ST VNQ600AP-E User Manual
Features
Type R
VNQ600AP-E 35 mΩ 25 A 36 V
1. Per each channel
DS(on)
(1)
I
lim
V
CC
VNQ600AP-E
Quad channel high side driver
■ DC short circuit current: 25 A
■ CMOS compatible inputs
■ Proportional load current sense
■ Undervoltage and overvoltage shutdown
■ Overvoltage clamp
■ Thermal shutdown
■ Current limitation
■ Very low standby power dissipation
■ Protection against: loss of ground and loss of
V
CC
■ Reverse battery protection
In compliance with the 2002/95/EC european
■
(a)
directive
SO-28 (DOUBLE ISLAND)
Description
The VNQ600AP-E is a quad HSD formed by
assembling two VND600-E chips in the same SO28 package. The VND600-E is a monolithic
device designed in| STMicroelectronics VIPower
M0-3 Technology. The VNQ600AP-E is intended
for driving any type of multiple loads with one side
connected to ground. This device has four
independent channels and four analog sense
outputs which deliver currents proportional to the
outputs currents. Active current limitation
combined with thermal shutdown and automatic
restart protect the device against overload.
Device automatically turns off in case of ground
pin disconnection.
Table 1. Device summary
Order codes
Package
a. See Application schematic on page 14.
Tub e Tap e a n d r e el
SO-28 VNQ600AP-E VNQ600APTR-E
October 2009 Doc ID 10873 Rev 3 1/26
www.st.com
1
Contents VNQ600AP-E
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 14
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.3 Microcontroller I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.5 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 19
4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2 SO-28 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2/26 Doc ID 10873 Rev 3
VNQ600AP-E List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Absolute maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Switching (V
Table 7. V
- output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
CC
Table 8. Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 9. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 10. Current sense (9 V< V
Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 12. Electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 13. Electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 14. Electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 15. Thermal calculation according to the PCB heatsink area . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 16. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 17. SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 18. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
=13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
CC
< 16 V) (see Figure 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
CC
Doc ID 10873 Rev 3 3/26
List of figures VNQ600AP-E
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Switching characteristics (resistive load RL= 2.6 Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 5. Waveforms (per each chip). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 6. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7. IOUT/ISENSE versus IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 8. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 9. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 10. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 11. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 12. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 13. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 14. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 15. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 16. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 17. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 18. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 19. On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 20. Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 21. Demagnetization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 22. SO-28 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 23. Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 21
Figure 24. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 25. Thermal fitting model of a quad channel HSD in SO-28 . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 26. SO-28 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 27. SO-28 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 28. SO-28 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4/26 Doc ID 10873 Rev 3
VNQ600AP-E Block diagram and pin description
1 Block diagram and pin description
Figure 1. Block diagram
1,2
V
CC
OVERVOLTAGE
UNDERVOLTAGE
INPUT 1
INPUT 2
GND 1,2
INPUT 3
INPUT 4
GND 3,4
OVERTEMP. 1
OVERTEMP. 2
OVERTEMP. 3
OVERTEMP. 4
LOGIC
LOGIC
DRIVER 1
I
OUT1
DRIVER 2
I
OUT2
OVERVOLTAGE
UNDERVOLTAGE
DRIVER 3
I
OUT3
DRIVER 4
I
OUT4
DEMAG 1
I
LIM1
K
DEMAG 2
I
LIM2
K
DEMAG 3
I
LIM3
K
DEMAG 4
I
LIM4
K
OUTPUT 1
CURRENT
SENSE 1
OUTPUT 2
CURRENT
SENSE 2
V
3,4
CC
OUTPUT 3
CURRENT
SENSE 3
OUTPUT 4
CURRENT
SENSE 4
Doc ID 10873 Rev 3 5/26
Block diagram and pin description VNQ600AP-E
Figure 2. Configuration diagram (top view)
15
28
V
1,2
CC
OUTPUT 1
OUTPUT 1
OUTPUT 1
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 3
OUTPUT 3
OUTPUT 3
OUTPUT 4
OUTPUT 4
OUTPUT 4
3,4
V
CC
VCC1,2
1
GND 1,2
INPUT2
INPUT1
CURRENT
CURRENT
SENSE 1
SENSE 2
V
1,2
CC
3,4
V
CC
GND 3,4
INPUT4
INPUT3
CURRENT SENSE 3
CURRENT SENSE 4
V
3,4
CC
Table 2. Suggested connections for unused and not connected pins
14
Connection/pin Current sense N.C. Output Input
Floating Not allowed X X X
To ground Through 1 kΩ resistor X Not allowed Through 10 kΩ resistor
6/26 Doc ID 10873 Rev 3
VNQ600AP-E Electrical specifications
2 Electrical specifications
Figure 3. Current and voltage conventions
1. VFn = V
CCn
- V
during reverse battery condition
OUTn
2.1 Absolute maximum ratings
Table 3. Absolute maximum rating
Symbol Parameter Value Unit
V
-V
I
OUT
V
CSENSE
I
GND
V
E
P
Supply voltage (continuous) 41 V
CC
Reverse supply voltage (continuous) -0.3 V
CC
Output current (continuous), for each channel 15 A
Reverse output current (continuous), for each channel -15 A
I
R
I
Input current +/- 10 mA
IN
Current sense maximum voltage
Ground current at T
Electrostatic discharge
(Human Body Model: R=1.5 KΩ; C=100 pF)
- Input
ESD
- Current Sense
- Output
- V
CC
Maximum switching energy
(L=0.11 mH; R
MAX
I
=40 A)
L
Power dissipation (per island) at T
tot
=0 Ω; V
L
-3
+15
< 25 °C (continuous) -200 mA
pins
4000
2000
5000
5000
=13.5 V; T
bat
=150 ºC;
jstart
=25 °C 6.25 W
lead
126 mJ
V
V
V
V
V
V
Doc ID 10873 Rev 3 7/26
Electrical specifications VNQ600AP-E
Table 3. Absolute maximum rating (continued)
Symbol Parameter Value Unit
T
Junction operating temperature Internally limited °C
j
T
Storage temperature -55 to 150 °C
stg
2.2 Thermal data
Table 4. Thermal data (per island)
Symbol Parameter Value Unit
R
thj-lead
R
thj-amb
R
thj-amb
1. When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 μm thick) connected to all VCC pins.
Horizontal mounting and no artificial air flow.
2. When mounted on a standard single-sided FR-4 board with 6 cm
Horizontal mounting and no artificial air flow.
Thermal resistance Junction-lead (max) 15 °C/W
Thermal resistance Junction-ambient (one chip on max) 60
Thermal Resistance Junction-ambient (two chips on
max)
2
of Cu (at least 35 μm thick) connected to all VCC pins.
46
(1)
(1)
31
44
(2)
((2))
2.3 Electrical characteristics
Values specified in this section are for 8 V<VCC<36 V; -40 °C< Tj <150 °C, unless otherwise
specified.
(1)
(1)
Operating supply voltage 5.5 13 36 V
(1)
Undervoltage shutdown 3 4 5.5 V
(1)
Overvoltage shutdown 36 - - V
I
1,2,3,4=5 A; Tj=25 °C
OUT
On-state resistance
Clamp voltage ICC=20 mA
Supply current
Off-state output current VIN=V
1,2,3,4=5 A; Tj=150 °C
I
OUT
I
1,2,3,4=3 A; VCC=6 V
OUT
(2)
41 48 55 V
Off-state; V
VIN=V
OUT=VSENSE
Off-state; V
VIN=V
OUT=VSENSE
=25 °C
T
j
On-state; V
I
=0 A; R
OUT
V
SENSE
OUT=VSENSE
=13 V;
CC
=13 V;
CC
=13 V; VIN=5 V;
CC
SENSE
=0 V
--3570
12
=0 V
=0V;
-
12
=3.9 KΩ;
=0V 0 - 50 µA
Table 5. Power
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
CC
V
USD
V
OV
R
ON
V
clamp
I
S
I
L(off1)
120
40
25
6
°C/W
°C/W
mΩ
mΩ
mΩ
µA
µA
mA
8/26 Doc ID 10873 Rev 3
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