikes (see ISO7637
transient compatibility table). Active current
limitation combined with thermal shutdown and
automatic restart protects the device against over­load. The device detects the open-load condition
in both the on and off-state.

pin voltage clamp protects the

CC

In the off-state the device detects if the output is
shorted to V

. The device automatically turns off

CC

in the case where the ground pin becomes
disconnected.

Table 1. Device summary

Package

SO-28 VNQ830P-E VNQ830PTR-E

February 2011 Doc ID 10861 Rev 4 1/27

Tube Tape and reel

www.st.com

1

VNQ830P-E Contents

Contents

1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 17

3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 17

3.1.2 Solution 2: a diode (D

3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

) in the ground line . . . . . . . . . . . . . . . . . . . . 18

GND

3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.4 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.5 Maximum demagnetization energy (V

= 13.5 V) . . . . . . . . . . . . . . . . . 20

CC

4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

4.1 SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.2 SO-28 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Doc ID 10861 Rev 4 2/27

VNQ830P-E List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 4. Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 7. V
Table 8. Switching (V

Table 9. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 10. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 11. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 12. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Table 13. Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Table 14. Thermal calculation according to the PCB heatsink area . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Table 15. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 16. SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

- output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

CC

= 13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

CC

Doc ID 10861 Rev 4 3/27

VNQ830P-E List of figures

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 5. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 10. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 11. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 12. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 13. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 14. On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 15. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 16. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 17. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 18. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 19. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 20. Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 21. Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 22. Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 23. Open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 24. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 25. Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 26. Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 27. SO-28 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 28. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 22

Figure 29. SO-28 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 30. Thermal fitting model of a quad channel HSD in SO-28. . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 31. SO-28 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 32. SO-28 tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 33. SO-28 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Doc ID 10861 Rev 4 4/27

VNQ830P-E Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

V

CC1,2

V

cc

CLAMP

OVERVOLTAGE

UNDERVOLTAGE

GND1,2

INPUT1

STAT US1

INPUT2

STAT US2

GND3,4

INPUT3

STAT US3

INPUT4

STAT US4

OVERTEMP. 1

OVERTEMP. 2

V

cc

CLAMP

OVERTEMP. 3

OVERTEMP. 4

LOGIC

LOGIC

CLAMP 1

DRIVER 1

CURRENT LIMITER 1

OPEN-LOAD ON 1

OPEN-LOAD OFF 1

OVERVOLTAGE

UNDERVOLTAGE

CLAMP 3

DRIVER 3

CURRENT LIMITER 3

OPEN-LOAD ON 3

OPEN-LOAD OFF 3

CLAMP 2

DRIVER 2

CURRENT LIMITER 2

OPEN-LOAD ON 2

OPEN-LOAD OFF 2

CLAMP 4

DRIVER 4

CURRENT LIMITER 4

OPEN-LOAD ON 4

OPEN-LOAD OFF 4

OUTPUT1

OUTPUT2

V

CC3,4

OUTPUT3

OUTPUT4

Doc ID 10861 Rev 4 5/27

VNQ830P-E Block diagram and pin description

Figure 2. Configuration diagram (top view)

VCC1,2

1

GND 1,2

INPUT1

STATUS1

STATUS2

INPUT2

1,2

V

CC

3,4

V

CC

GND 3,4

INPUT3

STATUS3

STATUS4

INPUT4

V

3,4

CC

Table 2. Suggested connections for unused and not connected pins

14

28

15

V

OUTPUT1

OUTPUT1

OUTPUT1

OUTPUT2

OUTPUT2

OUTPUT2

OUTPUT3

OUTPUT3

OUTPUT3

OUTPUT4

OUTPUT4

OUTPUT4

V

CC

CC

1,2

3,4

Connection / pin Status N.C. Output Input

Floating X X X X

To ground X

Through 10 KΩ

resistor

Doc ID 10861 Rev 4 6/27

VNQ830P-E Electrical specifications

2 Electrical specifications

2.1 Absolute maximum ratings

Stressing the device above the rating listed in Ta ble 3 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to Absolute Maximum Rating conditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality
document.

Table 3. Absolute maximum ratings

Symbol Parameter Value Unit

V

- V

- I

I

- I

I

V

E

T

CC

CC

GND

OUT

OUT

I

IN

STAT

ESD

MAX

P

tot

T

stg

DC supply voltage 41 V

Reverse DC supply voltage - 0.3 V

DC reverse ground pin current - 200 mA

DC output current Internally limited A

Reverse DC output current - 6 A

DC input current +/- 10 mA

DC status current +/- 10 mA

Electrostatic discharge (Human Body Model: R=1.5 KΩ;
C = 100 pF)
–INPUT
–STATUS
–OUTPUT
–V

CC

Maximum switching energy
(L = 1.5 mH; R

= 0 Ω; V

L

Power dissipation (per island) at T

Junction operating temperature Internally limited °C

j

= 13.5 V; T

bat

= 150 °C; IL = 9 A)

jstart

= 25 °C 6.25 W

lead

4000
4000
5000
5000

140 mJ

Storage temperature - 55 to 150 °C

V
V
V
V

Doc ID 10861 Rev 4 7/27

VNQ830P-E Electrical specifications

2.2 Thermal data

Table 4. Thermal data (per island)

Symbol Parameter Value Unit

R

thj-lead

R

thj-amb

R

thj-amb

Thermal resistance junction-lead 15 °C/W

Thermal resistance junction-ambient
(one chip ON)

Thermal resistance junction-ambient
(two chips ON)

1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35 µm thick) connected
to all V

2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35 µm thick) connected to
all V

pins. Horizontal mounting and no artificial air flow.

CC

pins. Horizontal mounting and no artificial air flow.

CC

2.3 Electrical characteristics

Values specified in this section are for 8 V < V
otherwise stated.

Figure 3. Current and voltage conventions

I

S3,4

V

CC3,4 V

I

IN1

V

STAT3

V

IN4

V

I

STAT1

I

IN2

I

STAT2

I

IN3

I

STAT3

I

IN4

I

STAT4

STAT4

V

IN1

V

STAT1

V

IN2

V

STAT2

V

IN3

INPUT1

STATUS1

INPUT2

STATUS2

INPUT3

STATUS3

INPUT4

STATUS4

GND

(1)

60

(1)

46

< 36 V; -40°C < Tj < 150°C, unless

CC

V

CC3,4

3,4

I

GND3,4

V

CC1,2

OUTPUT1

OUTPUT2

OUTPUT3

OUTPUT4

GND

1,2

I

GND1,2

I

OUT1

I

OUT2

I

OUT3

I

OUT4

V

OUT4

V

F1(1)

OUT3

I

V

S1,2

OUT2

44

31

V

(2)

(2)

OUT1

V

°C/W

°C/W

CC1,2

1. VFn = V

Table 5 . Power

CCn

- V

during reverse battery condition.

OUTn

Symbol Parameter Test conditions Min. Typ. Max. Unit

V

V

V

Operating supply

CC

voltage

Undervoltage shutdown 3 4 5.5 V

USD

Overvoltage shutdown 36 V

OV

5.5 13 36 V

Doc ID 10861 Rev 4 8/27

VNQ830P-E Electrical specifications

Table 5. Power (continued)

Symbol Parameter Test conditions Min. Typ. Max. Unit

R

I

L(off1)

I

L(off2)

I

L(off3)

I

L(off4)

Table 6. Protections

Symbo

T

TSD

T

T

hyst

t

SDL

I

lim

V

demag

On-state resistance

ON

Supply current

I

S

Off-state output current V

Off-state output current V

Off-state output current

Off-state output current

l

Parameter Test conditions Min. Typ. Max. Unit

Shutdown temperature 150 175 200 °C

Reset temperature 135 °C

R

Thermal hysteresis 7 15 °C

Status delay in overload
conditions

Current limitation

Turn-off output clamp
voltage

I

= 2 A; Tj = 25°C

OUT

= 2 A; V

I

OUT

Off-state; V

= V

V

IN

OUT

Off-state; V

= V

V

IN

OUT

On-state; V

= 0 A

I

OUT

= V

IN

OUT

= 0V; V

IN

V

= V

IN

OUT

= 125°C

T

j

V

= V

IN

OUT

=25°C

T

j

> T

T

j

TSD

V

= 13 V 6 9 15 A

CC

5.5 V < V

I

= 2 A;

OUT

L = 6 mH

65

> 8 V

CC

= 13 V;

CC

= 0 V

= 13 V;

CC

= 0 V; Tj = 25°C

= 13 V; V

CC

IN

= 5 V;

130mΩmΩ

12 40 µA

12 25 µA

57mA

= 0 V 0 50 µA

= 3.5 V -75 0 µA

OUT

= 0V; V

= 0 V; V

CC

CC

= 13 V;

= 13 V;

5µA

3µA

20 µs

< 36 V 15 A

CC

V

CC

-41 V

CC

-48 V

-55 V

CC

Note: To ensure long term reliability under heavy overload or short circuit conditions, protection

and related diagnostic signals must be used together with a proper software strategy. If the
device is subjected to abnormal conditions, this software must limit the duration and number
of activation cycles.

Table 7 . VCC - output diode

Symbol Parameter Test conditions Min. Typ. Max. Unit

V

F

Forward on voltage - I

Doc ID 10861 Rev 4 9/27

= 1.2 A; Tj = 150°C — — 0.6 V

OUT