ST VNQ810P-E User Manual

Features

Type R

VNQ810P-E 160mΩ

1. Per each channel.

DS(on)

(1)

OUT

3.5A

(1)

36V

VNQ810P-E

Quad channel high-side driver

■ ECOPACK

■ Automotive Grade: compliance with AEC

: lead free and RoHS compliant

guidelines

■ Very low standby current

■ CMOS compatible input

■ On-state open-load detection

■ Off-state open-load detection

■ Thermal shutdown protection and diagnosis

■ Undervoltage shutdown

■ Overvoltage clamp

■ Output stuck to V

■ Load current limitation

■ Reverse battery protection

■ Electrostatic discharge protection

detection

SO-28 (double island)

Description

The VNQ810P-E is a quad HSD formed by assembling two VND810P-E chips in the same SO-28 package. The VNQ810P-E is a monolithic device made by using STMicroelectronics VIPower™ M0-3 technology, intended for driving any kind of load with one side connected to ground. Active V device against low energy spikes (see ISO7637 transient compatibility table).

Active current limitation combined with thermal shutdown and automatic restart protects the device against overload. The device detects open-load condition both in on and off-state. Output shorted to V Device automatically turns off in case of ground pin disconnection.

pin voltage clamp protects the

is detected in the off-state.

Table 1. Device summary

Order codes

Package

Tube Tape and reel

SO-28 (double island) VNQ810P-E VNQ810PTR-E

April 2010 Doc ID 17387 Rev 1 1/28

www.st.com

Contents VNQ810P-E

Contents

1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 17

3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 17

3.1.2 Solution 2: a diode (D

3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

) in the ground line . . . . . . . . . . . . . . . . . . . . 18

GND

3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.4 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.5 Maximum demagnetization energy (V

= 13.5V) . . . . . . . . . . . . . . . . . . 20

4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

4.1 SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.2 SO-28 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5.3 SO-28 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

2/28 Doc ID 17387 Rev 1

VNQ810P-E List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 4. Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 5. Power output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 7. V

Table 8. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 9. Switching (V

Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 10. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 11. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 12. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 13. Electrical transient requirements on V Table 14. Electrical transient requirements on V Table 15. Electrical transient requirements on V

Table 16. Thermal calculation according to the PCB heatsink area . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Table 17. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 18. SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 19. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

- output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

= 13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

pin (part 1/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

pin (part 2/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

pin (part 3/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Doc ID 17387 Rev 1 3/28

List of figures VNQ810P-E

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 4. Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Figure 5. Switching time Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 10. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 11. Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 12. Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 13. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 14. I

Figure 15. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 16. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 17. On-state resistance vs T Figure 18. On-state resistance vs V

Figure 19. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 20. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 21. Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 22. Open-load off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 23. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 24. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 25. Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 26. SO-28 (double island) maximum turn-off current versus load inductance . . . . . . . . . . . . . 20

Figure 27. SO-28 double island PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 28. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 22

Figure 29. SO-28 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 30. Thermal fitting model of a quad channel HSD in SO-28. . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 31. SO-28 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 32. SO-28 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Figure 33. SO-28 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

LIM

vs T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

case

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

case

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4/28 Doc ID 17387 Rev 1

VNQ810P-E Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

CC1,2

CLAMP

OVERVOLTAGE

UNDERVOLTAGE

GND1,2

INPUT1

STAT US1

INPUT2

STAT US2

GND3,4

INPUT3

STAT US3

INPUT4

STAT US4

OVERTEMP. 1

OVERTEMP. 2

CLAMP

OVERTEMP. 3

OVERTEMP. 4

LOGIC

CLAMP 1

DRIVER 1

CURRENT LIMITER 1

OPENLOAD ON 1

OPENLOAD OFF 1

OVERVOLTAGE

UNDERVOLTAGE

CLAMP 3

DRIVER 3

CURRENT LIMITER 3

OPENLOAD ON 3

OPENLOAD OFF 3

CLAMP 2

DRIVER 2

CURRENT LIMITER 2

OPENLOAD ON 2

OPENLOAD OFF 2

CLAMP 4

DRIVER 4

CURRENT LIMITER 4

OPENLOAD ON 4

OPENLOAD OFF 4

OUTPUT1

OUTPUT2

CC3,4

OUTPUT3

OUTPUT4

Doc ID 17387 Rev 1 5/28

Block diagram and pin description VNQ810P-E

Figure 2. Configuration diagram (top view)

VCC1,2

GND 1,2

INPUT1

STATUS1

STATUS2

INPUT2

1,2

3,4

GND 3,4

INPUT3

STATUS3

STATUS4

INPUT4

3,4

Table 2. Suggested connections for unused and not connected pins

OUTPUT1

OUTPUT2

OUTPUT3

OUTPUT4

1,2

3,4

Connection / pin Status N.C. Output Input

Floating X X X X

To ground X

Through 10 KΩ

resistor

6/28 Doc ID 17387 Rev 1

VNQ810P-E Electrical specifications

2 Electrical specifications

2.1 Absolute maximum ratings

Stressing the device above the rating listed in the Ta bl e 5 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE program and other relevant quality document.

Table 3. Absolute maximum ratings

Symbol Parameter Value Unit

-V

-I

OUT

-I

STAT

GND

OUT

ESD

MAX

tot

stg

DC supply voltage 41 V

Reverse DC supply voltage -0.3 V

DC reverse ground pin current -200 mΑ

DC output current Internally limited A

Reverse DC output current -6 A

DC input current +/-10 mA

DC Status current +/-10 mA

Electrostatic discharge (human body model: R = 1.5 KΩ; C=100pF)

- INPUT

- STATUS

- OUTPUT

- V

Maximum switching energy (L = 2.5 mH; R

= 0 Ω; V

= 13.5 V; T

bat

Power dissipation (per island) at T

= 150 °C; IL = 9 A)

jstart

= 25°C 6.25 W

lead

4000 4000 5000 5000

23 mJ

V V V V

Junction operating temperature Internally limited °C

Storage temperature - 55 to 150 °C

2.2 Thermal data

Table 4. Thermal data (per island)

Symbol Parameter Value Unit

thj-lead

thj-amb

1. When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick) connected to all V

2. When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 µm thick) connected to all V

Thermal resistance junction-lead 20 °C/W

Thermal resistance junction-ambient (one chip ON) 60

Thermal resistance junction-ambient (two chips ON) 46

pins. Horizontal mounting and no artificial air flow.

(1)

(2)

°C/W

Doc ID 17387 Rev 1 7/28

Electrical specifications VNQ810P-E

2.3 Electrical characteristics

Values specified in this section are for 8 V < V

otherwise stated.

Figure 3. Current and voltage conventions

S3,4

INPUT1

STATUS1

INPUT2

STATUS2

INPUT3

STATUS3

INPUT4

STATUS4

GND

CC3,4

3,4

CC3,4

IN1

STAT1

IN2

STAT2

IN3

STAT3

1. VFn = V

Table 5. Power output

CCn

- V

during reverse battery condition.

OUTn

IN1

STAT1

IN2

STAT2

IN3

STAT3

IN4

STAT4

IN4

STAT4

< 36 V; -40 °C < Tj < 150 °C, unless

S1,2

GND3,4

CC1,2

OUTPUT1

OUTPUT2

OUTPUT3

OUTPUT4

GND

1,2

GND1,2

OUT1

OUT2

OUT3

OUT4

OUT3

(1)

OUT1

OUT2

CC1,2

Symbol Parameter Test conditions Min. Typ. Max. Unit

(1)

USD

L(off1)

L(off2)

L(off3)

L(off4)

1. Per island.

Operating supply voltage 5.5 13 36 V

(1)

Undervoltage shutdown 3 4 5.5 V

(1)

Overvoltage shutdown 36 V

= 1 A; Tj = 25 °C

On-state resistance

Supply current

Off-state output current V

Off-state output current

OUT

= 1 A; V

OUT

Off-state; V V

= V

OUT

Off-state; V

= V

OUT

On-state; V

=0A

OUT

= V

OUT

= 0V; V

= V

OUT

Tj=125°C

= V

OUT

=25°C

> 8 V

= 13 V;

= 0 V

= 13 V;

= 0 V; Tj = 25 °C

= 13 V; V

= 5 V;

12 40 µA

12 25 µA

= 0 V 0 50 µA

= 3.5 V -75 0 µA

OUT

= 0V; V

= 13 V;

160 320mΩmΩ

57mA

5µA

3µA

8/28 Doc ID 17387 Rev 1

VNQ810P-E Electrical specifications

Table 6. Protections

(1)

Symbol Parameter Test conditions Min. Typ. Max. Unit

demag

1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related

Tabl e 7. VCC - output diode

Shutdown temperature 150 175 200 °C

TSD

Reset temperature 135 °C

Thermal hysteresis 7 15 °C

hyst

Status delay in overload

SDL

conditions

Current limitation

lim

Turn-off output clamp voltage I

diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.

> T

TSD

= 13 V 3.5 5 7.5 A

5.5 V < V

= 1A; L = 6mH VCC-41 VCC-48 VCC-55 V

OUT

< 36 V 7.5 A

20 µs

Symbol Parameter Test conditions Min. Typ. Max. Unit

Table 8. Status pin

Forward on voltage -I

= 0.5 A; Tj = 150 °C - - 0.6 V

OUT

Symbol Parameter Test conditions Min. Typ. Max. Unit

LSTAT

Table 9. Switching (V

Status low output voltage I

STAT

Status leakage current Normal operation; V

Status pin Input capacitance Normal operation; V

STAT

Status clamp voltage

SCL

= 13V)

STAT

= 1.6mA 0.5 V

= 5 V 10 µA

STAT

= 5 V 100 pF

STAT

= 1 mA 6 6.8 8 V

= - 1 mA -0.7 V

Symbol Parameter Test conditions Min. Typ. Max. Unit

= 13 Ω from VIN rising edge

d(on)

d(off)

/dt

OUT

/dt

OUT

Turn-on delay time

Turn-off delay time

Turn-on voltage slope

(on)

Turn-off voltage slope

(off)

to V

R edge to V

R to V

= 1.3 V

OUT

= 13 Ω from VIN falling

= 13 Ω from V

OUT

= 13 Ω from V

OUT

= 11.7 V

OUT

= 10.4 V

= 1.3 V

OUT

= 1.3 V

= 11.7 V

-30 -µs

See

Figure 10

See

Figure 12

-V/µs

Doc ID 17387 Rev 1 9/28

+ 19 hidden pages

ST VNQ810P-E User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Table 1. Device summary

1 Block diagram and pin description

Figure 1. Block diagram

Figure 2. Configuration diagram (top view)

Table 2. Suggested connections for unused and not connected pins

2 Electrical specifications

2.1 Absolute maximum ratings

Table 3. Absolute maximum ratings

2.2 Thermal data

Table 4. Thermal data (per island)

2.3 Electrical characteristics

Figure 3. Current and voltage conventions

Table 5. Power output

Table 6. Protections

Tabl e 7. VCC - output diode

Table 8. Status pin