ST VNQ810M-E User Manual

VNQ810M-E
QUAD CHANNEL HIGH SIDE DRIVER
Table 1. General Features
Type R
VNQ810M-E 150m
(*) Per each channel
CMOS COMPATIBLE INPUTS
ON STATE OP EN L OAD DET ECTIO N
OFF STATE OPEN LOAD DETECTION
SHOR T E D L O A D PROTE C TION
UNDERVOLTAGE AND OVERVOLTAGE
DS(on)
(*) 0.6A (*) 36V
I
out
V
CC
SHUTDOWN
PROTECTION AGAINST LOSS OF GROUND
VERY LOW STAND-BY CURRENT
REVERSE BATTERY PROTECTION (**)
IN COMPLIANCE WITH THE 2002/95/EC
EUROPEAN DIRECT IVE
DESCRIPTION
The VNQ810M-E is a quad HSD formed by assembling two VND810M-E chips in the same SO-28 package. The VNQ810M -E is a monolithic device made by using STMicroelectronics VIPower M0-3 Technology, intended for driving any kind of load with one side connected to ground. Active V
pin voltage clamp protects the
CC
device against low energy spikes (see ISO7637 transient compatibility table).
Figure 1. Package
SO-28 (DOUBLE ISLAND)
Active current limitation combined with thermal shutdown and automatic restart protects the device against overload. The current limitation threshold is aimed at detecting the 21W/12V standard bulb as an overload fault. The device detects open load condition both in on and off state . Output shorted to V
is detected in the off
CC
state. Device automatically turns off in case of ground pin disconnection.
Table 2. Order Codes
Package Tube Tape and Reel
SO-28
Note: (**) See appli c a t i on sche m atic at pa ge 10
VNQ810M-E VNQ810MTR-E
Rev. 1
1/21October 2004
VNQ810M-E
Figure 2. Block Diagram
V
cc
CLAMP
OVERVOLTAGE
UNDERVOLTAGE
V
CC1,2
GND1,2
INPUT1
STATUS1
INPUT2
STATUS2
GND3,4
INPUT3
STATUS3
INPUT4
STATUS4
OVERTEMP. 1
OVERTEMP. 2
V
cc
CLAMP
OVERTEMP. 3
LOGIC
LOGIC
CLAM P 1
DRIVER 1
CURRENT LIMITER 1
OPENLOAD ON 1
OPENLOAD OFF 1
OVERVOLTAGE
UNDERVOLTAGE
CLAMP 3
DRIVER 3
CURRENT LIMITE R 3
OPENLOAD ON 3
OPENLOAD OFF 3
CLAMP 2
DRIVER 2
CURRENT LIMITER 2
OPENLOAD ON 2
OPENLOAD OFF 2
CLAMP 4
DRIVER 4
CURRENT LIMITER 4
OPENLOAD ON 4
OUTPUT1
OUTPUT2
V
CC3,4
OUTPUT3
OUTPUT4
2/21
OVERTEMP. 4
OPENLOAD OFF 4
VNQ810M-E
Table 3. Absolute Maximum Ratings
Symbol Parameter Value Unit
V
- V
- I I
OUT
- I I
I
STAT
V
ESD
E
MAX
P
T
CC
CC
gnd
OUT
IN
tot
T
j
stg
DC Supply Voltage 41 V Reverse DC Supply Voltage -0.3 V DC Reverse Ground Pin Current -200 mA DC Output Current Internally Limited A Reverse DC Output Current -6 A DC Input Current +/- 10 mA DC Status Current +/- 10 mA Electrostatic Discharge (Human Body Model:
R=1.5KΩ; C=100pF)
- INPUT
- STATUS
- OUTPUT
- V
CC
4000 4000 5000 5000
Maximum Switching Energy (L=310mH; R
I
=0.9A)
L
=0Ω; V
L
=13.5V; T
bat
Power dissipation (per island) at T
=150ºC;
jstart
=25°C 6.25 W
lead
174 mJ
Junction Operating Temperature Internally Limited °C Storage Temperature -55 to 150 °C
V V V V
Figure 3. Con fig urat i on Dia g ra m (Top View) & Sugg est ed C o nnections for Unu sed and N.C. Pins
VCC1,2 GND 1,2 INPUT1 STA TUS1 STA TUS2 INPUT2
1,2
V
CC
3,4
V
CC
GND 3,4 INPUT3
STA TUS3 STA TUS4 INPU T 4
V
3,4
CC
1
14
Connection / Pin Status N.C. Output Input
Floating X X X X To Ground X Through 10Kresistor
1,2
V
28
15
CC
OUTPUT1 OUTPUT1 OUTPUT1
OUTPUT2 OUTPUT2
OUTPUT2
OUTPUT3 OUTPUT3 OUTPUT3
OUTPUT4
OUTPUT4
OUTPUT4
3,4
V
CC
3/21
VNQ810M-E
Figure 4. Current and Voltage Conventions
V
CC3,4
V
(*) VFn = V
IN1
V
CCn
STAT1
- V
I
S3,4
I
IN1
I
STAT1
I
IN2
I
V
IN2
V
STAT2
V
IN3
V
STAT3
during reverse battery condition
OUTn
STAT2
I
IN3
I
STAT3
I
IN4
I
STAT4
V
IN4
V
STAT4
INPUT1 STATUS1
INPUT2 STATUS2
INPUT3
STATUS3 INPUT4
STATUS4
GND
V
CC3,4
3,4
I
GND3,4
V
CC1,2
OUTPUT1
OUTPUT2
OUTPUT3
OUTPUT4
GND
1,2
I
GND1,2
I
OUT1
I
OUT2
I
OUT3
I
OUT4
V
OUT4
V
V
F1
OUT3
(*)
I
S1,2
V
OUT2
V
OUT1
V
CC1,2
Table 4. Thermal Data (Per islan d )
Symbol Parameter Value Unit
R
thj-lead
R
thj-amb
R
thj-amb
Thermal Resistance Junction-lead per chip 20 °C/W
Thermal Resistance Junction-ambient (one chip ON) 60 Thermal Resistance Junction-ambient (two chips ON) 46
(1) (1)
44 31
(2) (2)
°C/W °C/W
Note: 1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick) connected to all VCC pins. Horizontal
mounting an d no arti ficial ai r flow
Note: 2. When mounted on a standard single-sided FR-4 board with 6cm
2
of Cu (at least 3 5µm thick) connected to all VCC pins. Hori zontal
mounting an d no arti fi cial ai r flow
4/21
VNQ810M-E
ELECTRICAL CHARACTERISTICS
(8V<V
(Per each channel)
Table 5. Po we r Ou t put
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
V
Note: (**) Per island
<36V; -40°C< Tj <150°C, unless otherwise specified)
CC
(**) Operating Supply Voltage 5.5 13 36 V
CC
(**) Undervoltage Shut-down 3 4 5.5 V
USD
(**) Overvo ltage Shut- down 36 V
OV
I
R
ON
(**) Supply Current
I
S
I
L(off1)
I
L(off2)
I
L(off3)
I
L(off4)
On State Resistance
Off State Output Current VIN=V Off State Output Current VIN=0V; V Off State Output Current VIN=V Off State Output Current VIN=V
=0.5A; Tj=25°C
OUT
I
=0.5A; VCC> 8V
OUT
Off State; V Off State; V
=25°C
T
j
On State; V
OUT
OUT OUT
=13V; VIN=V
CC
=13V; VIN=V
CC
=13V; VIN=5V; I
CC
OUT OUT
=0V =0V;
OUT
=0A
12
12
5
=0V 0 50 µA
=3.5V -75 0 µA
OUT
=0V; VCC=13V; Tj =125°C 5 µA =0V; VCC=13V; Tj =25°C 3 µA
150 300
40
25
7
m m
µA
µA
mA
Table 6. Protection (Per each channel) (See note 1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
T
TSD
T
T
hyst
t
SDL
I
lim
V
demag
Note: 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be
Shut-down Temperature 150 175 200 °C Reset Temperature 135 °C
R
Thermal Hysteresis 7 15 °C Status Delay in Overload
Conditions
Current limitation
Turn-off Output Clamp Voltage
used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the durat i on and number of activation cycl es
Tj>T
TSD
0.7 0.9 1.4
5.5V < V
I
OUT
< 36V
CC
=0.5A VCC-41 VCC-48 VCC-55 V
20 µs
1.4
A A
Table 7. VCC - Output Diode
Symbol Parameter Test Conditions Min Typ Max Unit
V
Forward on Voltage -I
F
=0.53A; Tj=150°C 0.6 V
OUT
5/21
VNQ810M-E
ELECTRICAL CHARACTERISTICS (continued) Table 8. Status Pin (Per each channel)
Symbol Parameter Test Conditions Min Typ Max Unit
V I
LSTAT
C
V
STAT
STAT
SCL
Status Low Output Voltage I
= 1.6 mA 0.5 V
STAT
Status Leakage Current Normal Operation; V Status Pin Input
Capacitance Status Clamp Voltage
Normal Operation; V I
=1mA
STAT
=-1mA
I
STAT
= 5V 10 µA
STAT
= 5V 100 pF
STAT
6 6.8
-0.7
8V
V
Table 9. Switching (Per each channel) (V
CC
=13V)
Symbol Parameter Test Conditions Min Typ Max Unit
=26from VIN rising edge to
R
t
d(on)
t
d(off)
Turn-on Delay Time
Turn-off Delay Time
L
V
=1.3V
OUT
=26from VIN falling edge to
R
L
V
=11.7V
OUT
30 µs
30 µs
See
dV
/dt
OUT
Turn-on Voltage Slope RL=26from V
(on)
=1.3V to V
OUT
OUT
=10.4V
relative
diagram
See
/dt
dV
OUT
Turn-off Voltage Slope RL=26from V
(off)
=11.7V to V
OUT
OUT
=1.3V
relative
diagram
Table 10. Openload Detection
(Per each channel)
Symbol Parameter Test Conditions Min Typ Max Unit
I
OL
t
DOL(on)
Openload ON State Detection Threshold Openload ON State Detection Delay
=5V 20 40 80 mA
V
IN
I
=0A 200 µs
OUT
Openload OFF State
V
OL
Voltage Detection
V
=0V 1.5 2.5 3.5 V
IN
Threshold Openload Detection Delay
t
DOL(off)
at Turn Off
1000 µs
V/µs
V/µs
Table 11. Logic Input
(Per each channel)
Symbol Parameter Test Conditions Min Typ Max Unit
V
V
V
IL
I
IL
V
IH
I
IH
I(hyst)
ICL
Input Low Level 1.25 V Low Level Input Current VIN = 1.25V 1 µA Input High Level 3.25 V High Level Input Current VIN = 3.25V 10 µA Input Hysteresis Voltage 0.5 V
Input Clamp Voltage
I
= 1mA
IN
= -1mA
I
IN
6 6.8
-0.7
8V
6/21
V
Tabl e 12. Truth Tabl e
CONDITIONS INPUT OUTPUT SENSE
VNQ810M-E
Normal Operation
Current Limitation
Overtemperature
Undervoltage
Overvoltage
Output Voltage > V
Output Current < I
Figure 5.
OPENLOAD ST ATUS TIMING (with external pull-up)
V
INn
OL
OL
L
H
L H H
L H
L H
L H
L H
L H
L
H
L X X
(T
(T
< T
j
> T
j
L L
L L
L L
H H
L
H
TSD
TSD
H H
H
) H
) L
H
L
X X
H H
L
H H
L
OVERTEMP STA TUS TIMING
I
< I
OUT
V
> V
OUT
OL
OL
V
INn
Tj > T
TSD
V
STATn
t
DOL(off)
t
DOL(on)
V
STATn
t
SDL
t
SDL
7/21
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